BTB1198A3-S-TB-G [CYSTEKEC]
PNP Epitaxial Planar Transistor;
| 型号： | BTB1198A3-S-TB-G |
| 厂家： | 
CYSTECH ELECTONICS CORP. |
| 描述： | PNP Epitaxial Planar Transistor |
| 文件： | 总7页 (文件大小：265K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spec. No. : C824A3
Issued Date : 2007.02.28
Revised Date : 2012.12.27
Page No. : 1/7
CYStech Electronics Corp.
PNP Epitaxial Planar Transistor
BTB1198A3
Features
• Low VCE(SAT), VCE(SAT)= -0.16V (Typ.) @ IC/IB=-500mA/-50mA
• High breakdown voltage, BVCEO=-80V
• Complementary to BTD1768A3
• Pb-free lead plating and halogen-free package
Symbol
Outline
BTB1198A3
TO-92
B：Base
C：Collector
E：Emitter
E C B
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Symbol
VCBO
VCEO
VEBO
IC
Limits
-80
-80
-5
Unit
V
V
V
A
Collector Current (DC)
-1
Collector Current (Pulse)
Power Dissipation
Thermal Resistance, Junction to Ambient
Operating Junction Temperature Range
Storage Temperature Range
ICP
PD
RθJA
Tj
Tstg
-2 (Note)
750
167
A
mW
°C/W
°C
-55~+150
-55~+150
°C
Note : Pulse test, PW ≤ 10ms, Duty ≤ 50%.
BTB1198A3
CYStek Product Specification
Spec. No. : C824A3
Issued Date : 2007.02.28
Revised Date : 2012.12.27
Page No. : 2/7
CYStech Electronics Corp.
Characteristics
(Ta=25°C)
Symbol
BVCBO
Min. Typ.
Max.
Unit
Test Conditions
-80
-
-
-
-
V
V
V
µA
µA
V
IC=-50μA
IC=-2mA
IE=-50μA
VCB=-50V
VEB=-4V
BVCEO
BVEBO
ICBO
IEBO
*VCE(sat)
*hFE
-80
-
-5
-
-
-
-
-
-0.5
-0.5
-0.5
560
-
-
120
-
-0.16
-
180
11
IC=-500mA, IB=-50mA
VCE=-3V, IC=-100mA
VCE=-10V, IC=-50mA, f=100MHz
VCB=-10V, f=1MHz
-
fT
Cob
MHz
pF
-
-
*Pulse Test: Pulse Width ≤380μs, Duty Cycle≤2%
Classification Of hFE
Rank
Q
R
S
Range
120~270
180~390
270~560
Ordering Information
Device
HFE rank
Package
TO-92 (Pb-free lead plating 1000 pcs/ bag, 10 bags/box,
and halogen-free package) 10boxes/carton
TO-92 (Pb-free lead plating 1000 pcs/ bag, 10 bags/box,
and halogen-free package) 10boxes/carton
TO-92 (Pb-free lead plating 1000 pcs/ bag, 10 bags/box,
Shipping
BTB1198A3-Q-BK-G
BTB1198A3-R-BK-G
BTB1198A3-S-BK-G
BTB1198A3-Q-TB-G
BTB1198A3-R-TB-G
BTB1198A3-S-TB-G
Q
R
S
and halogen-free package)
TO-92 (Pb-free lead plating
and halogen-free package)
TO-92 (Pb-free lead plating
and halogen-free package)
TO-92 (Pb-free lead plating
and halogen-free package)
10boxes/carton
Q
R
S
2000 pcs / Tape & Box
2000 pcs / Tape & Box
2000 pcs / Tape & Box
BTB1198A3
CYStek Product Specification
Spec. No. : C824A3
Issued Date : 2007.02.28
Revised Date : 2012.12.27
Page No. : 3/7
CYStech Electronics Corp.
Characteristic Curves
Output Characteristics
Output Characteristics
0.1
0.05
0
0.45
0.4
IB=500uA
IB=2.5mA
IB=2mA
0.35
0.3
IB=400uA
IB=300uA
IB=1.5mA
IB=1mA
0.25
0.2
IB=200uA
IB=100uA
0.15
0.1
IB=500uA
IB=0
0.05
0
IB=0
5
0
1
2
3
4
5
6
0
1
2
3
4
6
Collector-to-Emitter Voltage---VCE(V)
Collector-to-Emitter Voltage---VCE(V)
Output Characteristics
Output Characteristics
IB=25mA
0.9
1.2
1
IB=10mA
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
IB=20mA
IB=8mA
IB=6mA
IB=15mA
IB=10mA
0.8
0.6
0.4
0.2
0
IB=4mA
IB=2mA
IB=5mA
IB=0
5
IB=0
5
0
1
2
3
4
6
0
1
2
3
4
6
Collector-to-Emitter Voltage---VCE(V)
Collector-to-Emitter Voltage---VCE(V)
Saturation Voltage vs Collector Current
Current Gain vs Collector Current
10000
1000
100
1000
100
10
VCE(SAT)
VCE=3V
IC=25IB
VCE=2V
IC=20IB
VCE=1V
IC=10IB
10
10
1
1
100
1000
10000
1
10
100
1000
10000
Collector Current---IC(mA)
Collector Current---IC(mA)
BTB1198A3
CYStek Product Specification
Spec. No. : C824A3
Issued Date : 2007.02.28
Revised Date : 2012.12.27
Page No. : 4/7
CYStech Electronics Corp.
Characteristic Curves(Cont.)
Power Derating Curve
Saturation Voltage vs Collector Current
10000
1000
100
800
700
600
500
400
300
200
100
0
VBE(SAT)@IC=10IB
0
50
100
150
200
1
10
100
1000
10000
Collector Current---IC(mA)
Ambient Temperature---TA(℃)
BTB1198A3
CYStek Product Specification
Spec. No. : C824A3
Issued Date : 2007.02.28
Revised Date : 2012.12.27
Page No. : 5/7
CYStech Electronics Corp.
TO-92 Taping Outline
H2AH2A
D2
H2
H2
A
H3
H4 H
L
L1
W1
H1
W
D1
D
F1F2
P
P1
T2
T
T1
P2
Millimeters
DIM
Item
Min.
4.33
3.80
0.36
4.33
2.40
-
15.50
8.50
-
Max.
4.83
4.20
0.53
4.83
2.90
0.3
16.50
9.50
1
A
D
Component body height
Tape Feed Diameter
Lead Diameter
D1
D2
F1,F2
F1,F2
H
H1
H2
H2A
H3
H4
L
Component Body Diameter
Component Lead Pitch
F1-F2
Height Of Seating Plane
Feed Hole Location
Front To Rear Deflection
Deflection Left Or Right
Component Height
-
-
-
-
1
27
21
11
Feed Hole To Bottom Of Component
Lead Length After Component Removal
Lead Wire Enclosure
Feed Hole Pitch
Center Of Seating Plane Location
4 Feed Hole Pitch
Over All Tape Thickness
Total Taped Package Thickness
Carrier Tape Thickness
Tape Width
L1
P
2.50
12.50
5.95
50.30
-
-
12.90
6.75
51.30
0.55
1.42
0.68
19.00
7.00
255
P1
P2
T
T1
T2
W
-
0.36
17.50
5.00
253
W1
-
Adhesive Tape Width
20 pcs Pitch
BTB1198A3
CYStek Product Specification
Spec. No. : C824A3
Issued Date : 2007.02.28
Revised Date : 2012.12.27
Page No. : 6/7
CYStech Electronics Corp.
Recommended wave soldering condition
Product
Peak Temperature
Soldering Time
5 +1/-1 seconds
Pb-free devices
260 +0/-5 °C
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
Time maintained above:
−Temperature (TL)
− Time (tL)
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
10-30 seconds
20-40 seconds
Ramp down rate
Time 25 °C to peak temperature
6°C/second max.
6 minutes max.
6°C/second max.
8 minutes max.
BTB1198A3
CYStek Product Specification
Spec. No. : C824A3
Issued Date : 2007.02.28
Revised Date : 2012.12.27
Page No. : 7/7
CYStech Electronics Corp.
TO-92 Dimension
Marking:
α2
Product Name
HFE
Rank
A
□
B1198
B
□□
1
2
3
Date Code: Year+Month
Year: 4→2004, 5→2005
Month: 1→1, 2→2, ‧‧‧,
9→9, A→10, B→11, C→12
α3
C
E
D
H
G
α1
I
Style: Pin 1.Emitter 2.Collector 3.Base
F
3-Lead TO-92 Plastic Package
CYStek Package Code: A3
*: Typical
Inches
Millimeters
Inches
Min. Max.
0.0142 0.0220
Millimeters
DIM
DIM
Min.
Max.
Min.
Max.
4.83
4.83
-
0.56
*1.27
3.76
Min.
0.36
Max.
0.56
*2.54
*1.27
*5°
A
B
C
D
E
F
0.1704 0.1902
0.1704 0.1902
0.5000
0.0142 0.0220
*0.0500
0.1323 0.1480
4.33
4.33
12.70
0.36
-
G
H
I
α1
α2
α3
-
-
-
-
-
*0.1000
*0.0500
*5°
-
-
-
-
-
-
-
*2°
*2°
*2°
3.36
*2°
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTB1198A3
CYStek Product Specification
相关型号：
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