BTB1580SN3 [CYSTEKEC]

PNP Epitaxial Planar Transistor;
BTB1580SN3
型号: BTB1580SN3
厂家: CYSTECH ELECTONICS CORP.    CYSTECH ELECTONICS CORP.
描述:

PNP Epitaxial Planar Transistor

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中文:  中文翻译
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Spec. No. : C655N3  
Issued Date : 2017.11.27  
Revised Date :  
CYStech Electronics Corp.  
Page No. : 1/7  
PNP Epitaxial Planar Transistor  
BTB1580SN3  
Description  
The BTB1580SN3 is designed for use in general purpose amplifier and low speed switching application.  
Pb-free lead plating package process is adopted.  
Equivalent Circuit  
Outline  
BTB1580SM3  
SOT-23  
C
4K  
BBase  
E
CCollector  
EEmitter  
B
Ordering Information  
Device  
Package  
SOT-23  
(Pb-free lead plating and halogen-free package)  
Shipping  
BTB1580SN3-0-T1-G  
3000 pcs / Tape & Reel  
Environment friendly grade : S for RoHS compliant products, G for RoHS  
compliant and green compound products  
Packing spec, T1 :3000 pcs/tape & reel, 7reel  
Product rank, zero for no rank products  
Product name  
BTB1580SN3  
CYStek Product Specification  
Spec. No. : C655N3  
Issued Date : 2017.11.27  
Revised Date :  
CYStech Electronics Corp.  
Page No. : 2/7  
Absolute Maximum Ratings (Ta=25C)  
Parameter  
Collector-Base Voltage  
Collector-Emitter Voltage  
Emitter-Base Voltage  
Collector Current (DC)  
Symbol  
Limits  
Unit  
V
VCBO  
VCEO  
VEBO  
IC  
ICP  
RθJA  
RθJC  
-120  
-120  
-5  
-2  
A
C/W  
W
Collector Current (Pulse)  
-4 (Note 1)  
Thermal Resistance, Junction to Ambient  
Thermal Resistance, Junction to Case  
Power Dissipation @ TA=25°C  
500  
100  
0.3  
PD  
Power Dissipation @ TC=25°C  
Opeearting Junction Temperature Range  
Storage Temperature Range  
1.5  
-55~+175  
-55~+175  
Tj  
Tstg  
C  
Note : 1. Single Pulse Pw 350μs, Duty 2%.  
Characteristics (Ta=25C)  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Test Conditions  
IC=-1mA, IB=0  
IC=-100μA, IE=0  
VCB=-120V, IE=0  
VCE=-120V, IB=0  
VEB=-5V, IC=0  
IC=-2A, IB=-2mA  
VCE=-4V, IC=-2A  
VCE=-4V, IC=-1A  
VCE=-4V, IC=-2A  
BVCEO  
BVCBO  
ICBO  
ICEO  
IEBO  
*VCE(sat)  
*VBE(on)  
*hFE1  
*hFE2  
Cob  
-120  
-120  
-
-
-
-
-
-
-
-
-
-
-
-
V
V
nA  
μA  
mA  
V
V
-
-
pF  
-100  
-1  
-2  
-1.8  
-2.2  
-
1000  
1000  
-
-
-
-
200  
VCB=-10V, IE=0A, f=1MHz  
*Pulse Test : Pulse Width 300μs, Duty Cycle2%  
Recommended Soldering Footprint  
BTB1580SN3  
CYStek Product Specification  
Spec. No. : C655N3  
Issued Date : 2017.11.27  
Revised Date :  
CYStech Electronics Corp.  
Page No. : 3/7  
Typical Characteristics  
Current Gain vs Collector Current  
Current Gain vs Collector Current  
10000  
1000  
100  
10  
10000  
25°C  
85°C  
25°C  
140°C  
85°C  
1000  
140°C  
100  
0°C  
0°C  
10  
1
-40°  
-40°  
VCE=-3V  
VCE=-4V  
1
1
10  
100  
1000  
10000  
1
10  
100  
1000  
10000  
-IC, Collector Current(mA)  
-IC, Collector Current(mA)  
Saturation Voltage vs Collector Current  
Saturation Voltage vs Collector Current  
10000  
10000  
1000  
100  
0°C  
-40°C  
0°C  
-40°C  
1000  
140°  
25°C  
85°  
85°C  
140°C  
25°C  
VCESAT@IC=500IB  
VCESAT@IC=250IB  
100  
10  
100  
1000  
10000  
10  
100  
1000  
10000  
-IC, Collector Current(mA)  
-IC, Collector Current(mA)  
On Voltage vs Collector Current  
Saturation Voltage vs Collector Current  
10000  
1000  
100  
10000  
1000  
100  
-40°C  
-40°C  
0°C  
0°C  
25°C  
25°C  
85°C  
85°C  
140°C  
VBESAT@IC=250IB  
VBEON@VCE=-4V  
140°C  
10  
100  
1000  
10000  
1
10  
100  
1000  
10000  
-IC, Collector Current(mA)  
-IC, Collector Current(mA)  
BTB1580SN3  
CYStek Product Specification  
Spec. No. : C655N3  
Issued Date : 2017.11.27  
Revised Date :  
CYStech Electronics Corp.  
Page No. : 4/7  
Typical Characteristics(Cont.)  
Capacitance vs Reverse-Biased Voltage  
Built-in Diode Characteristics  
100  
10000  
1000  
100  
Cib  
-40°C  
0°C  
25°C  
85°C  
140°C  
Cob  
10  
0.1  
1
10  
100  
1
10  
100  
1000  
10000  
VR, Reverse-Biased Voltage(V)  
-IF, Forward Current(mA)  
Power Derating Curves  
Power Derating Curve  
0.35  
0.3  
1.6  
1.4  
1.2  
1
0.25  
0.2  
0.8  
0.6  
0.4  
0.2  
0
0.15  
0.1  
0.05  
0
0
25  
50  
75 100 125 150 175 200  
0
25  
50  
75 100 125 150 175 200  
TA, Ambient Temperature(℃)  
TC, Case Temeprature(℃)  
BTB1580SN3  
CYStek Product Specification  
Spec. No. : C655N3  
Issued Date : 2017.11.27  
Revised Date :  
CYStech Electronics Corp.  
Page No. : 5/7  
Reel Dimension  
Carrier Tape Dimension  
BTB1580SN3  
CYStek Product Specification  
Spec. No. : C655N3  
Issued Date : 2017.11.27  
Revised Date :  
CYStech Electronics Corp.  
Page No. : 6/7  
Recommended wave soldering condition  
Product  
Peak Temperature  
Soldering Time  
5 +1/-1 seconds  
Pb-free devices  
260 +0/-5 C  
Recommended temperature profile for IR reflow  
Profile feature  
Average ramp-up rate  
(Tsmax to Tp)  
Sn-Pb eutectic Assembly  
Pb-free Assembly  
3C/second max.  
3C/second max.  
Preheat  
Temperature Min(TS min)  
Temperature Max(TS max)  
Time(ts min to ts max)  
100C  
150C  
60-120 seconds  
150C  
200C  
60-180 seconds  
Time maintained above:  
Temperature (TL)  
Time (tL)  
183C  
60-150 seconds  
217C  
60-150 seconds  
Peak Temperature(TP)  
240 +0/-5 C  
260 +0/-5 C  
Time within 5C of actual peak  
temperature(tp)  
10-30 seconds  
20-40 seconds  
Ramp down rate  
6C/second max.  
6C/second max.  
6 minutes max.  
8 minutes max.  
Time 25 C to peak temperature  
Note : All temperatures refer to topside of the package, measured on the package body surface.  
BTB1580SN3  
CYStek Product Specification  
Spec. No. : C655N3  
Issued Date : 2017.11.27  
Revised Date :  
CYStech Electronics Corp.  
Page No. : 7/7  
SOT-23 Dimension  
Marking:  
Device Code  
BN  
Date Code: Year+Month  
Year: 72017, 82018  
Month: 11, 22,‧‧‧  
99, A10, B11, C12  
3-Lead SOT-23 Plastic  
Surface Mounted Package  
CYStek Package Code: N3  
Style : Pin 1.Base 2.Emitter 3.Collector  
Inches  
DIM  
Millimeters  
Inches  
Min. Max.  
Millimeters  
DIM  
Min.  
Max.  
Min.  
Max.  
3.04  
1.70  
1.15  
0.50  
2.00  
0.10  
Min.  
Max.  
0.20  
0.72  
1.15  
2.95  
0.65  
0.60  
A
B
C
D
G
H
0.1102 0.1204  
0.0472 0.0669  
0.0335 0.0453  
0.0118 0.0197  
0.0669 0.0787  
0.0000 0.0040  
2.80  
1.20  
0.89  
0.30  
1.70  
0.00  
J
K
L
S
V
0.0032 0.0079  
0.0197 0.0283  
0.0335 0.0453  
0.0830 0.1161  
0.0098 0.0256  
0.0118 0.0236  
0.08  
0.50  
0.85  
2.10  
0.25  
0.30  
L1  
Notes : 1.Controlling dimension : millimeters.  
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.  
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.  
Material :  
Lead : Pure tin plated.  
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.  
Important Notice:  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.  
CYStek reserves the right to make changes to its products without notice.  
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.  
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.  
BTB1580SN3  
CYStek Product Specification  

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