BTB589N3 [CYSTEKEC]
Low Saturation PNP Epitaxial Planar Transistor; 低饱和PNP外延平面晶体管![BTB589N3](http://pdffile.icpdf.com/pdf1/p00097/img/icpdf/BTB589N3_516492_icpdf.jpg)
型号: | BTB589N3 |
厂家: | ![]() |
描述: | Low Saturation PNP Epitaxial Planar Transistor |
文件: | 总5页 (文件大小:264K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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Spec. No. : C314N3
Issued Date : 2005.04.20
Revised Date :
CYStech Electronics Corp.
Page No. : 1/ 5
Low Saturation PNP Epitaxial Planar Transistor
BTB589N3
Description
The BTB589N3 is designed with high current gain and low saturation voltage with collector current up
to 1A continuous.
Features
• Low VCE(SAT) , VCE(SAT)≤ -0.3V (IC / IB=-1A/-100mA)
• Large collector current, IC=-1A
• Pb-free package
Symbol
Outline
BTB589N3
SOT-23
B:Base
C:Collector
E:
BTB589N3
CYStek Product Specification
Spec. No. : C314N3
Issued Date : 2005.04.20
Revised Date :
CYStech Electronics Corp.
Page No. : 2/ 5
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Limits
Unit
Collector-Base Voltage
VCBO
VCEO
VEBO
IC
-50
V
V
V
Collector-Emitter Voltage
Emitter-Base Voltage
-32
-5
Collector Current (DC)
Collector Current (Pulse)
-1
A
ICP
-2
310 (Note 1)
500 (Note 2)
403 (Note 1)
250 (Note 2)
-55~+150
-55~+150
Power Dissipation
Pd
mW
Thermal Resistance, Junction to Ambient
Junction Temperature
RθJA
°C/W
Tj
Tstg
°C
°C
Storage Temperature
Note: 1.Device mounted on FR-4 PCB with minimum pad
2.Device mounted on FR-4 PCB with area of 4.5”×5”, mounting pad 0.02 in² of 2 oz copper
Characteristics
(Ta=25°C)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
BVCBO
BVCEO
BVEBO
ICBO
-40
-
-
-
-
-
-
-
-
-
-
-
V
IC=-50µA
IC=-1mA
IE=-50µA
VCB=-30V
VEB=-4V
-32
-
V
-5
-
-
V
-100
-100
-0.25
-0.30
-0.65
-1.2
-1.1
420
-
nA
nA
V
IEBO
-
*VCE(sat)
*VCE(sat)
*VCE(sat)
*VBE(sat)
*VBE(on)
1
2
3
-
IC=-500mA, IB=-50mA
IC=-1A, IB=-100mA
IC=-2A, IB=-200mA
IC=-1A, IB=-100mA
VCE=-2V, IC=-1A
-
V
-
V
-
V
-
V
*hFE
*hFE
*hFE
*hFE
fT
1
2
3
4
180
100
80
-
-
-
VCE=-3V, IC=-100mA
VCE=-2V, IC=-500mA
VCE=-2V, IC=-1A
-
-
-
-
-
30
-
-
VCE=-2V, IC=-2A
100
-
200
12
-
MHz
pF
VCE=-5V, IC=-50mA, f=100MHz
Cob
25
VCB=-10V, f=1MHz
*Pulse Test: Pulse Width ≤380µs, Duty Cycle≤2%
BTB589N3
CYStek Product Specification
Spec. No. : C314N3
Issued Date : 2005.04.20
Revised Date :
CYStech Electronics Corp.
Page No. : 3/ 5
Characteristic Curves
Current Gain vs Collector Current
Saturation Voltage vs Collector Current
1000
10000
1000
100
VCE = 2V
100
VCE(SAT) @ IC=100IB
VCE = 1V
VCE(SAT) @ IC=10IB
10
10
1
10
100
1000
10000
10000
200
1
10
100
1000
10000
Collector Current---IC(mA)
Collector Current---IC(mA)
Saturation Voltage vs Collector Current
On Voltage vs Collector Current
10000
1000
100
1000
VBE(SAT) @ IC=10IB
VBE(ON) @ VCE=1V
100
1
10
100
1000
1
10
100
1000
10000
Collector Current---IC(mA)
Collector Current---IC(mA)
Power Derating Curves
500
400
300
200
100
0
See Note 2 on page 1
See Note 1 on page 1
0
50
100
150
Ambient Temperature---TA(℃)
BTB589N3
CYStek Product Specification
Spec. No. : C314N3
Issued Date : 2005.04.20
Revised Date :
CYStech Electronics Corp.
Page No. : 4/ 5
Reel Dimension
Carrier Tape Dimension
BTB589N3
CYStek Product Specification
Spec. No. : C314N3
Issued Date : 2005.04.20
Revised Date :
CYStech Electronics Corp.
Page No. : 5/ 5
SOT-23 Dimension
A
L
Marking:
3
AH
S
B
1
2
V
G
3-Lead SOT-23 Plastic
Surface Mounted Package
CYStek Package Code: N3
C
Style: Pin 1.Base 2.Emitter 3.Collector
D
K
H
J
*: Typical
Millimeters
Inches
Millimeters
Inches
Min. Max.
DIM
DIM
Min.
Max.
Min.
Max.
3.04
1.60
1.30
0.50
2.30
0.10
Min.
Max.
0.177
0.67
1.15
2.75
0.65
A
B
C
D
G
H
0.1102 0.1204
0.0472 0.0630
0.0335 0.0512
0.0118 0.0197
0.0669 0.0910
0.0005 0.0040
2.80
1.20
0.89
0.30
1.70
0.013
J
K
L
0.0034 0.0070
0.0128 0.0266
0.0335 0.0453
0.0830 0.1083
0.0098 0.0256
0.085
0.32
0.85
2.10
0.25
S
V
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTB589N3
CYStek Product Specification
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