DIS0365CTSP [CYSTEKEC]
Switching Control Diode;
| 型号： | DIS0365CTSP |
| 厂家： | 
CYSTECH ELECTONICS CORP. |
| 描述： | Switching Control Diode |
| 文件： | 总7页 (文件大小：643K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spec. No. : C065SP
Issued Date : 2017.10.13
Revised Date :
CYStech Electronics Corp.
Page No. : 1/7
Switching Control Diode
DIS0365CTSP
Features
• High current capability
• Smoothly soft reverse recovery time (trr)
• Low profile surface mounted package in order to minimize board space
• Two dice in a package
• Pb-free lead plating and halogen-free package
Mechanical data
•Case : TO-277 Molded plastic
•Epoxy : UL94-V0 rated flame retardant
•Terminals : Plated terminals, solderable per MIL-STD-202 method 208
•Weight : approx. 0.094 gram
Symbol
Outline
DIS0365CTSP
TO-277
Anode
Anode
2
2
3
1
Cathode
Cathode
Cathode
3
1
Cathode
Ordering Information
Device
Package
TO-277
Shipping
5000 pcs / tape & reel
DIS0365CTSP-65-TD-G
(Pb-free lead plating and halogen-free package)
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, TD : 5000 pcs / tape & reel, 13” reel
Product rank, zero for no rank products
Product name
DIS0365CTSP
Preliminary
CYStek Product Specification
Spec. No. : C065SP
Issued Date : 2017.10.13
Revised Date :
CYStech Electronics Corp.
Page No. : 2/7
Absolute Maximum Ratings (TA=25℃, unless otherwise noted) , per leg
Parameters
Conditions
Symbol
Value
Units
Repetitive peak reverse voltage
RMS voltage
VRRM
VRMS
VR
650
455
650
V
V
V
Continuous reverse voltage
Single phase half wave,
Forward rectified current
IF(AV)
IF(AV)
IFRM
3
6
A
A
A
°
60Hz @TJ=25 C, per leg
Single phase half wave,
Forward rectified current
°
60Hz @TJ=25 C, per device
Single phase half wave,
Repetitive Peak Forward Current
4.7
°
60Hz @TJ=25 C
8.3ms single half sine-wave
superimposed on rated load
(JEDEC method)
Forward surge current
IFSM
48
A
Maximum reverse recovery time
Storage temperature range
IF=1A, dIF/dt=100A/μs
trr
Tstg
Tj
1
μs
-55~+150
-55~+150
°C
°C
Operating junction temperature range
Thermal Data
Parameter
Symbol
Rth,j-c
Value
6.5
39
75
169
19
3.2
1.7
0.74
Unit
Thermal Resistance, Junction-to-case, max
Thermal Resistance, Junction-to-ambient, max (Note 1 )
Thermal Resistance, Junction-to-ambient, max (Note 2 )
Thermal Resistance, Junction-to-ambient, max (Note 3)
Power Dissipation @ TC=25°C
Power Dissipation @ TA=25°C
Power Dissipation @ TA=25°C
Power Dissipation @ TA=25°C
°C/W
Rth,j-a
PD
(Note 1 )
(Note 2 )
(Note 3 )
W
Note: 1. Device mounted on FR-4 PCB, single sided 2 oz. copper, pad dimension 50mm×50mm.
2. Device mounted on FR-4 PCB, single sided 1 oz. copper, pad dimension 25mm×25mm.
3. Device mounted on FR-4 PCB, single sided 1 oz. copper, minimum recommended pad dimension.
Characteristics (TA=25°C, unless otherwise noted) , per leg
Characteristic
Symbol
Condition
IR=100μA
Min.
650
Typ
Max. Unit
-
-
-
V
Continuous reverse voltage
VR
VF 1
VF 2
IF=1A
-
-
-
-
-
1.1
1.2
100
10
-
Forward Voltage
V
-
IF=3A
-
VR=540V
nA
μA
pF
Reverse Leakage Current
Junction Capacitance
IR
-
VR=540V, TA=125°C
VR=1V, f=1MHz
53
CJ
DIS0365CTSP
Preliminary
CYStek Product Specification
Spec. No. : C065SP
Issued Date : 2017.10.13
Revised Date :
CYStech Electronics Corp.
Page No. : 3/7
Typical Characteristics , per leg
Power Derating Curve
Power Derating Curve
3.5
3
20
18
16
14
12
10
8
S
ee Note1 on page 2
S
ee Note 2 on page 2
2.5
2
S
ee Note 3 on page 2
1.5
1
6
4
0.5
0
2
0
0
25
50
75
100 125 150 175
0
25
50
75
100 125
150 175
Ambient Temperature---TA(℃)
Case Temperature---TC℃)
Forward Current vs Forward Voltage
Reverse Leakage Current vs Reverse Voltage
10000
1000
100
10
10000
1000
100
10
Tj=150℃
Tj=125°C
150℃
Tj=75℃
Tj=25℃
12
5°
25°C
0℃
75°C
Tj=0°C
-40°C
1
Tj=-40°C
Pulse width=300μs,
1% Duty cycle
0.1
1
0.01
0
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
2
0
50 100 150 200 250 300 350 400 450 500 550 600 650
Forward Voltage---VF(V)
Reverse Voltage---VR(V)
Junction Capacitance vs Reverse Voltage
100
10
1
Tj=25℃, f=1.0MHz
0.1
1
10
100
Reverse Voltage---V (V)
R
DIS0365CTSP
Preliminary
CYStek Product Specification
Spec. No. : C065SP
Issued Date : 2017.10.13
Revised Date :
CYStech Electronics Corp.
Page No. : 4/7
Recommended Soldering Footprint
DIS0365CTSP
Preliminary
CYStek Product Specification
Spec. No. : C065SP
Issued Date : 2017.10.13
Revised Date :
CYStech Electronics Corp.
Page No. : 5/7
Reel Dimension
Carrier Tape Dimension
DIS0365CTSP
Preliminary
CYStek Product Specification
Spec. No. : C065SP
Issued Date : 2017.10.13
Revised Date :
CYStech Electronics Corp.
Page No. : 6/7
Recommended wave soldering condition
Product
Peak Temperature
Soldering Time
5 +1/-1 seconds
Pb-free devices
260 +0/-5 °C
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
Time maintained above:
−Temperature (TL)
− Time (tL)
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
10-30 seconds
20-40 seconds
Ramp down rate
Time 25 °C to peak temperature
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Note :1. All temperatures refer to topside of the package, measured on the package body surface.
2.For devices mounted on FR-4 PCB of 1.6mm or equivalent grade PCB. If other grade PCB is used, care
should be taken to match the coefficients of thermal expansion between components and PCB. If they are
not matched well, the solder joints may crack or the bodies of the parts may crack or shatter as the
assembly cools.
DIS0365CTSP
Preliminary
CYStek Product Specification
Spec. No. : C065SP
Issued Date : 2017.10.13
Revised Date :
CYStech Electronics Corp.
Page No. : 7/7
TO-277 Dimension
Marking:
Cathode Cathode
Cathode
DIS
0365
CT
Date
Code
□□
Anode
Cathode
Anode
TO-277 Plastic Surface
Mounted Package
CYStek Package Code: SP
Millimeters
DIM
Inches
Min.
Millimeters
Inches
Min.
DIM
Min.
1.05
0.80
1.70
0.15
0.20
4.00
3.90
Max.
Max.
0.045
0.039
0.074
0.014
0.013
0.169
0.159
Min.
Max.
3.15
6.60
5.45
3.65
4.60
Max.
0.124
0.260
0.215
0.144
0.181
A
b1
b2
b3
C
1.15
0.99
1.88
0.35
0.33
4.30
4.05
0.041
0.031
0.067
0.006
0.008
0.157
0.154
D2
E
E1
E2
E3
e
2.95
6.40
5.30
3.45
4.20
0.116
0.252
0.209
0.136
0.165
D
D1
1.84 TYP
0.072 TYP
L
0.75
0.95
0.030
0.037
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : Pure tin plated.
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
DIS0365CTSP
Preliminary
CYStek Product Specification
相关型号：
DIS5-102-51-F-D-VS
Board Connector, 4 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal,
SAMTEC
DIS5-102-51-L-D-VS
Board Connector, 4 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal,
SAMTEC
DIS5-102-52-F-D-VS
Board Connector, 4 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal,
SAMTEC
DIS5-103-51-L-D-VS
Board Connector, 6 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal,
SAMTEC
DIS5-103-52-F-D-VS
Board Connector, 6 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal,
SAMTEC
©2020 ICPDF网 联系我们和版权申明