MTA090A02KS6R [CYSTEKEC]
N-Channel MOSFET;
| 型号： | MTA090A02KS6R |
| 厂家： | 
CYSTECH ELECTONICS CORP. |
| 描述： | N-Channel MOSFET |
| 文件： | 总9页 (文件大小：458K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spec. No. : C983S6R
Issued Date : 2017.03.21
Revised Date :
CYStech Electronics Corp.
Page No. : 1/ 9
N-Channel MOSFET (dual transistors)
MTA090A02KS6R
BVDSS
20V
2.8A
1.8A
ID@VGS=4.5V, TC=25°C
ID@VGS=4.5V, TA=25°C
Features
• Low on-resistance
• ESD protected gate
85mΩ
VGS=4.5V, ID=1A
110mΩ
160mΩ
RDSON(TYP)
VGS=2.5V, ID=1A
• High speed switching
VGS=1.8V, ID=0.5A
• Low-voltage drive
• Easily designed drive circuits
• Easy to use in parallel
• Pb-free lead plating and halogen-free package
Equivalent Circuit
Outline
MTA090A02KS6R
SOT-363
Tr1
Tr2
Ordering Information
Device
Package
SOT-363
(Pb-free lead plating and halogen-free package)
Shipping
3000 pcs / Tape & Reel
MTA090A02K6R-0-T1-G
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T1 : 3000 pcs / tape & reel, 7” reel
Product rank, zero for no rank products
Product name
MTA090A02KS6R
CYStek Product Specification
Spec. No. : C983S6R
Issued Date : 2017.03.21
Revised Date :
CYStech Electronics Corp.
Page No. : 2/ 9
The following characteristics apply to both Tr1 and Tr2
Absolute Maximum Ratings (Ta=25°C)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Symbol
VDSS
VGSS
Limits
20
Unit
V
±8
VGS=4.5V, TA=25°C
VGS=4.5V, TA=70°C
VGS=4.5V, TC=25°C
VGS=4.5V, TC=70°C
1.8 (Note 1)
1.4 (Note 1)
2.8
Continuous Drain Current
ID
A
2.2
Pulsued Drain Current
IDM
8
(Note 2)
TA=25°C
0.61 (Note 1)
Continuous Source-Drain Diode Current
Power Dissipation
IS
TC=25°C
TA=25°C
TA=70°C
TC=25°C
TC=70°C
1
0.74 (Note 1)
0.47 (Note 1)
1.25
PD
W
0.8
Operating Junction and Storage Temperature Range
Tj ; Tstg
-55~+150
°C
Thermal Data
Parameter
Symbol
RθJC
RθJA
Value
100
170
Unit
°C/W
Thermal Resistance, Junction-to-case, max
Thermal Resistance, Junction-to-ambient, max (Note 1)
Note : 1.Surface mounted on 1 in² copper pad of FR-4 board, t≤5 sec. 220℃/W under steady state.
2.Pulse width limited by maximum junction temperature.
Electrical Characteristics (TJ=25°C, unless otherwise noted)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
Static
BVDSS*
VGS(th)
IGSS
20
0.3
-
-
-
-
-
-
1
±10
1
10
145
180
255
-
VGS=0V, ID=10μA
V
VDS=VGS, ID=250μA
VGS=±8V, VDS=0V
VDS=20V, VGS=0V
VDS=20V, VGS=0V, Tj=55 C
VGS=4.5V, ID=1A
VGS=2.5V, ID=1A
VGS=1.8V ID=0.5A,
VDS=4V, ID=1.5A
-
-
-
-
-
-
-
μA
IDSS
°
85
110
160
3.5
RDS(ON)*
mΩ
GFS
S
Dynamic
Ciss
Coss
Crss
-
-
-
157
34
29
236
-
-
pF
VDS=10V, VGS=0V, f=1MHz
MTA090A02KS6R
CYStek Product Specification
Spec. No. : C983S6R
Issued Date : 2017.03.21
Revised Date :
CYStech Electronics Corp.
Page No. : 3/ 9
td(ON)
tr
td(OFF)
tf
td(ON)
tr
td(OFF)
tf
-
-
-
-
-
-
-
-
-
-
-
4
6
28
22
8
18.4
14.6
5.2
Ω
VDS=10V, ID=1.2A, VGS=4.5V, RG=1
ns
2.4
4
18.8
13.2
3.6
2.5
0.57
0.53
28
20
6
3.8
-
Ω
VDS=10V, ID=1.2A, VGS=8V, RG=1
VDS=10V, ID=1.5A, VGS=4.5V
Qg
Qgs
Qgd
nC
A
-
Source-Drain Diode
°
*IS
*ISM
*VSD
*trr
Qrr
ta
-
-
-
-
-
-
-
-
-
1
4
1.2
-
-
-
TC=25 C
0.86
4.1
1.0
3
V
ns
nC
IS=1.2A,VGS=0V
IF=1.2A,VGS=0V, dIF/dt=100A/μs
ns
tb
1.1
-
*Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2%
Recommended Soldering Footprint
MTA090A02KS6R
CYStek Product Specification
Spec. No. : C983S6R
Issued Date : 2017.03.21
Revised Date :
CYStech Electronics Corp.
Page No. : 4/ 9
Typical Characteristics
Brekdown Voltage vs Ambient Temperature
Typical Output Characteristics
1.4
1.2
1.0
0.8
0.6
8
6
4
2
0
5V, 4V,3V,2.5V
2V
ID=250μA,
1
VGS= .5V
VGS=0V
-75 -50 -25
0 25 50 75 100 125 150 175
Tj, Junction Temperature(°C)
0
1
2
3
VDS, Drain-Source Voltage(V)
4
5
Static Drain-Source On-State resistance vs Drain Current
Reverse Drain Current vs Source-Drain Voltage
1000
100
10
1.6
1.4
1.2
1
VGS=1.8V
VGS=2.5V
Tj=25°C
0.8
0.6
0.4
0.2
Tj=150°C
VGS=4.5V
0
1
2
3
4
5
0.001
0.01
0.1
ID, Drain Current(A)
1
10
IDR, Reverse Drain Current(A)
Drain-Source On-State Resistance vs Junction Tempearture
Static Drain-Source On-State Resistance vs Gate-Source
Voltage
500
2
450
400
350
300
250
200
150
100
50
ID=500mA
ID=1A
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
VGS=4.5V, ID=1A
RDSON@Tj=25°C : 81mΩ typ.
0
-75 -50 -25
0
25 50 75 100 125 150 175
0
1
2
V
3
4
5
6
GS, Gate-Source Voltage(V)
7
8
Tj, Junction Temperature(°C)
MTA090A02KS6R
CYStek Product Specification
Spec. No. : C983S6R
Issued Date : 2017.03.21
Revised Date :
CYStech Electronics Corp.
Page No. : 5/ 9
Typical Characteristics (Cont.)
Threshold Voltage vs Junction Tempearture
Capacitance vs Drain-to-Source Voltage
1000
1.4
1.2
1
ID=1mA
Ciss
100
0.8
0.6
0.4
C
oss
ID=250μA
Crss
15
10
-75 -50 -25
0
25 50 75 100 125 150 175
0
5
10
20
VDS, Drain-Source Voltage(V)
Tj, Junction Temperature(°C)
Forward Transfer Admittance vs Drain Current
Maximum Drain Current vs JunctionTemperature
10
1
2
1.6
1.2
0.8
0.4
0
0.1
0.01
VDS=10V
Pulsed
Ta=25°C
θJA
TA=25°C, VGS=4.5V, R =170°C/W
0.001
0.01
0.1
1
25
50
75
100
125
Tj, Junction Temperature(°C)
150
175
ID, Drain Current(A)
Maximum Safe Operating Area
Gate Charge Characteristics
8
7
6
5
4
3
2
1
0
100
10
100μs
1
1ms
10ms
0.1
100ms
VDS=10V
ID=1.5A
TA=25°C, Tj=150°C,
θ
DC
VGS=4.5V, R JA=170°C/W
0.01
0.001
Single Pulse
0
1
2
3
4
5
0.01
0.1
1
10
100
VDS, Drain-Source Voltage(V)
Qg, Total Gate Charge(nC)
MTA090A02KS6R
CYStek Product Specification
Spec. No. : C983S6R
Issued Date : 2017.03.21
Revised Date :
CYStech Electronics Corp.
Page No. : 6/ 9
Typical Characteristics (Cont.)
Single Pulse Power Rating, Junction to Ambient
Typical Transfer Characteristics
8
30
25
20
15
10
5
VDS=5V
TJ(MAX)=150°C
TA=25°C
6
RθJA=170°C/W
4
2
0
0
0.0001 0.001
0.01
0.1
1
10
100
0
1
2
3
4
5
VGS, Gate-Source Voltage(V)
Pulse Width(s)
Transient Thermal Response Curves
1
D=0.5
0.2
1.RθJA(t)=r(t)*RθJA
0.1
0.1
1
2
2.Duty Factor, D=t /t
JM
A
DM
3.T -T =P *RθJA(t)
0.05
=170
4.RθJA
°C/W
0.02
0.01
0.01
Single Pulse
0.001
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
t1, Square Wave Pulse Duration(s)
MTA090A02KS6R
CYStek Product Specification
Spec. No. : C983S6R
Issued Date : 2017.03.21
Revised Date :
CYStech Electronics Corp.
Page No. : 7/ 9
Reel Dimension
Carrier Tape Dimension
MTA090A02KS6R
CYStek Product Specification
Spec. No. : C983S6R
Issued Date : 2017.03.21
Revised Date :
CYStech Electronics Corp.
Page No. : 8/ 9
Recommended wave soldering condition
Product
Peak Temperature
Soldering Time
5 +1/-1 seconds
Pb-free devices
260 +0/-5 °C
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
Time maintained above:
−Temperature (TL)
− Time (tL)
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
10-30 seconds
20-40 seconds
Ramp down rate
Time 25 °C to peak temperature
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Note :1. All temperatures refer to topside of the package, measured on the package body surface.
2.For devices mounted on FR-4 PCB of 1.6mm or equivalent grade PCB. If other grade PCB is used, care
should be taken to match the coefficients of thermal expansion between components and PCB. If they are
not matched well, the solder joints may crack or the bodies of the parts may crack or shatter as the
assembly cools.
MTA090A02KS6R
CYStek Product Specification
Spec. No. : C983S6R
Issued Date : 2017.03.21
Revised Date :
CYStech Electronics Corp.
Page No. : 9/ 9
SOT-363 Dimension
Marking:
KAC
Date
Code
Device
Code
6-Lead SOT-363 Plastic
Surface Mounted Package
CYStek Package Code: S6R
Style:
Pin 1. Source1 (S1)
Pin 2. Gate1 (G1)
Pin 3. Drain2 (D2)
Pin 4. Source2 (S2)
Pin 5. Gate2 (G2)
Pin 6. Drain1 (D1)
Millimeters
DIM
Inches
Min.
Millimeters
Inches
DIM
Min.
Max.
1.100
0.100
1.000
0.350
0.150
2.200
1.350
Max.
0.043
0.004
0.039
0.014
0.006
0.087
0.053
Min.
Max.
Min.
Max.
A
A1
A2
b
0.900
0.000
0.900
0.150
0.080
2.000
1.150
0.035
0.000
0.035
0.006
0.003
0.079
0.045
E1
e
e1
L
L1
θ
2.150
2.450
0.085
0.096
0.650 TYP
0.026 TYP
1.200
1.400
0.047
0.055
0.525 REF
0.021 REF
c
D
0.260
0.460
0.010
0.018
0°
8°
0°
8°
E
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : Pure tin plated.
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTA090A02KS6R
CYStek Product Specification
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