SK1BSA [CYSTEKEC]
1.0Amp. Surface Mount Schottky Barrier Diodes;
| 型号： | SK1BSA |
| 厂家： | 
CYSTECH ELECTONICS CORP. |
| 描述： | 1.0Amp. Surface Mount Schottky Barrier Diodes |
| 文件： | 总6页 (文件大小：235K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spec. No. : C752SA
Issued Date : 2006.07.13
Revised Date :2014.02.05
Page No. : 1/6
CYStech Electronics Corp.
1.0Amp. Surface Mount Schottky Barrier Diodes
SK12SA thru SK1BSA
Features
• For surface mounted applications.
• For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications.
• Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0.
• Low leakage current.
• High surge capability.
• High temperature soldering: 250°C/10 seconds at terminals.
• Exceeds environmental standards of MIL-S-19500/228.
Mechanical Data
• Case: Molded plastic, JEDEC DO-214AC/SMA.
• Terminals: Solder plated, solderable per MIL-STD-750 method 2026.
• Polarity: Indicated by cathode band.
• Mounting position: Any.
• Weight: 0.064 gram, 0.002 ounce.
Ordering Information
Device
Package
Shipping
Marking
SK12
SK13
SK14
SK15
SK16
SK18
SK1B
SK12SA-0-T4-G
SK13SA-0-T4-G
SK14SA-0-T4-G
SK15SA-0-T4-G
SK16SA-0-T4-G
SK18SA-0-T4-G
SK1BSA-0-T4-G
SMA
(Pb-free lead plating and halogen-free
package)
7500 pcs / Tape & Reel
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T4 : 7500 pcs / tape & reel, 13” reel
Product rank, zero for no rank products
Product name
SK12SA thru SK1BSA
CYStek Product Specification
Spec. No. : C752SA
Issued Date : 2006.07.13
Revised Date :2014.02.05
Page No. : 2/6
CYStech Electronics Corp.
Maximum Ratings and Electrical Characteristics
(Rating at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%. )
Type
Parameter
Symbol
Units
SK12
20
SK13 SK14
SK15 SK16 SK18
SK1B
100
70
Repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous forward
Voltage @ IF=1A (Note 1)
VRRM
VRMS
VR
30
21
30
40
28
40
50
35
50
60
42
60
80
56
80
V
V
V
14
20
100
VF
IO
0.5
0.7
0.85
V
A
Maximum average forward
rectified current @ TL=100°C
1
Peak forward surge current @
8.3ms, single half sine-wave
superimposed on rated load
(JEDEC method)
IFSM
30
A
Maximum DC reverse current at
Rated DC blocking
voltage
Typical thermal resistance,
junction to lead
Typical thermal resistance,
junction to case
TJ=25°C
TJ=100°C
IR
R th, JA
Rth, JC
0.5
10
mA
°C/W
°C/W
85
18
Power
Dissipation
TA=25°C
TC=25°C
1.5
7
PD
CJ
W
Typical diode junction
capacitance @ f=1MHz and
applied 4V reverse voltage
Storage temperature
120
pF
°C
°C
Tstg
-55 ~ +150
-55 ~ +125
Operating temperature
TJ
Recommended soldering footprint
SK12SA thru SK1BSA
CYStek Product Specification
Spec. No. : C752SA
Issued Date : 2006.07.13
Revised Date :2014.02.05
Page No. : 3/6
CYStech Electronics Corp.
Characteristic Curves
SK12-SK14
SK16
SK18-SK1B
SK12SA thru SK1BSA
CYStek Product Specification
Spec. No. : C752SA
Issued Date : 2006.07.13
Revised Date :2014.02.05
Page No. : 4/6
CYStech Electronics Corp.
Reel Dimension
Carrier Tape Dimension
SK12SA thru SK1BSA
CYStek Product Specification
Spec. No. : C752SA
Issued Date : 2006.07.13
Revised Date :2014.02.05
Page No. : 5/6
CYStech Electronics Corp.
Recommended wave soldering condition
Product
Peak Temperature
Soldering Time
5 +1/-1 seconds
Pb-free devices
260 +0/-5 °C
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
Time maintained above:
−Temperature (TL)
− Time (tL)
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
10-30 seconds
20-40 seconds
Ramp down rate
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Time 25 °C to peak temperature
Note : All temperatures refer to topside of the package, measured on the package body surface.
SK12SA thru SK1BSA
CYStek Product Specification
Spec. No. : C752SA
Issued Date : 2006.07.13
Revised Date :2014.02.05
Page No. : 6/6
CYStech Electronics Corp.
SMA/DO-214AC Dimension
Marking :
SK12SA SK13SA SK14SA SK15SA
SK12 SK13 SK14 SK15
SK16SA SK18SA SK1BSA
SK16 SK18 SK1B
SMA/DO-214AC Plastic
Surface Mounted Package
CYStek Package Code : SA
*:Typical
Inches
Min.
0.055
0.098
0.157
0.078
Millimeters
Inches
Min.
0.006
0.002
0.030
0.188
Millimeters
DIM
DIM
Max.
0.062
0.114
0.181
0.096
Min.
Max.
1.60
2.90
4.60
2.44
Max.
0.012
0.008
0.060
0.208
Min.
0.152
0.051
0.76
Max.
0.305
0.203
1.52
A
B
C
D
1.40
2.50
4.00
2.00
E
F
G
H
4.80
5.28
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : Pure tin plated.
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SK12SA thru SK1BSA
CYStek Product Specification
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