SK38 [CYSTEKEC]
3.0Amp. Surface Mount Schottky Barrier Diodes; 3.0Amp 。表面贴装肖特基势垒二极管
| 型号： | SK38 |
| 厂家： | 
CYSTECH ELECTONICS CORP. |
| 描述： | 3.0Amp. Surface Mount Schottky Barrier Diodes |
| 文件： | 总3页 (文件大小：83K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spec. No. : C754SA
Issued Date : 2006.07.13
Revised Date :
CYStech Electronics Corp.
Page No. : 1/3
3.0Amp. Surface Mount Schottky Barrier Diodes
SK3XSA Series
Features
• For surface mounted applications.
• For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications
• Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0
• Low leakage current
• High surge capability
• High temperature soldering: 250°C/10 seconds at terminals
• Exceeds environmental standards of MIL-S-19500/228
• Pb-free package
Mechanical Data
• Case: SMA/DO-214AC molded plastic.
• Terminals: Solder plated, solderable per MIL-STD-750 method 2026
• Polarity: Indicated by cathode band.
• Packaging: 12mm tape per EIA STD RS-481.
• Weight: 0.064 gram, 0.002 ounce
Maximum Ratings and Electrical Characteristics
(Rating at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz,
resistive or inductive load. For capacitive load, derate current by 20%. )
Type
Parameter
Symbol
Units
SK32 SK34 SK36 SK38 SK3B
Repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous forward voltage,
IF=3A
VRRM
VRMS
VR
20
14
20
40
28
40
60
42
60
80
56
80
100
70
100
V
V
V
VF
IO
0.5
0.7
3.0
0.85
V
A
Maximum average forward rectified current
at TL (See Fig. 1 )
Peak forward surge current @8.3ms single half
sine wave superimposed on rated load (JEDEC
method)
IFSM
80
A
mA
mA
℃
Maximum DC reverse current @ TJ = 25
IR
Rth,JA
CJ
0.5
10
℃
At Rated DC Blocking Voltage @ TJ = 100
Maximum thermal resistance, Junction to
ambient(Note 1)
88 (typ)
℃
/W
Diode junction capacitance @
200 (typ)
pF
f = 1MHz and applied 4V reverse voltage
Operating Junction and Storage temperature
Rang
TJ, Tstg
-55 ~ +125 / -55 ~ +150
℃
Notes : 1.Mounted on PCB with 14mm² (0.013mm thickness) copper pad area.
SK3XSA
CYStek Product Specification
Spec. No. : C754SA
Issued Date : 2006.07.13
Revised Date :
CYStech Electronics Corp.
Page No. : 2/3
Characteristic Curves
SK32-SK34
--- SK36-SK3B
SK32-SK34
SK36
SK38-SK3B
SK3XSA
CYStek Product Specification
Spec. No. : C754SA
Issued Date : 2006.07.13
Revised Date :
CYStech Electronics Corp.
Page No. : 3/3
SMA Dimension
Marking :
Device SK32 SK34 SK36 SK38
Code SK32 SK34 SK36 SK38
B
A
Device SK3B
Code SK3B
C
G
D
H
SMA/DO-214AC Plastic
E
F
Surface Mounted Package
CYStek Package Code : SA
*:Typical
Inches
Min. Max.
Millimeters
Inches
Min.
0.030
0.002
0.188
0.006
Millimeters
DIM
DIM
Min.
1.40
2.50
4.00
2.00
Max.
1.60
2.90
4.60
2.44
Max.
0.060
0.008
0.208
0.012
Min.
0.76
Max.
1.52
A
B
C
D
0.055
0.098
0.157
0.078
0.062
0.114
0.181
0.096
E
F
G
H
0.051
4.80
0.203
5.28
0.152
0.305
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SK3XSA
CYStek Product Specification
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