SK520SC [CYSTEKEC]
5.0Amp. Surface Mount Schottky Barrier Diodes;
| 型号： | SK520SC |
| 厂家： | 
CYSTECH ELECTONICS CORP. |
| 描述： | 5.0Amp. Surface Mount Schottky Barrier Diodes |
| 文件： | 总7页 (文件大小：209K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spec. No. : C337SB
Issued Date : 2005.12.07
Revised Date :2010.11.29
Page No. : 1/7
CYStech Electronics Corp.
5.0Amp. Surface Mount Schottky Barrier Diodes
SK520SB thru SK5100SB
Features
• For surface mounted applications.
• For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications
• Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0
• Low leakage current
• High surge capability
• Exceeds environmental standards of MIL-S-19500/228
Mechanical Data
• Case: Molded plastic, SMB/JEDEC DO-214AA.
• Terminals: Solder plated, solderable per MIL-STD-750 method 2026
• Polarity: Indicated by cathode band.
• Mounting Position : Any.
• Weight: 0.0878 gram
Maximum Ratings and Electrical Characteristics
(Rating at 25°C ambient temperature unless otherwise specified. )
Type
Parameter
Symbol
Units
SK
SK
SK
SK
SK
SK
SK
520
530
540
550
560
580
5100
Repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
VRRM
VRMS
VR
20
14
20
30
21
30
40
28
40
50
35
50
60
42
60
80
56
80
100
70
100
V
V
V
Maximum instantaneous
VF
IO
0.55
0.55
0.55
0.7
5
0.7
0.85
0.85
V
A
forward voltage, IF=5A (Note 1)
Average forward rectified current
Peak forward surge current @8.3ms
single half sine wave superimposed
on rated load (JEDEC method)
Maximum DC reverse current
IFSM
150
A
℃
VR=VRRM,TA=25 (Note)
0.5
50
mA
mA
IR
Rth,JL
CJ
℃
VR=VRRM,TA=125 (Note)
Maximum thermal resistance,
Junction to Lead
Diode junction capacitance @
f=1MHz and applied 4VDC reverse
voltage
12 (typ)
℃
/W
380(typ)
pF
Storage temperature
Operating temperature
Tstg
TJ
-55 ~ +150
℃
℃
-55 ~ +125
-55 ~ +150
Notes : Pulse test, pulse width=300μsec, 2% duty cycle
SK520SB-SK5100SB
CYStek Product Specification
Spec. No. : C337SB
Issued Date : 2005.12.07
Revised Date :2010.11.29
Page No. : 2/7
CYStech Electronics Corp.
Characteristic Curves
Forward Current Derating Curve
Maximum Non-Repetitive Forward Surge Current
160
140
120
100
80
6
5
4
3
2
1
0
Tj=25℃, 8.3ms Single Half
Sine Wave
JEDEC method
SK550-SK5100
60
SK520-SK540
40
20
0
1
10
100
0
50
100
150
200
Number of Cycles at 60Hz
Ambient Temperature---TA(℃)
Junction Capacitance vs Reverse Voltage
Forward Current vs Forward Voltage
1400
100
10
SK520-SK540
1200
1000
800
600
400
200
0
SK550-SK560
SK580-SK5100
1
0.1
0.01
Tj=25℃, Pulse width=300μs,
1% Duty cycle
0.01
0.1
1
10
100
0.1
0.3
0.5
0.7
0.9
1.1
1.3
1.5
Reverse Voltage---VR(V)
Forward Voltage---VF(V)
Reverse Leakage Current vs Reverse Voltage
100
10
Tj=75℃
1
0.1
0.01
Tj=25℃
0
20
40
60
80
100 120 140
Percent of Rated Peak
Reverse Voltage---(%)
SK520SB-SK5100SB
CYStek Product Specification
Spec. No. : C337SB
Issued Date : 2005.12.07
Revised Date :2010.11.29
Page No. : 3/7
CYStech Electronics Corp.
Taping Reel Dimension
SK520SB-SK5100SB
CYStek Product Specification
Spec. No. : C337SB
Issued Date : 2005.12.07
Revised Date :2010.11.29
Page No. : 4/7
CYStech Electronics Corp.
Recommended Wave Soldering Profile
SK520SB-SK5100SB
CYStek Product Specification
Spec. No. : C337SB
Issued Date : 2005.12.07
Revised Date :2010.11.29
Page No. : 5/7
CYStech Electronics Corp.
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
Time maintained above:
−Temperature (TL)
− Time (tL)
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
10-30 seconds
6°C/second max.
6 minutes max.
20-40 seconds
6°C/second max.
8 minutes max.
Ramp down rate
Time 25 °C to peak
temperature
Note : All temperatures refer to topside of the package, measured on the package body surface.
SK520SB-SK5100SB
CYStek Product Specification
Spec. No. : C337SB
Issued Date : 2005.12.07
Revised Date :2010.11.29
Page No. : 6/7
CYStech Electronics Corp.
Recommended Footprint
Inches
Typ
Millimeters
Typ
DIM
A
B
C
0.142
0.059
0.118
3.60
1.50
3.00
Ordering Information
Device
SK520SB
SK530SB
SK540SB
SK550SB
SK560SB
SK580SB
SK5100SB
Package
SMB
SMB
SMB
SMB
SMB
SMB
SMB
Shipping
Marking
3000 pcs / Tape & Reel
3000 pcs / Tape & Reel
3000 pcs / Tape & Reel
3000 pcs / Tape & Reel
3000 pcs / Tape & Reel
3000 pcs / Tape & Reel
3000 pcs / Tape & Reel
SS52
SS53
SS54
SS55
SS56
SS58
S510
SK520SB-SK5100SB
CYStek Product Specification
Spec. No. : C337SB
Issued Date : 2005.12.07
Revised Date :2010.11.29
Page No. : 7/7
CYStech Electronics Corp.
DO-214AA/SMB Dimension
DO-214AA/SMB Plastic
Surface Mounted Package
CYStek Package Code : SB
*:Typical
Inches
Min.
0.076
0.137
0.167
0.078
Millimeters
Inches
Min.
0.006
0.004
0.035
0.207
Millimeters
DIM
DIM
Max.
0.082
0.147
0.187
0.103
Min.
1.93
3.48
4.25
1.99
Max.
2.08
3.73
4.75
2.61
Max.
0.012
0.008
0.056
0.215
Min.
0.15
0.10
0.90
5.26
Max.
0.31
0.20
1.41
5.46
A
B
C
D
E
F
G
H
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : Pure tin plated.
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SK520SB-SK5100SB
CYStek Product Specification
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