DS1220Y [DALLAS]

16k Nonvolatile SRAM; 16K非易失SRAM
DS1220Y
型号: DS1220Y
厂家: DALLAS SEMICONDUCTOR    DALLAS SEMICONDUCTOR
描述:

16k Nonvolatile SRAM
16K非易失SRAM

存储 内存集成电路 静态存储器 光电二极管
文件: 总8页 (文件大小:147K)
中文:  中文翻译
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DS1220Y  
16k Nonvolatile SRAM  
www.dalsemi.com  
FEATURES  
PIN ASSIGNMENT  
10 years minimum data retention in the  
absence of external power  
A7  
A6  
A5  
A4  
VCC  
24  
23  
1
A8  
A9  
2
3
4
Data is automatically protected during power  
loss  
Directly replaces 2k x 8 volatile static RAM  
or EEPROM  
Unlimited write cycles  
Low-power CMOS  
JEDEC standard 24-pin DIP package  
Read and write access times as fast as 100 ns  
Full ±10% operating range  
Optional industrial temperature range of  
-40°C to +85°C, designated IND  
22  
21  
WE  
OE  
A10  
CE  
DQ7  
DQ6  
A3  
A2  
20  
19  
5
6
A1  
A0  
18  
17  
7
8
DQ0  
9
16  
DQ1  
DQ2  
GND  
10  
DQ5  
DQ4  
DQ3  
15  
14  
11  
12  
13  
24-Pin ENCAPSULATED PACKAGE  
720-mil EXTENDED  
PIN DESCRIPTION  
A0-A10  
- Address Inputs  
DQ0-DQ7  
- Data In/Data Out  
CE  
- Chip Enable  
- Write Enable  
WE  
OE  
VCC  
GND  
- Output Enable  
- Power (+5V)  
- Ground  
DESCRIPTION  
The DS1220Y 16k Nonvolatile SRAM is a 16,384-bit, fully static, nonvolatile RAM organized as 2048  
words by 8 bits. Each NV SRAM has a self-contained lithium energy source and control circuitry which  
constantly monitors VCC for an out-of-tolerance condition. When such a condition occurs, the lithium  
energy source is automatically switched on and write protection is unconditionally enabled to prevent  
data corruption. The NV SRAM can be used in place of existing 2k x 8 SRAMs directly conforming to  
the popular bytewide 24-pin DIP standard. The DS1220Y also matches the pinout of the 2716 EPROM or  
the 2816 EEPROM, allowing direct substitution while enhancing performance. There is no limit on the  
number of write cycles that can be executed and no additional support circuitry is required for  
microprocessor interfacing.  
1 of 8  
111899  
DS1220Y  
READ MODE  
The DS1220Y executes a read cycle whenever WE (Write Enable) is inactive (high) and CE (Chip  
Enable) and OE (Output Enable) are active (low). The unique address specified by the 11 address inputs  
(A0-A10) defines which of the 2048 bytes of data is to be accessed. Valid data will be available to the  
eight data output drivers within tACC (Access Time) after the last address input signal is stable, providing  
that CE and OE access times are also satisfied. If CE and OE access times are not satisfied, then data  
access must be measured from the later-occurring signal and the limiting parameter is either tCO for CE or  
tOE for OE rather than address access.  
WRITE MODE  
The DS1220Y executes a write cycle whenever the WE and CE signals are active (low) after address  
inputs are stable. The later-occurring falling edge of CE or WE will determine the start of the write  
cycle. The write cycle is terminated by the earlier rising edge of CE or WE . All address inputs must be  
kept valid throughout the write cycle. WE must return to the high state for a minimum recovery time  
(tWR) before another cycle can be initiated. The OE control signal should be kept inactive (high) during  
write cycles to avoid bus contention. However, if the output drivers are enabled ( CE and OE active)  
then WE will disable the outputs in tODW from its falling edge.  
DATA RETENTION MODE  
The DS1220Y provides full-functional capability for VCC greater than 4.5 volts and write protects at 4.25  
nominal. Data is maintained in the absence of VCC without any additional support circuitry. The  
DS1220Y constantly monitors VCC. Should the supply voltage decay, the NV SRAM automatically write  
protects itself, all inputs become “don’t care,” and all outputs become high-impedance. As VCC falls  
below approximately 3.0 volts, a power switching circuit connects the lithium energy source to RAM to  
retain data. During power-up, when VCC rises above approximately 3.0 volts, the power switching circuit  
connects external VCC to RAM and disconnects the lithium energy source. Normal RAM operation can  
resume after VCC exceeds 4.5 volts.  
2 of 8  
DS1220Y  
ABSOLUTE MAXIMUM RATINGS*  
Voltage on Any Pin Relative to Ground  
Operating Temperature  
-0.3V to +7.0V  
0°C to 70°C; -40°C to +85°C for IND parts  
Storage Temperature  
Soldering Temperature  
-40°C to +70°C; -40°C to +85°C for IND parts  
260°C for 10 seconds  
This is a stress rating only and functional operation of the device at these or any other conditions  
above those indicated in the operation sections of this specification is not implied. Exposure to  
absolute maximum rating conditions for extended periods of time may affect reliability.  
RECOMMENDED DC OPERATING CONDITIONS  
(TA : See Note 10)  
PARAMETER  
Power Supply Voltage  
Input Logic 1  
SYMBOL  
VCC  
MIN  
4.5  
2.2  
TYP  
5.0  
MAX UNITS NOTES  
5.5  
VCC  
+0.8  
V
V
V
VIH  
Input Logic 0  
VIL  
0.0  
DC ELECTRICAL CHARACTERISTICS  
(TA : See Note 10; VCC = 5V ± 10%)  
PARAMETER  
SYMBOL  
MIN  
-1.0  
-1.0  
TYP  
MAX UNITS NOTES  
Input Leakage Current  
IIL  
+1.0  
µA  
µA  
I/O Leakage Current  
IIO  
+1.0  
CE VIH VCC  
Output Current @ 2.4V  
Output Current @ 0.4V  
IOH  
IOL  
ICCS1  
-1.0  
2.0  
mA  
mA  
mA  
3.0  
2.0  
7.0  
4.0  
75  
Standby Current CE =2.2V  
ICCS2  
ICCO1  
mA  
mA  
Standby Current CE =VCC -0.5V  
Operating Current tCYC= 200ns  
(Commercial)  
Operating Current tCYC=200ns  
(Industrial)  
Write Protection Voltage  
ICCO1  
VTP  
85  
mA  
V
4.25  
CAPACITANCE  
PARAMETER  
Input Capacitance  
(T A = 25°C)  
SYMBOL  
CIN  
MIN  
TYP  
5
5
MAX UNITS NOTES  
10  
12  
pF  
pF  
Input/Output Capacitance  
CI/O  
3 of 8  
DS1220Y  
AC ELECTRICAL CHARACTERISTICS  
(TA : See Note 10; VCC =5.0V ± 10%)  
DS1220Y-100 DS1220Y-120  
DS1220Y-150  
DS1220Y-200  
PARAMETER  
SYM  
UNITS NOTE  
MIN MAX MIN MAX MIN  
MAX  
MIN  
MAX  
Read Cycle Time  
Access Time  
100  
120  
150  
200  
ns  
ns  
t
RC  
100  
50  
120  
60  
150  
70  
200  
100  
t
ACC  
OE to Output  
Valid  
ns  
ns  
t
OE  
CE to Output  
Valid  
100  
120  
150  
200  
t
CO  
OE or CE to  
Output Active  
5
5
5
5
5
5
5
5
ns  
5
5
t
COE  
Output High Z  
from Deslection  
Output Hold from  
Address Change  
Write Cycle Time  
35  
35  
35  
35  
ns  
ns  
t
t
OD  
OH  
100  
75  
120  
90  
150  
100  
200  
150  
ns  
ns  
t
WC  
Write Pulse Width  
3
t
WP  
Address Setup  
Time  
0
0
0
0
ns  
t
AW  
Write Recovery  
Time  
t
t
0
10  
0
10  
0
10  
0
10  
ns  
ns  
12  
13  
WR1  
WR2  
Output High Z  
35  
35  
35  
35  
ns  
5
t
ODW  
from WE  
Output Active  
5
5
5
5
ns  
ns  
5
4
t
OEW  
from WE  
Data Setup Time  
40  
50  
60  
80  
t
DS  
Data Hold Time  
t
0
10  
0
10  
0
10  
0
10  
ns  
ns  
12  
13  
DH1  
DH2  
t
4 of 8  
DS1220Y  
READ CYCLE  
SEE NOTE 1  
WRITE CYCLE 1  
SEE NOTES 2, 3, 4, 6, 7, 8 AND 12  
WRITE CYCLE 2  
SEE NOTES 2, 3, 4, 6, 7, 8 AND 13  
5 of 8  
DS1220Y  
POWER-DOWN/POWER-UP CONDITION  
SEE NOTE 11  
POWER-DOWN/POWER-UP TIMING  
PARAMETER  
SYMBOL  
MIN  
MAX UNITS NOTES  
tPD  
0
11  
µs  
CE at VIH before Power-Down  
VCC Slew from VTP to 0V  
VCC Slew from 0V to VTP  
tF  
tR  
100  
0
µs  
µs  
tREC  
2
ms  
CE at VIH after Power-Up  
(TA = 25°C)  
PARAMETER  
Expected Data Retention Time  
SYMBOL  
MIN  
10  
MAX UNITS NOTES  
years  
tDR  
9
WARNING:  
Under no circumstance are negative undershoots, of any amplitude, allowed when device is in battery  
backup mode.  
NOTES:  
1. WE is high for a read cycle.  
2. OE = VIH or VIL . If OE = VIH during a write cycle, the output buffers remain in a high impedance  
state.  
3. tWP is specified as the logical AND of CE and WE . tWP is measured from the latter of CE or WE  
going low to the earlier of CE or WE going high.  
4. tDS are measured from the earlier of CE or WE going high.  
5. These parameters are sampled with a 5 pF load and are not 100% tested.  
6. If the CE low transition occurs simultaneously with or later than the WE low transition in write  
cycle 1, the output buffers remain in a high impedance state during this period.  
6 of 8  
DS1220Y  
7. If the CE high transition occurs prior to or simultaneously with the WE high transition, the output  
buffers remain in a high impedance state during this period.  
8. If WE is low or the WE low transition occurs prior to or simultaneously with the CE low transition,  
the output buffers remain in a high impedance state during this period.  
9. Each DS1220Y is marked with a 4-digit date code AABB. AA designates the year of manufacture.  
BB designates the week of manufacture. The expected tDR is defined as starting at the date of  
manufacture.  
10. All AC and DC electrical characteristics are valid over the full operating temperature range. For  
commercial products, this range is 0°C to 70°C. For industrial products (IND), this range is -40°C to  
+85°C.  
11. In a power-down condition the voltage on any pin may not exceed the voltage of VCC  
12. tWR1 , tDH1 are measured from WE going high.  
.
13. tWR2 , tDH2 are measured from CE going high.  
14. DS1220Y modules are recognized by Underwriters Laboratory (U.L. ) under file E99151 (R).  
DC TEST CONDITIONS  
Outputs open.  
All voltages are referenced to ground.  
AC TEST CONDITIONS  
Output Load: 100pF + 1TTL Gate  
Input Pulse Levels: 0-3.0V  
Timing Measurement Reference Levels  
Input:1.5V  
Output: 1.5V  
Input Pulse Rise and Fall Times: 5ns  
ORDERING INFORMATION  
7 of 8  
DS1220Y  
DS1220Y NONVOLATILE SRAM, 24-PIN 720-MIL EXTENDED MODULE  
PKG  
DIM  
24-PIN  
MIN  
MAX  
A IN. 1.320  
1.340  
34.04  
0.720  
18.29  
0.415  
10.54  
0.130  
3.30  
0.030  
0.76  
0.160  
4.06  
MM  
B IN.  
MM  
C IN.  
MM  
33.53  
0.695  
17.65  
0.390  
9.91  
D IN. 0.100  
MM  
E IN.  
MM  
F IN.  
MM  
2.54  
0.017  
0.43  
0.120  
3.05  
G IN. 0.090  
0.110  
2.79  
0.630  
16.00  
0.012  
0.30  
MM  
H IN  
MM  
J IN.  
MM  
2.29  
0.590  
14.99  
0.008  
0.20  
K IN. 0.015  
MM 0.38  
0.021  
0.53  
8 of 8  

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