DS14285Q [DALLAS]

Real Time Clock with NV RAM Control; 实时时钟,带有非易失RAM控制器
DS14285Q
型号: DS14285Q
厂家: DALLAS SEMICONDUCTOR    DALLAS SEMICONDUCTOR
描述:

Real Time Clock with NV RAM Control
实时时钟,带有非易失RAM控制器

计时器或实时时钟 微控制器和处理器 外围集成电路
文件: 总25页 (文件大小:304K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DS14285/DS14287  
Real Time Clock with NV RAM Control  
www.dalsemi.com  
FEATURES  
PIN ASSIGNMENT  
Direct replacement for IBM AT computer  
clock/calendar  
VCCO  
VCC  
SQW  
1
24  
23  
X1  
X2  
AD0  
AD1  
AD2  
2
3
4
Functionally compatible with the  
DS1285/DS1287  
Available as chip (DS14285, DS14285S, or  
DS14285Q) or stand-alone module with  
embedded lithium battery and crystal  
(DS14287)  
Automatic backup supply and write  
protection to make external SRAM  
nonvolatile  
22  
21  
CEO  
CEI  
VBAT  
IRQ  
RESET  
DS  
GND  
R/W  
AS  
5
6
20  
19  
AD3  
AD4  
7
8
18  
17  
AD5  
AD6  
AD7  
9
10  
16  
15  
11  
12  
14  
13  
GND  
CS  
DS14285 24-Pin DIP  
Counts seconds, minutes, hours, days, day of  
the week, date, month, and year with leap  
year compensation valid up to 2100  
Binary or BCD representation of time,  
calendar, and alarm  
DS14285S 24-Pin SOIC  
12- or 24-hour clock with AM and PM in  
12-hour mode  
Daylight Savings Time option  
Multiplex bus for pin efficiency  
Interfaced with software as 128 RAM  
locations  
4
3
2
1
28 27 26  
25  
5
6
7
8
AD0  
AD1  
AD2  
AD3  
AD4  
AD5  
NC  
CEI  
VBAT  
IRQ  
RESET  
DS  
GND  
R/W  
24  
23  
22  
21  
20  
19  
9
10  
11  
12 13 14 15 16 17 18  
– 14 bytes of clock and control registers  
– 114 bytes of general purpose RAM  
Programmable square wave output signal  
DS14285Q 28-Pin PLCC  
Bus-compatible interrupt signals ( IRQ )  
Three interrupts are separately software-  
maskable and testable  
VCC  
VCCO  
NC  
NC  
1
24  
23  
– Time-of-day alarm once/second to  
once/day  
– Periodic rates from 122 µs to 500 ms  
– End of clock update cycle  
SQW  
CEO  
CEI  
2
3
4
22  
21  
AD0  
AD1  
AD2  
NC  
5
6
20  
19  
IRQ  
RESET  
DS  
NC  
R/W  
AS  
AD3  
AD4  
7
8
18  
17  
Optional industrial temperature version  
available DS14285 DIP, SOIC, and PLCC  
AD5  
AD6  
AD7  
9
10  
16  
15  
11  
12  
14  
13  
GND  
CS  
DS14287 24-Pin  
Encapsulated Package  
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080400  
DS14285/DS14287  
ORDERING INFORMATION  
DS14285  
RTC Chip; 24-pin DIP  
DS14285N  
DS14285S  
DS14285SN  
DS14285Q  
DS14285QN  
DS14287  
RTC Chip; 24-pin DIP; Industrial Temp Range  
RTC Chip; 24-pin SOIC  
RTC Chip; 24-pin SOIC; Industrial Temp Range  
RTC Chip; 28-pin PLCC  
RTC Chip; 28-pin PLCC; Industrial Temp Range  
RTC Module; 24-pin DIP  
PIN DESCRIPTION  
AD0-AD7  
NC  
- Multiplexed Address/Data Bus  
- No Connection  
MOT  
- Bus Type Select (DS14285Q only)  
CS  
- Chip Select  
AS  
- Address Strobe  
R/ W  
DS  
- Read/Write Input  
- Data Strobe  
RESET  
- Reset Input  
IRQ  
- Interrupt Request Output  
- Square Wave Output  
- +5V Supply  
SQW  
VCC  
GND  
VCCO  
- Ground  
- RAM Power Supply Output  
CEI  
- RAM Chip Enable In  
CEO  
X1, X2  
VBAT  
- RAM Chip Enable Out  
- 32.768 kHz Crystal Connections  
- +3V Battery Input  
DESCRIPTION  
The DS14285/DS14287 Real Time Clock with NVRAM Control provides the industry standard DS1287  
clock function with the additional feature of providing nonvolatile control for an external SRAM.  
Functions include a nonvolatile time-of-day clock, alarm, 100-year calendar, programmable interrupt,  
square wave generator, and 114 bytes of nonvolatile static RAM. For the DS14287 a lithium energy  
source, quartz crystal, and write protection circuitry are contained within a 24-pin dual in-line package.  
The DS14285 requires an external quartz crystal connected to the X1 and X2 pins as well as an external  
energy source connected to the VBAT pin. A standard 32.768 kHz quartz crystal can be directly connected  
to the DS14285 via pins 1 and 2 (X1, X2). The crystal selected for use should have a specified load  
capacitance (CL) of 6 pF. For more information on crystal selection and crystal layout considerations,  
please consult Application Note 58, “Crystal Considerations with Dallas Real-time Clocks.”  
The DS14285/DS14287 uses its backup energy source and battery-backup controller to make a standard  
CMOS static RAM nonvolatile during power-fail conditions. During power fail, the DS14285/DS14287  
automatically write-protects the external SRAM and provides a VCC output sourced from its internal  
battery.  
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DS14285/DS14287  
For the DS14287 the internal lithium cell is electrically isolated from the clock and memory when  
shipped from the factory. This isolation is removed after the first application of VCC, allowing the lithium  
cell to provide data retention to the clock, internal RAM, VCCO and CEO on subsequent power-downs.  
Care must be taken after this isolation has been broken to avoid inadvertently discharging the lithium cell  
through the VCCO and CEO pins.  
OPERATION  
The block diagram in Figure 1 shows the pin connections with the major internal functions of the  
DS14285/DS14287. The following paragraphs describe the function of each pin.  
SIGNAL DESCRIPTIONS  
GND, VCC - DC power is provided to the device on these pins. VCC is the +5 volt input.  
SQW (Square Wave Output) - The SQW pin can output a signal from one of 13 taps provided by the 15  
internal divider stages of the real time clock. The frequency of the SQW pin can be changed by  
programming Register A as shown in Table 1. The SQW signal can be turned on and off using the SQWE  
bit in Register B. The SQW signal is not available when VCC is less than 4.25 volts typical.  
AD0-AD7 (Multiplexed Bi-directional Address/Data Bus) - Multiplexed buses save pins because  
address information and data information time-share the same signal paths. The addresses are present  
during the first portion of the bus cycle and the same pins and signal paths are used for data in the second  
portion of the cycle. Address/data multiplexing does not slow the access time of the DS14285/DS14287  
since the bus change from address to data occurs during the internal RAM access time. Addresses must be  
valid prior to the falling edge of AS/ALE, at which time the DS14285/DS14287 latches the address from  
AD0 to AD6. Valid write data must be present and held stable during the latter portion of the DS or WR  
pulses. In a read cycle the DS14285/DS14287 outputs 8 bits of data during the latter portion of the DS or  
RD pulses. The read cycle is terminated and the bus returns to a high impedance state as DS transitions  
low in the case of Motorola timing or as RD transitions high in the case of Intel timing.  
MOT (Mode Select) - The MOT pin offers the flexibility to choose between to bus types. When  
connected to VCC, Motorola bus timing is selected. When connected to GND or left disconnected, Intel  
bus timing is selected. The pin has an internal pull-down resistance of approximately 20 K. This pin is  
on the DS14285Q only.  
AS (Address Strobe Input) - A positive going address strobe pulse serves to demultiplex the bus. The  
falling edge of AS/ALE causes the address to be latched within the DS14285/DS14287.  
DS (Data Strobe or Read Input) - For the DS14285Q the DS/ RD pin has two modes of operation  
depending on the level of the MOT pin. When the MOT pin is connected to VCC, Motorola bus timing is  
selected. In this mode DS is a positive pulse during the latter portion of the bus cycle and is called Data  
Strobe. During read cycles, DS signifies the time that the DS14285Q is to drive the bidirectional bus. In  
write cycles the trailing edge of DS causes the DS14285Q to latch the written data. When the MOT pin is  
connected to GND, Intel bus timing is selected. In this mode the DS pin is called Read(RD ). RD identifies  
the time period when the DS14285Q drives the bus with read data. The RD signal is the same definition  
as the Output Enable (OE ) signal on a typical memory.  
The DS14285, DS14285S and DS14287 do not have a MOT pin and therefore operate only in Intel bus  
timing mode.  
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DS14285/DS14287  
R/ W (Read/Write Input) - The R/ W pin also has two modes of operation. When the MOT pin is  
connected to VCC for Motorola timing, R/ W is at a level which indicates whether the current cycle is a  
read or write. A read cycle is indicated with a high level on R/ W while DS is high. A write cycle is  
indicated when R/ W is low during DS.  
When the MOT pin is connected to GND for Intel timing, the R/ W signal is an active low signal called  
WR . In this mode the R/ W pin has the same meaning as the Write Enable signal ( WE ) on generic  
RAMs.  
CS (Chip Select Input) - The Chip Select signal must be asserted low for a bus cycle in the  
DS14285/DS14287 to be accessed. CS must be kept in the active state during DS for Motorola timing  
and during RD and WR for Intel timing. Bus cycles which take place without asserting CS will latch  
addresses but no access will occur. When VCC is below 4.25 volts, the DS14285/DS14287 internally  
inhibits access cycles by internally disabling the CS input. This action protects both the real time clock  
data and RAM data during power outages.  
IRQ (Interrupt Request Output) - The IRQ pin is an active low output of the DS14285/DS14287 that  
can be used as an interrupt input to a processor. The IRQ output remains low as long as the status bit  
causing the interrupt is present and the corresponding interrupt-enable bit is set. To clear the IRQ pin the  
processor program normally reads the C register. The RESET pin also clears pending interrupts.  
When no interrupt conditions are present, the IRQ level is in the high impedance state. Multiple  
interrupting devices can be connected to an IRQ bus. The IRQ bus is an open drain output and requires an  
external pull-up resistor.  
RESET (Reset Input) - The RESET pin has no effect on the clock, calendar, or RAM. On power-up the  
RESET pin can be held low for a time in order to allow the power supply to stabilize. The amount of time  
that RESET is held low is dependent on the application. However, if RESET is used on power-up, the  
time RESET is low should exceed 200 ms to make sure that the internal timer that controls the  
DS14285/DS14287 on power-up has timed out. When RESET is low and VCC is above 4.25 volts, the  
following occurs:  
A. Periodic Interrupt Enable (PEI) bit is cleared to 0.  
B. Alarm Interrupt Enable (AIE) bit is cleared to 0.  
C. Update Ended Interrupt Flag (UF) bit is cleared to 0.  
D. Interrupt Request Status Flag (IRQF) bit is cleared to 0.  
E. Periodic Interrupt Flag (PF) bit is cleared to 0.  
F. The device is not accessible until RESET is returned high.  
G. Alarm Interrupt Flag (AF) bit is cleared to 0.  
H. IRQ pin is in the high impedance state.  
I. Square Wave Output Enable (SQWE ) bit is cleared to 0.  
J. Update Ended Interrupt Enable (UIE) is cleared to 0.  
K. CEO is driven high.  
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DS14285/DS14287  
In a typical application RESET can be connected to VCC. This connection will allow the DS14287 to go in  
and out of power fail without affecting any of the control registers.  
CEI (External RAM Chip Enable Input, active low) - CEI should be driven low to enable the external  
RAM. CEI is internally pulled up with a 50kresistor.  
CEO (External RAM Chip Enable Output, active low) - When VCC is greater than 4.25 volts (typical),  
CEO will reflect CEI provided the RESET is at a logic high. When VCC is less than 4.25 volts (typical),  
CEO will be forced to an inactive level regardless of CEI .  
VCCO (External RAM Power Supply Output) - VCCO provides the higher of VCC or VBAT through an  
internal switch to power an external RAM.  
DS14285 Only  
X1, X2 - Connections for a standard 32.768 kHz quartz crystal. The internal oscillator circuitry is  
designed for operation with a crystal having a specified load capacitance (CL) of 6 pF. The crystal is  
connected directly to the X1 and X2 pins. There is no need for external capacitors or resistors. Note: X1  
and X2 are very high impedance nodes. It is recommended that they and the crystal be guard–ringed with  
ground and that high frequency signals be kept away from the crystal area. For more information on  
crystal selection and crystal layout considerations, please consult Application Note 58, “Crystal  
Considerations with Dallas Real Time Clocks.”  
VBAT – Battery input for any standard 3-volt lithium cell or other energy source. See the Power-Up/Down  
section for considerations in selecting the size of the external energy source  
The battery should be connected directly to the VBAT pin. A diode must not be placed in series with the  
battery to the VBAT pin. Furthermore, a diode is not necessary because reverse charging current  
protection circuitry is provided internal to the device and has passed the requirements of Underwriters  
Laboratories for UL listing.  
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DS14285/DS14287  
DS14285/DS14287 BLOCK DIAGRAM Figure 1  
6 of 25  
DS14285/DS14287  
POWER-DOWN/POWER-UP CONSIDERATIONS  
The real time clock function will continue to operate and all of the RAM, time, calendar, and alarm  
memory locations remain nonvolatile regardless of the level of the VCC input. When VCC is applied to the  
DS14285/DS14287 and reaches a level of greater than 4.25 volts (typical), the device becomes accessible  
after 200 ms, provided that the oscillator is running and the oscillator countdown chain is not in reset (see  
Register A). This time period allows the system to stabilize after power is applied. When VCC falls below  
4.25 volts (typical), the chip select input is internally forced to an inactive level regardless of the value of  
CS at the input pin. The DS14285/DS14287 is, therefore, write-protected. When the DS14285/DS14287  
is in a write-protected state, all inputs are ignored and all outputs are in a high impedance state. When  
VCC falls below a level of approximately 3 volts, the external VCC supply is switched off and an internal  
lithium energy source supplies power to the Real-time Clock and the RAM memory.  
An external SRAM can be made nonvolatile by using the VCCO and SRAM chip enable pins (see Figure  
1). Nonvolatile control of the external SRAM is analogous to that of the real time clock registers. When  
VCC slews down during a power fail, CEO is driven to an inactive level regardless CEI . This write  
protection occurs when VCC is less than 4.25 volts (typical).  
During power up, when VCC reaches a level of greater than 4.25 volts (typical), CEO will reflect CEI  
after 200 ms. During power-valid operation, the CEI input is passed to the CEO output with a  
propagation delay of less than 10 ns.  
When VCC is above a level of approximately 3V, the external SRAM will be powered by VCC through the  
VCCO pin. When VCC is below a level of approximately 3V, the external SRAM will be powered by the  
internal lithium cell through the VCCO pin. An internal comparator and switch determine whether VCCO is  
powered by VCC or the internal lithium cell.  
When the device is in battery backup mode, the energy source connected to the VBAT pin in the case of  
the DS14285, or the internal lithium cell in the case of the DS14287 can power an external SRAM for an  
extended period of time. The amount of time that the lithium cell can supply power to the external SRAM  
is a function of the data retention current of the SRAM. The capacity of the lithium cell that is  
encapsulated within the DS14287 module is 130 mAh. If an SRAM with a data retention current of less  
than 1 µA is used and the oscillator current is 300 nA (typical), the cumulative data retention time is  
calculated at more than 11 years.  
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DS14285/DS14287  
RTC ADDRESS MAP  
The address map of the DS14285/DS14287 is shown in Figure 2. The address map consists of 114 bytes  
of user RAM, 10 bytes of RAM that contain the RTC time, calendar, and alarm data, and 4 bytes which  
are used for control and status. All 128 bytes can be directly written or read except for the following:  
1. Registers C and D are read-only.  
2. Bit 7 of Register A is read-only.  
3. The high order bit of the seconds byte is read-only.  
The contents of four registers (A,B,C, and D) are described in the “Registers” section.  
DS14285/DS14287 ADDRESS MAP Figure 2  
TIME, CALENDAR AND ALARM LOCATIONS  
The time and calendar information is obtained by reading the appropriate memory bytes. The time,  
calendar, and alarm are set or initialized by writing the appropriate RAM bytes. The contents of the 10  
time, calendar, and alarm bytes can be either Binary or Binary-Coded Decimal (BCD) format. Before  
writing the internal time, calendar, and alarm registers, the SET bit in Register B should be written to a  
logic 1 to prevent updates from occurring while access is being attempted. In addition to writing the 10  
time, calendar, and alarm registers in a selected format (binary or BCD), the data mode bit (DM) of  
Register B must be set to the appropriate logic level. All 10 time, calendar, and alarm bytes must use the  
same data mode. The set bit in Register B should be cleared after the data mode bit has been written to  
allow the real-time clock to update the time and calendar bytes. Once initialized, the real-time clock  
makes all updates in the selected mode. The data mode cannot be changed without reinitializing the 10  
data bytes. Table 1 shows the binary and BCD formats of the ten time, calendar, and alarm locations. The  
24-12 bit cannot be changed without reinitializing the hour locations. When the 12-hour format is  
selected, the high order bit of the hours byte represents PM when it is a logic one. The time, calendar,  
8 of 25  
DS14285/DS14287  
and alarm bytes are always accessible because they are double buffered. Once per second the 10 bytes are  
advanced by 1 second and checked for an alarm condition. If a read of the time and calendar data occurs  
during an update, a problem exists where seconds, minutes, hours, etc. may not correlate. The probability  
of reading incorrect time and calendar data is low. Several methods of avoiding any possible incorrect  
time and calendar reads are covered later in this text.  
The three alarm bytes can be used in two ways. First, when the alarm time is written in the appropriate  
hours, minutes, and seconds alarm locations, the alarm interrupt is initiated at the specified time each day  
if the alarm enable bit is high. The second use condition is to insert a “don’t care” state in one or more of  
the 3 alarm bytes. The “don’t care” code is any hexadecimal value from C0 to FF. The 2 most significant  
bits of each byte set the “don’t care” condition when at logic 1. An alarm will be generated each hour  
when the “don’t care” bits are set in the hours byte. Similarly, an alarm is generated every minute with  
“don’t care” codes in the hours and minute alarm bytes. The “don’t care” codes in all three alarm bytes  
create an interrupt every second.  
TIME, CALENDAR AND ALARM DATA MODES Table 1  
RANGE  
ADDRESS  
DECIMAL  
RANGE  
0-59  
FUNCTION  
LOCATION  
BINARY DATA MODE BCD DATA MODE  
00-3B  
00-3B  
00-3B  
00-3B  
01-0C AM, 81-8C PM  
0
1
2
3
4
Seconds  
Seconds Alarm  
Minutes  
Minutes Alarm  
Hours-12-hr Mode  
Hours-24-hr Mode  
Hours Alarm-12-hr  
Hours Alarm-24-hr  
Day of the Week  
Sunday = 1  
00-59  
00-59  
00-59  
00-59  
01-12AM, 81-92PM  
00-23  
01-12AM, 81-92PM  
00-23  
0-59  
0-59  
0-59  
1-12  
0-23  
00-17  
5
6
1-12  
0-23  
1-7  
01-0C AM, 81-8C PM  
00-17  
01-07  
01-07  
7
8
9
Date of the Month  
Month  
Year  
1-31  
1-12  
0-99  
01-1F  
01-0C  
00-63  
01-31  
01-12  
00-99  
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DS14285/DS14287  
CONTROL REGISTERS  
The DS14285/DS14287 has four control registers which are accessible at all times, even during the  
update cycle.  
REGISTER A  
MSB  
LSB  
BIT 0  
RS0  
BIT 7  
UIP  
BIT 6  
DV2  
BIT 5  
DV1  
BIT 4  
DV0  
BIT 3  
RS3  
BIT 2  
RS2  
BIT 1  
RS1  
UIP - The Update In Progress (UIP) bit is a status flag that can be monitored. When the UIP bit is a 1, the  
update transfer will soon occur. When UIP is a 0, the update transfer will not occur for at least 244 µs.  
The time, calendar, and alarm information in RAM is fully available for access when the UIP bit is 0. The  
UIP bit is read-only and is not affected by RESET . Writing the SET bit in Register B to a 1 inhibits any  
update transfer and clears the UIP status bit.  
DV0, DV1, DV2 - These 3 bits are used to turn the oscillator on or off and to reset the countdown chain.  
A pattern of 010 is the only combination of bits that will turn the oscillator on and allow the RTC to keep  
time. A pattern of 11X will enable the oscillator but holds the countdown chain in reset. The next update  
will occur at 500 ms after a pattern of 010 is written to DV0, DV1, and DV2.  
RS3, RS2, RS1, RS0 - These four rate-selection bits select one of the 13 taps on the 15-stage divider or  
disable the divider output. The tap selected can be used to generate an output square wave (SQW pin)  
and/or a periodic interrupt. The user can do one of the following:  
1. Enable the interrupt with the PIE bit;  
2. Enable the SQW output pin with the SQWE bit;  
3. Enable both at the same time and the same rate; or  
4. Enable neither.  
Table 2 lists the periodic interrupt rates and the square wave frequencies that can be chosen with the RS  
bits. These 4 read/write bits are not affected by RESET .  
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DS14285/DS14287  
REGISTER B  
MSB  
LSB  
BIT 0  
DSE  
BIT 7  
SET  
BIT 6  
PIE  
BIT 5  
AIE  
BIT 4  
UIE  
BIT 3  
SQWE  
BIT 2  
DM  
BIT 1  
24/12  
SET - When the SET bit is a 0, the update transfer functions normally by advancing the counts once per  
second. When the SET bit is written to a 1, any update transfer is inhibited and the program can initialize  
the time and calendar bytes without an update occurring in the midst of initializing. Read cycles can be  
executed in a similar manner. SET is a read/write bit that is not modified by RESET or internal functions  
of the DS14285/DS14287.  
PIE - The periodic interrupt enable PIE bit is a read/write bit which allows the Periodic Interrupt Flag  
(PF) bit in Register C to drive the IRQ pin low. When the PIE bit is set to 1, periodic interrupts are  
generated by driving the IRQ pin low at a rate specified by the RS3-RS0 bits of Register A. A 0 in the  
PIE bit blocks the IRQ output from being driven by a periodic interrupt, but the Periodic Flag (PF) bit is  
still set at the periodic rate. PIE is not modified by any internal DS14285/DS14287 functions, but is  
cleared to 0 on RESET .  
AIE - The Alarm Interrupt Enable (AIE) bit is a read/write bit which, when set to a 1, permits the Alarm  
Flag (AF) bit in register C to assert IRQ . An alarm interrupt occurs for each second that the 3 time bytes  
equal the 3 alarm bytes including a “don’t care” alarm code of binary 11XXXXXX. When the AIE bit is  
set to 0, the AF bit does not initiate the IRQ signal. The RESET pin clears AIE to 0. The internal  
functions of the DS14285/DS14287 do not affect the AIE bit.  
UIE - The Update Ended Interrupt Enable (UIE) bit is a read/write that enables the Update End Flag (UF)  
bit in Register C to assert IRQ . The RESET pin going low or the SET bit going high clears to UIE bit.  
SQWE - When the Square Wave Enable (SQWE) bit is set to a 1, a square wave signal at the frequency  
set by the rate-selection bits RS3 through RS0 is driven out on a SQW pin. When the SQWE bit is set to  
0, the SQW pin is held low; the state of SQWE is cleared by the RESET pin. SQWE is a read/write bit.  
DM - The Data Mode (DM) bit indicates whether time and calendar information is in binary or BCD  
format. The DM bit is set by the program to the appropriate format and can be read as required. This bit is  
not modified by internal functions or RESET . A one in DM signifies binary data while a 0 in DM  
specifies Binary Coded Decimal (BCD) data.  
24/12 - The 24/12 control bit establishes the format of the hours byte. A 1 indicates the 24-hour mode and  
a 0 indicates the 12-hour mode. This bit is read/write and is not affected by internal functions of RESET .  
DSE - The Daylight Savings Enable (DSE) bit is a read/write bit which enables two special updates when  
DSE is set to 1. On the first Sunday in April the time increments from 1:59:59 AM to 3:00:00 AM. On  
the last Sunday in October when the time first reaches 1:59:59 AM it changes to 1:00:00 AM. These  
special updates do not occur when the DSE bit is a 0. This bit is not affected by internal functions or  
RESET .  
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DS14285/DS14287  
REGISTER C  
MSB  
LSB  
BIT 0  
0
BIT 7  
IRQF  
BIT 6  
PF  
BIT 5  
AF  
BIT 4  
UF  
BIT 3  
0
BIT 2  
0
BIT 1  
0
IRQF - The Interrupt Request Flag (IRQF) bit is set to a 1 when one or more of the following are true:  
PF = PIE = 1  
AF = AIE = 1  
UF = UIE = 1  
That is, IRQF = PF =PIE + AF =AIE + UF =UIE.  
Any time the IRQF bit is a 1, the IRQ pin is driven low. All flag bits are cleared after Register C is read  
by the program or when the RESET pin is low.  
PF - The Periodic Interrupt Flag (PF) is a read-only bit which is set to a 1 when an edge is detected on the  
selected tap of the divider chain. The RS3 through RS0 bits establish the periodic rate. PF is set to a 1  
independent of the state of the PIE bit. When both PF and PIE are 1s, the IRQ signal is active and will set  
the IRQF bit. The PF bit is cleared by a RESET or a software read of Register C.  
AF - A 1 in the Alarm Interrupt Flag (AF) bit indicates that the current time has matched the alarm time.  
If the AIE bit is also a 1, the IRQ pin will go low and a one will appear in the IRQF bit. A RESET or a  
read of Register C will clear AF.  
UF - The Update Ended Interrupt Flag (UF) bit is set after each update cycle. When the UIE bit is set to  
1, the 1 in UF causes the IRQF bit to be a 1 which will assert the IRQ pin. UF is cleared by reading  
Register C or a RESET .  
BIT 0 THROUGH BIT 3 - These are unused bits of the status Register C. These bits always read 0 and  
cannot be written.  
REGISTER D  
MSB  
LSB  
BIT 0  
BIT 7  
VRT  
BIT 6  
0
BIT 5  
0
BIT 4  
0
BIT 3  
0
BIT 2  
0
BIT 1  
0
0
VRT - The Valid RAM and Time (VRT) bit indicates the condition of the internal battery (the battery  
connected to the VBAT pin in the case of the DS14285S, DS14285, and the DS14285Q). This bit is not  
writable and should always be a 1 when read. If a 0 is ever present, an exhausted internal lithium energy  
source is indicated and both the contents of the RTC data and RAM data are questionable. This bit is  
unaffected by RESET .  
BIT 6 THROUGH BIT 0 - The remaining bits of Register D are not usable. They cannot be written and,  
when read, they will always read 0.  
12 of 25  
DS14285/DS14287  
NONVOLATILE RAM  
The 114 general purpose nonvolatile RAM bytes are not dedicated to any special function within the  
DS14285/DS14287. They can be used by the processor program as nonvolatile memory and are fully  
available during the update cycle.  
The DS14285/DS14287 can also provide additional nonvolatile RAM. This is accomplished through the  
use of its internal lithium cell in the case of the DS14287 (or the energy source connected to the VBAT pin  
in the case of the DS14285) and battery-backup controller to make a standard CMOS SRAM nonvolatile  
during power-fail conditions. During power-fail, the DS14285/DS14287 automatically write-protects the  
external SRAM and provides a VCC output sourced from the internal lithium cell. The interface between  
the DS14285/DS14287 and an external SRAM is illustrated in Figure 3.  
EXTERNAL SRAM INTERFACE TO THE DS14285/DS14287 RTC Figure 3  
INTERRUPTS  
The RTC plus RAM includes three separate, fully automatic sources of interrupt for a processor. The  
alarm interrupt can be programmed to occur at rates from once per second to once per day. The periodic  
interrupt can be selected for rates from 500 ms to 122 µs. The update-ended interrupt can be used to  
indicate to the program that an update cycle is complete. Each of these independent interrupt conditions is  
described in greater detail in other sections of this text.  
The processor program can select which interrupts, if any, are going to be used. Three bits in Register B  
enable the interrupts. Writing a logic 1 to an interrupt-enable bit permits that interrupt to be initiated when  
the event occurs. A 0 in an interrupt-enable bit prohibits the IRQ pin from being asserted from that  
interrupt condition. If an interrupt flag is already set when an interrupt is enabled, IRQ is immediately set  
at an active level, although the interrupt initiating the event may have occurred much earlier. As a result,  
there are cases where the program should clear such earlier initiated interrupts before first enabling new  
interrupts. When an interrupt event occurs, the relating flag bit is set to logic 1 in Register C. These flag  
bits are set independent of the state of the corresponding enable bit in Register B. The flag bit can be used  
in a polling mode without enabling the corresponding enable bits. The interrupt flag bit is a status bit  
which software can interrogate as necessary. When a flag is set, an indication is given to software that an  
interrupt event has occurred since the flag bit was last read; however, care should be taken when using the  
flag bits as they are cleared each time Register C is read. Double latching is included with Register C so  
13 of 25  
DS14285/DS14287  
that bits which are set remain stable throughout the read cycle. All bits which are set (high) are cleared  
when read and new interrupts which are pending during the read cycle are held until after the cycle is  
completed. One, 2, or 3 bits can be set when reading Register C. Each utilized flag bit should be  
examined when read to ensure that no interrupts are lost.  
The second flag bit usage method is with fully enabled interrupts. When an interrupt flag bit is set and the  
corresponding interrupt enable bit is also set, the IRQ pin is asserted low. IRQ is asserted as long as at  
least one of the three interrupt sources has its flag and enable bits both set. The IRQF bit in Register C is  
a one whenever the IRQ pin is being driven low. Determination that the RTC initiated an interrupt is  
accomplished by reading Register C. A logic one in bit 7 (IRQF bit) indicates that one or more interrupts  
have been initiated by the DS14285/DS14287. The act of reading Register C clears all active flag bits and  
the IRQF bit.  
PERIODIC INTERRUPT SELECTION  
The periodic interrupt will cause the IRQ pin to go to an active state from once every 500 ms to once  
every 122 µs. This function is separate from the alarm interrupt which can be output from once per  
second to once per day. The periodic interrupt rate is selected using the same Register A bits which select  
the square wave frequency (see Table 2). Changing the Register A bits affects both the square wave  
frequency and the periodic interrupt output. However, each function has a separate enable bit in Register  
B. The SQWE bit controls the square wave output. Similarly, the periodic interrupt is enabled by the PIE  
bit in Register B. The periodic interrupt can be used with software counters to measure inputs, create  
output intervals, or await the next needed software function.  
OSCILLATOR CONTROL BITS  
When the DS14287 is shipped from the factory, the internal oscillator is turned off. This feature prevents  
the lithium energy cell from being used until it is installed in a system. A pattern of 010 in bits 4 through  
6 of Register A will turn the oscillator on and enable the countdown chain. A pattern of 11X will turn the  
oscillator on, but holds the countdown chain of the oscillator in reset. All other combinations of bits 4  
through 6 keep the oscillator off.  
SQUARE WAVE OUTPUT SELECTION  
Thirteen of the 15 divider taps are made available to a 1-of-15 selector, as shown in the block diagram of  
Figure 1. The first purpose of selecting a divider tap is to generate a square wave output signal on the  
SQW pin. The RS0-RS3 bits in Register A establish the square wave output frequency. These  
frequencies are listed in Table 2. The SQW frequency selection shares its 1-of-15 selector with the  
periodic interrupt generator. Once the frequency is selected, the output of the SQW pin can be turned on  
and off under program control with the square wave enable bit (SQWE).  
14 of 25  
DS14285/DS14287  
PERIODIC INTERRUPT RATE AND  
SQUARE WAVE OUTPUT FREQUENCY Table 2  
SELECT BITS REGISTER A  
tPI PERIODIC  
INTERRUPT RATE  
None  
SQW OUTPUT  
FREQUENCY  
None  
RS3  
0
RS2  
0
RS1  
0
RS0  
0
0
0
0
0
0
0
0
1
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
3.90625 ms  
7.8125 ms  
122.070 µs  
244.141 µs  
488.281 µs  
976.5625 µs  
1.953125 ms  
3.90625 ms  
7.8125 ms  
15.625 ms  
31.25 ms  
256 Hz  
128 Hz  
8.192 kHz  
4.096 kHz  
2.048 kHz  
1.024 kHz  
512 Hz  
256 Hz  
128 Hz  
64 Hz  
1
1
1
0
0
0
0
1
1
1
0
1
32 Hz  
1
1
0
0
62.5 ms  
16 Hz  
1
1
0
1
125 ms  
8 Hz  
1
1
1
0
250 ms  
4 Hz  
1
1
1
1
500 ms  
2 Hz  
UPDATE CYCLE  
The DS14285/DS14287 executes an update cycle once per second regardless of the SET bit in Register B.  
When the SET bit in Register B is set to one, the user copy of the double buffered time, calendar, and  
alarm bytes is frozen and will not update as the time increments. However, the time countdown chain  
continues to update the internal copy of the buffer. This feature allows time to maintain accuracy  
independent of reading or writing the time, calendar, and alarm buffers and also guarantees that time and  
calendar information is consistent. The update cycle also compares each alarm byte with the  
corresponding time byte and issues an alarm if a match or if a “don’t care” code is present in all three  
positions.  
There are three methods that can handle access of the real-time clock that avoid any possibility of  
accessing inconsistent time and calendar data. The first method uses the update-ended interrupt. If  
enabled, an interrupt occurs after every up date cycle that indicates that over 999 ms are available to read  
valid time and date information. If this interrupt is used, the IRQF bit in Register C should be cleared  
before leaving the interrupt routine.  
A second method uses the update-in-progress bit (UIP) in Register A to determine if the update cycle is in  
progress. The UIP bit will pulse once per second. After the UIP bit goes high, the update transfer occurs  
244 µs later. If a low is read on the UIP bit, the user has at least 244 µs before the time/calendar data will  
be changed. Therefore, the user should avoid interrupt service routines that would cause the time needed  
to read valid time/calendar data to exceed 244 µs.  
The third method uses a periodic interrupt to determine if an update cycle is in progress. The UIP bit in  
Register A is set high between the setting of the PF bit in Register C (see Figure 4). Periodic interrupts  
that occur at a rate of greater than tBUC allow valid time and date information to be reached at each  
occurrence of the periodic interrupt. The reads should be complete within 1 (tPI/ + tBUC) to ensure that  
2
data is not read during the update cycle.  
15 of 25  
DS14285/DS14287  
UPDATE-ENDED AND PERIODIC INTERRUPT RELATIONSHIP Figure 4  
16 of 25  
DS14285/DS14287  
ABSOLUTE MAXIMUM RATINGS*  
Voltage on Any Pin Relative to Ground  
Storage Temperature  
-0.5V to +7.0V  
-40°C to +85°C  
Soldering Temperature  
DIP: 260°C for 10 seconds (See Note 12)  
See IPC/JEDEC Standard J-STD-020A for Surface Mount  
Devices  
* This is a stress rating only and functional operation of the device at these or any other conditions above  
those indicated in the operation sections of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods of time may affect reliability.  
Operating Range  
Range  
Commercial  
Industrial  
Temperature  
0°C to +70°C  
-40°C to +85°C  
Vcc  
5V ±10%  
5V ±10%  
RECOMMENDED DC OPERATING CONDITIONS Over the operating range  
PARAMETER  
Power Supply Voltage  
Battery Voltage  
Input Logic 1  
SYMBOL  
VCC  
MIN  
4.5  
2.5  
2.2  
-0.3  
TYP  
5.0  
MAX  
5.5  
3.6  
VCC+0.3  
+0.8  
UNITS NOTES  
V
V
V
V
1
1
1
1
Vbat  
VIH  
VIL  
Input Logic 0  
DC ELECTRICAL CHARACTERISTICS Over the operating range  
PARAMETER  
Power Supply Current  
Oscillator Current  
Input Leakage  
SYMBOL  
ICC1  
MIN  
TYP  
7
300  
MAX  
15  
500  
+1.0  
+1.0  
+500  
200  
UNITS NOTES  
mA  
nA  
µA  
µA  
µA  
µA  
2
IOSC  
IIL  
-1.0  
-1.0  
-1.0  
-1.0  
3
5
3
4
I/O Leakage  
ILO  
MOT Input Current  
IMOT  
I
CEI  
CEI Input Current  
ZCE  
60  
11  
CEI to CEO Impedance  
Output @ 2.4V  
Output @ 0.4V  
Write-Protect Voltage  
VCCO Voltage  
VCCO Voltage  
IOH  
IOL  
VTP  
VCCO1  
VCCO2  
-1.0  
mA  
mA  
V
V
V
1, 6  
1
4.0  
4.5  
4.0  
VCC-0.3V  
VBAT-0.3V  
4.25  
7
8
CAPACITANCE  
PARAMETER  
Input Capacitance  
Output Capacitance  
(tA = 25°C)  
SYMBOL  
CIN  
MIN  
TYP  
MAX  
UNITS NOTES  
5
7
pF  
pF  
COUT  
17 of 25  
DS14285/DS14287  
AC ELECTRICAL CHARACTERISTICS Over the operating range  
PARAMETER  
SYMBOL MIN  
TYP  
MAX  
UNITS NOTES  
Cycle  
tCYC  
PWEL  
225  
115  
DC  
ns  
ns  
Pulse Width, DS/E Low or RD/ WR  
High  
PWEH  
80  
ns  
Pulse Width, DS/E Low or RD/ WR  
Low  
Input Rise and Fall Time  
tR, tF  
tRWH  
30  
50  
ns  
ns  
10  
10  
20  
R/ W Hold Time  
tRWS  
tCS  
ns  
ns  
R/ W Setup Time Before DS/E  
Chip Select Setup Time Before DS,  
WR , or RD  
Chip Select Hold Time  
Read Data Hold Time  
Write Data Hold Time  
Muxed Address Valid Time to AS/ALE  
Fall  
tCH  
tDHR  
tDHW  
tASL  
0
10  
0
ns  
ns  
ns  
ns  
30  
Muxed Address Hold Time  
Delay Time DS/E to AS/ALE Rise  
Pulse Width AS/ALE High  
Delay Time, AS/ALE to DS/E Rise  
Output Data Delay Time From DS/E or  
tAHL  
tASD  
PWASH  
tASED  
tDDR  
10  
20  
60  
35  
10  
ns  
ns  
ns  
ns  
75  
ns  
9
RD  
Data Setup Time  
Reset Pulse Width  
tDSW  
tRWL  
tIRDS  
60  
5
ns  
µs  
µs  
2
2
IRQ Release from DS  
tIRR  
µs  
IRQ Release from RESET  
AC TEST CONDITIONS  
Input Pulse Level: 0 to 3.0V  
Input Rise/Fall Times: 5 ns  
Input and Output Timing Reference Levels: 1.5V  
OUTPUT LOAD Figure 5  
18 of 25  
DS14285/DS14287  
DS14285 BUS TIMING FOR MOTOROLA INTERFACE  
DS14285/DS14287 BUS TIMING FOR INTEL INTERFACE WRITE CYCLE  
19 of 25  
DS14285/DS14287  
DS14285/DS14287 BUS TIMING FOR INTEL INTERFACE READ CYCLE  
DS14285/DS14287 IRQ RELEASE DELAY TIMING  
20 of 25  
DS14285/DS14287  
POWER-DOWN/POWER-UP TIMING  
POWER-DOWN/POWER-UP TIMING  
PARAMETER  
SYMBOL MIN  
TYP  
MAX  
UNITS NOTES  
tPD  
0
µs  
CS at VIH before Power-Down  
VCC slew from 4.5V to 0V (CS at VIH)  
VCC slew from 0V to 4.5V (CS at VIH)  
tF  
300  
100  
20  
µs  
µs  
ms  
ns  
tR  
tREC  
tCED  
200  
10  
CS at VIH after Power-Up  
Chip Enable Propagation Delay to  
External SRAM  
(tA = 25°C)  
PARAMETER  
Expected Data Retention for DS14287  
SYMBOL MIN  
tDR 10  
TYP  
MAX  
UNITS NOTES  
years  
10  
NOTE:  
The real-time clock will keep time to an accuracy of+1 minute per month during data retention time for  
the period of tDR.  
WARNING:  
Under no circumstances are negative undershoots, of any amplitude, allowed when device is in battery  
backup mode.  
21 of 25  
DS14285/DS14287  
NOTES:  
1. All voltages are referenced to ground.  
2. All outputs are open.  
3. The MOT pin has an internal pull-down of 20 k.  
4. The CEI pin has an internal pull-up of 50 k.  
5. Applies to the AD0-AD7 pins, the IRQ pin, and the SQW pin when each is in the high impedance  
state.  
6. The IRQ pin is open drain. The interrupt and the internal clock continue to run regardless of the level  
of VCC. However, it is important to insure that the pullup resistor used with the interrupt pin is never  
pulled up to a value which is greater than VCC + 0.3V. As VCC falls below approximately 3.0 volts,  
a power switching circuit turns the lithium energy source on to maintain the clock and timer data  
functionality.  
7. ICCO =100 mA, VCC > VBAT  
.
8. ICCO =100 µA, VCC < VBAT  
.
9. Measured with a load as shown in Figure 5.  
10. Expected data retention is based on using an external SRAM with a data retention current of less than  
1 µA at 25°C.  
11. ZCE is an average input-to-output impedance as the input is swept from ground to VCCI and less than 4  
mA is forced through ZCE.  
12. Real-Time Clock Modules such as the DS14287 can be successfully processed through conventional  
wave-soldering techniques as long as temperature exposure to the lithium energy source contained  
within does not exceed +85°C. Post-solder cleaning with water washing techniques is acceptable,  
provided that ultrasonic vibration is not used.  
22 of 25  
DS14285/DS14287  
DS14285 24-PIN DIP  
PKG  
DIM  
24-PIN  
MIN  
MAX  
A IN.  
MM  
B IN.  
MM  
C IN.  
MM  
1.245  
31.62  
0.530  
13.46  
0.140  
3.56  
1.270  
32.25  
0.550  
13.97  
0.160  
4.06  
D IN.  
MM  
E IN.  
MM  
F IN.  
MM  
0.600  
15.24  
0.015  
0.380  
0.120  
3.05  
0.625  
15.88  
0.050  
1.27  
0.145  
3.68  
G IN.  
MM  
0.090  
2.29  
0.110  
2.79  
H IN.  
MM  
J IN.  
MM  
0.625  
15.88  
0.008  
0.20  
0.675  
17.15  
0.012  
0.30  
K IN.  
MM  
0.015  
0.38  
0.022  
0.56  
DS14285 24-PIN SOIC  
PKG  
DIM  
24-PIN  
MIN  
MAX  
A IN.  
MM  
B IN.  
MM  
0.602  
15.29  
0.290  
7.37  
0.612  
15.54  
0.300  
7.65  
C IN.  
MM  
0.089  
2.26  
0.095  
2.41  
E IN.  
MM  
F IN.  
MM  
0.004  
0.102  
0.094  
2.38  
0.012  
0.30  
0.105  
2.68  
G IN.  
MM  
0.050 BSC  
1.27 BSC  
H IN.  
MM  
J IN.  
MM  
K IN.  
MM  
0.398  
0.416  
10.57  
0.013  
0.33  
0.019  
0.48  
10.11  
0.009  
0.229  
0.013  
0.33  
L IN.  
MM  
0.016  
0.406  
0.040  
1.02  
phi  
0°  
8°  
23 of 25  
DS14285/DS14287  
DS14285Q 28-PIN PLCC  
PKG  
DIM  
A
A1  
A2  
B
B1  
C
D
D1  
D2  
E
E1  
E2  
L1  
N
28-PIN  
MIN  
MAX  
0.180  
0.120  
-
0.165  
0.090  
0.020  
0.026  
0.013  
0.009  
0.485  
0.450  
0.390  
0.485  
0.450  
0.390  
0.060  
28  
0.033  
0.021  
0.012  
0.495  
0.456  
0.430  
0.495  
0.456  
0.430  
-
-
e1  
CH1  
0.050 BSC  
0.042  
0.048  
24 of 25  
DS14285/DS14287  
DS14287 REAL-TIME CLOCK PLUS RAM  
PKG  
DIM  
24-PIN  
NOTE:  
PINS 2, 3, 16, AND 20 ARE MISSING BY DESIGN.  
MIN  
MAX  
A IN.  
MM  
B IN.  
MM  
C IN.  
MM  
1.320  
33.53  
0.720  
18.29  
0.345  
8.76  
1.335  
33.91  
0.740  
18.80  
0.370  
9.40  
D IN.  
MM  
0.100  
2.54  
0.130  
3.30  
E IN.  
MM  
0.015  
0.38  
0.030  
0.76  
F IN.  
MM  
0.110  
2.79  
0.140  
3.56  
G IN.  
MM  
0.090  
2.29  
0.110  
2.79  
H IN.  
MM  
J IN.  
MM  
0.590  
14.99  
0.008  
0.20  
0.630  
16.00  
0.012  
0.30  
K IN.  
MM  
0.015  
0.38  
0.021  
0.53  
25 of 25  

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