KH960-HM175BS-7100E [DFI]

7th Gen Intel Core Processor COM Express Basic;
KH960-HM175BS-7100E
型号: KH960-HM175BS-7100E
厂家: DFI    DFI
描述:

7th Gen Intel Core Processor COM Express Basic

文件: 总2页 (文件大小:838K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
7th Gen Intel® CoreTM Processor  
COM Express® Basic  
Features  
KH960-HM175  
• Dual channel DDR4 2400MHz SODIMM up to 32GB  
• Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI  
Supports three independent displays  
HM175  
BGA 1440  
• eDP resolution supports up to 4096x2304 @ 60Hz  
• Multiple expansion: 1 PCIe x16, 8 PCIe x1  
• Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0  
* Populated by default  
DDR4_2  
SODIMM  
DDR4_1  
SODIMM  
850C  
R
2.1  
Intel HM175  
-400C  
Wide  
Temperature  
Type  
6
3 Displays  
USB 3.0  
SATA 3.0  
CPU Fan  
Mechanical Drawing  
Block Diagram  
DDR4 2400MHz  
SODIMM  
Processor  
(optional)  
Channel A  
Channel B  
CORE CORE  
CORE CORE  
DDR4 2400MHz  
SODIMM  
eDP  
LVDS  
7th Generation  
PTN3460  
PCIe x16 (PEG)  
Intel® Corei7/i5/i3  
DDI Port 1  
DDI Port 2  
Memory  
Controller  
Graphics  
CORE  
VGA  
CH7517  
LPC Bus  
Serial Port 0,1  
SLP/LID  
ꢀ5.15  
ꢀ1.07  
WDT  
Embedded  
ꢀ1.07  
4ꢀ.55  
Fan PWM/  
TACH_IN  
Controller  
IT8528E  
I
2C Bus  
USB 3.0 4x  
Mobile  
Intel® HM175  
Chipset  
PCIe (2 x1/1 x2)  
PCIe (4 x1/1 x4)  
PCIe (2 x1/1 x2)  
PCIe x1  
MDI  
Intel® GLAN  
I219LM  
USB 2.0 8x  
SATA 3.0 4x  
4.08  
0.00  
4.08  
HDA  
SPI Bus  
SPI Flash  
PCIe L0~3  
PCIe L4~5  
x2  
PCIe L6~7  
x2  
x4  
x4  
x2  
x2  
x1  
x1  
x1  
x1  
x1  
x1  
x1  
x1  
* 8 x PCIe x1 or 2 x PCIe x4 or 4 x PCIe x2  
KH960-HM175  
Specifications  
SYSTEM  
Processor  
7th Generation Intel® CoreTM Processors, BGA 1440  
Intel® Core™ i7-7820EQ Processor, Quad Core, 8M Cache, 3.0GHz (3.7GHz), 45W  
Intel® Core™ i5-7440EQ Processor, Quad Core, 6M Cache, 2.9GHz (3.6GHz), 45W  
Intel® Core™ i5-7442EQ Processor, Quad Core, 6M Cache, 2.1GHz (2.9GHz), 25W  
Intel® Core™ i3-7100E Processor, Dual Core, 3M Cache, 2.9GHz, 35W  
Intel® Core™ i3-7102E Processor, Dual Core, 3M Cache, 2.1GHz, 25W  
Intel® HM175 Chipset  
Chipset  
Memory  
BIOS  
Controller  
Feature  
Two 260-pin SODIMM up to 32GB  
Insyde SPI 128Mbit  
Dual Channel DDR4 2400MHz  
GRAPHICS  
Intel® HD Graphics  
OpenGL up to 5.0, DirectX 11, OpenCL 2.1  
HW Decode: HEVC/H.265, H.264, M/JPEG, MPEG2, VC1/WMV9, VP8 (8-bit), VP9 (10-bit)  
HW Encode: HEVC/H.265, M/JPEG, MPEG2, VP8  
Display  
1 x VGA/DDI (DDI available upon request)  
1 x LVDS/eDP (eDP available upon request)  
2 x DDI (HDMI/DVI/DP++)  
VGA: resolution up to 1920x1200 @ 60Hz  
LVDS: dual channel 24-bit, resolution up to 1920x1200 @ 60Hz  
HDMI: resolution up to 4096x2160 @ 30 24bpp  
DVI: resolution up to 1920x1200 @ 60Hz  
DP++/eDP: resolution up to 4096x2304 @ 60Hz  
Triple Displays  
Interface  
VGA + LVDS + DDI or VGA + DDI1 + DDI2 eDP + 2 DDI (available upon request)  
EXPANSION  
1 x PCIe x16 or 2 x PCIe x8 (Gen 3)  
8 x PCIe x1 or 2 x PCIe x4 or 4 x PCIe x2 (Gen 3)  
1 x LPC  
1 x I2C  
1 x SMBus  
2 x UART (TX/RX)  
AUDIO  
ETHERNET  
I/O  
Interface  
Controller  
USB  
HD Audio  
1 x Intel® I219LM PCIe (10/100/1000Mbps)  
4 x USB 3.0  
8 x USB 2.0  
SATA  
4 x SATA 3.0 (up to 6Gb/s)  
DIO  
1 x 8-bit DIO (Default 4 inputs and 4 outputs)  
System Reset, Programmable via Software from 1 to 255 Seconds  
Available Upon Request  
WATCHDOG TIMER  
SECURITY  
Output & Interval  
TPM  
POWER  
Type  
12V, 5VSB, VCC_RTC (ATX mode)  
12V, VCC_RTC (AT mode)  
Consumption  
TBD  
OS SUPPORT  
Windows: Windows 10 IoT Enterprise 64-bit LINUX: Yocto Project v2.2  
ENVIRONMENT  
Temperature  
Operating: 0 to 60°C  
-40 to 85°C  
Storage: -40 to 85°C  
Humidity  
MTBF  
Dimensions  
Compliance  
Operating: 5 to 90% RH  
TBD  
COM Express® Basic  
PICMG COM Express® R2.1, Type 6  
Storage: 5 to 90% RH  
MECHANICAL  
95mm (3.74") x 125mm (4.9")  
Ordering Information  
Model Name  
KH960-HM175BS-7100E 770-KH9602-500G  
KH960-HM175BS-7102E 770-KH9602-600G  
P/N  
Processor  
i3-7100E  
i3-7102E  
Memory  
2 SODIMM VGA  
2 SODIMM VGA  
VGA/DDI LVDS/eDP GbE USB 3.0 USB 2.0 Power Thermal Temp.  
LVDS  
LVDS  
1
1
4
4
8
8
ATX/AT Cooler  
ATX/AT Cooler  
0 to 60oC  
0 to 60oC  
Note: Core i5 and i7 are supported upon request with MOQ requirement.  
Optional Items  
Packing List  
COM332-B carrier board kit  
• Heat spreader (Height: 11mm)  
770-CM3321-000G  
A71-011073-000G  
• 1 KH960-HM175 board  
• 1 Cooler (Height: 36.58mm)  
or 1 Cooler (Height: 45.3mm)  
StandardA71-111026-000G  
Wide-TempA71-111040-000G  
DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your sales  
representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © February 25, 2020 DFI Inc.  
www.dfi.com  

相关型号:

KH960-HM175BS-7102E

7th Gen Intel Core Processor COM Express Basic
DFI

KH960-QM175BS-7440EQ

Intel Xeon/7th Gen Intel CoreTM Processor COM Express Basic
DFI

KH960-QM175BS-7442EQ

Intel Xeon/7th Gen Intel CoreTM Processor COM Express Basic
DFI

KH960-QM175BS-7820EQ

Intel Xeon/7th Gen Intel CoreTM Processor COM Express Basic
DFI

KHAE-11A11B-12

General Purpose Dry Circuit to 5A Multicontact AC or DC Relay
TE

KHAE-11A11B-120

General Purpose Dry Circuit to 5A Multicontact AC or DC Relay
TE

KHAE-11A11B-24

General Purpose Dry Circuit to 5A Multicontact AC or DC Relay
TE

KHAE-11A11B-240

General Purpose Dry Circuit to 5A Multicontact AC or DC Relay
TE

KHAE-11A11B-48

General Purpose Dry Circuit to 5A Multicontact AC or DC Relay
TE

KHAE-11A11B-6

General Purpose Dry Circuit to 5A Multicontact AC or DC Relay
TE

KHAE-11A12B-12

General Purpose Dry Circuit to 5A Multicontact AC or DC Relay
TE

KHAE-11A12B-120

General Purpose Dry Circuit to 5A Multicontact AC or DC Relay
TE