DA16600MOD-AAE4WA32 [DIALOG]
Ultra-Low Power Wi-Fi Bluetooth® LE Combo Module;型号: | DA16600MOD-AAE4WA32 |
厂家: | Dialog Semiconductor |
描述: | Ultra-Low Power Wi-Fi Bluetooth® LE Combo Module |
文件: | 总26页 (文件大小:1141K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DA16600MOD Series
Ultra-Low Power Wi-Fi + Bluetooth® LE Combo
Module
General Description
The DA16600 series is a highly integrated ultra-low-power Wi-Fi + Bluetooth® Low Energy Combo
Module solution. This module includes the DA16200 that has an 802.11b/g/n radio (PHY), a
baseband processor, a media access controller (MAC), on-chip memory, and a host networking
application processor. DA16600 also has a DA14531 that has a 2.4 GHz transceiver and an Arm®
Cortex-M0+® microcontroller with a RAM of 48 kB and a One-Time Programmable (OTP) memory of
32 kB. The radio transceiver, the baseband processor, and the qualified Bluetooth® low energy stack
is fully compliant with the Bluetooth Low Energy 5.1 standard.
The DA16600 is a synthesis of breakthrough ultra-low-power technologies, which enables an
extremely low power operation in the module. The DA16200 and DA14531 shut down every micro
element of the chip that is not in use, which creates a power consumption that is near zero when not
actively transmitting or receiving data. Such low power operation can extend the battery life up to a
year or more depending on the application. The DA16600 also enables ultra-low power transmission
and reception modes when the SoC needs to be awake to exchange information with other devices.
Advanced algorithms enable sleep mode until the exact moment when wake up is required to
transmit or receive data.
Module Features
■
Module Variants
□
□
DA16600MOD-AAC4WA32 (Chip Antenna)
DA16600MOD-AAE4WA32 (u.FL Connector)
■
■
■
Dimensions
□
14.3 mm × 24.3 mm × 3.0 mm, 51-Pins
Ambient operating temperature range
□
-40 °C to 85 °C
Regulatory certifications:
□
□
□
□
FCC
IC
CE
TELEC
Wi-Fi Features
■
Highly integrated ultra-low power Wi-Fi®
system on a chip
■ Wi-Fi processor
□
IEEE 802.11b/g/n, 1x1, 20 MHz channel
bandwidth, 2.4 GHz
■
RF Performance
□
□
Tx Power: +18 dBm, 1 Mbps DSSS
□
Wi-Fi security: WPA/WPA2-
Enterprise/Personal, WPA2 SI, WPA3
SAE, and OWE
Rx Sensitivity: -97.5 dBm, 1 Mbps DSSS
■
■
Full offload: SoC runs full networking OS and
TCP/IP stack
□
Vendor EAP types: EAP-
TTLS/MSCHAPv2, PEAPv0/EAP-
MSCHAPv2, PEAPv1, EAP-FAST, and
EAP-TLS
Hardware accelerators
□
□
□
General HW CRC engine
□
□
□
Operating modes: Station, Soft AP
WPS-PIN/PBC for easy Wi-Fi provisioning
Fast Wi-Fi connections
HW zeroing function for fast booting
Pseudo random number generator
(PRNG)
■
SPI flash Memory
Datasheet
Revision 3.0
23-Feb-2021
CFR0011-120-00
1 of 26
© 2021 Dialog Semiconductor
DA16600MOD Series
Ultra-Low Power Wi-Fi + Bluetooth® LE Combo
Module
□
32 M-bit / 4 M-byte
■
Supports various interfaces
■
■
Complete software stack
□
□
□
□
□
□
Two UARTs
□
□
Comprehensive networking software stack
SPI Master/Slave interface
I2C Master/Slave interface
I2S for digital audio streaming
4-channel PWM
Provides TCP/IP stack in the form of
network socket APIs
CPU core subsystem
□
Arm® Cortex®-M4F core with clock
frequency of 30~160 MHz
Individually programmable, multiplexed
GPIO pins
□
ROM: 256 KB, SRAM: 512 KB, OTP: 8
KB, Retention Memory: 48 KB
□
JTAG and SWD
■
■
Advanced security
■
■
Built-in 2-channel auxiliary ADC for sensor
interfaces
□
□
Secure booting
Secure debugging using JTAG/SWD and
UART ports
□
12-bit SAR ADC: single-ended two
channels
□
Secure asset storage
Supply
Built-in hardware crypto engines for advanced
security
□
Operating voltage: 2.1 V to 3.6 V (typical:
3.3 V)
□
□
TLS/DTLS security protocol functions
□
□
2 Digital I/O Supply Voltage: 1.8 V / 3.3 V
Black-out and brown-out detector
Crypto engine for key deliberate generic
security functions: AES (128,192,256),
DES/3DES, SHA1/224/256, RSA, DH,
ECC, CHACHA, and TRNG
■
Power management unit
□
□
On-Chip RTC
Wake-up control of fast booting or full
booting with minimal initialization time
□
Supports three ultra-low power sleep
modes
Bluetooth Features
■
Bluetooth
■
■
Radio
□
Compatible with Bluetooth® v5.1,
ETSI EN 300 328 and EN 300 440 Class 2
(Europe), FCC CFR47 Part 15 (US) and
ARIB STD-T66 (Japan) core
□
□
Programmable RF transmit power
-93 dBm receiver sensitivity
Interfaces
□
□
□
□
□
□
2 channel 11-bit ENOB ADC
□
Supports up to 3 connections
2 general purpose timers with PWM
■
Processing and memories
5 GPIOs
□
16 MHz 32-bit Arm®Cortex-M0+ with SWD
interface
SPI
□
□
□
48 Kbytes RAM
144 Kbytes ROM
32 Kbytes OTP
2x UART, 1-wire UART support
I2C
■
■
Power management
■
Current Consumption
□
□
Operating range (1.8 V - 3.3 V)
Inrush current control
□
□
□
2 mA RX at VBAT = 3V
4 mA TX at VBAT = 3 V and 0 dBm
1.8 uA at sleep with all RAM retained
Other
□
□
Real Time Clock
Trimmed 32 MHz Crystal
Datasheet
Revision 3.0
23-Feb-2021
CFR0011-120-00
2 of 26
© 2021 Dialog Semiconductor
DA16600MOD Series
Ultra-Low Power Wi-Fi + Bluetooth® LE Combo
Module
Contents
1
2
3
References ..................................................................................................................................... 5
Block Diagram ............................................................................................................................... 6
Pinout ............................................................................................................................................. 7
3.1 Pinout Description (51-pins).................................................................................................. 7
3.2 Pin Multiplexing................................................................................................................... 10
4
Electrical Specification............................................................................................................... 11
4.1 Absolute Maximum Ratings ................................................................................................ 11
4.2 Recommended Operating Conditions................................................................................. 11
4.3 Electrical Characteristics..................................................................................................... 11
4.3.1
4.3.2
4.3.3
DC Parameters, 1.8 V IO..................................................................................... 11
DC Parameters, 3.3 V IO..................................................................................... 12
DC Parameters for RTC Block ............................................................................ 12
4.4 Radio Characteristics.......................................................................................................... 13
4.4.1
4.4.2
Wi-Fi Characteristics............................................................................................ 13
Bluetooth® LE Characteristics.............................................................................. 14
4.5 Current Consumption.......................................................................................................... 14
4.5.1
4.5.2
Wi-Fi Characteristics............................................................................................ 14
Bluetooth® LE Characteristics.............................................................................. 15
4.6 Radiation Performance ....................................................................................................... 16
4.7 ESD Ratings........................................................................................................................ 16
5
6
Power-on Sequence.................................................................................................................... 17
Applications Schematic.............................................................................................................. 18
6.1 Typical Application .............................................................................................................. 18
7
Package Information................................................................................................................... 19
7.1 Dimension: DA16600MOD-AAC......................................................................................... 19
7.2 Dimension: DA16600MOD-AAE ......................................................................................... 19
7.3 PCB Land Pattern ............................................................................................................... 20
7.4 4-layer PCB Example.......................................................................................................... 22
7.5 Soldering Information.......................................................................................................... 23
7.5.1
Ordering Information .................................................................................................................. 24
Revision History ................................................................................................................................ 25
Recommended Condition for Reflow Soldering .................................................. 23
8
Datasheet
Revision 3.0
23-Feb-2021
CFR0011-120-00
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© 2021 Dialog Semiconductor
DA16600MOD Series
Ultra-Low Power Wi-Fi + Bluetooth® LE Combo
Module
Figures
Figure 1: DA16600 Block Diagram........................................................................................................ 6
Figure 2: DA16600MOD 51-Pins Pinout Diagram (Top View) .............................................................. 7
Figure 3: TIS 3D .................................................................................................................................. 16
Figure 4: TRP 3D................................................................................................................................. 16
Figure 5: Power On Sequence ............................................................................................................ 17
Figure 6: Typical Application ............................................................................................................... 18
Figure 7: AAC Module Dimension ....................................................................................................... 19
Figure 8: AAE Module Dimension ....................................................................................................... 20
Figure 9: PCB Land Pattern (Top View).............................................................................................. 20
Figure 10: PCB Land Pattern (Bottom View)....................................................................................... 21
Figure 11: 4-Layer PCB Example........................................................................................................ 22
Figure 12: Reflow Condition ................................................................................................................ 23
Tables
Table 1: Pin Description ........................................................................................................................ 8
Table 2: DA16200 Pin Multiplexing ..................................................................................................... 10
Table 3: Absolute Maximum Ratings................................................................................................... 11
Table 4: Recommended Operating Conditions ................................................................................... 11
Table 5: DC Parameters, 1.8 V IO ...................................................................................................... 11
Table 6: DC Parameters, 3.3 V IO ...................................................................................................... 12
Table 7: DC Parameters for RTC block, 3.3 V VBAT.......................................................................... 12
Table 8: DC Parameters for RTC block, 2.1 V VBAT.......................................................................... 12
Table 9: Wi-Fi Receiver Characteristics.............................................................................................. 13
Table 10: Wi-Fi Transmitter Characteristics........................................................................................ 13
Table 11: Radio 1 Mb/s – AC Characteristics ..................................................................................... 14
Table 12: Current Consumption in Active State .................................................................................. 14
Table 13: Current Consumption in Low Power Operation................................................................... 14
Table 14: DC Characteristics............................................................................................................... 15
Table 15: ESD Performance................................................................................................................ 16
Table 16: Power On Sequence Timing Requirements........................................................................ 17
Table 17: Coexistence Connection ..................................................................................................... 18
Table 18: Component Value................................................................................................................ 18
Table 19: Typical Reflow Profile (Lead Free): J-STD-020C................................................................ 23
Table 20: Ordering Information (Samples).......................................................................................... 24
Table 21: Ordering Information (Production)....................................................................................... 24
Datasheet
Revision 3.0
23-Feb-2021
CFR0011-120-00
4 of 26
© 2021 Dialog Semiconductor
DA16600MOD Series
Ultra-Low Power Wi-Fi + Bluetooth® LE Combo
Module
1
References
DA16600MOD consist of a DA16200 and a DA14531 chipset. Please see the respective chipset and
module datasheets for details.
[1] DA16200 Datasheet, Dialog Semiconductor
[2] DA16200MOD Datasheet, Dialog Semiconductor
(available at https://www.dialog-semiconductor.com/products/connectivity/wi-fi)
[3] DA14531, Datasheet, Dialog Semiconductor
[4] DA14531MOD Datasheet, Dialog Semiconductor
(available at https://www.dialog-semiconductor.com/products/connectivity/bluetooth-low-
energy/products/da14530-and-da14531)
Datasheet
Revision 3.0
23-Feb-2021
CFR0011-120-00
5 of 26
© 2021 Dialog Semiconductor
DA16600MOD Series
Ultra-Low Power Wi-Fi + Bluetooth® LE Combo
Module
2
Block Diagram
The DA16600 provides a high level of integration for a battery used wireless system, with integrated
IEEE 802.11 b/g/n and Bluetooth V5.1. The DA16600 is designed to address the needs of battery
used devices that require minimal power consumption and reliable operation.
Figure 1 shows the interconnection of all the physical blocks in DA16600MOD.
32 MHz
Crystal
DA14531
Matching
Circuit
GPIO Multiplexing
Low power
BLE SoC
U.FL
connector
or
Chip
antenna
SPDT for
antenna
switching
UART
DA16200
GPIO Multiplexing
RTC control
2.4GHz
BPF &
Matching
Circuit
Low power
Wi-Fi SoC
UART for debug
32.768
KHz
Crystal
4MByte
Serial
Flash
40 MHz
Crystal
Figure 1: DA16600 Block Diagram
Datasheet
Revision 3.0
23-Feb-2021
CFR0011-120-00
6 of 26
© 2021 Dialog Semiconductor
DA16600MOD Series
Ultra-Low Power Wi-Fi + Bluetooth® LE Combo
Module
3
Pinout
3.1 Pinout Description (51-pins)
VBAT_BLE
P0_10
P0_11
P0_5
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
DA16600
MOD Series
NC
P0_7
1
2
P0_2
P0_8
P0_6
P0_9
3
TP
GND
4
TEST or NC
GND
TP
5
GPIOA2
GPIOA3
VDD_DIO1
TP
6
RTC_PWR_KEY
TP
7
8
RTC_GPO
TMS
9
GND
TP
10
11
12
13
14
15
16
17
18
19
TCLK
GPIOA6
GPIOA7
GPIOA8
GPIOA9
GPIOA10
GPIOA11
GND
GPIOC_8
GPIOC_7
GPIOC_6
UART0_TXD
UART0_RXD
VDD_DIO2
TP
GND
TP
GND
Figure 2: DA16600MOD 51-Pins Pinout Diagram (Top View)
Datasheet
Revision 3.0
23-Feb-2021
CFR0011-120-00
7 of 26
© 2021 Dialog Semiconductor
DA16600MOD Series
Ultra-Low Power Wi-Fi + Bluetooth® LE Combo
Module
Table 1: Pin Description
#Pin Pin Name
Type
Drive(mA) Reset Related
State Device
Description
1
2
3
NC
AI
DA14531
DA14531
DA14531
Not Connect
P0_2
P0_6
DIO
DIO
General Purpose I/O
Internally connected to
RF switch
Note 1
4
5
GND
GND
AI
Common
Common
Ground
TEST or NC
Chip antenna type:
RF_Test
u.FL connector type: NC
6
7
8
GND
GND
DI
Common
DA16200
DA16200
Ground
RTC_PWR_KEY
TP
RTC block enable signal
DNC
RTC block wake up
signal is internally
connected
Note 1
9
RTC_GPO
TMS
DO
DA16200
Sensor control signal
JTAG I/F, SWDIO
10
11
DIO
DIO
2/4/8/12
2/4/8/12
I-PU
I-PD
DA16200
DA16200
TCLK
JTAG I/F, SWCLK,
General Purpose I/O
12
13
14
15
16
17
GPIOC_8
DIO
DIO
DIO
DO
2/4/8/12
2/4/8/12
2/4/8/12
2/4/8/12
2/4/8/12
I-PD
I-PD
I-PD
O
DA16200
DA16200
DA16200
DA16200
DA16200
DA16200
General Purpose I/O
General Purpose I/O
General Purpose I/O
UART transmit data
UART receive data
GPIOC_7
GPIOC_6
UART0_TXD
UART0_RXD
VDD_DIO2
DI
I
Supply power for digital
I/O
VDD
GPIOC6~GPIOC8,
TMS/TCLK, TXD/RXD
18
19
20
TP
TP
TP
DNC
DNC
DNC
DA16200
DA16200
DA16200
F_IO0 is internally
connected to Flash
Memory
F_CLK is internally
connected to Flash
Memory
F_IO3 is internally
connected to Flash
Memory
21
22
23
GND
GND
TP
GND
GND
DNC
Common
Common
DA16200
Ground
Ground
F_IO1 is internally
connected to Flash
Memory
24
TP
DNC
DA16200
F_CSN is internally
connected to Flash
Memory
Datasheet
Revision 3.0
23-Feb-2021
CFR0011-120-00
8 of 26
© 2021 Dialog Semiconductor
DA16600MOD Series
Ultra-Low Power Wi-Fi + Bluetooth® LE Combo
Module
#Pin Pin Name
Type
Drive(mA) Reset Related
State Device
Description
25
26
TP
DNC
DA16200
F_IO2 is internally
connected to Flash
Memory
RTC_WAKE_UP2
DI
DA16200
RTC block wake-up
signal
27
28
GND
GND
VDD
Common
DA16200
Ground
Supply power for internal
DC-DC, DIO_LDO, and
Analog IP of DA16200
VBAT_3V3
29
30
31
32
33
34
35
36
37
38
GND
GND
GND
GND
DIO
DIO
DIO
DIO
DIO
DIO
DNC
Common
Common
Common
Ground
GND
Ground
GND
Ground
GPIOA11
GPIOA10
GPIOA9
GPIOA8
GPIOA7
GPIOA6
TP
2/4/8/12
2/4/8/12
2/4/8/12
2/4/8/12
2/4/8/12
2/4/8/12
2/4/8/12
I-PD
I-PD
I-PD
I-PD
I-PD
I-PD
I-PD
DA16200
DA16200
DA16200
DA16200
DA16200
DA16200
Common
General Purpose I/O
General Purpose I/O
General Purpose I/O
General Purpose I/O
General Purpose I/O
General Purpose I/O
GPIOA5 of DA16200 is
internally connected to
P0_3 of DA14531 Note 1
39
40
TP
DNC
VDD
2/4/8/12
I-PD
Common
DA16200
GPIOA4 of DA16200 is
internally connected to
P0_4 of DA14531 Note 1
Supply power for digital
I/O
VDD_DIO1
GPIOA0~GPIOA11
41
42
43
GPIOA3
GPIOA2
TP
AI/DIO
AI/DIO
DNC
2/4/8/12
2/4/8/12
2/4/8/12
I-PD
I-PD
I-PD
DA16200
DA16200
Common
Aux. ADC input/General
Purpose I/O
Aux. ADC input/General
Purpose I/O
GPIOA1 of DA16200 is
internally connected to
P0_0 of DA14531 Note 1
44
TP
DNC
2/4/8/12
I-PD
Common
GPIOA0 of DA16200 is
internally connected to
P0_1 of DA14531 Note 1
45
46
47
48
49
50
51
P0_9
DIO
DIO
DIO
DIO
DIO
DIO
VDD
3.5 / 0.3
3.5 / 0.3
3.5 / 0.3
3.5 / 0.3
3.5 / 0.3
3.5 / 0.3
I-PD
I-PD
I-PD
I-PD
I-PD
I-PD
DA14531
DA14531
DA14531
DA14531
DA14531
DA14531
DA14531
General Purpose I/O
General Purpose I/O
General Purpose I/O
General Purpose I/O
General Purpose I/O
General Purpose I/O
P0_8
P0_7
P0_5
P0_11
P0_10
VBAT_BLE
Supply power for
DA14531
Datasheet
Revision 3.0
23-Feb-2021
CFR0011-120-00
9 of 26
© 2021 Dialog Semiconductor
DA16600MOD Series
Ultra-Low Power Wi-Fi + Bluetooth® LE Combo
Module
Note 1 Pin3, Pin8, Pin 38, Pin 39, Pin 43, and Pin 44 are connected internally so these pins can`t be used as
GPIO or as wake up input in application system.
3.2 Pin Multiplexing
This device provides various interfaces to support many kinds of applications.
In DA16200, it is possible to control each pin according to the required application in reference to the
pin multiplexing illustrated in Table 2 Pin control can be realized through register setting.
In DA14531, I/O pin assignment can be configured by the SW and is organized into the Port 0.
Please refer the datasheet and user manual of DA16200 and DA14531 respectively for detail
information.
Table 2: DA16200 Pin Multiplexing
Several pins are internally connected in the module, so these pins can’t be used as GPIO. These
pins are described as TP (test point) except P0_6 in DA16600MOD. Because of internally used pins,
several interfaces of DA16200 – SDIO, SDeMMC and UART1– are not possible on DA16600MOD.
●
●
DA16200: GPIOA0, GPIOA1, GPIOA4, GPIOA5
DA14531: P0_0, P0_1, P0_3, P0_4, P0_6
P0_6 of DA14531 is internally connected to RF switch and need to be connected externally to
GPIO_A9 or GPIO_A10 of DA16200 for coexistence, so this pin can’t be used as other purpose of
GPIO too.
Datasheet
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23-Feb-2021
CFR0011-120-00
10 of 26
© 2021 Dialog Semiconductor
DA16600MOD Series
Ultra-Low Power Wi-Fi + Bluetooth® LE Combo
Module
4
Electrical Specification
4.1 Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to
the device. These are stress ratings only, so functional operation of the device at these or any other
conditions beyond those indicated in the operational sections of the specification are not implied.
Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Table 3: Absolute Maximum Ratings
Parameter
VBAT_3V3
VDD_DIO1
VDD_DIO2
VBAT_BLE
#Pins
28
Min
-0.1
Max
3.9
Units
V
V
V
V
40
-0.1
-0.1
-0.1
3.9
3.9
3.6
17
51
4.2 Recommended Operating Conditions
Table 4: Recommended Operating Conditions
Parameter
VBAT_3V3
VDD_DIO1
VDD_DIO2
VBAT_BLE
#Pins
28
Min
Typ
Max
Units
2.1
3.6
3.6
3.6
3.3
V
40
1.62
1.62
1.8
V
V
V
17
51
Ambient operating temperature range
(TA)
-40
+85
°C
4.3 Electrical Characteristics
4.3.1
DC Parameters, 1.8 V IO
Table 5: DC Parameters, 1.8 V IO
Symbol Parameter Condition
Min
Typ
Max
Units
Guaranteed logic Low
level
0.3 ×
DVDD
VIL
Input Low Voltage
VSS
V
Note 1
Guaranteed logic High
level
0.7 ×
DVDD
VIH
Input High Voltage
DVDD
V
V
V
0.2 ×
DVDD
VOL
VOH
Output Low Voltage DVDD=Min.
Output High Voltage DVDD=Min.
VSS
0.8 ×
DVDD
DVDD
RPU
RPD
Pull-up Resistor
VPAD=VIH, DIO=Min.
VPAD=VIL, DIO=Min.
32.4
32.4
kΩ
Pull-down Resistor
Note 1 DVDD = 1.8V, VDD_DIO1, VDD_DIO2 Logic Level.
Datasheet
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23-Feb-2021
CFR0011-120-00
11 of 26
© 2021 Dialog Semiconductor
DA16600MOD Series
Ultra-Low Power Wi-Fi + Bluetooth® LE Combo
Module
4.3.2
DC Parameters, 3.3 V IO
Table 6: DC Parameters, 3.3 V IO
Symbol Parameter Condition
Min
Typ
Max
Units
Guaranteed logic Low
level
VIL
VIH
Input Low Voltage
VSS
0.8
V
Note 2
Guaranteed logic High
level
Input High Voltage
2.0
DVDD
V
VOL
VOH
RPU
RPD
Output Low Voltage DVDD=Min.
Output High Voltage DVDD=Min.
VSS
2.4
0.4
DVDD
19.4
V
V
Pull-up Resistor
VPAD=VIH, DIO=Min.
VPAD=VIL, DIO=Min.
kΩ
Pull-down Resistor
16.0
Note 2 DVDD= 3.3 V, VDD_DIO1, VDD_DIO2 Logic Level.
4.3.3
DC Parameters for RTC Block
There are several control pins in RTC block.
Table 7: DC Parameters for RTC block, 3.3 V VBAT
Symbol Parameter
Condition
Min
Typ
Max
Units
Guaranteed logic Low
level
VIL
VIH
Input Low Voltage
Input High Voltage
VSS
0.6
V
Guaranteed logic High
level
2.2
VBAT
V
(RTC block: RTC_PWR_KEY, RTC_WAKE_UP2)
Table 8: DC Parameters for RTC block, 2.1 V VBAT
Symbol Parameter
Condition
Min
Typ
Max
Units
Guaranteed logic Low
level
VIL
VIH
Input Low Voltage
Input High Voltage
VSS
0.3
V
Guaranteed logic High
level
1.6
VBAT
V
(RTC block: RTC_PWR_KEY, RTC_WAKE_UP2)
Datasheet
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23-Feb-2021
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© 2021 Dialog Semiconductor
DA16600MOD Series
Ultra-Low Power Wi-Fi + Bluetooth® LE Combo
Module
4.4 Radio Characteristics
4.4.1
Wi-Fi Characteristics
●
TA = +25 °C, VBAT = 3.3 V, CH1 (2412 MHz)
Table 9: Wi-Fi Receiver Characteristics
Parameter
Condition
Min
-98.5
-94
-89
-90
-90
-88
-81
-75
-90
-72
-4
Typ
-97.5
-93
-88
-89
-89
-87
-80
-74
-89
-71
0
Max
-95.5
-91
-86
-87
-87
-85
-78
-72
-87
-69
0
Units
1 Mbps DSSS
2 Mbps DSSS
11 Mbps CCK
6 Mbps OFDM
9 Mbps OFDM
18 Mbps OFDM
36 Mbps OFDM
54 Mbps OFDM
MCS0(GF)
Sensitivity
(8% PER for 11b rates, 10%
PER for 11g/11n rates)
dBm
MCS7(GF)
Maximum input level
802.11b
(8% PER for 11b rates, 10%
PER for 11g/11n rates)
802.11g
-10
-4
-3
Table 10: Wi-Fi Transmitter Characteristics
Parameter
Condition
Min
15
Typ
18
Max
19
Units
1 Mbps DSSS
2 Mbps DSSS
5.5 Mbps CCK
11 Mbps CCK
6 Mbps OFDM
9 Mbps OFDM
12 Mbps OFDM
18 Mbps OFDM
24 Mbps OFDM
36 Mbps OFDM
48 Mbps OFDM
54 Mbps OFDM
MCS0 OFDM
MCS7 OFDM
15
18
19
15
18
19
15
18
19
14
17
18
14
17
18
Maximum Output Power
measured form IEEE
spectral mask and EVM
14
17
18
dBm
14
17
18
13
16
17
13
16
17
11.5
10.5
14
14.5
13.5
17
15.5
14.5
18
10.5
13.5
14.5
Transmit center frequency
accuracy
-25
+25
ppm
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DA16600MOD Series
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4.4.2
Bluetooth® LE Characteristics
Table 11: Radio 1 Mb/s – AC Characteristics
Parameter
Description
Condition
Min
Typ
Max
Unit
Dirty Transmitter disabled;
DC-DC converter disabled;
PER = 30.8 %;
PSENS_CLEAN
sensitivity level
-93
dBm
Note 1
Extended packet size
(255 octets)
PSENS_EPKT
sensitivity level
-90
dBm
Note 1
Note 1 Measured according to Bluetooth® Low Energy Test Specification RF-PHY.TS/5.1.0
4.5 Current Consumption
4.5.1
Wi-Fi Characteristics
TA = +25 °C, VBAT = 3.3 V, w/ CPU clock is 80 MHz.
Table 12: Current Consumption in Active State
Parameter
Condition
1 Mbps DSSS
Min
260
240
180
180
25
Typ
280
260
200
200
29
Max
320
300
240
240
51
Units
@ 18.0 dBm
@ 17.0 dBm
@ 13.5 dBm
@ 13.5 dBm
6 Mbps OFDM
54 Mbps OFDM
MCS7
TX
RX
ACTIVE
No signal Note 1
mA
1 Mbps DSSS Note 1
1 Mbps DSSS
54 Mbps OFDM
MCS7
26.5
27
30.5
37.5
38.5
38.5
53
54
29
54
29
54
Note 1 Low Power Mode & CPU clock 30 MHz.
TA = +25 °C, VBAT = 3.3 V
Table 13: Current Consumption in Low Power Operation
Parameter
Condition
Min
Typ
Max
Units
5.2
Sleep 1
Note 1
6.8
Low Power
Operation
Sleep 2
Sleep 3
µA
Note 1
8.5
Note 1
Note 1 RF switch current consumption is included. VDD of RF switch is connected to VBAT_3V3 for DA16200
and typical current consumption of RF switch is 5 µA.
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4.5.2
Bluetooth® LE Characteristics
Table 14: DC Characteristics
Parameter
Description
Conditions
Min
Typ
Max
Units
Battery supply current
0.4
mA
IBAT_ACTIVE
Average battery supply
current with system in
Advertising state (3
channels) every 100ms
and extended sleep with
all RAM retained.
Average battery supply
current with system in a
connection state with
30ms connection interval
and extended sleep with
all RAM retained.
80
92
µA
µA
IBAT_BLE_ADV_100ms
IBAT_BLE_CONN_30ms
Battery supply current
with system shut down
0.6
2.3
µA
IBAT_HIBERN
IBAT_RF_RX
Continuous Rx
Battery supply current
mA
Continuous Tx; Output
power at 2dBm
Note 1
Battery supply current
mA
IBAT_RF_TX_+2
4.3
Continuous Tx; Output
power at -1dBm
Note 2
Continuous Tx; Output
power at -4dBm
Battery supply current
Battery supply current
mA
mA
IBAT_RF_TX_-1
IBAT_RF_TX_-4
3.6
2.8
Note 1 All Bluetooth applications run on DA16200, so DA16200 should be active to handle Bluetooth data
(e.g. Bluetooth Connection Request coming from a Bluetooth peer), in which case, Rx active current of
DA16200 is added to the total current consumption.
Note 2 The actual Tx output power is slightly different than the one indicated in the parameter name.
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4.6 Radiation Performance
Figure 3: TIS 3D
Figure 4: TRP 3D
4.7 ESD Ratings
Table 15: ESD Performance
Reliability Test
Standards
Test Conditions
± 2,000 V
Result
Pass
Human Body Model (HBM)
Charge Device Mode (CDM)
ANSI/ESDA/JEDEC JS-001-2017
ANSI/ESDA/JEDEC JS-002-2018
± 500 V
Pass
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5
Power-on Sequence
The sequence after the initial switching from power-off to power-on of DA16200 is shown in Figure 5.
The RTC_PWR_KEY is a pin that enables the RTC block of DA16200. Once RTC_PWR_KEY is
enabled after VBAT power is supplied, all the internal regulators are switched on automatically in the
sequence pre-defined by the RTC block.
Once RTC_PWR_KEY is switched on, LDOs for both XTAL and digital I/O are switched on shortly
and then the DC-DC regulator is switched on according to the pre-defined interval. The enabling
intervals can also be modified in the register settings after initial power-up.
VBAT
50% VBAT
T0
IO Voltage
50% IO
POWER_KEY
CLK_32K
50% VBAT
T1
T2
T3
Figure 5: Power On Sequence
Table 16: Power On Sequence Timing Requirements
Name
T0
Description
Min
Typ
Max
Unit
ms
VBAT power-on time from 10 % to 90 % of VBAT
IO voltage and VCC supply
T1
0
ms
T2
RTC_PWR_KEY turn-on time from 50 % VBAT to 50
% POWER_KEY * Note 3
5*T0
ms
T3
Internal RC oscillator wake-up time
217
µs
Note 3 If the T0 = 10 ms to switch on VBAT, the recommended T2 is 50 ms for the safe booting operation. It
would be externally controlled by MCU or it would be implemented using RC filter at the input of
RTC_PWR_KEY. The recommended C is 470 nF or 1 uF (not to exceed 1 uF) and R value is chosen to have T2
delay. For example, R and C values will be 82 kΩ and 1uF when T0 = 10 ms.
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6
Applications Schematic
6.1 Typical Application
10uF
VBAT_BLE 51
P0_10 50
VBAT_BLE
P0_10
P0_11
P0_5
P0_7
DA16600
MOD Series
P0_11
49
P0_5
P0_7
48
47
1
2
NC
P0_8 46
P0_9 45
P0_2
P0_6
P0_2
BLE_Debug /GPIO
Interface
0
3
P0_6
GND
TP
TP
4
44
43
Note: Remove R1 and C1 when
MCU control RTC_PWR_KEY.
TEST or NC
5
6
GND
GPIOA_2 42
GPIOA_3 41
VDD_DIO1 40
R1
GPIO Interface
VDD_DIO1
7
External Power Control
RTC_PWR_KEY
TP
C1
8
9
39
38
RTC_GPO
TMS
TP
TP
1uF
10
GND
JTAG Interface
GPIO Interface
11 TCLK
12
13 GPIOC_7
GPIOA_6 37
GPIOA_7 36
GPIOA_8 35
GPIO Interface
GPIOC_8
GPIOA_8
GPIOA_9
GPIOA_10
GPIOC_6
GPIOA_9
14
15
34
33
UART0_TX
GPIOA_10
UART Interface for debug
VDD_DIO2
16 UART0_RX
GPIOA_11 32
GPIO Interface
17 VDD_DIO2
31
30
29
18
19
1uF
4.7K
10uF
Figure 6: Typical Application
Table 17: Coexistence Connection
DA14531 part
P0_5
DA16200 part
Function
Wi-Fi_ACT
BT_ACT
GPIOA_8
GPIOA_9
GPIOA_10
P0_6
P0_7
BT_PRIO
Table 18: Component Value
Part Reference
Value
Description
Remove R1 when MCU control ‘RTC_PWR_KEY’.
This value should be chosen by customer application to achieve
the enough delay time depending on the power-on time of VBAT.
For detail information, see Section 5.
R1
470 kΩ
Remove C1 when MCU control ‘RTC_PWR_KEY’.
This value should be chosen by customer application to achieve
the enough delay time depending on the power-on time of VBAT.
Not to exceed 1uF. For detail information, see Section 5.
C1
1 uF
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7
Package Information
7.1 Dimension: DA16600MOD-AAC
Unit: millimeters (mm)
Tolerance : 14.3 (±0.2) x 24.3 (±0.2) x 3.0 (±0.1)
Figure 7: AAC Module Dimension
7.2 Dimension: DA16600MOD-AAE
Unit: millimeters (mm)
Tolerance : 14.3 (±0.2) x 24.3 (±0.2) x 3.0 (±0.1)
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Figure 8: AAE Module Dimension
7.3 PCB Land Pattern
Unit: millimeters (mm)
Figure 9: PCB Land Pattern (Top View)
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Figure 10: PCB Land Pattern (Bottom View)
Ant GND is only needed on the bottom of the PCB. GND must be removed for all layers including the
inner layer except the bottom. See Figure 11 for details.
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7.4 4-layer PCB Example
Top Layer
layer 2
layer 3
Bottom layer
Figure 11: 4-Layer PCB Example
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7.5 Soldering Information
7.5.1
Recommended Condition for Reflow Soldering
The reflow profile depends on the solder paste being used and the recommendations from the paste
manufacturer should be followed to determine the proper reflow profile.
Table 19: Typical Reflow Profile (Lead Free): J-STD-020C
Profile Feature
Lead Free SMD
Average ramp up rate (Tsmax to Tp)
3 °C/s Max.
Preheat
●
●
●
Temperature Min (Tsmin
Temperature Max (Tsmax
Time (Tsmax to Tsmin
)
●
●
●
150 °C
)
200 °C
)
60 to 180 seconds
Time maintained above
●
●
Temperature (TL)
Time (tL)
●
●
217 °C
60 to 150 seconds
Peak/Classification temperature (Tp)
Time within 5 °C of peak temperature (tp)
Ramp down rate
260 °C
20 to 40 seconds
6 °C/s Max.
8 minutes Max.
Time from 25 °C to peak temperature
Figure 12: Reflow Condition
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8
Ordering Information
The order number consists of the part number followed by a suffix that indicates the packing method.
For details and availability, please consult Dialog Semiconductor’s website at https://www.dialog-
semiconductor.com/products/da16600-modules or your local sales representative.
Table 20: Ordering Information (Samples)
Part Number
Pins
51
Size (mm)
Shipment Form
Reel
Pack Quantity
DA16600MOD-AAC4WA32
DA16600MOD-AAE4WA32
14.3 x 24.3 x 3.0
14.3 x 24.3 x 3.0
51
Reel
Table 21: Ordering Information (Production)
Part Number
Pins
51
Size (mm)
Shipment Form
Reel
Pack Quantity
DA16600MOD-AAC4WA32
DA16600MOD-AAE4WA32
14.3 x 24.3 x 3.0
14.3 x 24.3 x 3.0
500
500
51
Reel
Part Number Legend:
DA16600MOD-AAC4WA32
AA: Module revision number
C: Select module type
[C] Chip antenna, [E] u.FL connector
4: Flash memory
[4] 4Mbyte, [2] 2 Mbyte
W: Voltage range
[W] 3.3 V, [L] 1.8 V
A3: Package No.
2: T&R packing
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Revision History
Revision
3.0
Date
Description
23-Feb-2020
26-Oct-2020
15-July-2020
22-May-2020
29-April-2020
Official release
1.4
Modified application schematic
Modified application schematic
Added ESD performance, Table 15
Preliminary datasheet
1.3
1.2
1.1
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Datasheet Status
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Definition
This datasheet contains the design specifications for product development.
Specifications may be changed in any manner without notice.
1.<n>
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Development
This datasheet contains the specifications and preliminary characterization
data for products in pre-production. Specifications may be changed at any
time without notice in order to improve the design.
2.<n>
3.<n>
Preliminary
Qualification
This datasheet contains the final specifications for products in volume
production. The specifications may be changed at any time in order to
improve the design, manufacturing and supply. Major specification changes
are communicated via Customer Product Notifications. Datasheet changes
are communicated via www.dialog-semiconductor.com.
Final
Production
Archived
This datasheet contains the specifications for discontinued products. The
information is provided for reference only.
4.<n>
Obsolete
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