SLG47502 [DIALOG]
Low Voltage GreenPAK Programmable Mixed-Signal Matrix;型号: | SLG47502 |
厂家: | Dialog Semiconductor |
描述: | Low Voltage GreenPAK Programmable Mixed-Signal Matrix |
文件: | 总191页 (文件大小:2867K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
General Description
The SLG47502/03 provides a small, low voltage and low power component for commonly used mixed-signal functions. The
user creates their circuit design by programming the one time programmable (OTP) Non-Volatile Memory (NVM) to configure
the interconnect logic, the IO Pins, and the macrocells of the SLG47502/03. This highly versatile device allows a wide variety of
mixed-signal functions to be designed within a very small, low power single integrated circuit.
Key Features
Two High Speed General Purpose Analog Comparators
(ACMPxH)
Power Supply
1.1 V ≤ VDD ≤ 1.3 V
Integrated Voltage References (Vref)
Fifteen Combination Function Macrocells
Operating Temperature Range: -40 °C to 85 °C
RoHS Compliant/Halogen-Free
Available Package
Three Selectable DFF/LATCH or 2-bit LUTs or Shift
Registers
One Selectable Programmable Pattern Generator or
2-bit LUT
Ten Selectable DFF/LATCH or 3-bit LUTs or
Shift Registers
One Selectable DFF/LATCH or 4-bit LUTs or
Shift Register
12-pin STQFN: 1.6 mm x 1.6 mm x 0.55 mm, 0.4 mm
pitch
16-pin MSTQFN: 1.6 mm x 1.6 mm x 0.55 mm, 0.4 mm
pitch
Eight Multi-Function Macrocells
Seven Selectable DFF/LATCH or 3-bit LUTs + 8-bit
Delay/Counters
One Selectable DFF/LATCH or 4-bit LUT + 16-bit
Delay/Counter
Serial Communications
I2C Protocol Interface
Programmable Delay with Edge Detector Output
Deglitch Filter or Edge Detector
Two Oscillators (OSC)
2.048 kHz Oscillator
25 MHz Oscillator
Analog Temperature Sensor
Power-On Reset (POR) with CRC Check
Read Back Protection (Read Lock)
Applications
Notebook and Tablet PCs
Smartphones and Fitness Bands
Personal Computers and Servers
PC Peripherals
Consumer Electronics
Data Communications Equipment
Handheld and Portable Electronics
Datasheet
16-Jul-2021
Revision 2.0
1 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Contents
General Description.................................................................................................................................................................1
Key Features.............................................................................................................................................................................1
Applications..............................................................................................................................................................................1
1 Block Diagram ......................................................................................................................................................................7
2 Pinout ....................................................................................................................................................................................8
2.1 Pin Configuration - STQFN- 12L ............................................................................................................................8
2.2 Pin Configuration - MSTQFN- 16L .........................................................................................................................9
3 Characteristics ...................................................................................................................................................................13
3.1 Absolute Maximum Ratings .................................................................................................................................13
3.2 Electrostatic Discharge Ratings ...........................................................................................................................13
3.3 Recommended Operating Conditions .................................................................................................................13
3.4 Electrical Characteristics ......................................................................................................................................14
3.5 I2C Pins Electrical Characteristics ........................................................................................................................16
3.6 Macrocells Current Consumption .........................................................................................................................18
3.7 Timing Characteristics ..........................................................................................................................................19
3.8 Counter/Delay Characteristics .............................................................................................................................21
3.9 Oscillator Characteristics .....................................................................................................................................21
3.10 ACMP Characteristics ........................................................................................................................................22
4 User Programmability ........................................................................................................................................................24
5 IO Pins .................................................................................................................................................................................25
5.1 GPIO Pins ............................................................................................................................................................25
5.2 GPI Pin .................................................................................................................................................................25
5.3 Pull-Up/Down Resistors .......................................................................................................................................25
5.4 Fast Pull-up/down during Power-up .....................................................................................................................25
5.5 GPI Structure .......................................................................................................................................................26
5.6 GPIO with I2C Mode IO Structure ........................................................................................................................27
5.7 Matrix OE IO Structure .........................................................................................................................................28
5.8 IO Typical Performance .......................................................................................................................................29
6 Connection Matrix ..............................................................................................................................................................32
6.1 Matrix Input Table ...............................................................................................................................................33
6.2 Matrix Output Table ..............................................................................................................................................35
6.3 Connection Matrix Virtual Inputs ..........................................................................................................................38
7 Combination Function Macrocells ....................................................................................................................................39
7.1 2-Bit LUT or D Flip-Flop or Shift Register Macrocells ..........................................................................................39
7.2 2-bit LUT or Programmable Pattern Generator ....................................................................................................44
7.3 3-Bit LUT or D Flip-Flop with Set/Reset or Shift Register Macrocells ..................................................................46
7.4 4-Bit LUT or D Flip-Flop with Set/Reset or Shift Register Macrocell ....................................................................58
8 Multi-Function Macrocells .................................................................................................................................................62
8.1 3-Bit LUT or DFF/Latch with 8-Bit Counter/Delay Macrocells ..............................................................................62
8.2 4-Bit LUT or DFF/Latch with 16-Bit Counter/Delay Macrocell ..............................................................................71
8.3 CNT/DLY Timing Diagrams ..................................................................................................................................74
8.4 FSM Timing Diagrams .........................................................................................................................................81
8.5 Wake and Sleep Controller ..................................................................................................................................84
9 Analog Comparators ..........................................................................................................................................................89
9.1 ACMP0H Block Diagram ......................................................................................................................................90
9.2 ACMP1H Block Diagram ......................................................................................................................................91
9.3 ACMP Typical Performance .................................................................................................................................92
10 Programmable Delay/Edge Detector ..............................................................................................................................93
10.1 Programmable Delay Timing Diagram - Edge Detector Output .........................................................................93
11 Additional Logic Function. Deglitch Filter .....................................................................................................................94
12 Voltage Reference ............................................................................................................................................................95
12.1 Voltage Reference Overview .............................................................................................................................95
12.2 Vref Selection Table ...........................................................................................................................................95
12.3 Vref Block Diagram ...........................................................................................................................................96
12.4 Vref Typical Performance ...................................................................................................................................97
Datasheet
16-Jul-2021
Revision 2.0
2 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
13 Clocking ..........................................................................................................................................................................100
13.1 OSC General description .................................................................................................................................100
13.2 Oscillator0 (2.048 kHz) .....................................................................................................................................101
13.3 Oscillator1 (25 MHz) ........................................................................................................................................102
13.4 CNT/DLY Clock Scheme ..................................................................................................................................103
13.5 External Clocking .............................................................................................................................................103
13.6 Oscillators Accuracy .........................................................................................................................................104
13.7 Oscillators Settling time ....................................................................................................................................106
14 Power-On Reset ..............................................................................................................................................................108
14.1 General Operation ............................................................................................................................................108
14.2 POR Sequence ................................................................................................................................................109
14.3 Macrocells Output States During POR Sequence ...........................................................................................109
15 I2C Serial Communications Macrocell ..........................................................................................................................112
15.1 I2C Serial Communications Macrocell Overview ..............................................................................................112
15.2 I2C Serial Communications Device Addressing ...............................................................................................112
15.3 I2C Serial General Timing ................................................................................................................................113
15.4 I2C Serial Communications Commands ...........................................................................................................113
15.5 I2C Serial Command Register Map ..................................................................................................................118
16 Analog Temperature Sensor .........................................................................................................................................120
17 Register Definitions .......................................................................................................................................................121
17.1 Register Map ....................................................................................................................................................121
18 Package Top Marking Definitions .................................................................................................................................180
18.1 STQFN 12L 1.6 mm x 1.6 mm x 0.55 mm 0.4P FC .........................................................................................180
18.2 MSTQFN 16L 1.6 mm x 1.6 mm x 0.55 mm 0.4P ............................................................................................180
19 Package Information ......................................................................................................................................................181
19.1 Package outlines for STQFN 12L 1.6 mm x 1.6 mm x 0.55 MM 0.4P FC Package .........................................181
19.2 Package outlines for MSTQFN 16L 1.6 mm x 1.6 mm x 0.55 MM 0.4P Package ...........................................182
19.3 Moisture Sensitivity Level .................................................................................................................................183
19.4 STQFN Handling ..............................................................................................................................................183
19.5 Soldering Information .......................................................................................................................................183
20 Ordering Information .....................................................................................................................................................183
20.1 Tape and Reel Specifications ..........................................................................................................................183
20.2 Carrier Tape Drawing and Dimensions ............................................................................................................184
21 Layout Guidelines ..........................................................................................................................................................185
21.1 STQFN 12L 1.6 mm x 1.6 mm x 0.55 mm 0.4P FC Package ..........................................................................185
21.2 MSTQFN 16L 1.6 mm x 1.6 mm x 0.55 mm 0.4P Package .............................................................................186
Glossary................................................................................................................................................................................187
Revision History...................................................................................................................................................................190
Datasheet
16-Jul-2021
Revision 2.0
3 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Figures
Figure 1: Block Diagram.............................................................................................................................................................7
Figure 2: Steps to Create a Custom GreenPAK Device...........................................................................................................24
Figure 3: GPI Structure Diagram..............................................................................................................................................26
Figure 4: GPIO with I2C Mode IO Structure Diagram...............................................................................................................27
Figure 5: Matrix OE IO Structure Diagram...............................................................................................................................28
Figure 6: Typical High Level Output Current vs. High Level Output Voltage at T = 25 °C.......................................................29
Figure 7: Typical Low Level Output Current vs. Low Level Output Voltage, 1x Drive at T = 25 °C, Full Range......................29
Figure 8: Typical Low Level Output Current vs. Low Level Output Voltage, 1x Drive at T = 25 °C .........................................30
Figure 9: Typical Low Level Output Current vs. Low Level Output Voltage, 2x Drive at T = 25 °C, Full Range......................30
Figure 10: Typical Low Level Output Current vs. Low Level Output Voltage, 2x Drive at T = 25 °C .......................................31
Figure 11: Connection Matrix...................................................................................................................................................32
Figure 12: Connection Matrix Usage Example.........................................................................................................................32
Figure 13: 2-bit LUT0 or DFF0 or Shift Register0 ....................................................................................................................40
Figure 14: 2-bit LUT1 or DFF1 or Shift Register1 ....................................................................................................................40
Figure 15: 2-bit LUT2 or DFF2 or Shift Register2 ....................................................................................................................41
Figure 16: DFF0 to DFF2 and Shift Register0 to Shift Register2 Operation............................................................................41
Figure 17: DFF0 to DFF2 and Shift Register0 to Shift Register2 Operation with DFF Initial Value = 1...................................42
Figure 18: DFF0 to DFF2 and Shift Register0 to Shift Register2 Operation with Initial Value = b0001...................................43
Figure 19: 2-bit LUT3 or PGen.................................................................................................................................................45
Figure 20: PGen Timing Diagram.............................................................................................................................................45
Figure 21: 3-bit LUT0 or DFF3 or Shift Register 3 ...................................................................................................................47
Figure 22: 3-bit LUT1 or DFF4 or Shift Register 4 ...................................................................................................................48
Figure 23: 3-bit LUT2 or DFF5 or Shift Register 5 ...................................................................................................................48
Figure 24: 3-bit LUT3 or DFF6 or Shift Register 6 ...................................................................................................................49
Figure 25: 3-bit LUT4 or DFF7 or Shift Register 7 ...................................................................................................................49
Figure 26: 3-bit LUT5 or DFF8 or Shift Register 8 ...................................................................................................................50
Figure 27: 3-bit LUT6 or DFF9 or Shift Register 9 ...................................................................................................................50
Figure 28: 3-bit LUT7 or DFF10 or Shift Register 10 ...............................................................................................................51
Figure 29: 3-bit LUT8 or DFF11 or Shift Register 11 ...............................................................................................................51
Figure 30: 3-bit LUT9 or DFF12 or Shift Register 12 ...............................................................................................................52
Figure 31: DFF3 to DFF12 and Shift Register 3 to Shift Register 12 Operation......................................................................52
Figure 32: DFF3 to DFF12 and Shift Register 3 to Shift Register 12 Operation, nReset, Initial Value: b10011011................53
Figure 33: DFF3 to DFF12 and Shift Register3 to Shift Register12 Operation, nReset, Initial Value: b10011011, Case2......53
Figure 34: DFF3 to DFF12 and Shift Register 3 to Shift Register 12 Operation, nReset, Initial Value: b00011011................54
Figure 35: DFF3 to DFF12 and Shift Register 3 to Shift Register 12 Operation, nSet, Initial Value: b00011010....................54
Figure 36: DFF3 to DFF12 and Shift Register 3 to Shift Register 12 Operation, nSet, Initial Value: b00011010, Case 2.......55
Figure 37: DFF3 to DFF12 and Shift Register 3 to Shift Register 12 Operation, nSet, Initial Value: b10011010....................55
Figure 38: 4-bit LUT0 or DFF13 or Shift Register 13 ...............................................................................................................58
Figure 39: DFF13 and Shift Register 13 Operation..................................................................................................................59
Figure 40: DFF13 and Shift Register 13 Operation, nSet, Initial Value: xA7B2.......................................................................59
Figure 41: DFF13 and Shift Register 13 Operation, nReset, Initial Value: xA7B2...................................................................60
Figure 42: Possible Connections Inside Multi-Function Macrocell...........................................................................................62
Figure 43: 8-bit Multi-Function Macrocells Block Diagram (3-bit LUT10/DFF15, CNT/DLY1) .................................................63
Figure 44: 8-bit Multi-Function Macrocells Block Diagram (3-bit LUT11/DFF16, CNT/DLY2) .................................................64
Figure 45: 8-bit Multi-Function Macrocells Block Diagram (3-bit LUT12/DFF17, CNT/DLY3) .................................................65
Figure 46: 8-bit Multi-Function Macrocells Block Diagram (3-bit LUT13/DFF18, CNT/DLY4) .................................................66
Figure 47: 8-bit Multi-Function Macrocells Block Diagram (3-bit LUT14/DFF19, CNT/DLY5) .................................................67
Figure 48: 8-bit Multi-Function Macrocells Block Diagram (3-bit LUT15/DFF20, CNT/DLY6) .................................................68
Figure 49: 8-bit Multi-Function Macrocells Block Diagram (3-bit LUT16/DFF21, CNT/DLY7) .................................................69
Figure 50: 4-bit LUT1 or CNT/DLY0.........................................................................................................................................72
Figure 51: Delay Macrocell Behavior with Different Oscillators Options (Edge Select: Both, Counter Data: 3).......................74
Figure 52: Delay Mode Timing Diagram (Rising, Falling, and Both Edge Detection)...............................................................75
Figure 53: Counter Mode Timing Diagram without Two DFFs Synced Up ..............................................................................75
Figure 54: Counter Mode Timing Diagram with Two DFFs Synced Up ...................................................................................76
Figure 55: One-Shot Function Timing Diagram........................................................................................................................77
Datasheet
16-Jul-2021
Revision 2.0
4 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Figure 56: Frequency Detection Mode Timing Diagram...........................................................................................................78
Figure 57: Edge Detection Mode Timing Diagram...................................................................................................................79
Figure 58: Delayed Edge Detection Mode Timing Diagram.....................................................................................................80
Figure 59: Counter Value, Counter Data = 3............................................................................................................................81
Figure 60: CNT/FSM Mode Timing Diagram (Reset Rising Edge Mode, OSC is Forced On, UP=0) for CNT Data = 3..........81
Figure 61: CNT/FSM Mode Timing Diagram (Set Rising Edge Mode, OSC is Forced On, UP = 0) for CNT Data = 3............82
Figure 62: CNT/FSM Mode Timing Diagram (Reset Rising Edge Mode, OSC is Forced On, UP = 1) for CNT Data = 3........82
Figure 63: CNT/FSM Mode Timing Diagram (Set Rising Edge Mode, OSC is Forced On, UP = 1) for CNT Data = 3............83
Figure 64: DLY/FSM Mode, Falling Edge Delay, OSC is Forced On, DFFs Synced Up, UP = 0, CNT Data = 3 ....................83
Figure 65: One Shot/FSM Mode, Rising Edge, OSC is Forced On, DFFs Synced Up, UP = 0, CNT Data = 3.......................83
Figure 66: Freq. Detector/FSM Mode, Rising Edge, OSC is Forced On, DFFs Synced Up, UP = 0, CNT Data = 3...............84
Figure 67: Delayed Edge Detector/FSM Mode, Rising Edge, OSC is Forced On, DFFs Synced Up, UP = 0, CNT Data = 3.84
Figure 68: Wake/Sleep Controller............................................................................................................................................85
Figure 69: Wake/Sleep Timing Diagram, Normal Wake Mode, Counter Reset is Used ..........................................................86
Figure 70: Wake/Sleep Timing Diagram, Short Wake Mode, Counter Reset is Used .............................................................86
Figure 71: Wake/Sleep Timing Diagram, Normal Wake Mode, Counter Set is Used ..............................................................87
Figure 72: Wake/Sleep Timing Diagram, Short Wake Mode, Counter Set is Used .................................................................87
Figure 73: ACMP0H Block Diagram.........................................................................................................................................90
Figure 74: ACMP1H Block Diagram.........................................................................................................................................91
Figure 75: Typical Propagation Delay vs. Vref for ACMPxH at T = 25 °C, VDD = 1.1 V to 1.3 V, Gain = 1, Hysteresis = 0....92
Figure 76: ACMPxH Input Offset Voltage vs. Vref at T = -40 °C to 85 °C, VDD = 1.1 V to 1.3 V .............................................92
Figure 77: Programmable Delay ..............................................................................................................................................93
Figure 78: Edge Detector Output .............................................................................................................................................93
Figure 79: Deglitch Filter/Edge Detector Simplified Structure..................................................................................................94
Figure 80: Voltage Reference Block Diagram..........................................................................................................................96
Figure 81: Typical Load Regulation, Vref = 200 mV, T = -40 °C to +85 °C, Buffer - Enable....................................................97
Figure 82: Typical Load Regulation, Vref = 400 mV, T = -40 °C to +85 °C, Buffer - Enable....................................................97
Figure 83: Typical Load Regulation, Vref = 600 mV, T = -40 °C to +85 °C, Buffer - Enable....................................................98
Figure 84: Typical Load Regulation, Vref = 850 mV, T = -40 °C to +85 °C, Buffer - Enable....................................................98
Figure 85: Typical Input Offset Voltage vs. Vref at VDD = 1.2 V, T = 25 °C .............................................................................99
Figure 86: Oscillator0 Block Diagram.....................................................................................................................................101
Figure 87: Oscillator1 Block Diagram.....................................................................................................................................102
Figure 88: Clock Scheme.......................................................................................................................................................103
Figure 89: Oscillator0 Frequency vs. Temperature, OSC0 = 2.048 kHz................................................................................104
Figure 90: Oscillator1 Frequency vs. Temperature, OSC1 = 25 MHz....................................................................................104
Figure 91: Oscillators Total Error vs. Temperature................................................................................................................105
Figure 92: Oscillator0 Settling Time, VDD = 1.2 V, T = 25 °C, OSC0 = 2.048 kHz.................................................................106
Figure 93: Oscillator1 Settling Time, VDD = 1.2 V, T = 25 °C, OSC1 = 25 MHz (Normal Start).............................................106
Figure 94: Oscillator1 Settling Time, VDD = 1.2 V, T = 25 °C, OSC1 = 25 MHz (Start with Delay)........................................107
Figure 95: POR Sequence.....................................................................................................................................................109
Figure 96: Internal Macrocell States During POR Sequence.................................................................................................110
Figure 97: Power-Down..........................................................................................................................................................111
Figure 98: Basic Command Structure....................................................................................................................................113
Figure 99: I2C General Timing Characteristics.......................................................................................................................113
Figure 100: Byte Write Command, R/W = 0...........................................................................................................................114
Figure 101: Sequential Write Command................................................................................................................................114
Figure 102: Current Address Read Command, R/W = 1........................................................................................................115
Figure 103: Random Read Command ...................................................................................................................................115
Figure 104: Sequential Read Command................................................................................................................................115
Figure 105: Reset Command Timing .....................................................................................................................................116
Figure 106: Example of I2C Byte Write Bit Masking...............................................................................................................117
Figure 107: Analog Temperature Sensor Structure Diagram.................................................................................................120
Datasheet
16-Jul-2021
Revision 2.0
5 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Tables
Table 1: Functional Pin Description............................................................................................................................................9
Table 2: Pin Type Definitions ...................................................................................................................................................12
Table 3: Absolute Maximum Ratings........................................................................................................................................13
Table 4: Electrostatic Discharge Ratings .................................................................................................................................13
Table 5: Recommended Operating Conditions........................................................................................................................13
Table 6: EC at T = -40 °C to +85 °C, VDD = 1.1 V to 1.3 V Unless Otherwise Noted ..............................................................14
Table 7: EC of the I2C Pins for DI Mode at T = -40 °C to +85 °C, Full VDD Range Unless Otherwise Noted..........................16
Table 8: EC of the I2C Pins for DILV Mode at T = -40 °C to +85 °C, Full VDD Range Unless Otherwise Noted......................16
Table 9: I2C Pins Timing Characteristics for DI Mode, T = -40 °C to +85 °C, Full VDD Range Unless Otherwise Noted ........17
Table 10: I2C Pins Timing Characteristics for DILV Mode, T = -40 °C to +85 °C, Full VDD Range Unless Otherwise Noted..17
Table 11: Typical Current Estimated for Each Macrocell at T = 25 °C, VDD = 1.2 V ...............................................................18
Table 12: Typical Delay Estimated for Each Macrocell at T = 25 °C, VDD = 1.2 V...................................................................19
Table 13: Programmable Delay Expected Typical Delays and Pulse Widths at T = 25 °C, VDD = 1.2 V ...............................20
Table 14: Typical Filter Pulse Width, VDD = 1.2 V ...................................................................................................................21
Table 15: Typical Counter/Delay Offset at T = 25 °C, VDD = 1.2 V .........................................................................................21
Table 16: Oscillators Frequency Limits, VDD = 1.1 V to 1.3 V ................................................................................................21
Table 17: Oscillators Power-On Delay at T = 25 °C, VDD = 1.1 V to 1.3 V, OSC Power Setting: "Auto Power-On"................22
Table 18: ACMP Specifications at T = -40 °C to +85 °C, VDD = 1.1 V to 1.3 V Unless Otherwise Noted................................22
Table 19: Matrix Input Table.....................................................................................................................................................33
Table 20: Matrix Output Table..................................................................................................................................................35
Table 21: Connection Matrix Virtual Inputs ..............................................................................................................................38
Table 22: 2-bit LUT2_0 to 2-bit LUT2_2 Truth Table ...............................................................................................................44
Table 23: 2-bit LUT Standard Digital Functions .......................................................................................................................44
Table 24: 2-bit LUT2_3 Truth Table.........................................................................................................................................46
Table 25: 2-bit LUT Standard Digital Functions .......................................................................................................................46
Table 26: 3-bit LUT3_0 to 3-bit LUT3_9 Truth Table ...............................................................................................................56
Table 27: 3-bit LUT Standard Digital Functions .......................................................................................................................56
Table 28: 4-bit LUT0 Truth Table.............................................................................................................................................60
Table 29: 4-bit LUT Standard Digital Functions .......................................................................................................................61
Table 30: 3-bit LUT10 to 3-bit LUT16 Truth Table ...................................................................................................................70
Table 31: 4-bit LUT1 Truth Table.............................................................................................................................................73
Table 32: 4-bit LUT Standard Digital Functions .......................................................................................................................73
Table 33: ACMP Input Selection..............................................................................................................................................89
Table 34: Vref Selection Table.................................................................................................................................................95
Table 35: Oscillator Operation Mode Configuration Settings.................................................................................................100
Table 36: Read/Write Protection Options...............................................................................................................................118
Table 37: Register Map..........................................................................................................................................................121
Table 38: MSL Classification..................................................................................................................................................183
Datasheet
16-Jul-2021
Revision 2.0
6 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
1
Block Diagram
GPIO12*
GPIO11*
GPIO10*
Combination Function Macrocell
High Speed
Analog
VDD
GPIO9*
Vref0
2-bit LUT2_0
or DFF0
or Shift_Reg0
2-bit LUT2_1
or DFF1
or Shift_Reg1
2-bit LUT2_2
or DFF2
or Shift_Reg2
2-bit
LUT2_3
or PGEN
3-bit LUT3_0
or DFF3
or Shift_Reg3
3-bit LUT3_1
or DFF4
or Shift_Reg4
3-bit LUT3_2
or DFF5
or Shift_Reg5
3-bit LUT3_3
or DFF6
or Shift_Reg6
ACMP0H
ACMP1H
GPI
GPIO8
3-bit LUT3_4
or DFF7
or Shift_Reg7
3-bit LUT3_5
or DFF8
or Shift_Reg8
3-bit LUT3_6
or DFF9
or Shift_Reg9
3-bit LUT3_7
or DFF10
or Shift_Reg10
3-bit LUT3_8
or DFF11
or Shift_Reg11
4-bit LUT4_0
or DFF13
or Shift_Reg13
3-bit LUT3_9
or DFF12
or Shift_Reg12
GPIO0
GPIO7
I2C_SCL
ACMP1_H+
Temperature
Sensor
I2C Serial
Communication
Filter with Edge
Multi - Function Macrocell
Detect
3-bit
3-bit
3-bit
3-bit
GPIO1
GPIO6
LUT3_10/
DFF15+8bit
CNT/DLY1
LUT3_11/
DFF16+8bit
CNT/DLY2
LUT3_12/
DFF17+8bit
CNT/DLY3
LUT3_13/
DFF18+8bit
CNT/DLY4
Oscillators
I2C_SDA
ACMP0_H+
Programmable
Delay
2.048kHz
25MHz
3-bit
3-bit
3-bit
4-bit
LUT3_14/
DFF19+8bit
CNT/DLY5
LUT3_15/
DFF20+8bit
CNT/DLY6
LUT3_16/
DFF21+8bit
CNT/DLY7
LUT4_1/
DFF14+16bit
CNT/DLY0
POR with CRC
GPIO5
Vref0 Out
TS Out
GPIO2
GPIO3
EXT_Vref0
GPIO4
EXT_Vref1
GND
Note *: GPIO 9, 10, 11, and 12 are available in 16-pin package only.
Figure 1: Block Diagram
Datasheet
16-Jul-2021
Revision 2.0
7 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
2
Pinout
2.1 PIN CONFIGURATION - STQFN- 12L
Pin # Pin Name Pin Functions
1
2
VDD
Power Supply
GPI
GPI, SLA_0
3
GPIO0
GPIO1
GPIO2
GPIO3
GND
GPIO, I2C SCL
GPIO, I2C SDA
4
5
GPIO with OE, EXT_OSC1_IN
6
GPIO with OE, EXT_Vref0, SLA_1
Ground
7
12 11
GPIO6
GPIO5
GPIO4
GND
VDD
1
8
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO with OE, EXT_Vref1, SLA_2
GPIO with OE, Vref_OUT, TS_OUT
GPIO with OE, ACMP0_H+
GPIO with OE, ACMP1_H+
GPIO with OE, SLA_3, EXT_OSC0_IN
10
9
GPI
GPIO0
GPIO1
2
3
4
9
8
7
10
11
12
5
6
Legend:
OE: Output Enable
ACMPx+: ACMPx Positive Input
ACMPx-: ACMPx Negative Input
I2C SCL: I2C Clock Input
I2C SDA: I2C Data Input/Output
Vref: Voltage Reference Output
EXT_CLKx: External Clock Input
SLA: Slave Address
STQFN-12L
(Top View)
TS_OUT: Temperature Output
Datasheet
16-Jul-2021
© 2021 Dialog Semiconductor
Revision 2.0
8 of 191
CFR0011-120-00
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
2.2 PIN CONFIGURATION - MSTQFN- 16L
Pin # Pin Name Pin Functions
1
2
VDD
Power Supply
GPI
GPI, SLA_0
3
GPIO0
GPIO1
GPIO2
GPIO3
GND
GPIO, I2C SCL
GPIO, I2C SDA
4
5
GPIO with OE, EXT_OSC1_IN
6
GPIO with OE, EXT_Vref0, SLA_1
Ground
7
12 11
GPIO6
VDD
GPI
1
8
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
GPIO10
GPIO11
GPIO12
GPIO with OE, EXT_Vref1, SLA_2
GPIO with OE, Vref_OUT, TS_OUT
GPIO with OE, ACMP0_H+
GPIO with OE, ACMP1_H+
GPIO with OE, SLA_3, EXT_OSC0_IN
GPIO with OE
10
9
9
16
13
GPIO5
GPIO4
GND
2
3
4
10
11
12
13
14
15
16
GPIO0
GPIO1
8
14
15
7
GPIO with OE
5
6
GPIO with OE
GPIO with OE
Legend:
OE: Output Enable
MSTQFN-16L
(Top View)
ACMPx+: ACMPx Positive Input
ACMPx-: ACMPx Negative Input
I2C SCL: I2C Clock Input
I2C SDA: I2C Data Input/Output
Vref: Voltage Reference Output
EXT_CLKx: External Clock Input
SLA: Slave Address
TS_OUT: Temperature Output
Table 1: Functional Pin Description
Pin #
Pin
Signal
Name
Input
Options
Output
Options
Function
Name
STQFN-12L
MSTQFN-16L
1
1
VDD
VDD
Power Supply
--
--
--
Digital Input
without Schmitt Trigger
GPI
General Purpose Input
Digital Input
with Schmitt Trigger
--
--
--
2
2
GPI
Low Voltage Digital Input
I2C Slave
Address 0
--
Open-Drain
NMOS
(1x)
Digital Input
without Schmitt Trigger
General Purpose IO
GPIO0
(Note 1)
Digital Input
with Schmitt Trigger
3
3
GPIO0
Low Voltage Digital Input
--
--
--
Digital Input
without Schmitt Trigger
I2C SCL
I2C Serial Clock
Low Voltage Digital Input
Datasheet
16-Jul-2021
Revision 2.0
9 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 1: Functional Pin Description (Continued)
Pin #
Pin
Name
Signal
Name
Input
Options
Output
Options
Function
STQFN-12L
MSTQFN-16L
Open-Drain
NMOS
(1x)
Digital Input
without Schmitt Trigger
GPIO1
General Purpose IO
Digital Input
with Schmitt Trigger
4
4
GPIO1
Low Voltage Digital Input
Digital Input
without Schmitt Trigger
--
--
I2C SDA
I2C Serial Data
Low Voltage Digital Input
Digital Input
without Schmitt Trigger
Push-Pull (1x)
(2x)
General Purpose IO
with OE (Note 1)
Open-Drain
NMOS
(1x) (2x)
GPIO2
EXT_OSC1_IN
GPIO3
Digital Input
with Schmitt Trigger
5
5
GPIO2
Low Voltage Digital Input
--
--
External Clock
Connection
--
Digital Input
without Schmitt Trigger
Push-Pull (1x)
(2x)
General Purpose IO
with OE (Note 1)
Open-Drain
NMOS
(1x) (2x)
Digital Input
with Schmitt Trigger
6
6
GPIO3
Low Voltage Digital Input
Analog
--
Analog Comparator
Negative Input
EXT_VREF0
--
I2C Slave
Address 1
--
--
--
--
7
8
7
8
GND
GND
Power Supply
Digital Input
without Schmitt Trigger
Push-Pull (1x)
(2x)
General Purpose IO
with OE
Open-Drain
NMOS
(1x) (2x)
GPIO4
GPIO4
Digital Input
with Schmitt Trigger
Low Voltage Digital Input
Analog
Analog Comparator
Negative Input
EXT_VREF1
--
--
8
9
8
9
I2C Slave
Address 2
--
Digital Input
without Schmitt Trigger
Push-Pull (1x)
(2x)
General Purpose IO
with OE (Note 1)
Open-Drain
NMOS
(1x) (2x)
GPIO5
Digital Input
with Schmitt Trigger
GPIO5
Low Voltage Digital Input
Analog
--
--
Vref0
Vref0 Output
Temperature Sensor
Output
TS_OUT
Analog
--
Datasheet
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Revision 2.0
10 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 1: Functional Pin Description (Continued)
Pin #
Pin
Name
Signal
Name
Input
Options
Output
Options
Function
STQFN-12L
MSTQFN-16L
Digital Input
without Schmitt Trigger
Push-Pull (1x)
(2x)
General Purpose IO
with OE (Note 1)
Open-Drain
NMOS
(1x) (2x)
GPIO6
ACMP0_H+
GPIO7
Digital Input
with Schmitt Trigger
10
10
GPIO6
Low Voltage Digital Input
Analog
--
Analog Comparator
0_H Positive Input
--
Digital Input
without Schmitt Trigger
Push-Pull (1x)
(2x)
General Purpose IO
with OE (Note 1)
Open-Drain
NMOS
(1x) (2x)
Digital Input
with Schmitt Trigger
11
11
GPIO7
Low Voltage Digital Input
Analog
--
Analog Comparator
1_H Positive Input
ACMP1_H+
GPIO8
--
Digital Input
without Schmitt Trigger
Push-Pull (1x)
(2x)
General Purpose IO
with OE (Note 1)
Open-Drain
NMOS
(1x) (2x)
Digital Input
with Schmitt Trigger
12
12
GPIO8
Low Voltage Digital Input
--
--
I2C Slave
Address 3
--
External Clock
Connection
EXT_OSC0_IN
--
--
Digital Input
without Schmitt Trigger
Push-Pull (1x)
(2x)
General Purpose IO
with OE (Note 1)
Open-Drain
NMOS
(1x) (2x)
--
--
--
13
14
15
GPIO9
GPIO10
GPIO11
GPIO9
Digital Input
with Schmitt Trigger
Low Voltage Digital Input
--
Digital Input
without Schmitt Trigger
Push-Pull (1x)
(2x)
General Purpose IO
with OE (Note 1)
Open-Drain
NMOS
(1x) (2x)
GPIO10
GPIO11
Digital Input
with Schmitt Trigger
Low Voltage Digital Input
--
Digital Input
without Schmitt Trigger
Push-Pull (1x)
(2x)
General Purpose IO
with OE (Note 1)
Open-Drain
NMOS
(1x) (2x)
Digital Input
with Schmitt Trigger
Low Voltage Digital Input
--
Datasheet
16-Jul-2021
Revision 2.0
11 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 1: Functional Pin Description (Continued)
Pin #
Pin
Name
Signal
Name
Input
Options
Output
Options
Function
STQFN-12L
MSTQFN-16L
Digital Input
without Schmitt Trigger
Push-Pull (1x)
(2x)
General Purpose IO
with OE (Note 1)
Open-Drain
NMOS
(1x) (2x)
--
16
GPIO12
GPIO12
Digital Input
with Schmitt Trigger
Low Voltage Digital Input
--
Note 1 General Purpose IO's with OE can be used to implement bidirectional signals under user control via
Connection Matrix to OE signal in IO structure or as a 3-state output.
Table 2: Pin Type Definitions
Pin Type
VDD
Description
Power Supply
GPI
General Purpose Input
General Purpose Input/Output
Ground
GPIO
GND
Datasheet
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Revision 2.0
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© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
3
Characteristics
3.1 ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, so functional operation of the device at these or any other conditions beyond those indicated in the operational
sections of the specification are not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect
device reliability.
Table 3: Absolute Maximum Ratings
Parameter
Supply Voltage on VDD relative to GND
DC Input Voltage
Min
Max
Unit
V
-0.3
2.2
GND - 0.5 V VDD + 0.5 V
V
Maximum Average or DC Current
(Through VDD or GND pin)
--
90
mA
mA
Push-Pull 1x
--
--
11
16
Push-Pull 2x
OD 1x
Maximum Average or DC Current
(Through pin)
--
11
OD 2x
--
21
Current at Input Pin
-1.0
--
1.0
1000
150
150
mA
nA
°C
Input Leakage Current (Absolute Value)
Storage Temperature Range
Junction Temperature
-65
--
°C
Moisture Sensitive Level
1
3.2 ELECTROSTATIC DISCHARGE RATINGS
Table 4: Electrostatic Discharge Ratings
Parameter
Min
2000
1000
Max
--
Unit
V
ESD Protection (Human Body Model)
ESD Protection (Charged Device Model)
--
V
3.3 RECOMMENDED OPERATING CONDITIONS
Table 5: Recommended Operating Conditions
Parameter
Condition
Min
1.1
-40
Max
1.3
85
Unit
V
Supply Voltage (VDD
)
Operating Temperature
°C
Maximal Voltage Applied to any PIN in High
Impedance State
VDD+
0.3
--
V
Typical Capacitor Value at VDD
0.1
0
--
µF
Analog Input Common Mode Range
Allowable Input Voltage atAnalog Pins
VDD
V
Datasheet
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SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
3.4 ELECTRICAL CHARACTERISTICS
Table 6: EC at T = -40 °C to +85 °C, VDD = 1.1 V to 1.3 V Unless Otherwise Noted
Parameter Description
Condition
Min
Typ
Max
VDD
Unit
+
0.65x
VDD
Logic Input (Note 1)
--
V
0.3
VDD
0.3
+
0.52x
VDD
Logic Input with 10 kΩ Pull-up (Note 1)
--
--
V
V
Logic Input with 10 kΩ Pull-down
(Note 1)
0.83x
VDD
VDD+
0.3
Logic Input with Schmitt Trigger
(PositiveGoingThresholdVoltage min=
0.7x
VDD
VDD
0.3
+
--
--
V
V
0.4xVDD; max = 0.7xVDD
)
Logic Input with Schmitt Trigger
(PositiveGoingThresholdVoltage min=
0.4xVDD; max = 0.7xVDD), with 10 kΩ
Pull-up
VDD+
VIH
HIGH-Level Input Voltage
0.62x
VDD
0.3
Logic Input with Schmitt Trigger
(PositiveGoingThresholdVoltage min=
0.4xVDD; max = 0.7xVDD), with 10 kΩ
Pull-down
VDD
0.3
+
0.88x
VDD
--
V
Low-Level Logic Input (Note 1)
0.6
--
--
--
--
V
V
Low-Level Logic Input with 10 kΩ
Pull-up (Note 1)
0.44
Low-Level Logic Input with 10 kΩ
Pull-down (Note 1)
0.75
--
--
--
--
--
V
V
V
V
VDD
-
-
-
0.3x
VDD
Logic Input (Note 1)
0.3
VDD
0.3
0.19x
VDD
Logic Input with 10 kΩ Pull-up (Note 1)
Logic Input with 10 kΩ Pull-down
(Note 1)
VDD
0.3
0.37x
VDD
Logic Input with Schmitt Trigger
(Negative Going Threshold Voltage min
VDD
0.3
-
0.3x
VDD
--
--
V
V
= 0.3xVDD; max = 0.6xVDD
)
Logic Input with Schmitt Trigger
(Negative Going Threshold Voltage min
= 0.3xVDD; max = 0.6xVDD),
with 10 kΩ Pull-up
VDD
0.3
-
0.16x
VDD
VIL
LOW-Level Input Voltage
Logic Input with Schmitt Trigger
(Negative Going Threshold Voltage min
= 0.3xVDD; max = 0.6xVDD),
with 10 kΩ Pull-down
VDD
0.3
-
0.37x
VDD
--
V
VDD
0.3
-
-
-
Low-Level Logic Input (Note 1)
--
--
--
0.27
0.08
0.33
V
V
V
V
Low-Level Logic Input with 10 kΩ
Pull-up (Note 1)
VDD
0.3
Low-Level Logic Input with 10 kΩ
Pull-down (Note 1)
VDD
0.3
Schmitt Trigger Hysteresis
Voltage
0.075x
VDD
0.2x
VDD
0.29x
VDD
VHYS
Datasheet
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Revision 2.0
14 of 191
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SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 6: EC at T = -40 °C to +85 °C, VDD = 1.1 V to 1.3 V Unless Otherwise Noted (Continued)
Parameter Description
Condition
Min
Typ
Max
Unit
0.09x
VDD
0.25x
VDD
0.36x
VDD
With 10 kΩ Pull-up/Pull-down
V
0.13x
VDD
0.22x
VDD
0.29x
VDD
VDD = 1.1 V
V
V
V
Schmitt Trigger Hysteresis
Voltage
VHYS
0.1x
VDD
0.2x
VDD
0.27x
VDD
V
DD = 1.2 V
0.075x
VDD
0.18x
VDD
0.25x
VDD
VDD = 1.3 V
Push-Pull, 1x Drive, IOH = 100 µA
Push-Pull, 1x Drive, IOH = 2 mA
VDD-0.1
--
--
--
--
V
V
0.8x
VDD
VOH
HIGH-Level Output Voltage
VDD
0.05
-
Push-Pull, 2x Drive, IOH = 100 µA
--
--
V
0.9x
VDD
Push-Pull, 2x Drive, IOH = 2 mA
Push-Pull, 1x Drive, IOL= 100 µA
Push-Pull, 1x Drive, IOL= 2 mA
Push-Pull, 2x Drive, IOH = 100 µA
Push-Pull, 2x Drive, IOH = 2 mA
NMOS OD, 1x Drive, IOL = 100 µA
NMOS OD, 1x Drive, IOL = 2 mA
NMOS OD, 2x Drive, IOL = 100 µA
NMOS OD, 2x Drive, IOL = 2 mA
--
--
--
--
--
--
--
--
--
--
V
V
V
V
V
V
V
V
V
--
--
--
--
--
--
--
--
0.007
0.2x
VDD
0.004
0.1x
VDD
VOL
LOW-Level Output Voltage
0.004
0.1x
VDD
0.002
0.1x
VDD
Push-Pull, 1x Drive, VOH = 0.8x
VDD
2.9
5.6
2.3
4.5
4.7
9.0
3.8
7.6
4.6
8.9
7.3
14.1
5.9
mA
mA
mA
mA
mA
mA
HIGH-Level Output Pulse
Current (Note 2)
IOH
Push-Pull, 2x Drive, VOH = 0.8x
VDD
Push-Pull, 1x Drive, VOL = 0.2x
VDD
Push-Pull, 2x Drive, VOL = 0.2x
VDD
11.8
7.1
LOW-Level Output Pulse
Current (Note 2)
IOL
NMOS OD, 1x Drive, VOL = 0.1x
VDD
2.7
5.3
NMOS OD, 2x Drive, VOL = 0.1x
VDD
14.0
From VDD rising past PONTHR
tRAMP = 1 µs
,
TSU
Startup Time
1.885
2.087
0.888
0.502
3.288
1.078
0.735
ms
V
PONTHR
Power-On Threshold
VDD Level Required to Start Up the Chip 0.710
VDD Level Required to Switch Off the
Chip
POFFTHR Power-Off Threshold
0.393
V
Datasheet
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Revision 2.0
15 of 191
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SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 6: EC at T = -40 °C to +85 °C, VDD = 1.1 V to 1.3 V Unless Otherwise Noted (Continued)
Parameter Description
Condition
Min
Typ
Max
1.262
Unit
1 M for Pull-up: VIN = GND;
for Pull-down: VIN = VDD
0.831
1.019
MΩ
Pull-up or Pull-down
Resistance
100 k for Pull-up: VIN = GND;
for Pull-down: VIN = VDD
RPULL
90.197 102.269 126.064
kΩ
10 k For Pull-up: VIN = GND;
for Pull-down: VIN = VDD
9.088
10.274
3.2
12.556
kΩ
CIN
Input Capacitance
pF
Note 1 No hysteresis.
Note 2 DC or average current through any pin should not exceed value given in Absolute Maximum Conditions.
3.5 I2C PINS ELECTRICAL CHARACTERISTICS
Table 7: EC of the I2C Pins for DI Mode at T = -40 °C to +85 °C, Full VDD Range Unless Otherwise Noted
Fast-Mode
Fast-Mode Plus
Parameter Description
Condition
Unit
Min
Max
Min
Max
LOW-level Input
Voltage
VIL
-0.5
0.3xVDD
-0.5
0.3xVDD
V
V
HIGH-level Input
Voltage
VIH
0.7xVDD
VDD
0.7xVDD
VDD
Hysteresis of
VHYS
Schmitt Trigger
Inputs
0.05xVDD
--
0.05xVDD
--
V
Open-Drain at 2 mA sink
current
0
0
--
3
0.2xVDD
0
--
0.2xVDD
V
V
LOW-Level Output Open-Drain at 3 mA sink
VOL
0.4
--
--
0.31
--
Voltage
current
Open-Drain at 20 mA sink
current
0
V
LOW-Level Output
Current
IOL
V
DD = 1.2 V, VOL = 0.2 V
--
20
mA
Output Fall Time
from VIHmin to
VILmax
tof
--
250
--
120
ns
Input Current each
IO Pin
Ii
0.1xVDD < VI < 0.9xVDDmax
T = 25 °C, VDD = 1.2 V
-10
--
+10
10
-10
--
+10
10
mA
pF
Capacitance for
each IO Pin
Ci
Note 1 For Fast-mode Plus SDA pin must be configured as NMOS 2x Open-Drain, see register [1328] in section 17.
Table 8: EC of the I2C Pins for DILV Mode at T = -40 °C to +85 °C, Full VDD Range Unless Otherwise Noted
Fast-Mode
Parameter Description
Condition
Unit
Min
Max
0.3xVDD
VDD
VIL
LOW-level Input Voltage
-0.5
V
V
V
V
VIH
HIGH-level Input Voltage
0.7xVDD
Open-Drain at 2 mA sink current
Open-Drain at 3 mA sink current
0
0
0.2xVDD
0.4
VOL
LOW-Level Output Voltage
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Revision 2.0
16 of 191
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SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 8: EC of the I2C Pins for DILV Mode at T = -40 °C to +85 °C, Full VDD Range Unless Otherwise Noted (Continued)
Fast-Mode
Parameter Description
IOL LOW-Level Output Current
tof
Condition
Unit
Min
Max
VDD = 1.2 V, VOL = 0.2 V
3
--
mA
ns
Output Fall Time from VIHmin to
VILmax
--
250
Ii
Input Current each IO Pin
0.1xVDD < VI < 0.9xVDDmax
-10
--
+10
10
mA
pF
Ci
Capacitance for each IO Pin
Table 9: I2C Pins Timing Characteristics for DI Mode, T = -40 °C to +85 °C, Full VDD Range Unless Otherwise Noted
Speed
Parameter Description
Condition
400 kHz
1 MHz
Unit
Min
Max
400
--
Min
Max
1000
--
FSCL
tLOW
tHIGH
Clock Frequency, SCL
--
--
kHz
ns
Clock Pulse Width Low
Clock Pulse Width High
1300
600
500
260
--
--
ns
Input Filter Spike Suppression
(SCL, SDA)
tI
50
--
--
900
--
50
--
--
450
--
ns
ns
ns
tVD_ACK
tBUF
Data Valid Acknowledge Time
Bus Free Time between Stop and
Start
1300
500
tHD_STA
tSU_STA
tHD_DAT
tSU_DAT
tR
Start Hold Time
600
600
55
100
--
--
--
260
260
55
50
--
--
--
ns
ns
ns
ns
ns
ns
ns
ns
Start Set-up Time
Data Hold Time (Note 1)
Data Set-up Time
Inputs Rise Time
Inputs Fall Time
--
--
--
--
300
300
--
120
120
--
tF
--
--
tSU_STO
tVD_DAT
Stop Set-up Time
600
260
Data Valid Time
--
900
--
450
Note 1 Does not meet standard I2C specifications: tHD_DAT = 0 ns (min) for Fast-Mode and Fast-Mode Plus.
Note 2 Timing diagram can be found in Figure 99.
Table 10: I2C Pins Timing Characteristics for DILV Mode, T = -40 °C to +85 °C, Full VDD Range Unless Otherwise Noted
Speed
Parameter Description
Condition
400 kHz
Unit
Min
--
Max
400
--
FSCL
tLOW
tHIGH
Clock Frequency, SCL
kHz
ns
Clock Pulse Width Low
Clock Pulse Width High
1300
600
--
ns
Input Filter Spike Suppression (SCL,
SDA)
tI
50
--
ns
tVD_ACK
tBUF
Data Valid Acknowledge Time
--
900
--
ns
ns
Bus Free Time between Stop and Start
1300
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SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 10: I2C Pins Timing Characteristics for DILV Mode, T = -40 °C to +85 °C, Full VDD Range Unless Otherwise Noted
Speed
Parameter Description
Condition
400 kHz
Unit
Min
600
600
180
200
--
Max
--
tHD_STA
tSU_STA
tHD_DAT
tSU_DAT
tR
Start Hold Time
ns
ns
ns
ns
ns
ns
ns
ns
Start Set-up Time
Data Hold Time (Note 1)
Data Set-up Time (Note 1)
Inputs Rise Time
--
--
--
300
300
--
tF
Inputs Fall Time
--
tSU_STO
tVD_DAT
Stop Set-up Time
Data Valid Time
600
--
900
Note 1 Does not meet standard I2C specifications: tHD_DAT = 0 ns (min), tSU_DAT = 100 ns (min).
Note 2 Timing diagram can be found in Figure 99.
3.6 MACROCELLS CURRENT CONSUMPTION
Table 11: Typical Current Estimated for Each Macrocell at T = 25 °C, VDD = 1.2 V
Parameter
Description
Note
Typ
Unit
PDET+I2C
PDET+BG+I2C
0.395
0.927
µA
µA
PDET+BG+IBIAS+Vref Source+Buffer
(Buffer Selection: Any ACMPxH Vref)
15.06
8.169
15.86
µA
µA
µA
PDET+BG+IBIAS+Buffer+Vref Source
(Vref Source - External,
Buffer Selection: Any ACMPxH Vref)
Temperature Sensor+PDET+BG+IBIAS+ Vref
Source+TPS+Buffer
OSC1+BG+PDET, Pre-divider = 1
OSC1+BG+PDET, Pre-divider = 4
OSC1+BG+PDET, Pre-divider = 8
OSC0+BG+PDET, Pre-divider = 1
OSC0+BG+PDET, Pre-divider = 4
OSC0+BG+PDET, Pre-divider = 8
79.492
82.364
80.911
1.177
µA
µA
µA
µA
µA
µA
IDD
Current
1.176
1.176
PDET+BG+IBIAS+ACMPH0+ACMPH1 +Vref Source
(Vref Source - Internal,
18.228
µA
VIN+ = VDD
,
VIN- = 25 mV)
PDET+BG+IBIAS+ACMPH0+ACMPH1
(VIN+ = VDD,
11.222
6.277
µA
µA
External Vref = 650 mV)
PDET+BG+IBIAS+ACMPH0
(VIN+ = VDD,
External Vref = 650 mV)
Datasheet
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SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
3.7 TIMING CHARACTERISTICS
Table 12: Typical Delay Estimated for Each Macrocell at T = 25 °C, VDD = 1.2 V
Parameter
Description
Note
Unit
Rising
11
Falling
11
tpd
tpd
Delay
Delay
Digital Input to PP 1x
Digital Input to PP 2x
ns
ns
11
11
tpd
Delay
Digital Input with Schmitt Trigger to PP 1x
11
11
ns
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tw
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Width
Delay
Low Voltage Digital Input to PP 1x
Digital input to NMOS 1x
Digital input to NMOS 2x
Output enable from Pin, OE Hi-Z to 1
Output enable from Pin, OE Hi-Z to 0
PP 1x 3 State Hi-Z to 1
PP 1x 3 State Hi-Z to 0
PP 2x 3 State Hi-Z to 1
PP 2x 3 State Hi-Z to 0
LATCH Q
11
--
11
11
10
--
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
--
12
--
12
--
12
--
12
--
11
--
11
9
9
LATCH nQ
9
9
LATCH nRESET High Q
LATCH nRESET High nQ
LATCH nRESET Low Q
LATCH nRESET Low nQ
LATCH nSET High Q
9
9
10
9
9
9
9
9
9
9
LATCH nSET High nQ
LATCH nSET Low Q
9
9
10
10
9
10
9
LATCH nSET Low nQ
Multi-Function LATCH Q
Multi-Function LATCH nQ
Multi-Function LATCH nRESET Q
Multi-Function LATCH nRESET nQ
Multi-Function LATCH nSET Q
Multi-Function LATCH nSET nQ
2-bit LUT
9
9
9
9
9
9
9
9
9
9
9
6
6
3-bit LUT
9
8
4-bit LUT
8
8
Multi-Function 3-bit LUT
Multi-Function 3-bit LUT, CNT Delay
Multi-Function 4-bit LUT
Multi-Function 4-bit LUT, CNT Delay
Edge detect
9
9
14
8
13
8
13
6
13
6
Edge detect
171
176
175
181
tpd
Edge detect Delayed
Datasheet
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SLG47502/03
Preliminary
Unit
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 12: Typical Delay Estimated for Each Macrocell at T = 25 °C, VDD = 1.2 V(Continued)
Parameter
Description
Note
Rising
10
9
Falling
9
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tw
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Width
Width
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
DFF Q
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
DFF nQ
10
10
--
DFF nRESET High Q
--
DFF nRESET High nQ
10
--
DFF nRESET Low Q
10
--
DFF nRESET Low nQ
10
10
--
DFF nSET High Q
--
DFF nSET High nQ
10
--
DFF nSET Low Q
10
--
DFF nSET Low nQ
10
8
Multi-Function DFF Q
8
Multi-Function DFF nQ
8
8
Multi-Function DFF nRESET Q
Multi-Function DFF nRESET nQ
Multi-Function DFF nSET Q
Multi-Function DFF nSET nQ
Shift Registers Q
--
10
--
9
9
--
--
10
10
12
--
10
12
10
--
Shift Registers nQ
Multi-Function Reset CNT Q
Multi-Function Reset CNT nQ
Multi-Function CNT Delay Q
Multi-Function CNT Delay nQ
Multi-Function CNT Edge Detect Q
Multi-Function CNT Edge Detect nQ
Multi-Function CNT Edge Detect Q
Multi-Function CNT Edge Detect nQ
Multi-Function CNT Frequency Detect Q
Multi-Function CNT Frequency Detect nQ
Multi-Function CNT One Shot Q
Multi-Function CNT One Short nQ
PGen CLK
13
16
11
--
16
11
9
--
9
107
--
--
tw
107
20
20
--
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
tpd
22
22
11
--
11
6
6
PGen nRESET Hi-Z to 0
PGen nRESET Hi-Z to 1
Filter Q
--
7
7
--
62
99
62
108
Filter nQ
Table 13: Programmable Delay Expected Typical Delays and Pulse Widths at T = 25 °C, VDD = 1.2 V
Parameter
Description
Note
Typ
Unit
tw1
Pulse Width, 1 cell
mode: (any) edge detect, edge detect output
175
ns
Datasheet
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SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 13: Programmable Delay Expected Typical Delays and Pulse Widths at T = 25 °C, VDD = 1.2 V (Continued)
Parameter
tw2
Description
Pulse Width, 2 cell
Pulse Width, 3 cell
Pulse Width, 4 cell
Delay, 1 cell
Note
Typ
347
520
695
6
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
mode: (any) edge detect, edge detect output
mode: (any) edge detect, edge detect output
mode: (any) edge detect, edge detect output
mode: (any) edge detect, edge detect output
mode: (any) edge detect, edge detect output
mode: (any) edge detect, edge detect output
mode: (any) edge detect, edge detect output
mode: both edge delay, edge detect output
mode: both edge delay, edge detect output
mode: both edge delay, edge detect output
mode: both edge delay, edge detect output
tw3
tw4
time1
time1
time1
time1
time2
time2
time2
time2
Delay, 2 cell
6
Delay, 3 cell
6
Delay, 4 cell
6
Delay, 1 cell
180
357
533
710
Delay, 2 cell
Delay, 3 cell
Delay, 4 cell
Table 14: Typical Filter Pulse Width, VDD = 1.2 V
Parameter
Condition
Typ
< 45
< 37
< 28
Unit
T = 25 °C, VDD = 1.2 V
ns
ns
ns
Filtered Pulse Width, tblock
T = -40 °C to +85 °C, VDD = 1.2 V
T = -40 °C to +85 °C, VDD = 1.2 V ± 0.1 V
3.8 COUNTER/DELAY CHARACTERISTICS
Table 15: Typical Counter/Delay Offset at T = 25 °C, VDD = 1.2 V
Parameter
OSC Freq
25 MHz
OSC Power
auto
Typ
0.05
Unit
µs
Power-On time
Power-On time
2.048 kHz
25 MHz
auto
570
µs
frequency settling time
frequency settling time
variable (CLK period)
variable (CLK period)
auto
0.828
963
µs
2.048 kHz
25 MHz
auto
µs
forced
forced
0-40.6
0-490
ns
2.048 kHz
µs
3.9 OSCILLATOR CHARACTERISTICS
Table 16: Oscillators Frequency Limits, VDD = 1.1 V to 1.3 V
Temperature Range
+25 °C
Parameter
Minimum
Value, kHz
Maximum Value, kHz
Error, %
+1.3
-1.3
+2.1
-2.1
2.048 kHz RC OSC0
25 MHz RC OSC1
2.0205
24475
2.0754
25525
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Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
3.9.1 OSC Power-On Delay
Table 17: Oscillators Power-On Delay at T = 25 °C, VDD = 1.1 V to 1.3 V, OSC Power Setting: "Auto Power-On"
OSC1 25 MHz
Start with Delay
OSC0 2.048 kHz
OSC1 25 MHz
Typical
Value, µs
Maximum
Value, µs
Typical
Value, ns
Maximum
Value, ns
Typical
Value, ns
Maximum
Value, ns
476
--
40.21
48.40
150
--
3.10 ACMP CHARACTERISTICS
Table 18: ACMP Specifications at T = -40 °C to +85 °C, VDD = 1.1 V to 1.3 V Unless Otherwise Noted
Parameter Description
Note
Condition
Min
0
Typ
--
Max
VDD
VDD
Unit
Positive Input
Negative Input
V
V
ACMP Input Voltage
VACMP
Range
0
--
Vhys = 0 mV,
Gain = 1,
Vref = 25 mV to 850 mV
Voffset
ILKG
ACMP Input Offset
-7.0
--
--
5
7.1
mV
nA
ACMP Input Leakage
199
ACMPxH Power-Ondelay,
Minimal required wake
time for the "Wake and
Sleep function"
tstart
ACMP Startup Time
BG always On
--
--
77
µs
VHYS = 25 mV
VHYS = 150 mV
VHYS = 25 mV
T = 25 °C
T = 25 °C
22.0
147.4
19.2
24.6
149.7
24.6
26.6
152.4
28.8
mV
mV
mV
ACMP0H, ACMP1H
Built-in Hysteresis
(Note 1)
VHYS
VHYS = 150 mV
Gain = 1x
133.8
--
149.4
3.3
162.1
--
mV
GΩ
MΩ
Series Input
Resistance
Rsin
Gain = 0.5x
1.0
1.2
1.5
Gain = 1,
Vref = 25 mV to 850mV,
Overdrive = 100 mV
Low to High
High to Low
Low to High
High to Low
--
--
--
--
0.6
0.8
0.6
0.7
1.5
1.8
1.4
1.2
µs
µs
µs
µs
PROP
Propagation Delay,
Response Time
Gain = 1,
Vref = 250 mV to 650mV,
Overdrive = 100 mV
G = 1
1
1
1
G
Gain error
G = 0.5
Vref > 250 mV
0.495
0.500
0.504
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SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 18: ACMP Specifications at T = -40 °C to +85 °C, VDD = 1.1 V to 1.3 V Unless Otherwise Noted (Continued)
Parameter Description
Note
Condition
Min
-1.65
-8.17
-1.65
-8.17
-1.27
-7.87
-0.81
-7.46
-0.61
-7.15
-1.53
-8.19
-0.90
-7.33
-27.18
Typ
--
Max
1.49
4.42
1.49
4.42
1.37
4.27
0.72
3.67
0.68
3.61
1.73
5.01
1.05
3.92
31.20
3.64
7.75
6.51
7.83
6.55
9.79
Unit
%
T = 25 °C
Vref = 25 mV
--
%
T = 25 °C
T = 25 °C
T = 25 °C
T = 25 °C
T = 25 °C
T = 25 °C
VDD = 1.2 V
--
%
Vref = 25 mV to 850 mV
Vref = 50 mV to 850 mV
Vref = 250 mV to 850 mV
Vref = 850 mV
--
%
--
%
Vref Accuracy,
Buffer Disabled
--
%
--
%
%
--
--
--
--
--
--
--
--
--
--
--
--
--
%
%
%
Vref = 250 mV to 850 mV
%
%
Vref
Vref = 850 mV
Vref Output Error,
%
Buffer Enabled
Vref = 25 mV to 850 mV
%
T = 25 °C, VDD = 1.2 V -2.82
%
Vref = 200 mV to 850 mV,
Load Current = 1 µA
VDD = 1.2 V
T = 25 °C
-7.81
-5.36
-6.10
-5.87
-9.06
%
mV
mV
mV
mV
Vref = 25 mV
Vref Output Buffer
Offset
T = 25 °C
Vref = 25 mV to 850 mV
Load Resistance =
1 MΩ,
Vref = 25 mV to 850 mV
--
--
--
--
50
pF
pF
Vref Output
Capacitance Loading
Load Resistance =
1 kΩ,
200
Vref = 25mV to 850 mV
Note 1 VIL = Vin - VHYS, VIH = Vin.
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Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
4
User Programmability
The SLG47502/03 is a user programmable device with one time programmable (OTP) memory elements that are able to
configure the connection matrix and macrocells. A programming development kit allows the user the ability to create initial
devices. Once the design is finalized, the programming code (.gpx file) is forwarded to Dialog Semiconductor to integrate into a
production process.
Product
Definition
E-mail Product Idea, Definition, Drawing or
Customer creates their own design in
Schematic to
GreenPAK Designer
CMBUGreenPAK@diasemi.com
Dialog Semiconductor Applications
Engineer will review design specifications
with customer
Customer verifies GreenPAK in system
design
GreenPAK Design
approved
Samples, Design and Characterization
Report send to customer
GreenPAK Design
approved
Customers verifies GreenPAK design
GreenPAK Design
approved in system test
Custom GreenPAK part enters production
Figure 2: Steps to Create a Custom GreenPAK Device
Datasheet
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Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
5
IO Pins
The SLG47502/03 has a total of 9 GPIOs (13 GPIOs for 16-PIN version) which can operate as Input or Output, and 1 GPI Pin
which can operate as Input, as well as serve as a special function (such as outputting the voltage reference).
5.1 GPIO PINS
Pins from GPIO0 to GPIO12 serve as General Purpose IO Pins.
5.2 GPI PIN
GPI serves as a General Purpose Input Pin.
5.3 PULL-UP/DOWN RESISTORS
All IO Pins, except GPI, have the option for user selectable resistors connected to the input structure. The selectable values on
these resistors are 10 kΩ, 100 kΩ, and 1 MΩ. The internal resistors can be configured as either Pull-up or Pull-downs.
5.4 FAST PULL-UP/DOWN DURING POWER-UP
During power-up, IO Pull-up/down resistance will switch to 2.6 kΩ initially and then it will switch to normal setting value. This
function is enabled by register [1426].
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Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
5.5 GPI STRUCTURE
5.5.1 GPI Structure (for GPI)
Non-Schmitt
Trigger Input
Input Mode [1:0]
00: Digital In without Schmitt Trigger, wosmt_en = 1, OE=0
01: Digital In with Schmitt Trigger, smt_en = 1, OE = 0
10: Low Voltage Digital In mode, lv_en = 1, OE = 0
11: Reserved
WOSMT_EN
SMT_EN
OE
OE
Schmitt
Trigger Input
Digital In
Note 1: OE cannot be selected by user
Note 2: OE is Matrix output, Digital In is Matrix input
Low Voltage
Input
LV_EN
OE
PAD
Figure 3: GPI Structure Diagram
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Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
5.6 GPIO WITH I2C MODE IO STRUCTURE
5.6.1 GPIO with I2C Mode Structure (for GPIO0 and GPIO1)
Non-Schmitt
Trigger Input
GPIO0, GPIO1 Mode [2:0]
00: Digital Input without Schmitt Trigger
01: Reserved
10: Low Voltage Digital Input
11: Reserved
WOSMT_EN
OE
OE
Digital In
Low Voltage
Input
Note 1: OE cannot be selected by user and
is controlled by register. Digital In is Matrix input.
Note 2: GPIO0 and GPIO1 do not support
Push-Pull and PMOS Open-Drain modes.
Note 3: Can be varied over PVT, for reference
only.
LV_EN
Analog IO
Floating
s0
s1
s2
s3
2 kΩ
(Note 3)
s1
s0
900 kΩ
90 kΩ
8 kΩ
Res_sel [1:0]
00: Floating
01: 10 kΩ
Pull-up_EN
10: 100 kΩ
11: 1 MΩ
Digital OUT
I2C_EN register [31]
VDD
Digital OUT
I2C_EN register [31]
GPIO0/1_OD_EN register [1313]/[1329]
PAD
FAST_MODE_EN register [1312]/[1328]
I2C_EN register [31]
Figure 4: GPIO with I2C Mode IO Structure Diagram
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Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
5.7 MATRIX OE IO STRUCTURE
5.7.1 Matrix OE IO Structure (from GPIO0 to GPIO11)
Non-Schmitt
Trigger Input
Input Mode [1:0]
00: Digital In without Schmitt Trigger, wosmt_en = 1
01: Digital In with Schmitt Trigger, smt_en = 1
10: Low Voltage Digital In mode, lv_en = 1
11: analog IO mode
WOSMT_EN
SMT_EN
Schmitt
Trigger Input
Digital IN
Output Mode [1:0]
00: Push-Pull 1x mode, pp1x_en = 1
01: Push-Pull 2x mode, pp2x_en = 1, pp1x_en = 1
10: NMOS 1x Open-Drain mode, od1x_en = 1
11: NMOS 2x Open-Drain mode, od2x_en = 1, od1x_en = 1
Low Voltage
Input
Note 1: Digital Out and OE are Matrix Output, Digital In is Matrix Input
Note 2: Can be varied over PVT, for reference only.
LV_EN
Analog IO
Floating
s0
VDD
s1
s2
s3
s1
s0
2 kΩ
(Note 2)
900 kΩ
90 kΩ
8 kΩ
VDD
Res_sel [1:0]
00: Floating
01: 10 kΩ
Pull-up_EN
10: 100 kΩ
11: 1 MΩ
Digital OUT
Digital OUT
OE
OE
OD1x_EN
PP1x_EN
VDD
PAD
VDD
Digital OUT
Digital OUT
OE
OE
OD2x_EN
PP2x_EN
Figure 5: Matrix OE IO Structure Diagram
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Mixed-Signal Matrix
5.8 IO TYPICAL PERFORMANCE
Figure 6: Typical High Level Output Current vs. High Level Output Voltage at T = 25 °C
20
18
16
14
12
10
8
Open Drain 1x @ VDD = 1.3 V
Open Drain 1x @ VDD = 1.2 V
Open Drain 1x @ VDD = 1.1 V
Push-Pull 1x @ VDD = 1.3 V
Push-Pull 1x @ VDD = 1.2 V
Push-Pull 1x @ VDD = 1.1 V
6
4
2
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
VOL (V)
Figure 7: Typical Low Level Output Current vs. Low Level Output Voltage, 1x Drive at T = 25 °C, Full Range
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Mixed-Signal Matrix
16
Open Drain 1x @ VDD = 1.3 V
14
12
10
8
Open Drain 1x @ VDD = 1.2 V
Open Drain 1x @ VDD = 1.1 V
Push-Pull 1x @ VDD = 1.3 V
Push-Pull 1x @ VDD = 1.2 V
Push-Pull 1x @ VDD = 1.1 V
6
4
2
0
0
0.05
0.1
0.15
0.2
VOL (V)
Figure 8: Typical Low Level Output Current vs. Low Level Output Voltage, 1x Drive at T = 25 °C
26
24
22
20
18
16
14
12
10
8
Open Drain 2x @ VDD = 1.3 V
Open Drain 2x @ VDD = 1.2 V
Open Drain 2x @ VDD = 1.1 V
Push-Pull 2x @ VDD = 1.3 V
Push-Pull 2x @ VDD = 1.2 V
Push-Pull 2x @ VDD = 1.1 V
6
4
2
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
VOL (V)
Figure 9: Typical Low Level Output Current vs. Low Level Output Voltage, 2x Drive at T = 25 °C, Full Range
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Mixed-Signal Matrix
16
Open Drain 2x @ VDD = 1.3 V
Open Drain 2x @ VDD = 1.2 V
14
Open Drain 2x @ VDD = 1.1 V
Push-Pull 2x @ VDD = 1.3 V
12
Push-Pull 2x @ VDD = 1.2 V
Push-Pull 2x @ VDD = 1.1 V
10
8
6
4
2
0
0
0.05
0.1
0.15
0.2
VOL (V)
Figure 10: Typical Low Level Output Current vs. Low Level Output Voltage, 2x Drive at T = 25 °C
Datasheet
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SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
6
Connection Matrix
The Connection Matrix in the SLG47502/03 is used to create an internal routing for internal functional macrocells of the device
once it is programmed. The registers are programmed from the one time programmable (OTP) NVM cell during Test Mode
Operation. The output of each functional macrocell within the SLG47502/03 has a specific digital bit code assigned to it, that is
either set to active “High” or inactive “Low”, based on the design that is created. Once the 2048 register bits within the SLG47502/
03 are programmed, a fully custom circuit will be created.
The Connection Matrix has 64 inputs and 98 outputs. Each of the 64 inputs to the Connection Matrix is hard-wired to the digital
output of a particular source macrocell, including IO pins, LUTs, analog comparators, other digital resources, such as VDD and
GND. The input to a digital macrocell uses a 6-bit register to select one of these 64 input lines.
For a complete list of the SLG47502/03’s register table, see Section 17.
Matrix Input Signal
N
Functions
GND
0
1
2
3
LUT2_0/DFF0 output/
Shift_Reg0 output
LUT2_1/DFF1 output/
Shift_Reg1 output
LUT2_2/DFF2 output/
Shift_Reg2 output
POR
VDD
62
63
Matrix Inputs
0
1
2
97
N
Registers
registers [45:40]
registers [51:46]
registers [57:52]
Matrix Out: IN0 of
registers [627:622]
Matrix OUT: IN0 of
Matrix OUT: IN1 of
Matrix Out: Oscillator1
ENABLE
LUT2_0 or Clock In- LUT2_0 or Data In- LUT2_1 or Clock In-
put of DFF0 or Clock put of DFF0 or Data put of DFF1 or Clock
Input of Shift_Reg0 Input of Shift_Reg0 Input of Shift_Reg1
Function
Matrix Outputs
Figure 11: Connection Matrix
Function
Connection Matrix
GPIO8
GPIO7
LUT
GPIO7
GPIO8
GPIO9
LUT
GPIO9
Figure 12: Connection Matrix Usage Example
Datasheet
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© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
6.1 MATRIX INPUT TABLE
Table 19: Matrix Input Table
Matrix Decode
Matrix Input
Matrix Input Signal Function
Number
5
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
4
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
3
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
0
GND
1
LUT2_0/DFF0 output/Shift_Reg0 output
LUT2_1/DFF1 output/Shift_Reg1 output
LUT2_2/DFF2 output/Shift_Reg2 output
LUT2_3/PGen output
2
3
4
5
LUT3_0/DFF3 output/Shift_Reg3 output
LUT3_1/DFF4 output/Shift_Reg4 output
LUT3_2/DFF5 output/Shift_Reg5 output
LUT3_3/DFF6 output/Shift_Reg6 output
LUT3_4/DFF7 output/Shift_Reg7 output
LUT3_5/DFF8 output/Shift_Reg8 output
LUT3_6/DFF9 output/Shift_Reg9 output
LUT3_7/DFF10 output/Shift_Reg10 output
LUT3_8/DFF11 output/Shift_Reg11 output
LUT3_9/DFF12 output/Shift_Reg12 output
LUT4_0/DFF13 output/Shift_Reg13 output
CNT0 output
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
MLT0_LUT4_1/DFF14_OUT
CNT1 output
MLT1_LUT3_10/DFF15_OUT
CNT2 output
MLT2_LUT3_11/DFF16_OUT
CNT3 output
MLT3_LUT3_12/DFF17_OUT
CNT4 output
MLT4_LUT3_13/DFF18_OUT
CNT5 output
MLT5_LUT3_14/DFF19_OUT
CNT6 output
MLT6_LUT3_15/DFF20_OUT
CNT7 output
MLT7_LUT3_16/DFF21_OUT
GPIO0 digital input or I2C_virtual_0 Input
GPIO1 digital input or I2C_virtual_1 Input
I2C_virtual_2 Input
33
34
1
1
0
0
0
0
0
0
0
1
1
0
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SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 19: Matrix Input Table (Continued)
Matrix Decode
Matrix Input
Matrix Input Signal Function
Number
5
1
1
1
1
1
4
0
0
0
0
0
3
0
0
0
0
0
2
0
1
1
1
1
1
1
0
0
1
1
0
1
0
1
0
1
I2C_virtual_3 Input
35
I2C_virtual_4 Input
36
I2C_virtual_5 Input
37
I2C_virtual_6 Input
38
I2C_virtual_7 Input
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
Programmable Delay Edge Detect Output
Edge Detect Filter Output
GPI Digital Input
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
GPIO2 Digital Input
GPIO3 Digital Input
GPIO4 Digital Input
GPIO5 Digital Input
GPIO6 Digital Input
GPIO7 Digital Input
GPIO8 Digital Input
GPIO9 Digital Input (Note 1)
GPIO10 Digital Input (Note 1)
GPIO11 Digital Input (Note 1)
GPIO12 Digital Input (Note 1)
Reserved
Reserved
Reserved
Oscillator0 output 0
Oscillator0 output 1
Oscillator1 output
ACMP0H Output
ACMP1H Output
POR
VDD
Note 1 GPIO 9, 10, 11, and 12 are available in 16-pin package only.
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SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
6.2 MATRIX OUTPUT TABLE
Table 20: Matrix Output Table
Register Bit
Matrix Output
Number
Matrix Output Signal Function
Address
[45:40]
[51:46]
IN0 of LUT2_0 or Clock Input of DFF0 or Clock Input of Shift_Reg0
0
IN1 of LUT2_0 or Data Input of DFF0 or Data Input of Shift_Reg0
IN0 of LUT2_1 or Clock Input of DFF1 or Clock Input of Shift_Reg1
IN1 of LUT2_1 or Data Input of DFF1 or Data Input of Shift_Reg1
IN0 of LUT2_2 or Clock Input of DFF2 or Clock Input of Shift_Reg2
IN1 of LUT2_2 or Data Input of DFF2 or Data Input of Shift_Reg2
IN0 of LUT2_3 or Clock Input of PGen
1
[57:52]
2
[63:58]
3
[69:64]
4
[75:70]
5
[81:76]
6
[87:82]
IN1 of LUT2_3 or nRST of PGen
7
[93:88]
IN0 of LUT3_0 or Clock Input of DFF3 or Clock Input of Shift_Reg3
IN1 of LUT3_0 or Data Input of DFF3 or Data Input of Shift_Reg3
IN2 of LUT3_0 or nRST(nSET) of DFF3 or nRST(nSET) of Shift_Reg3
IN0 of LUT3_1 or Clock Input of DFF4 or Clock Input of Shift_Reg4
IN1 of LUT3_1 or Data Input of DFF4 or Data Input of Shift_Reg4
IN2 of LUT3_1 or nRST(nSET) of DFF4 or nRST(nSET) of Shift_Reg4
IN0 of LUT3_2 or Clock Input of DFF5 or Clock Input of Shift_Reg5
IN1 of LUT3_2 or Data Input of DFF5 or Data Input of Shift_Reg5
IN2 of LUT3_2 or nRST(nSET) of DFF5 or nRST(nSET) of Shift_Reg5
IN0 of LUT3_3 or Clock Input of DFF6 or Clock Input of Shift_Reg6
IN1 of LUT3_3 or Data Input of DFF6 or Data Input of Shift_Reg6
IN2 of LUT3_3 or nRST(nSET) of DFF6 or nRST(nSET) of Shift_Reg6
IN0 of LUT3_4 or Clock Input of DFF7 or Clock Input of Shift_Reg7
IN1 of LUT3_4 or Data Input of DFF7 or Data Input of Shift_Reg7
IN2 of LUT3_4 or nRST(nSET) of DFF7 or nRST(nSET) of Shift_Reg7
IN0 of LUT3_5 or Clock Input of DFF8 or Clock Input of Shift_Reg8
IN1 of LUT3_5 or Data Input of DFF8 or Data Input of Shift_Reg8
IN2 of LUT3_5 or nRST(nSET) of DFF8 or nRST(nSET) of Shift_Reg8
IN0 of LUT3_6 or Clock Input of DFF9 or Clock Input of Shift_Reg9
IN1 of LUT3_6 or Data Input of DFF9 or Data Input of Shift_Reg9
IN2 of LUT3_6 or nRST(nSET) of DFF9 or nRST(nSET) of Shift_Reg9
IN0 of LUT3_7 or Clock Input of DFF10 or Clock Input of Shift_Reg10
IN1 of LUT3_7 or Data Input of DFF10 or Data Input of Shift_Reg10
IN2 of LUT3_7 or nRST(nSET) of DFF10 or nRST(nSET) of Shift_Reg10
IN0 of LUT3_8 or Clock Input of DFF11 or Clock Input of Shift_Reg11
IN1 of LUT3_8 or Data Input of DFF11 or Data Input of Shift_Reg11
IN2 of LUT3_8 or nRST(nSET) of DFF11 or nRST(nSET) of Shift_Reg11
IN0 of LUT3_9 or Clock Input of DFF12 or Clock Input of Shift_Reg12
8
[99:94]
9
[105:100]
[111:106]
[117:112]
[123:118]
[129:124]
[135:130]
[141:136]
[147:142]
[153:148]
[159:154]
[165:160]
[171:166]
[177:172]
[183:178]
[189:184]
[195:190]
[201:196]
[207:202]
[213:208]
[219:214]
[225:220]
[231:226]
[237:232]
[243:238]
[249:244]
[255:250]
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
Datasheet
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© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 20: Matrix Output Table (Continued)
Register Bit
Matrix Output
Number
Matrix Output Signal Function
Address
[261:256]
[267:262]
[273:268]
[279:274]
[285:280]
[291:286]
IN1 of LUT3_9 or Data Input of DFF12 or Data Input of Shift_Reg12
36
37
38
39
40
41
42
IN2 of LUT3_9 or nRST(nSET) of DFF12 or nRST(nSET) of Shift_Reg12
IN0 of LUT4_0 or Clock Input of DFF13 or Clock Input of Shift_Reg13
IN1 of LUT4_0 or Data Input of DFF13 or Data Input of Shift_Reg13
IN2 of LUT4_0 or nRST(nSET) of DFF13 or nRST(nSET) of Shift_Reg13
IN3 of LUT4_0 or Clock Enable of DFF13 or Clock Enable of Shift_Reg13
IN0 of MLT0_LUT4_1 or Clock Input of DFF14 or
Delay0 Input (or Counter0 nRST Input)
[297:292]
[303:298]
IN1 of MLT0_LUT4_1 or nRST (nSET) of DFF14 or
Delay0 Input (or Counter0 nRST Input or External Clock Source)
43
44
IN2 of MLT0_LUT4_1 or Data Input of DFF14 or
Delay0 Input (or Counter0 nRST Input)
[309:304]
[315:310]
[321:316]
IN3 of MLT0_LUT4_1
45
46
IN0 of MLT1_LUT3_10 or Clock Input of DFF15 or
Delay1 Input (or Counter1 nRST Input)
IN1 of MLT1_LUT3_10 or nRST (nSET) of DFF15 or
47
48
49
50
51
52
53
54
55
56
57
58
59
60
[327:322]
[333:328]
[339:334]
[345:340]
[351:346]
[357:352]
[363:358]
[369:364]
[375:370]
[381:376]
[387:382]
[393:388]
[399:394]
[405:400]
Delay1 Input (or Counter1 nRST Input or External Clock Source)
IN2 of MLT1_LUT3_10 or Data Input of DFF15 or
Delay1 Input (or Counter1 nRST Input)
IN0 of MLT2_LUT3_11 or Clock Input of DFF16 or
Delay2 Input (or Counter2 nRST Input)
IN1 of MLT2_LUT3_11 or nRST (nSET) of DFF16 or
Delay2 Input (or Counter2 nRST Input or External Clock Source)
IN2 of MLT2_LUT3_11 or Data Input of DFF16 or
Delay2 Input (or Counter2 nRST Input)
IN0 of MLT3_LUT3_12 or Clock Input of DFF17 or
Delay3 Input (or Counter3 nRST Input)
IN1 of MLT3_LUT3_12 or nRST (nSET) of DFF17 or
Delay3 Input (or Counter3 nRST Input or External Clock Source)
IN2 of MLT3_LUT3_12 or Data Input of DFF17 or
Delay3 Input (or Counter3 nRST Input)
IN0 of MLT4_LUT3_13 or Clock Input of DFF18 or
Delay4 Input (or Counter4 nRST Input)
IN1 of MLT4_LUT3_13 or nRST (nSET) of DFF18 or
Delay4 Input (or Counter4 nRST Input or External Clock Source)
IN2 of MLT4_LUT3_13 or Data Input of DFF18 or
Delay4 Input (or Counter4 nRST Input)
IN0 of MLT5_LUT3_14 or Clock Input of DFF19 or
Delay5 Input (or Counter5 nRST Input)
IN1 of MLT5_LUT3_14 or nRST (nSET) of DFF19 or
Delay5 Input (or Counter5 nRST Input or External Clock Source)
IN2 of MLT5_LUT3_14 or Data Input of DFF19 or
Delay5 Input (or Counter5 nRST Input)
Datasheet
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© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 20: Matrix Output Table (Continued)
Register Bit
Matrix Output
Number
Matrix Output Signal Function
Address
IN0 of MLT6_LUT3_15 or Clock Input of DFF20 or
61
62
63
64
65
66
[411:406]
[417:412]
[423:418]
[429:424]
[435:430]
[441:436]
Delay6 Input (or Counter6 nRST Input)
IN1 of MLT6_LUT3_15 or nRST (nSET) of DFF20 or
Delay6 Input (or Counter6 nRST Input or External Clock Source)
IN2 of MLT6_LUT3_15 or Data Input of DFF20 or
Delay6 Input (or Counter6 nRST Input)
IN0 of MLT7_LUT3_16 or Clock Input of DFF21 or
Delay7 Input (or Counter7 nRST Input)
IN1 of MLT7_LUT3_16 or nRST (nSET) of DFF21 or
Delay7 Input (or Counter7 nRST Input or External Clock Source)
IN2 of MLT7_LUT3_16 or Data Input of DFF21 or
Delay7 Input (or Counter7 nRST Input)
[447:442]
[453:448]
[459:454]
[465:460]
[471:466]
[477:472]
[483:478]
[489:484]
[495:490]
[501:496]
[507:502]
[513:508]
[519:514]
[525:520]
[531:526]
[537:532]
[543:538]
[549:544]
[555:550]
[561:556]
[567:562]
[573:568]
[579:574]
[585:580]
[591:586]
[597:592]
[603:598]
GPIO0 Digital Output
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
GPIO1 Digital Output
GPIO2 Digital Output OE
GPIO2 Digital Output
GPIO3 Digital Output OE
GPIO3 Digital Output
GPIO4 Digital Output OE
GPIO4 Digital Output
GPIO5 Digital Output OE
GPIO5 Digital Output
GPIO6 Digital Output OE
GPIO6 Digital Output
GPIO7 Digital Output OE
GPIO7 Digital Output
GPIO8 Digital Output OE
GPIO8 Digital Output
GPIO9 Digital Output OE (Note 2)
GPIO9 Digital Output (Note 2)
GPIO10 Digital Output OE (Note 2)
GPIO10 Digital Output (Note 2)
GPIO11 Digital Output OE (Note 2)
GPIO11 Digital Output (Note 2)
GPIO12 Digital Output OE (Note 2)
GPIO12 Digital Output (Note 2)
Filter/Edge Detect Input
Programmable Delay/Edge Detect Input
PWR UP of ACMP0_H
Datasheet
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© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 20: Matrix Output Table (Continued)
Register Bit
Matrix Output
Number
Matrix Output Signal Function
Address
[609:604]
[615:610]
[621:616]
[627:622]
PWR UP of ACMP1_H
Temp sensor, Vref Out_0 Power Up
Oscillator0 ENABLE
94
95
96
97
Oscillator1 ENABLE
Note 1 For each Address, the two most significant bits are unused.
Note 2 GPIO 9, 10, 11, and 12 are available in 16-pin package only.
6.3 CONNECTION MATRIX VIRTUAL INPUTS
As mentioned previously, the Connection Matrix inputs come from the outputs of various digital macrocells on the device. Eight
of the Connection Matrix inputs have the special characteristic that the state of these signal lines comes from a corresponding
data bit written as a register value via I2C. This gives the user the ability to write data via the serial channel, and have this
information translated into signals that can be driven into the Connection Matrix and from the Connection Matrix to the digital
inputs of other macrocells on the device. The I2C address for reading and writing these register values is at byte 0x1.
Six of the eight Connection Matrix Virtual Inputs are dedicated to this virtual input function. An I2C write command to these register
bits will set the signal values going into the Connection Matrix to the desired state. A read command to these register bits will
read either the original data values coming from the NVM memory bits (that were loaded during the initial device startup), or the
values from a previous write command (if that has happened).
Two of the eight Connection Matrix Virtual Inputs are shared with Pin digital inputs (GPIO0 Digital or I2C_virtual_0 Input), and
(GPIO1 Digital or I2C_virtual_1 Input). If the virtual input mode is selected, an I2C write command to these register bits will set
the signal values going into the Connection Matrix to the desired state. A read command to these register bits will read either the
original data values coming from the NVM memory bits (that were loaded during the initial device startup), or the values from a
previous write command (if that has happened). The I2C disable/enable register bit [31] selects whether the Connection Matrix
input comes from the Pin input or from the virtual register:
Select SCL & Virtual Input 0 or GPIO0
Select SDA & Virtual Input 1 or GPIO1
See Table 21 for Connection Matrix Virtual Inputs.
Table 21: Connection Matrix Virtual Inputs
Register Bit
Addresses (d)
Matrix Input Number
Matrix Input Signal Function
32
33
34
35
36
37
38
39
I2C_virtual_0 Input
I2C_virtual_1 Input
I2C_virtual_2 Input
I2C_virtual_3 Input
I2C_virtual_4 Input
I2C_virtual_5 Input
I2C_virtual_6 Input
I2C_virtual_7 Input
[8]
[9]
[10]
[11]
[12]
[13]
[14]
[15]
Datasheet
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SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
7
Combination Function Macrocells
The SLG47502/03 has 15 combination function macrocells that can serve as more than one logic or timing function. In each case,
they can serve as a Look Up Table (LUT), or as another logic or timing function. See the list below for the functions that can be
implemented in these macrocells.
Three macrocells that can serve as 2-bit LUT or as D Flip-Flop, or as Shift Register
Ten macrocells that can serve as either 3-bit LUTs or as D Flip-Flops with Set/Reset Input, or as Shift Register
One macrocell that can serve as either 2-bit LUT or as Programmable Pattern Generator (PGen)
One macrocell that can serve as either 4-bit LUT or as D Flip-Flop with Set/Reset Input, or as Shift Register
Inputs/Outputs for the 15 combination function macrocells are configured from the connection matrix with specific logic functions
being defined by the state of configuration bits.
When used as a LUT to implement combinatorial logic functions, the outputs of the LUTs can be configured to any user defined
function, including the following standard digital logic devices (AND, NAND, OR, NOR, XOR, XNOR).
7.1 2-BIT LUT OR D FLIP-FLOP OR SHIFT REGISTER MACROCELLS
There are three macrocells that can serve as 2-bit LUT or as DFF/LATCH, or as Shift Register. It is also possible to define the
active level (Q or nQ) for the macrocell’s output by registers [748], [753], [758]. DFF/Shift Register or LUT are selected by registers
[744], [749], [754]. When used to implement LUT functions, the 2-bit LUT takes in two input signals from the connection matrix
and produce a single output, which goes back into the connection matrix.
When used to implement Shift Register, the two input signals from the connection matrix go to the data (D_in), clock (CLK) inputs
for the Shift Register, with the output going back to the connection matrix. The input data (D_in) writes into LSB. The Shift Register
length (up to 4 bits/memory cells) is selected by registers [746:745], [751:750], [756:755], when these registers = 0 DFF/LATCH
function is selected.
When used to implement DFF/LATCH function, the two input signals from the connection matrix go to the data (D_in), clock (CLK)
inputs for the Flip-Flop, with the output going back to the connection matrix. LATCH or DFF configuration is selected by registers
[747], [752], [757].
The operation of the D Flip-Flop and LATCH will follow the functional descriptions below:
DFF: CLK is rising edge triggered, then Q = D; otherwise Q will not change.
LATCH: when CLK is Low, then Q = D; otherwise Q remains its previous value (input D has no effect on the output, when CLK
is High).
It's possible to read/write the Shift Register content via I2C. See section 15.4.10 for more information.
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SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
From Connectinon
Matrix Output [1]
LUT IN1
4 memory cells
S1
S0
D_in
DFF data in
ShRg data in
From Connectinon
Matrix Output [0]
LUT IN0
S1
S0
Clk
DFF CLK
ShRg CLK
LATCH/DFF_sel
Out[3:0]
4
2-bit LUT
[3]
[0]
To Connection
Matrix Input [1]
11
.
.
.
S0
S1
2
2
00
S0
S1
LUT config
ShRg/LUT_sel
1-bit NVM
ShRg_length [1:0]
2
4
2
nQ/Q_sel
4-bit NVM
Figure 13: 2-bit LUT0 or DFF0 or Shift Register0
From Connectinon
Matrix Output [3]
LUT IN1
4 memory cells
S1
S0
D_in
DFF data in
ShRg data in
From Connectinon
Matrix Output [2]
LUT IN0
S1
S0
Clk
DFF CLK
ShRg CLK
LATCH/DFF_sel
Out[3:0]
4
2-bit LUT
[3]
[0]
To Connection
Matrix Input [2]
11
.
.
.
S0
S1
2
2
00
S0
S1
LUT config
ShRg/LUT_sel
1-bit NVM
ShRg_length [1:0]
2
4
2
nQ/Q_sel
4-bit NVM
Figure 14: 2-bit LUT1 or DFF1 or Shift Register1
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Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
From Connectinon
Matrix Output [5]
LUT IN1
4 memory cells
S1
S0
D_in
DFF data in
ShRg data in
From Connectinon
Matrix Output [4]
LUT IN0
S1
S0
Clk
DFF CLK
ShRg CLK
LATCH/DFF_sel
Out[3:0]
4
2-bit LUT
[3]
[0]
To Connection
Matrix Input [3]
11
.
.
.
S0
S1
2
2
00
S0
S1
LUT config
ShRg/LUT_sel
1-bit NVM
ShRg_length [1:0]
2
4
2
nQ/Q_sel
4-bit NVM
Figure 15: 2-bit LUT2 or DFF2 or Shift Register2
Inital Value is loaded from NVM to Shift Register
VDD
Data
Clk
POR
ShReg_Out[3:0]
Initial Value 1001 (x9)
0011
0111
1110
1100
1000
0000
0000
0001
0011
0111
1111
(Internal Signal)
Q=ShReg_Out[0]
(see note 1)
Q=ShReg_Out[3]
MSB
LSB
(see note 2)
x9
Initial Value is transmitted
Input Data are transmitted
Note1 : Macrocell is configured as DFF
Note2 : Macrocell is configured as 4-bit Shift Register
Figure 16: DFF0 to DFF2 and Shift Register0 to Shift Register2 Operation
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Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Inital Value is loaded from NVM to Shift Register
VDD
Data
Clk
ShReg_Out[3:0]
(Internal Signal)
Initial Value 1001 (x9)
0010
0101
1010
0101
1011
0111
POR
Q=ShReg_Out[0]
(see note 2)
Q=ShReg_Out[3]
(see note 3)
4 Clk pulses
Note1 : DFF Setting “Initial Value: 1”
Note2 : Macrocell is configured as DFF
Note3 : Macrocell is configured as 4-bits ShReg
Figure 17: DFF0 to DFF2 and Shift Register0 to Shift Register2 Operation with DFF Initial Value = 1
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Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Inital Value is loaded from NVM to Shift Register
VDD
Data
Clk
ShReg_Out[3:0]
(Internal Signal)
Initial Value 0001 (x1)
0010
0101
1010
0101
1011
0111
POR
Q=ShReg_Out[0]
(see note 2)
Q=ShReg_Out[3]
(see note 3)
4 Clk pulses
Note1 : DFF Setting “Initial Value: 1”
Note2 : Macrocell is configured as DFF
Note3 : Macrocell is configured as 4-bits ShReg
Figure 18: DFF0 to DFF2 and Shift Register0 to Shift Register2 Operation with Initial Value = b0001
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Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
7.1.1 2-Bit LUT or D Flip-Flop Macrocell Used as 2-Bit LUT
This Macrocell, when programmed for a LUT function, uses a 4-bit register to define their output function:
2-Bit LUT0 is defined by registers [635:632]
2-Bit LUT1 is defined by registers [639:636]
2-Bit LUT2 is defined by registers [643:640]
Table 22: 2-bit LUT2_0 to 2-bit LUT2_2 Truth Table
IN1
0
IN0
0
OUT LUT0
register [632
register [633
register [634
register [635
OUT LUT1
register [636
register [637
register [638
register [639
OUT LUT2
register [640
register [641
register [642
register [643
]
]
]
]
]
]
]
]
]
]
]
]
LSB
0
1
1
0
1
1
MSB
Table 23 shows the register bits for the standard digital logic devices (AND, NAND, OR, NOR, XOR, XNOR) that can be created
within each of the 2-bit LUT logic cells.
Table 23: 2-bit LUT Standard Digital Functions
Function
AND-2
MSB
LSB
1
0
1
0
0
1
0
1
1
0
1
0
0
1
1
0
1
0
0
1
0
1
0
1
NAND-2
OR-2
NOR-2
XOR-2
XNOR-2
7.2 2-BIT LUT OR PROGRAMMABLE PATTERN GENERATOR
The SLG47502/03 has one combination function macrocell that can serve as a logic or a timing function. This macrocell can serve
as a Look Up Table (LUT), or a Programmable Pattern Generator (PGen).
When used to implement LUT functions, the 2-bit LUT takes in two input signals from the connection matrix and produces a single
output, which goes back into the connection matrix. When used as a LUT to implement combinatorial logic functions, the outputs
of the LUT can be configured to any user defined function, including the following standard digital logic devices (AND, NAND,
OR, NOR, XOR, XNOR). The user can also define the combinatorial relationship between inputs and outputs to be any selectable
function.
It is possible to define the RST level for the PGen macrocell. There are both high level reset (RST) and a low level reset (nRST)
options available, which are selected by register [760]. When operating as the Programmable Pattern Generator, the output of
the macrocell will clock out a sequence of two to sixteen bits that are user selectable in their bit values, and user selectable in
the number of bits (up to sixteen) that are output before the pattern repeats.
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Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
From Connection Matrix Output [6]
From Connection Matrix Output [7]
In0
In1
OUT
2-bit LUT3
LUT Truth
Table
To Connection Matrix Input [4]
S0
S1
registers [647:644]
0: 2-bit LUT3 OUT
1: PGen OUT
Pattern
size
nRST/RST
CLK
PGen
OUT
PGen
Data
register [759]
registers [871:856]
Figure 19: 2-bit LUT3 or PGen
V
DD
t
t
nRST
CLK
OUT
1
2
6
8
16 17
3
5
7
0
4
9
10 11
14 15
12 13
t
D7
D6
D5
D10
D8
D4
D3
D2
D1
D15
D0
D9
D0
D15
D14
D13
D12
D11
D0
t
Figure 20: PGen Timing Diagram
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Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 24: 2-bit LUT2_3 Truth Table
IN1
0
IN0
0
OUT
register [647]
register [646]
register [645]
register [644]
LSB
0
1
1
0
1
1
MSB
This macrocell, when programmed for a LUT function, uses a 4-bit register to define their output function:
2-Bit LUT2_3 is defined by registers [647:644]
Table 25 shows the register bits for the standard digital logic devices (AND, NAND, OR, NOR, XOR, XNOR) that can be created
within each of the 2-bit LUT logic cells.
Table 25: 2-bit LUT Standard Digital Functions
Function
AND-2
MSB
LSB
1
0
1
0
0
1
0
1
1
0
1
0
0
1
1
0
1
0
0
1
0
1
0
1
NAND-2
OR-2
NOR-2
XOR-2
XNOR-2
7.3 3-BIT LUT OR D FLIP-FLOP WITH SET/RESET OR SHIFT REGISTER MACROCELLS
There are ten macrocells that can serve as 3-bit LUT or as DFF/LATCH, or as Shift Register. It is also possible to define the active
level (Q or nQ) for the macrocell’s output by registers [766], [774], [782], [790], [798], [806], [814], [822], [830], [838]. DFF/Shift
Register or LUT are selected by registers [761], [769], [777], [785], [793], [801], [809], [817], [825], [833]. When used to implement
LUT functions, the 3-bit LUT takes in three input signals from the connection matrix and produces a single output, which goes
back into the connection matrix.
When used to implement Shift Register, the three input signals from the connection matrix go to the data (D_in), clock (CLK), and
Set/Reset (nSET/nRST) inputs for the Shift Register, with the output going back to the connection matrix. It is possible to define
the active level for the Set/Reset input of Shift Register macrocell which is selected by registers [768], [776], [784], [792], [800],
[808], [816], [824], [832], [840]. The input data (D_in) writes into LSB. The Shift Register length (up to 8 bits/memory cells) is
selected by registers [764:762], [772:770], [780:778], [788:786], [796:794], [804:802]. [812:810], [820:818], [828:826], [836:834],
[845:842], when these registers = 0 DFF/LATCH function is selected.
When used to implement D Flip-Flop/LATCH function, the three input signals from the connection matrix go to the data (D_in),
clock (CLK), and Set/Reset (nSET/nRST) inputs for the Flip-Flop/LATCH, with the output going back to the connection matrix. It
is possible to define the active level for the Set/Reset input (nSET/nRST_sel which is selected by register [767], [775], [783],
[791], [799], [807], [815], [823], [831], [839]) of DFF/LATCH macrocell. LATCH or DFF configuration is selected by registers [765],
[773], [781], [789], [797], [805], [813], [821], [829], [837].
The operation of the D Flip-Flop and LATCH will follow the functional descriptions below:
DFF: CLK is rising edge triggered, then Q = D; otherwise Q will not change.
LATCH: when CLK is Low, then Q = D; otherwise Q remains its previous value (input D has no effect on the output, when CLK
is High)
.
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Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
It's possible to read/write the Shift Register content via I2C. See section 15.4.10 for more information.
LUT IN1
DFF data in
ShRg data in
From Connectinon
Matrix Output [9]
8 memory cells
S1
S0
D_in
Clk
LUT IN0
DFF CLK
ShRg CLK
From Connectinon
Matrix Output [8]
S1
S0
LUT IN2
DFF nSet/nRST
ShRg nSet/nRST
S0
S1
nSET/nRST
SET/RST
From Connectinon
Matrix Output [10]
nSET/nRST_sel Out[7:0]
SET/RST_act_level LATCH/DFF_sel
8
3-bit LUT
[7]
To Connection
Matrix Input [5]
111
000
.
.
.
S0
S1
3
3
] 0 [
LUT config
S0
S1
ShRg/LUT_sel
1-bit NVM
ShRg_length [2:0]
3
7
4
nQ/Q_sel
7-bit NVM
Figure 21: 3-bit LUT0 or DFF3 or Shift Register 3
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Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
LUT IN1
DFF data in
ShRg data in
From Connectinon
Matrix Output [12]
8 memory cells
S1
S0
D_in
Clk
LUT IN0
DFF CLK
ShRg CLK
From Connectinon
Matrix Output [11]
S1
S0
LUT IN2
DFF nSet/nRST
ShRg nSet/nRST
S0
S1
nSET/nRST
SET/RST
From Connectinon
Matrix Output [13]
nSET/nRST_sel Out[7:0]
SET/RST_act_level LATCH/DFF_sel
8
3-bit LUT
[7]
To Connection
Matrix Input [6]
111
000
.
.
.
S0
S1
3
3
] 0 [
LUT config
S0
S1
ShRg/LUT_sel
1-bit NVM
ShRg_length [2:0]
3
7
4
nQ/Q_sel
7-bit NVM
Figure 22: 3-bit LUT1 or DFF4 or Shift Register 4
LUT IN1
DFF data in
ShRg data in
From Connectinon
Matrix Output [15]
8 memory cells
S1
S0
D_in
Clk
LUT IN0
DFF CLK
ShRg CLK
From Connectinon
Matrix Output [14]
S1
S0
LUT IN2
DFF nSet/nRST
ShRg nSet/nRST
S0
S1
nSET/nRST
SET/RST
From Connectinon
Matrix Output [16]
LATCH/DFF_sel
nSET/nRST_sel Out[7:0]
SET/RST_act_level
8
3-bit LUT
To Connection
Matrix Input [7]
[7]
111
000
.
.
.
S0
S1
3
3
] 0 [
LUT config
S0
S1
ShRg/LUT_sel
1-bit NVM
ShRg_length [2:0]
3
7
4
nQ/Q_sel
7-bit NVM
Figure 23: 3-bit LUT2 or DFF5 or Shift Register 5
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Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
LUT IN1
DFF data in
ShRg data in
From Connectinon
Matrix Output [18]
8 memory cells
S1
S0
D_in
Clk
LUT IN0
DFF CLK
ShRg CLK
From Connectinon
Matrix Output [17]
S1
S0
LUT IN2
DFF nSet/nRST
ShRg nSet/nRST
S0
S1
nSET/nRST
SET/RST
From Connectinon
Matrix Output [19]
LATCH/DFF_sel
nSET/nRST_sel Out[7:0]
SET/RST_act_level
8
3-bit LUT
[7]
To Connection
Matrix Input [8]
111
000
.
.
.
S0
S1
3
3
] 0 [
LUT config
S0
S1
ShRg/LUT_sel
1-bit NVM
ShRg_length [2:0]
3
7
4
nQ/Q_sel
7-bit NVM
Figure 24: 3-bit LUT3 or DFF6 or Shift Register 6
LUT IN1
DFF data in
ShRg data in
From Connectinon
Matrix Output [21]
8 memory cells
S1
S0
D_in
Clk
LUT IN0
DFF CLK
ShRg CLK
From Connectinon
Matrix Output [20]
S1
S0
LUT IN2
DFF nSet/nRST
ShRg nSet/nRST
S0
S1
nSET/nRST
SET/RST
From Connectinon
Matrix Output [22]
LATCH/DFF_sel
nSET/nRST_sel Out[7:0]
SET/RST_act_level
8
3-bit LUT
[7]
To Connection
Matrix Input [9]
111
000
.
.
.
S0
S1
3
3
] 0 [
LUT config
S0
S1
ShRg/LUT_sel
1-bit NVM
ShRg_length [2:0]
3
7
4
nQ/Q_sel
7-bit NVM
Figure 25: 3-bit LUT4 or DFF7 or Shift Register 7
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Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
LUT IN1
DFF data in
ShRg data in
From Connectinon
Matrix Output [24]
8 memory cells
S1
S0
D_in
Clk
LUT IN0
DFF CLK
ShRg CLK
From Connectinon
Matrix Output [23]
S1
S0
LUT IN2
DFF nSet/nRST
ShRg nSet/nRST
S0
S1
nSET/nRST
SET/RST
From Connectinon
Matrix Output [25]
nSET/nRST_sel Out[7:0]
SET/RST_act_level LATCH/DFF_sel
8
3-bit LUT
[7]
To Connection
Matrix Input [10]
111
000
.
.
.
S0
S1
3
3
] 0 [
LUT config
S0
S1
ShRg/LUT_sel
1-bit NVM
ShRg_length [2:0]
3
7
4
nQ/Q_sel
7-bit NVM
Figure 26: 3-bit LUT5 or DFF8 or Shift Register 8
LUT IN1
DFF data in
ShRg data in
From Connectinon
Matrix Output [27]
8 memory cells
S1
S0
D_in
Clk
LUT IN0
DFF CLK
ShRg CLK
From Connectinon
Matrix Output [26]
S1
S0
LUT IN2
DFF nSet/nRST
ShRg nSet/nRST
S0
S1
nSET/nRST
SET/RST
From Connectinon
Matrix Output [28]
nSET/nRST_sel Out[7:0]
SET/RST_act_level LATCH/DFF_sel
8
3-bit LUT
[7]
To Connection
111
Matrix Input [11]
.
.
.
S0
S1
3
3
] 0 [
LUT config
000
S0
S1
ShRg/LUT_sel
1-bit NVM
ShRg_length [2:0]
3
7
4
nQ/Q_sel
7-bit NVM
Figure 27: 3-bit LUT6 or DFF9 or Shift Register 9
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Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
LUT IN1
DFF data in
ShRg data in
From Connectinon
Matrix Output [30]
8 memory cells
S1
S0
D_in
Clk
LUT IN0
DFF CLK
ShRg CLK
From Connectinon
Matrix Output [29]
S1
S0
LUT IN2
DFF nSet/nRST
ShRg nSet/nRST
S0
S1
nSET/nRST
SET/RST
From Connectinon
Matrix Output [31]
nSET/nRST_sel Out[7:0]
SET/RST_act_level LATCH/DFF_sel
8
3-bit LUT
[7]
To Connection
Matrix Input [12]
111
000
.
.
.
S0
S1
3
3
] 0 [
LUT config
S0
S1
ShRg/LUT_sel
1-bit NVM
ShRg_length [2:0]
3
7
4
nQ/Q_sel
7-bit NVM
Figure 28: 3-bit LUT7 or DFF10 or Shift Register 10
LUT IN1
DFF data in
ShRg data in
From Connectinon
Matrix Output [33]
8 memory cells
S1
S0
D_in
Clk
LUT IN0
DFF CLK
ShRg CLK
From Connectinon
Matrix Output [32]
S1
S0
LUT IN2
DFF nSet/nRST
ShRg nSet/nRST
S0
S1
nSET/nRST
SET/RST
From Connectinon
Matrix Output [34]
nSET/nRST_sel Out[7:0]
SET/RST_act_level LATCH/DFF_sel
8
3-bit LUT
[7]
To Connection
111
Matrix Input [13]
.
.
.
S0
S1
3
3
] 0 [
LUT config
000
S0
S1
ShRg/LUT_sel
1-bit NVM
ShRg_length [2:0]
3
7
4
nQ/Q_sel
7-bit NVM
Figure 29: 3-bit LUT8 or DFF11 or Shift Register 11
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Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
LUT IN1
DFF data in
ShRg data in
From Connectinon
Matrix Output [36]
8 memory cells
S1
S0
D_in
Clk
LUT IN0
DFF CLK
ShRg CLK
From Connectinon
Matrix Output [35]
S1
S0
LUT IN2
DFF nSet/nRST
ShRg nSet/nRST
S0
S1
nSET/nRST
SET/RST
From Connectinon
Matrix Output [37]
nSET/nRST_sel Out[7:0]
SET/RST_act_level LATCH/DFF_sel
8
3-bit LUT
To Connection
Matrix Input [14]
[7]
111
000
.
.
.
S0
S1
3
3
] 0 [
LUT config
S0
S1
ShRg/LUT_sel
1-bit NVM
ShRg_length [2:0]
3
7
4
nQ/Q_sel
7-bit NVM
Figure 30: 3-bit LUT9 or DFF12 or Shift Register 12
Inital Value is loaded from NVM to Shift Register
VDD
Data
Clk
POR
ShReg_Out[7:0]
Initial Value 10011011 (x9B)
00110111 01101111 11011110 10111100 01111000 11110000 11100000 11000001 10000011 00000111 00001111
(Internal Signal)
Q=ShReg_Out[0]
(see note 1)
Q=ShReg_Out[7]
(see note 2)
MSB
LSB
x9
xB
Initial Value is transmitted (x9B)
Input Data are transmitted
Note1 : Macrocell is configured as DFF
Note2 : Macrocell is configured as 8-bit Shift Register
Figure 31: DFF3 to DFF12 and Shift Register 3 to Shift Register 12 Operation
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Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Inital Value is loaded from NVM to Shift Register
VDD
Data
Clk
POR
ShReg_Out[7:0]
(Internal Signal)
Initial Value 10011011 (x9B)
00000010 00000101 00001010 00010100 00101000 01010000 10100000
00000000
00000000 00000001
nReset
(see note 1)
Q=ShReg_Out[0]
(see note 2)
Q=ShReg_Out[7]
(see note 3)
8 Clk pulses
Note1 : DFF Setting “Initial Value: 1”
Note2 : Macrocell is configured as DFF
Note3 : Macrocell is configured as 8-bits
Figure 32: DFF3 to DFF12 and Shift Register 3 to Shift Register 12 Operation, nReset, Initial Value: b10011011
Inital Value is loaded from NVM to Shift Register
VDD
Data
Clk
POR
ShReg_Out[7:0]
(Internal Signal)
Initial Value 10011011
00000010 00000101
00000001
00000000
00000001 00000011 00000111
00000000
nReset
(see note 1)
Q=ShReg_Out[0]
(see note 2)
Q=ShReg_Out[7]
(see note 3)
Note1 : DFF Setting “Initial Value: 1”
Note2 : Macrocell is configured as DFF
Note3 : Macrocell is configured as 8-bits
Figure 33: DFF3 to DFF12 and Shift Register3 to Shift Register12 Operation, nReset, Initial Value: b10011011, Case2
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Inital Value is loaded from NVM to Shift Register
VDD
Data
Clk
POR
ShReg_Out[7:0]
Initial Value 00011011
11011110 10111101
00000000
00000001 00000011 00000111
00110111 01101111
(Internal Signal)
nReset
(see note 1)
Q=ShReg_Out[0]
(see note 2)
Q=ShReg_Out[7]
(see note 3)
Note1 : DFF Setting “Initial Value: 1”
Note2 : Macrocell is configured as DFF
Note3 : Macrocell is configured as 8-bits
Figure 34: DFF3 to DFF12 and Shift Register 3 to Shift Register 12 Operation, nReset, Initial Value: b00011011
Inital Value is loaded from NVM to Shift Register
VDD
Data
Clk
POR
ShReg_Out[7:0]
Initial Value 00011010 (x1A)
11111100 11111001 11110010 11100100 11001000 10010000 00100000 11111111 11111111
11111111 11111110
(Internal Signal)
nSet
(see note 1)
Q=ShReg_Out[0]
(see note 2)
Q=ShReg_Out[7]
(see note 3)
8 Clk pulses
Note1 : DFF Setting “Initial Value: 0”
Note2 : Macrocell is configured as DFF
Note3 : Macrocell is configured as 8-bits
Figure 35: DFF3 to DFF12 and Shift Register 3 to Shift Register 12 Operation, nSet, Initial Value: b00011010
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Inital Value is loaded from NVM to Shift Register
VDD
Data
Clk
POR
ShReg_Out[7:0]
(Internal Signal)
Initial Value 00011010
11111111
11111100 11111001
11111111
11111110 11111100 11111000
11111110
nSet
(see note 1)
Q=ShReg_Out[0]
(see note 2)
Q=ShReg_Out[7]
(see note 3)
Note1 : DFF Setting “Initial Value: 0”
Note2 : Macrocell is configured as DFF
Note3 : Macrocell is configured as 8-bits
Figure 36: DFF3 to DFF12 and Shift Register 3 to Shift Register 12 Operation, nSet, Initial Value: b00011010, Case 2
Inital Value is loaded from NVM to Shift Register
VDD
Data
Clk
POR
ShReg_Out[7:0]
Initial Value 10011010
00110101
11010100 10101001
11111111
11111110 11111100 11111000
01101010
(Internal Signal)
nSet
(see note 1)
Q=ShReg_Out[0]
(see note 2)
Q=ShReg_Out[7]
(see note 3)
Note1 : DFF Setting “Initial Value: 0”
Note2 : Macrocell is configured as DFF
Note3 : Macrocell is configured as 8-bits
Figure 37: DFF3 to DFF12 and Shift Register 3 to Shift Register 12 Operation, nSet, Initial Value: b10011010
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7.3.1 3-Bit LUT or D Flip-Flop Macrocells Used as 3-Bit LUTs
Each macrocell, when programmed for a LUT function, uses an 8-bit register to define their output function:
3-Bit LUT3_0 is defined by registers [655:648]
3-Bit LUT3_1 is defined by registers [663:656]
3-Bit LUT3_2 is defined by registers [671:664]
3-Bit LUT3_3 is defined by registers [679:672]
3-Bit LUT3_4 is defined by registers [687:680]
3-Bit LUT3_5 is defined by registers [695:688]
3-Bit LUT3_6 is defined by registers [703:696]
3-Bit LUT3_7 is defined by registers [711:704]
3-Bit LUT3_8 is defined by registers [719:712]
3-Bit LUT3_9 is defined by registers [727:720]
Table 26: 3-bit LUT3_0 to 3-bit LUT3_9 Truth Table
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
register register register register register register register register register register
[648] [656] [664] [672] [680] [688] [696] [704] [712] [720]
LSB
register register register register register register register register register register
[649] [657] [665] [673] [681] [689] [697] [705] [713] [721]
register register register register register register register register register register
[650] [658] [666] [674] [682] [690] [698] [706] [714] [722]
register register register register register register register register register register
[651] [659] [667] [675] [683] [691] [699] [707] [715] [723]
register register register register register register register register register register
[652] [660] [668] [676] [684] [692] [700] [708] [716] [724]
register register register register register register register register register register
[653] [661] [669] [677] [685] [693] [701] [709] [717] [725]
register register register register register register register register register register
[654] [662] [670] [678] [686] [694] [702] [710] [718] [726]
register register register register register register register register register register
[655] [663] [671] [679] [687] [695] [703] [711] [719] [727]
MSB
Table 27 shows the register bits for the standard digital logic devices (AND, NAND, OR, NOR, XOR, XNOR) that can be created
within each of the four 3-bit LUT logic cells.
Table 27: 3-bit LUT Standard Digital Functions
Function
AND-3
MSB
LSB
1
0
1
0
1
1
0
1
1
0
1
1
0
1
1
0
1
1
0
1
1
0
1
0
NAND-3
OR-3
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Table 27: 3-bit LUT Standard Digital Functions (Continued)
Function
NOR-3
MSB
LSB
0
1
0
0
0
1
0
0
1
0
1
0
0
0
1
0
1
0
0
1
0
1
0
1
XOR-3
XNOR-3
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7.4 4-BIT LUT OR D FLIP-FLOP WITH SET/RESET OR SHIFT REGISTER MACROCELL
There is one macrocell that can serve as 4-bit LUT or as DFF/LATCH, or as Shift Register. It is also possible to define the active
level (Q or nQ) for the macrocell’s output by register [847]. DFF/Shift Register or LUT are selected by register [841]. When used
to implement LUT functions, the 4-bit LUT takes in four input signals from the connection matrix and produces a single output,
which goes back into the connection matrix.
When used to implement Shift Register, the four input signals from the connection matrix go to the data (D_in), clock (CLK),
clock enable (CLK_enable), and Set/Reset (nSET/nRST) inputs for the Shift Register, with the output going back to the
connection matrix. It is possible to define the active level for the reset/set input of Shift Register macrocell which is selected by
register [849]. The input data (D_in) writes into LSB. The Shift Register length (up to 16 bits/memory cells) is selected by register
[845:842]. Register [845:842] = 0 means that DFF/LATCH function is selected.
When used to implement D Flip-Flop function, the four input signals from the connection matrix go to the data (D_in), clock
(CLK), clock enable (CLK_enable), and Set/Reset (nSET/nRST) inputs for the Flip-Flop, with the output going back to the
connection matrix. Macrocell in LATCH configuration have three input signals: data (D_in), clock (CLK), and Set/Reset (nSET/
nRST). It is possible to define the active level for the reset/set input (nSET/nRST_sel which are selected by register [848]) of
DFF/LATCH macrocell. LATCH or DFF configuration is selected by register [846].
The operation of the D Flip-Flop and LATCH will follow the functional descriptions below:
DFF: CLK is rising edge triggered, then Q = D; otherwise Q will not change. When clock enable (CLK_enable) is low, macrocell
doesn't react to any pulses at clock (CLK) input.
LATCH: when CLK is Low, then Q = D; otherwise Q remains its previous value (input D has no effect on the output, when CLK is
High).
It's possible to read/write the Shift Register content via I2C. See section 15.4.10 for more information.
LUT IN1
DFF data in
ShRg data in
From Connectinon
Matrix Output [39]
16 memory cells
S1
S0
D_in
LUT IN0
DFF CLK
ShRg CLK
From Connectinon
Matrix Output [38]
S1
S0
Clk
From Connectinon
Matrix Output [40]
Clk_enable
LUT IN2
DFF nSet/nRST
ShRg nSet/nRST
S0
S1
nSET/nRST
nSET/nRST_sel Out[15:0] SET/RST_act_level LATCH/DFF_sel
16
4-bit LUT
From Connectinon
Matrix Output [41]
S1
S0
[15]
LUT IN3
DFF CLK Enable
ShRg CLK Enable
To Connection
Matrix Input [15]
1111
.
LUT config
S0
S1
.
4
4
] 0 [
.
0000
S0
S1
ShRg/LUT_sel
1-bit NVM
ShRg_length [3:0]
4
8
4
nQ/Q_sel
8-bit NVM
Figure 38: 4-bit LUT0 or DFF13 or Shift Register 13
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Inital Value is loaded from NVM to Shift Register
VDD
Data
Clk
POR
CLK_En
Initial Value (xA7B2)
10100111/10110010
01001111 10011110 00111101 01111011 11110110 11101100 11011001 10110010 01100101 11001011 10010110 00101100 01011000 10110000 01100000 11000001 10000011 00000111
01100101 11001011 10010110 00101100 01011000 10110000 01100000 11000001 10000011 00000111 00001111 00011111 00111110 01111100 11111001 11110011 11100110 11001100
MSB
LSB
xA
x7
xB
Initial Value is transmitted (xA7B2)
x2
Input Data
is transmitted
Note1 : Macrocell is configured as DFF
Note2 : Macrocell is configured as 16-bit Shift Register
Figure 39: DFF13 and Shift Register 13 Operation
Inital Value is loaded from NVM to Shift Register
VDD
Data
Clk
POR
CLK_En
Initial Value (xA7B2)
10100111/10110010
11111111 11111111 11111111 11111111 11111111 11111111 11111111 11111111 11111111 11111111 11111110 11111100 11111000 11110000 11100000 11000001 10000011 00000111
11111111 11111111 11111110 11111100 11111000 11110000 11100000 11000001 10000011 00000111 00001111 00011111 00111110 01111100 11111001 11110011 11100110 11001100
ShReg_Out[15:0]
(Internal Signal)
nSet
(see note 1)
Q=ShReg_Out[0]
(see note 2)
Q=ShReg_Out[15]
(see note 3)
16 Clk pulses
Note1 : DFF Setting “Initial Value: 0”
Note2 : Macrocell is configured as DFF
Note3 : Macrocell is configured as 16-bits ShReg
Figure 40: DFF13 and Shift Register 13 Operation, nSet, Initial Value: xA7B2
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Inital Value is loaded from NVM to Shift Register
VDD
Data
Clk
POR
CLK_En
ShReg_Out[15:0]
(Internal Signal)
Initial Value (xA7B2)
10100111/10110010
00000000 00000000 00000000 00000000 00000000 00000000 00000000 00000000 00000000 00000001 00000010 00000100 00001000 00010000 00100000 01000001 10000011 00000111
00000000 00000001 00000010 00000100 00001000 00010000 00100000 01000001 10000011 00000111 00001111 00011111 00111110 01111100 11111001 11110011 11100110 11001100
nReset
(see note 1)
Q=ShReg_Out[0]
(see note 2)
Q=ShReg_Out[15]
(see note 3)
16 Clk pulses
Note1 : DFF Setting “Initial Value: 0”
Note2 : Macrocell is configured as DFF
Note3 : Macrocell is configured as 16-bits ShReg
Figure 41: DFF13 and Shift Register 13 Operation, nReset, Initial Value: xA7B2
7.4.1 4-Bit LUT Macrocell Used as 4-Bit LUT
Table 28: 4-bit LUT0 Truth Table
IN3
0
IN2
0
IN1
0
IN0
0
OUT
register [728]
register [729]
register [730]
register [731]
register [732]
register [733]
register [734]
register [735]
register [736]
register [737]
register [738]
register [739]
register [740]
register [741]
register [742]
register [743]
LSB
0
0
0
1
0
0
1
0
0
0
1
1
0
1
0
0
0
1
0
1
0
1
1
0
0
1
1
1
1
0
0
0
1
0
0
1
1
0
1
0
1
0
1
1
1
1
0
0
1
1
0
1
1
1
1
0
1
1
1
1
MSB
This macrocell, when programmed for a LUT function, uses a 16-bit register to define their output function:
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4-Bit LUT0 is defined by registers [743:728]
Table 29: 4-bit LUT Standard Digital Functions
Function
AND-4
MSB
LSB
1
0
1
0
0
1
0
1
1
0
1
0
0
1
1
0
1
0
0
1
1
0
0
1
0
1
1
0
1
0
0
1
1
0
0
1
0
1
1
0
0
1
0
1
1
0
1
0
0
1
1
0
1
0
0
1
1
0
0
1
0
1
1
0
0
1
0
1
1
0
1
0
0
1
1
0
0
1
0
1
1
0
1
0
0
1
1
0
1
0
0
1
0
1
0
1
NAND-4
OR-4
NOR-4
XOR-4
XNOR-4
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8
Multi-Function Macrocells
The SLG47502/03 has 8 Multi-Function macrocells that can serve as more than one logic or timing function. In each case, they
can serve as a LUT, DFF with flexible settings, or as CNT/DLY with multiple modes such as One Shot, Frequency Detect, Edge
Detect, and others. Also, the macrocell is capable to combine those functions: LUT/DFF connected to CNT/DLY or CNT/DLY
connected to LUT/DFF, see Figure 42.
See the list below for the functions that can be implemented in these macrocells:
Seven macrocells that can serve as 3-bit LUTs/D Flip-Flops and as 8-Bit Counter/Delays
One macrocell that can serve as a 4-bit LUT/D Flip-Flop and as 16-Bit Counter/Delay/FSM
To Connection Matrix
To Connection Matrix
From Connection
Matrix
To Connection
Matrix
From Connection
Matrix
To Connection
Matrix
LUT
or
DFF
LUT
or
DFF
CNT/DLY
CNT/DLY
Figure 42: Possible Connections Inside Multi-Function Macrocell
Inputs/Outputs for the 8 Multi-Function function macrocells are configured from the connection matrix with specific logic functions
being defined by the state of NVM bits.
When used as a LUT to implement combinatorial logic functions, the outputs of the LUTs can be configured to any user defined
function, including the following standard digital logic devices (AND, NAND, OR, NOR, XOR, XNOR).
8.1 3-BIT LUT OR DFF/LATCH WITH 8-BIT COUNTER/DELAY MACROCELLS
There are seven macrocells that can serve as 3-bit LUTs/D Flip-Flops and as 8-Bit Counter/Delays.
When used to implement LUT functions, the 3-bit LUTs each takes in three input signals from the connection matrix and produces
a single output, which goes back into the connection matrix or can be connected to CNT/DLY's input.
When used to implement D Flip-Flop function, the three input signals from the connection matrix go to the data (D), clock (CLK),
and Set/Reset (nRST/nSET) inputs of the Flip-Flop, with the output going back to the connection matrix or to the CNT/DLY's input.
The operation of the D Flip-Flop and LATCH will follow the functional descriptions below:
DFF: CLK is rising edge triggered, then Q = D; otherwise Q will not change.
LATCH: when CLK is High, then Q = D; otherwise Q remains its previous value (input D has no effect on the output, when CLK
is Low).
When used to implement Counter/Delays, each macrocell has a dedicated matrix input connection. For flexibility, each of these
macrocells has a large selection of internal and external clock sources, as well as the option to chain from the output of the
previous (N-1) CNT/DLY macrocell, to implement longer count/delay circuits. These macrocells can also operate in a One-Shot
mode, which will generate an output pulse of user-defined width. They can also operate in a Frequency Detection or Edge
Detection mode.
Counter/Delay macrocell has an initial value, which define its initial value after GPAK is powered up. It is possible to select initial
Low or initial High, as well as initial value defined by a Delay In signal.
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For example, in case initial LOW option is used, the rising edge delay will start operation.
For timing diagrams refer to sections 7.1 and 8.3.
Note: After two DFF – counters initialize with counter data = 0 after POR.
Initial state = 1 – counters initialize with counter data = 0 after POR.
Initial state = 0 And After two DFF is bypass – counters initialize with counter data after POR.
CNT6 and CNT7 current count value can be read via I2C. However, it is possible to change the counter data (value counter starts
operating from) for any macrocell using I2C write commands. In this mode, it is possible to load count data immediately (after two
DFF) or after counter ends counting. See Section 15.4.8 for further details.
8.1.1 3-Bit LUT or 8-Bit CNT/DLY Block Diagrams
register [960] DFF or Latch Select
register [961] Output Select (Q or
From Connection
nQ)
Matrix Output A [48]
register [962] DFF Initial Polarity
Select
register [963] (nRST or nSET) from
matrix Output
IN2
IN1
IN0
S0
S1
3-bit LUT10
S0
S1
OUT
LUT Truth
Table
From Connection
Matrix Output B [47]
To Connection
S0
S0
S1
S0
S1
Matrix Input [19]
8-bits NVM
registers [967:960]
S1
DFF
Registers
D
From Connection
Matrix Output C [46]
S0
S1
S0
S1
nRST/nSET
CLK
DFF/
Latch15
Q/nQ
register [972]
LUT/DFF Sel
registers [999:992]
registers [979:976]
Mode Sel
CNT
Data
ext_CLK
To Connection
Matrix Input [18]
0
S0
OUT
CNT/DLY1
DLY_IN/CNT Reset
S0
S1
S2
S1
S2
S3
Config
Data
0
S3
registers [987:984], [981:980], [975:973], [971:968]
Figure 43: 8-bit Multi-Function Macrocells Block Diagram (3-bit LUT10/DFF15, CNT/DLY1)
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register [1008] DFF or Latch Select
register [1009] Output Select (Q or
nQ)
From Connection
Matrix Output [51]
register [1110] DFF Initial Polarity
Select
IN2
IN1
IN0
S0
3-bit LUT11
S0
register [1111] (nRST or nSET) from
matrix Output
OUT
S1
S1
LUT Truth
Table
From Connection
Matrix Output [50]
To Connection
S0
S0
S1
S0
S1
Matrix Input [21]
8-bits NVM
registers [1015:1008]
S1
DFF
Registers
D
From Connection
Matrix Output [49]
S0
S1
S0
S1
DFF/
Latch16
nRST/nSET
CLK
Q/nQ
register [1020]
LUT/DFF Sel
registers [1047:1040]
registers [1027:1024]
Mode Sel
CNT
Data
ext_CLK
To Connection
Matrix Input [20]
0
S0
OUT
CNT/DLY2
DLY_IN/CNT Reset
S0
S1
S2
S1
S2
S3
Config
Data
0
S3
registers [1047:1040], [1029:1027], [1023:1021], [1019:1016]
Figure 44: 8-bit Multi-Function Macrocells Block Diagram (3-bit LUT11/DFF16, CNT/DLY2)
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register [1056] DFF or Latch Select
register [1057] Output Select (Q or
nQ)
From Connection
Matrix Output [54]
register [1058] DFF Initial Polarity
Select
IN2
IN1
IN0
S0
3-bit LUT12
S0
register [1059] (nRST or nSET)
from matrix Output
OUT
S1
S1
LUT Truth
Table
From Connection
Matrix Output [53]
To Connection
S0
S0
S1
S0
S1
Matrix Input [23]
8-bits NVM
registers [1063:1056]
S1
DFF
Registers
D
From Connection
Matrix Output [52]
S0
S1
S0
S1
DFF/
Latch17
nRST/nSET
Q/nQ
CLK
register [1068]
LUT/DFF Sel
registers [1095:1088]
registers [1075:1072]
Mode Sel
CNT
Data
ext_CLK
To Connection
Matrix Input [22]
0
S0
OUT
CNT/DLY3
DLY_IN/CNT Reset
S0
S1
S2
S1
S2
S3
Config
Data
0
S3
registers [1083:1080], [1077:1076], [1071:1069], [1067:1064]
Figure 45: 8-bit Multi-Function Macrocells Block Diagram (3-bit LUT12/DFF17, CNT/DLY3)
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register [1104] DFF or Latch Select
register [1105] Output Select (Q or
nQ)
register [1106] DFF Initial Polarity
Select
register [1107] (nRST or nSET) from
matrix Output
From Connection
Matrix Output [57]
IN2
IN1
IN0
S0
3-bit LUT13
S0
OUT
S1
S1
LUT Truth
Table
From Connection
Matrix Output [56]
To Connection
S0
S0
S1
S0
S1
Matrix Input [25]
8-bits NVM
registers [1110:1104]
S1
DFF
Registers
D
From Connection
Matrix Output [55]
S0
S1
S0
S1
nRST/nSET DFF/
Q/nQ
Latch18
CLK
register [1116]
LUT/DFF Sel
registers [1143:1136]
registers [1123:1122]
Mode Sel
CNT
Data
ext_CLK
To Connection
Matrix Input [24]
0
S0
OUT
CNT/DLY4
DLY_IN/CNT Reset
S0
S1
S2
S1
S2
S3
Config
Data
0
S3
registers [1131:1128], [1125:1124], [1119:1117], [1115:1112]
Figure 46: 8-bit Multi-Function Macrocells Block Diagram (3-bit LUT13/DFF18, CNT/DLY4)
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register [1152] DFF or Latch Select
register [1153] Output Select (Q or
nQ)
register [1154] DFF Initial Polarity
Select
register [1155] (nRST or nSET) from
matrix Output
From Connection
Matrix Output [60]
IN2
IN1
IN0
S0
3-bit LUT14
S0
OUT
S1
S1
LUT Truth
Table
From Connection
Matrix Output [59]
To Connection
S0
S0
S1
S0
S1
Matrix Input [27]
8-bits NVM
registers [1158:1152]
S1
DFF
Registers
D
From Connection
Matrix Output [58]
S0
S1
S0
S1
DFF/
Latch19
nRST/nSET
Q/nQ
CLK
register [1164]
LUT/DFF Sel
registers [1171:1168]
Mode Sel
registers [1191:1184]
CNT
Data
ext_CLK
To Connection
Matrix Input [26]
0
S0
OUT
CNT/DLY5
DLY_IN/CNT Reset
S0
S1
S2
S1
S2
S3
Config
Data
0
S3
registers [1179:1176], [1173:1172], [1167:1165], [1162:1159]
Figure 47: 8-bit Multi-Function Macrocells Block Diagram (3-bit LUT14/DFF19, CNT/DLY5)
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register [1200] DFF or Latch Select
register [1201] Output Select (Q or
nQ)
From Connection
Matrix Output [63]
register [1202] DFF Initial Polarity
Select
IN2
IN1
IN0
S0
3-bit LUT15
S0
register [1203] (nRST or nSET)
from matrix Output
OUT
S1
S1
LUT Truth
Table
From Connection
Matrix Output [62]
To Connection
S0
S0
S1
S0
S1
Matrix Input [29]
8-bits NVM
registers [1206:1200]
S1
DFF
Registers
D
From Connection
Matrix Output [61]
S0
S1
S0
S1
DFF/
Latch20
nRST/nSET
Q/nQ
CLK
register [1212]
LUT/DFF Sel
registers [1239:1232]
registers [1219:1216]
Mode Sel
CNT
Data
ext_CLK
To Connection
Matrix Input [28]
0
S0
OUT
CNT/DLY6
DLY_IN/CNT Reset
S0
S1
S2
S1
S2
S3
Config
Data
0
S3
registers [1227:1224], [1221:1220], [1215:1213], [1211:1207]
Figure 48: 8-bit Multi-Function Macrocells Block Diagram (3-bit LUT15/DFF20, CNT/DLY6)
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register [1248] DFF or Latch Select
register [1249] Output Select (Q or
nQ)
From Connection
Matrix Output [66]
register [1250] DFF Initial Polarity Se
lect
-
IN2
IN1
IN0
S0
3-bit LUT16
S0
register [1251] (nRST or nSET) from
matrix Output
OUT
S1
S1
LUT Truth
Table
From Connection
Matrix Output [65]
To Connection
S0
S0
S1
S0
S1
Matrix Input [31]
8-bits NVM
registers [1255:1248]
S1
DFF
Registers
D
From Connection
Matrix Output [64]
S0
S1
S0
S1
DFF/
Latch21
nRST/nSET
CLK
Q/nQ
register [1260]
LUT/DFF Sel
registers [1287:1280]
registers [1267:1264]
Mode Sel
CNT
Data
ext_CLK
To Connection
Matrix Input [30]
0
S0
OUT
CNT/DLY7
DLY_IN/CNT Reset
S0
S1
S2
S1
S2
S3
Config
Data
0
S3
registers [1275:1272], [1269:1268], [1263:1261], [1259:1255]
Figure 49: 8-bit Multi-Function Macrocells Block Diagram (3-bit LUT16/DFF21, CNT/DLY7)
As shown in Figures 22-28 there is a possibility to use LUT/DFF and CNT/DLY simultaneously.
Note: It is not possible to use LUT and DFF at once, one of these macrocells must be selected.
Case 1. LUT/DFF in front of CNT/DLY. Three input signals from the connection matrix go to previously selected LUT or DFF's
inputs and produce a single output which goes to a CND/DLY input. In its turn Counter/Delay's output goes back to the matrix.
Case 2. CNT/DLY in front of LUT/DFF. Two input signals from the connection matrix go to CND/DLY's inputs (IN and CLK).
Its output signal can be connected to any input of previously selected LUT or DFF, after which the signal goes back to the
matrix.
Case 3. Single LUT/DFF or CNT/DLY. Also, it is possible to use a standalone LUT/DFF or CNT/DLY. In this case, all inputs
and output of the macrocell are connected to the matrix.
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8.1.2 3-Bit LUT or CNT/DLYs Used as 3-Bit LUTs
Table 30: 3-bit LUT10 to 3-bit LUT16 Truth Table
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
register
[960]
register
[1008]
register
[1056]
register
[1104]
register
[1152]
register
[1200]
register
[1248]
LSB
register
[961]
register
[1009]
register
[1057]
register
[1105]
register
[1153]
register
[1201]
register
[1249]
register
[962]
register
[1010]
register
[1058]
register
[1106]
register
[1154]
register
[1202]
register
[1250]
register
[963]
register
[1011]
register
[1059]
register
[1107]
register
[1155]
register
[1203]
register
[1251]
register
[964]
register
[1012]
register
[1060]
register
[1108]
register
[1156]
register
[1204]
register
[1252]
register
[965]
register
[1013]
register
[1061]
register
[1109]
register
[1157]
register
[1205]
register
[1253]
register
[966]
register
[1014]
register
[1062]
register
[1110]
register
[1158]
register
[1206]
register
[1254]
register
[967]
register
[1015]
register
[1063]
register
[1111]
register
[1159]
register
[1207]
register
[1255]
MSB
Each macrocell, when programmed for a LUT function, uses an 8-bit register to define their output function:
3-Bit LUT10 is defined by registers [967:960]
3-Bit LUT11 is defined by registers [1015:1008]
3-Bit LUT12 is defined by registers [1063:1056]
3-Bit LUT13 is defined by registers [1111:1104]
3-Bit LUT14 is defined by registers [1159:1152]
3-Bit LUT15 is defined by registers [1207:1200]
3-Bit LUT16 is defined by registers [1255:1248]
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8.2 4-BIT LUT OR DFF/LATCH WITH 16-BIT COUNTER/DELAY MACROCELL
There is one macrocell that can serve as either 4-bit LUT or as 16-bit Counter/Delay. When used to implement LUT function, the
4-bit LUT takes in four input signals from the Connection Matrix and produces a single output, which goes back into the Connection
Matrix. When used to implement 16-Bit Counter/Delay function, two of the four input signals from the connection matrix go to the
external clock (EXT_CLK) and reset (DLY_IN/CNT Reset) for the counter/delay, with the output going back to the connection
matrix.
This macrocell has an optional Finite State Machine (FSM) function. There are two additional matrix inputs for Up and Keep to
support FSM functionality. FSM has an option to reset its counted value either to 0 or to user defined data.
The behavior of FSM macrocell is described below:
FSM output Q goes to 1 if counter value reaches 0;
FSM Set Selection Mode sets the initial counter value to counter data;
RST Selection Mode sets the initial counter value to 0;
Counter value reaches maximum and overloads, after that counting starts from 0. Otherwise, in case of counting down from
maximum to 0, after overloading counter starts from 65535;
Mode signal synchronization (available for thee inputs) adds two extra clocks to avoid metastability issue.
This macrocell can also operate in a one-shot mode, which will generate an output pulse of user-defined width.
This macrocell can also operate in a frequency detection or edge detection mode.
This macrocell can have its active count value read via I2C. See Section 15.4.8 for further details.
Note: After two DFF – counters initialize with counter data = 0 after POR.
Initial state = 1 – counters initialize with counter data = 0 after POR.
Initial state = 0 And After two DFF is bypass – counters initialize with counter data after POR.
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8.2.1 4-Bit LUT or DFF/LATCH with 16-Bit CNT/DLY Block Diagram
From Connection
Matrix Output A [45]
register [872] DFF or Latch Select
register [873] DFF Output Select
(Q or nQ)
register [874] DFF Initial Polarity
Select
IN3
S0
S1
S1
S0
S0
S1
IN2
IN1
From Connection
Matrix Output B [44]
0
4-bit LUT1
S0
S1
S0
S1
S1
S0
0
OUT
IN0
LUT Truth
Table
From Connection
Matrix Output C [43]
S0
S1
To Connection
S0
S0
S1
S1
S0
Matrix Input [17]
registers [897:896] =
00, 10, 11
16-bits NVM
registers [887:872]
1
S1
From Connection
Matrix Output D [42]
DFF
D
S0
S1
Registers
S0
S1
S1
S0
nSET
Q/nQ
DFF14
1
nRST
CLK
LUT/DFF Sel
register [892]
registers [903:902]
registers [927:912]
CNT
registers [899:896]
0
0
S0
S1
S2
S3
Data
ext_CLK
CMO* [44]
CMO* [43]
S1
S0
To Connection
Matrix Input [16]
S0
0
S0
S1
S2
S3
CMO* [45]
CMO* [44]
CMO* [43]
CMO* [42]
S1
S2
S3
OUT
CNT/DLY0
DLY_IN/CNT Reset
CMO* [43]
S1
S0
From Connection
Matrix Output [44]
0
KEEP
UP
From Connection
Matrix Output [45]
FSM
S1
S0
Config
Data
0
Note: CMO - Connection Matrix Output
registers [897:896] = 01
registers [907:904], [901:900], [895:893], [891:888]
Figure 50: 4-bit LUT1 or CNT/DLY0
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8.2.2 4-Bit LUT or 16-Bit Counter/Delay Macrocells Used as 4-Bit LUTs
Table 31: 4-bit LUT1 Truth Table
IN3
0
IN2
0
IN1
0
IN0
0
OUT
register [872]
register [873]
register [874]
register [875]
register [876]
register [877]
register [878]
register [879]
register [880]
register [881]
register [882]
register [883]
register [884]
register [885]
register [886]
register [887]
LSB
0
0
0
1
0
0
1
0
0
0
1
1
0
1
0
0
0
1
0
1
0
1
1
0
0
1
1
1
1
0
0
0
1
0
0
1
1
0
1
0
1
0
1
1
1
1
0
0
1
1
0
1
1
1
1
0
1
1
1
1
MSB
This macrocell, when programmed for a LUT function, uses a 16-bit register to define their output function:
4-Bit LUT1 is defined by registers [887:872]
Table 32: 4-bit LUT Standard Digital Functions
Function
AND-4
MSB
LSB
1
0
1
0
0
1
0
1
1
0
1
0
0
1
1
0
1
0
0
1
1
0
0
1
0
1
1
0
1
0
0
1
1
0
0
1
0
1
1
0
0
1
0
1
1
0
1
0
0
1
1
0
1
0
0
1
1
0
1
0
0
1
1
0
0
1
0
1
1
0
0
1
0
1
1
0
1
0
0
1
1
0
1
0
0
1
1
0
1
0
0
1
0
1
0
1
NAND-4
OR-4
NOR-4
XOR-4
XNOR-4
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8.3 CNT/DLY TIMING DIAGRAMS
8.3.1 Delay Mode CNT/DLY0 to CNT/DLY7
Delay macrocell can automatically start/stop oscillator (Figure 51).
Delay In
Asynchronous delay variable
Asynchronous delay variable
OSC: force power-on
(always running)
Delay Output
delay = period x (counter data + 1) + variable
variable is from 0 to 1 clock period
delay = period x (counter data + 1) + variable
variable is from 0 to 1 clock period
Delay In
offset
offset
OSC: auto power-on
(powers up from delay in)
Delay Output
delay = offset + period x (counter data + 1)
See offset in table 11
delay = offset + period x (counter data + 1)
See offset in table 11
Figure 51: Delay Macrocell Behavior with Different Oscillators Options (Edge Select: Both, Counter Data: 3)
The macrocell shifts the respective edge to a set time and restarts by appropriate edge. It works as a filter if the input signal is
shorter than the delay time.
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Delay time
Delay time
Delay time
Delay time
Delay time
One-Shot/Freq. DET/Delay IN
t
t
Delay time
Delay Function
Rising Edge Detection
Delay Function
Falling Edge Detection
t
t
Delay Function
Both Edge Detection
Figure 52: Delay Mode Timing Diagram (Rising, Falling, and Both Edge Detection)
8.3.2 Count Mode (Count Data: 3), Counter Reset (Rising Edge Detect) CNT/DLY0 to CNT/DLY7
RESET_IN
CLK
Counter OUT
4 CLK period pulse
Count start in first rising edge CLK
Figure 53: Counter Mode Timing Diagram without Two DFFs Synced Up
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.
RESET_IN
CLK
Counter OUT
4 CLK period pulse
Count start in 0 CLK after reset
Figure 54: Counter Mode Timing Diagram with Two DFFs Synced Up
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8.3.3 One-Shot Mode CNT/DLY0 to CNT/DLY7
This macrocell will generate a pulse whenever a selected edge is detected on its input. Register bits set the edge selection. The
pulse width is determined by counter data and clock selection properties. The output pulse polarity (non-inverted or inverted) is
selected by register bit. Any incoming edges will be ignored during the pulse width generation. The following diagram shows
one-shot function for non-inverted output.
Delay time
Delay time
Delay time
Delay time
Delay time
One-Shot/Freq. DET/Delay IN
t
Delay time
One-Shot Function
Rising Edge Detection
t
One-Shot Function
Falling Edge Detection
t
One-Shot Function
Both Edge Detection
t
Figure 55: One-Shot Function Timing Diagram
This macrocell generates a high level pulse with a set width (defined by counter data) when detecting the respective edge. It does
not restart while pulse is high.
8.3.4 Frequency Detection Mode CNT/DLY0 to CNT/DLY7
Rising Edge: The output goes high if the time between two successive edges is less than the delay. The output goes low if the
second rising edge has not come after the last rising edge in specified time.
Falling Edge: The output goes high if the time between two falling edges is less than the set time. The output goes low if the
second falling edge has not come after the last falling edge in specified time.
Both Edge: The output goes high if the time between the rising and falling edges is less than the set time, which is equivalent to
the length of the pulse. The output goes low if after the last rising/falling edge and specified time, the second edge has not come.
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Delay time
Delay time
Delay time
Delay time
Delay time
One-Shot/Freq. DET/Delay IN
t
t
Delay time
Frequency Detector Function
Rising Edge Detection
Frequency Detector Function
Falling Edge Detection
t
t
Frequency Detector Function
Both Edge Detection
Figure 56: Frequency Detection Mode Timing Diagram
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8.3.5 Edge Detection Mode CNT/DLY1 to CNT/DLY7
The macrocell generates high level short pulse when detecting the respective edge. See Table 11.
Delay time
Delay time
Delay time
Delay time
Delay time
One-Shot/Freq. DET/Delay IN
t
t
Edge Detector Function
Rising Edge Detection
Edge Detector Function
Falling Edge Detection
t
t
Edge Detector Function
Both Edge Detection
Figure 57: Edge Detection Mode Timing Diagram
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8.3.6 Delayed Edge Detection Mode CNT/DLY0 to CNT/DLY7
In Delayed Edge Detection Mode, High level short pulses are generated on the macrocell output after the configured delay time,
if the corresponding edge was detected on the input.
If the input signal is changed during the set delay time, the pulse will not be generated. See Figure 58.
Delay time
Delay time
Delay time
Delay time
Delay time
One-Shot/Freq. DET/Delay IN
t
t
Delay time
Delayed Edge Detector Function
Rising Edge Detection
Delayed Edge Detector Function
Falling Edge Detection
t
t
Delayed Edge Detector Function
Both Edge Detection
Figure 58: Delayed Edge Detection Mode Timing Diagram
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8.3.7 Difference in Counter Value for Counter, Delay, One-Shot, and Frequency Detect Modes
There is a difference in counter value for Counter and Delay/One-Shot/Frequency Detect modes. Compared to Counter mode,
in Delay/One-Shot/Frequency Detect modes the counter value is shifted for two rising edges of the clock signal. See Figure 59:
One-Shot/Freq. SET/Delay IN
CLK
CNT Out
3
2
1
0
0
3
CNT Data
2
DLY Out
3
3
2
Delay Data
1
3
3
3
One-Shot Out
One-Shot Data
3
3
2
3
1
3
3
Figure 59: Counter Value, Counter Data = 3
8.4 FSM TIMING DIAGRAMS
RESET IN
KEEP
COUNT END
CLK
3
2
1
0
3
2
1
0
3
2
1
3
2
1
0
0
Q
Note: Q = current counter value
Figure 60: CNT/FSM Mode Timing Diagram (Reset Rising Edge Mode, OSC is Forced On, UP=0) for CNT Data = 3
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SET IN
KEEP
COUNT END
CLK
2
1
0
3
2
1
0
3
3
2
1
2
1
0
3
3
Q
Note: Q = current counter value
Figure 61: CNT/FSM Mode Timing Diagram (Set Rising Edge Mode, OSC is Forced On, UP = 0) for CNT Data = 3
RESET IN
KEEP
COUNT END
CLK
65534 65535
0
7
8
9
10 11
3
4
5
3
4
5
3
4
5
6
0
Q
Note: Q = current counter value
Figure 62: CNT/FSM Mode Timing Diagram (Reset Rising Edge Mode, OSC is Forced On, UP = 1) for CNT Data = 3
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SET IN
KEEP
COUNT END
CLK
65534 65535
0
8
9
10 11 12
3
4
5
3
4
5
4
5
6
7
3
Q
Note: Q = current counter value
Figure 63: CNT/FSM Mode Timing Diagram (Set Rising Edge Mode, OSC is Forced On, UP = 1) for CNT Data = 3
Two extra clocks
Two extra clocks
Delay In
Clk
Keep
3
2
1
3
2
1
3
Internal Counter
Q
Figure 64: DLY/FSM Mode, Falling Edge Delay, OSC is Forced On, DFFs Synced Up, UP = 0, CNT Data = 3
Two extra clocks
Two extra clocks
Delay In
Clk
Keep
3
2
1
3
2
1
3
Internal Counter
Q
Figure 65: One Shot/FSM Mode, Rising Edge, OSC is Forced On, DFFs Synced Up, UP = 0, CNT Data = 3
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Two extra clocks
Two extra clocks
Delay In
Clk
Keep
3
2
3
2
3
2
1
3
Internal Counter
Q
Less than
3 clk
between
2 rising edges
Figure 66: Freq. Detector/FSM Mode, Rising Edge, OSC is Forced On, DFFs Synced Up, UP = 0, CNT Data = 3
Time less than CNT Data
doesn’t cause any change
Two extra clocks
Two extra clocks
Delay In
Clk
Keep
3
2
1
3
2
1
Internal Counter
3
Q
Figure 67: Delayed Edge Detector/FSM Mode, Rising Edge, OSC is Forced On, DFFs Synced Up, UP = 0, CNT Data = 3
8.5 WAKE AND SLEEP CONTROLLER
SLG47502/03 has a Wake and Sleep function for all ACMPs. The macrocell CNT/DLY0 can be reconfigured for this purpose
registers [953:952] = 11 and register [948] = 1. The WS serves for power saving, it allows to switch on and off selected ACMPs
on selected bit of 16-bit counter.
Note 1: BG/Analog_Good time is long and should be considered in wake and sleep timing in case it dynamically powers on/off.
Note 2: Wake time should be long enough to make sure ACMP and Vref have enough time to get a sample before going to sleep.
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Power Control
From Connection Matrix Output [96] for 2 kHz OSC0
WS Controller
OSC
CNT0_out
CNT_end
CNT
To Connection Matrix Input [16]
ck
CK_OSC
Divider
Analog Control Block
ACMPx WS EN:
registers [953:952]
2
2
bg/regulator
pdb
From Connection
Matrix Output [94:93]
WS_out
WS_PD
WS_PD
(from OSC PD)
ACMPs_PD
WS_out
WS_PD to W&S out
state selection register [947]
registers [907:904]
WS clock freq. selection
registers [927:912]
WS ratio control data
ACMPs
register [949]
WS mode: normal or short wake
Note: WS_PD is High at WS OSC
ACMPH0,1 OUT
2
+
-
0
1
(2 kHz OSC0) power-down
2
To Connection
Matrix Input
[60, 61]
ACMPs_PD
WS_out
BG/Analog_Good
Figure 68: Wake/Sleep Controller
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time between Reset goes low
and 1st WS clock rsing edge
Force Wake
CNT_RST
(From Connection Matrix)
ACMP_PD is High
(From Connection Matrix)
CNT0_out
(To Connection Matrix)
WS_out
(internal signal)
Data is latched
BG/Analog_Good
(internal signal)
Sleep Mode
ACMP Latches Last Data
Normal ACMP
Sleep Mode
ACMP Latches New Data
Normal ACMP
Sleep Mode
ACMP Latches
New Data
Operation
Operation
ACMP follows input
ACMP follows input
BG/Analog
Startup time*
BG/Analog
Startup time*
Note: CNT0_out is a delayed WS_out signal for 1us to make sure the data is correct during LATCH.
Figure 69: Wake/Sleep Timing Diagram, Normal Wake Mode, Counter Reset is Used
time between Reset goes low
and 1st WS clock rsing edge
Force Wake
CNT_RST
(From Connection Matrix)
ACMP_PD is High
(From Connection Matrix)
CNT0_out
(To Connection Matrix)
WS_out
(internal signal)
Data is latched
Data is latched
BG/Analog_Good
(internal signal)
Sleep Mode
ACMP Latches Last Data
Sleep Mode
ACMP Latches New Data
Normal ACMP
Operation for short time
ACMP follows inout
Sleep Mode
ACMP Latches
New Data
Normal ACMP
Operation for short time
ACMP follows inout
BG/Analog
Startup time*
BG/Analog
Startup time*
Note: CNT0_out is a delayed WS_out signal for 1us to make sure the data is correct during LATCH.
Figure 70: Wake/Sleep Timing Diagram, Short Wake Mode, Counter Reset is Used
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time between Reset goes low
and 1st WS clock rsing edge
Force Sleep
CNT_SET
(From Connection Matrix)
ACMP_PD is High
(From Connection Matrix)
CNT0_out
(To Connection Matrix)
WS_out
(internal signal)
Data is latched
BG/Analog_Good
(internal signal)
Sleep Mode
ACMP Latches Last Data
Normal ACMP
Sleep Mode
ACMP Latches New Data
Operation
ACMP follows input
BG/Analog
Startup time*
Note: CNT0_out is a delayed WS_out signal for 1us to make sure the data is correct during LATCH.
Figure 71: Wake/Sleep Timing Diagram, Normal Wake Mode, Counter Set is Used
time between Reset goes low
and 1st WS clock rsing edge
Force Sleep
CNT_RST
(From Connection Matrix)
ACMP_PD is High
(From Connection Matrix)
CNT0_out
(To Connection Matrix)
WS_out
(internal signal)
Data is latched
BG/Analog_Good
(internal signal)
Sleep Mode
Sleep Mode
ACMP Latches New Data
ACMP Latches Last Data
Normal ACMP
Operation for short time
ACMP follows inout
BG/Analog
Startup time*
Note: CNT0_out is a delayed WS_out signal for 1us to make sure the data is correct during LATCH.
Figure 72: Wake/Sleep Timing Diagram, Short Wake Mode, Counter Set is Used
Note: If low power BG is powered on/off by WS, the wake time should be longer than 2.1 ms. The BG/analog start up time will
take maximal 2 ms. Therefore, 8 periods of the Oscillator0 is recommended for the wake time, when BG is configured to Auto
Power mode. If low power BG is always on, Oscillator0 period is longer than required wake time. The BG/analog start up time will
take maximal 450 us for ACMP0/1. The short wake mode can be used to reduce the current consumption.
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To use any ACMP under WS controller, the following settings must be done:
ACMP Power Up Input from matrix = 1 (for each ACMP separately);
CNT/DLY0 must be set to Wake and Sleep Controller function (for all ACMP);
Register WS → enable (for each ACMP separately);
CNT/DLY0 set/reset input = 0 (for all ACMP).
The user can select a period of time while the ACMP is sleeping in a range of 1 - 65535 clock cycles. Before they are sent to
sleep their outputs are latched, so the ACMPs remain their state (High or Low) while sleeping.
WS controller has the following settings:
Wake and Sleep Output State (High/Low)
If OSC is powered off (Power-down option is selected; Power-down input = 1) and Wake and Sleep Output State = High, the
ACMP is continuously on.
If OSC is powered off (Power-down option is selected; Power-down input = 1) and Wake and Sleep Output State = Low, the
ACMP is continuously off.
Both cases WS function is turned off.
Counter Data (Range: 1 - 65535)
User can select wake and sleep ratio of the ACMP; counter data = sleep time, one clock = wake time.
Q mode - defines the state of WS counter data when Set/Reset signal appears Reset - when active signal appears, the WS
counter will reset to zero and High level signal on its output will turn on the ACMPs. When Reset signal goes out, the WS
counter will go Low and turn off the ACMP until the counter counts up to the end. Set - when active signal appears, the WS
counter will stop and Low level signal on its output will turn off the ACMP. When Set signal goes out, the WS counter will go on
counting and High level signal will turn on the ACMP while counter is counting up to the end.
Note: The OSC0 matrix power-down to control ACMP WS is not supported for short wait time option.
Edge Select defines the edge for Q mode. High level Set/Reset - switches mode Set/Reset when level is High.
Note: Q mode operates only in case of "High Level Set/Reset”.
Wake time selection - time required for wake signal to turn the ACMPxH on.
Normal Wake Time - when WS signal is High, it takes BG/analog start up time to turn the ACMPs on. They will stay on until
WS signal is Low again. Wake time is one clock period. It should be longer than BG turn on time and minimal required com-
paring time of the ACMP.
Short Wake Time - when WS signal is High, it takes BG/analog start up time to turn the ACMPs on. They will stay on for 1 µs
and turn off regardless of WS signal. The WS signal width does not matter.
Keep - pauses counting while Keep = 1
Up - reverses counting
If Up = 1, CNT is counting up from user selected value to 65535.
If Up = 0, CNT is counting down from user selected value to 0.
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9
Analog Comparators
There are two High Speed Rail-to-Rail General Purpose Analog Comparators (ACMP) macrocells in the SLG47502/03. For the
ACMP cells to be used in a GreenPAK design, the power up signals (ACMP0H PWR UP and ACMP1H PWR UP) need to be
active. By connecting to signals coming from the Connection Matrix, it is possible to have each ACMP be ON continuously, OFF
continuously, or switched on periodically, based on a digital signal coming from the Connection Matrix. When ACMP is powered
down, its output is low. It is possible to decrease Power-On time of ACMP by forcing internal bias current generator, register
[1532] = 1.
Each of the ACMP cells has a positive input signal that can be provided by a variety of external sources, and can also have a
selectable gain stage (1x, 0.5x) before connection to the analog comparator. The gain divider is unbuffered and has input
resistance of 1.2 MΩ (typ.) for 0.5x and 100 MΩ for 1x. Each of the ACMP cells has a negative input signal that is either created
from an internal Vref or provided by any external source (GPIO 2). Note that the external Vref signal is filtered with a 2nd order
low pass filter with 300 kHz typical bandwidth, see Figure 73 to Figure 74.
Input bias current < 1 nA (typ).
PWR UP = 1 => ACMP is powered up.
PWR UP = 0 => ACMP is powered down.
During power-up, the ACMP output will remain LOW, and then becomes valid after power up signal goes high for ACMP0H and
ACMP1H (see parameter tstart in Table 18).
It is possible to enable Low Pass Filter (LPF) either onACMP IN+ or onACMP out, registers [1497:1496] and register [1513:1512].
Each cell also has a hysteresis selection, to offer hysteresis of (0, 25, 50, 150) mV. The hysteresis option is available when using
an internal Vref only.
ACMP0H IN+ options are GPIO and VDD
.
ACMP1H IN+ options are GPIO, ACMP0H IN+ MUX output, Temperature Sensor.
See Table 33 for ACMP Inputs selection.
Table 33: ACMP Input Selection
Register
[1530]
Register
[1500]
Register
[1516]
ACMP0H Positive Input
ACMP1H Positive Input
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
ACMP0H+ PIN
ACMP0H+ PIN
VDD
ACMP1H+ PIN
ACMP0H+ PIN
ACMP1H+ PIN
VDD
VDD
ACMP0H+ PIN
ACMP0H+ PIN
VDD
Temp Sensor
Temp Sensor
Temp Sensor
Temp Sensor
VDD
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9.1 ACMP0H BLOCK DIAGRAM
Registers [1495:1494]
to ACMP1H input MUX
Hysteresis
Selection
ACMP
Ready
Registers [1499:1498]
GPIOx: ACMP0H+
VDD
High Speed
ACMP
0
1
Selectable
Gain
0
1
to Connection
Matrix Input [60]
GPIOx in analog IO mode;
Registers [1500]
Pwr Up
LATCH
from Connection
Matrix Output [93]
W/S Control
Registers [953:952]
Ext. Vref0
Low Pass
Filter*
111111
Vref
34 100001
...
Internal Vref
000000
Registers [1493:1488]
Note*: 2nd order low pass filter
typical bandwidth is 300 kHz
Figure 73: ACMP0H Block Diagram
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9.2 ACMP1H BLOCK DIAGRAM
Registers [1511:1510]
Hysteresis
Selection
ACMP
Ready
Registers
[1515:1514]
GPIOx: ACMP1H+
00
High Speed
ACMP
From ACMP0H IN+ MUX Output 01
Selectable
Gain
10
0
1
Temperature sensor out
to Connection
Matrix Input [61]
11
Pwr Up
LATCH
2
GPIOx in analog IO mode;
Registers [1526:1525]
from Connection
Matrix Output [94]
W/S Control
Ext Vref0 input
Register [953:952]
1
0
Low Pass
Filter*
111111
Ext Vref1 input
Register [1517]
34 100001
...
Internal Vref
000000
Registers [1509:1504]
Note*: 2nd order low pass filter
typical bandwidth is 300 kHz
Figure 74: ACMP1H Block Diagram
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9.3 ACMP TYPICAL PERFORMANCE
3
High To Low, Overdrive = 10 mV
Low to High, Overdrive = 10 mV
Low to High, Overdrive = 100 mV
High to Low, Overdrive = 100 mV
2.5
2
1.5
1
0.5
0
25
250
425
650
850
Vref (mV)
Figure 75: Typical Propagation Delay vs. Vref for ACMPxH at T = 25 °C, VDD = 1.1 V to 1.3 V, Gain = 1, Hysteresis = 0
8
6
4
2
0
-2
-4
-6
-8
25
250
425
650
850
Vref (mV)
Figure 76: ACMPxH Input Offset Voltage vs. Vref at T = -40 °C to 85 °C, VDD = 1.1 V to 1.3 V
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10 Programmable Delay/Edge Detector
The SLG47502/03 has a programmable time delay logic cell that can generate a delay that is selectable from one of four timings
configured in the GreenPAK Designer. The programmable time delay cell can generate one of four different delay patterns, rising
edge detection, falling edge detection, both edge detection, and both edge delay. These four patterns can be further modified
with the addition of delayed edge detection, which adds an extra unit of delay, as well as glitch rejection during the delay period.
See Figure 77 and Figure 78 for further information.
Note: The input signal must be longer than the delay, otherwise it will be filtered out.
registers [1443:1442]
Delay Value Selection
registers [1441:1440]
Edge Mode Selection
To Connection
Matrix Input [40]
Programmable
From Connection Matrix Output [92]
IN
OUT
Delay
Figure 77: Programmable Delay
10.1 PROGRAMMABLE DELAY TIMING DIAGRAM - EDGE DETECTOR OUTPUT
width
width
IN
time1
Rising Edge Detector
time1
Falling Edge Detector
Edge Detector
Output
Both Edge Detector
Both Edge Delay
time2
time2
time1 is a fixed value
time2 delay value is selected via register
Figure 78: Edge Detector Output
Please refer to Table 11.
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11 Additional Logic Function. Deglitch Filter
The SLG47502/03 has one Deglitch Filter macrocell with inverter function that is connected directly to the Connection Matrix
inputs and outputs. The filter blocks the input signal for pulse width < tblock (at typical temperature 25 °C. See Table 14) and pass
the input signal for pulse width > tpass (at typical temperature 25 °C). For width in between, the output pulse width will be reduced.
The SLG47502/03 has one Deglitch Filter macrocell with inverter function that is connected directly to the Connection Matrix
inputs and outputs.
In addition, this macrocell can be configured as an Edge Detector, with the following settings:
Rising Edge Detector
Falling Edge Detector
Both Edge Detector
Both Edge Delay
Filter
R
From Connection Matrix
Output [91]
0
1
C
0
1
To Connection Matrix
Input [41]
Edge
Detector
Logic
register [1435]
registers [1434:1433]
register [1432]
Figure 79: Deglitch Filter/Edge Detector Simplified Structure
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12 Voltage Reference
12.1 VOLTAGE REFERENCE OVERVIEW
The SLG47502/03 has a Voltage Reference (Vref) macrocell to provide references to the two analog comparators. This macrocell
can supply a user selection of fixed voltage references, or temperature sensor output. The macrocell also has the option to output
reference voltages on GPIO. See Table 34 for the available selections for each analog comparator.
When changing power-down source settings or power-down register settings in a Voltage Reference block, similar changes of
these settings automatically occur in an Analog Temperature Sensor block.
Also see Figure 80, which shows the reference output structure.
12.2 VREF SELECTION TABLE
Table 34: Vref Selection Table
SEL[5:0]
Vref
0.025
0.05
0.075
0.1
SEL[5:0]
18
Vref
0.475
0.5
0
1
19
2
20
0.525
0.55
3
21
4
0.125
0.15
0.175
0.2
22
0.575
0.6
5
23
6
24
0.625
0.65
7
25
8
0.225
0.25
0.275
0.3
26
0.675
0.7
9
27
10
11
12
13
14
15
16
17
28
0.725
0.75
29
0.325
0.35
0.375
0.4
30
0.775
0.8
31
32
0.825
0.850
0.850
Ext. Vref
33
0.425
0.45
34 to 62
63
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12.3 VREF BLOCK DIAGRAM
register [1521]
register [1531]
register [1528]
0
1
From analog
macrocells
0
1
From Connectinon
Matrix Output [95]
Ext Vref0 ref
selection
register [1529]
register [1522]
PwrUp
Ext Vref0 input
111111
0.850
0.850
111110
none
Vref_Buf
PwrUp
Bandgap
S0
0.850
0.825
0.850
0.825
Vref_Out
aio_en
100001
100000
S1
S2
S1
S0
6-bit
divider
Vref
S3
0.050
0.025
0.050
0.025
register[1523]
000001
000000
registers [1526:1525]
Temp
registers [1493:1488]
Sensor
Ext Vref1 ref
selection
1
0
Ext Vref1 input
111111
0.850
111110
register [1517]
0.850
100001
0.825
100000
0.050
000001
0.025
000000
registers [1509:1504]
Figure 80: Voltage Reference Block Diagram
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12.4 VREF TYPICAL PERFORMANCE
Note 1 It is not recommended to use Vref connected to external pin without buffer.
250
200
150
100
50
VDD = 1.3 V
VDD = 1.2 V
VDD = 1.1 V
0
0
1
2
3
4
5
6
7
8
9
10
I, mA
Figure 81: Typical Load Regulation, Vref = 200 mV, T = -40 °C to +85 °C, Buffer - Enable
450
VDD = 1.3 V
400
VDD = 1.2 V
VDD = 1.1 V
350
300
250
200
150
100
50
0
0
1
2
3
4
5
6
7
8
9
10
I, mA
Figure 82: Typical Load Regulation, Vref = 400 mV, T = -40 °C to +85 °C, Buffer - Enable
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700
600
500
400
300
200
100
0
VDD = 1.3 V
VDD = 1.2 V
VDD = 1.1 V
0
1
2
3
4
5
6
7
8
9
10
I, mA
Figure 83: Typical Load Regulation, Vref = 600 mV, T = -40 °C to +85 °C, Buffer - Enable
900
VDD = 1.3 V
800
VDD = 1.2 V
VDD = 1.1 V
700
600
500
400
300
200
100
0
0
1
2
3
4
5
6
7
8
9
10
I, mA
Figure 84: Typical Load Regulation, Vref = 850 mV, T = -40 °C to +85 °C, Buffer - Enable
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1.20
1.10
1.00
0.90
0.80
0.70
0.60
0.50
25
75
125
175
225
275
325
375
425
475
525
575
625
675
725
775
825
Vref (mV)
Figure 85: Typical Input Offset Voltage vs. Vref at VDD = 1.2 V, T = 25 °C
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13 Clocking
13.1 OSC GENERAL DESCRIPTION
The SLG47502/03 has two internal oscillators to support a variety of applications:
Oscillator0 (2.048 kHz)
Oscillator1 (25 MHz).
There are two divider stages for each oscillator that give the user flexibility for introducing clock signals to connection matrix, as
well as various other macrocells. The pre-divider (first stage) for Oscillator0 allows the selection of /1, /2, /4, or /8 to divide down
frequency from the fundamental. The pre-divider (first stage) for Oscillator1 allows the selection of /1, /2, /4, /8, /12, /24, /48, /96
to divide down frequency from the fundamental. The second stage divider of oscillators has an input of frequency from the pre-
divider, and outputs one of eight different frequencies divided by /1, /2, /3, /4, /8, /12, /24, or /64 on Connection Matrix Input lines
[57], [58] and [59]. Please see Figure 86, Figure 87, and Figure 88 for more details on the SLG47502/03 clock scheme.
Oscillator1 (25 MHz) has an additional function of 100 ns delayed startup, which can be enabled/disabled by register [1480]. This
function is recommended to use when analog blocks are used along with the Oscillator.
The Matrix Power-down/Force On function allows switching off or force on the oscillator using an external pin. The Matrix Power-
down/Force On (Connection Matrix Output [96], [97]) signal has the highest priority. The OSC operates according to the following
table:
Table 35: Oscillator Operation Mode Configuration Settings
OSC
Register:
Register:
Auto
Signal
From
Connection
Matrix
Enable
Signalfrom Operation
CNT/DLY
Macrocells
OSC
External
Clock
Selection
Power-Down
POR
or Force On Power-On
by Matrix
Input
or
Mode
Force On
0
1
X
1
X
X
X
X
X
X
OFF
Internal
OSC is
OFF, logic
X
X
is ON
1
0
1
0
X
X
OFF
1
1
0
0
1
0
1
X
1
X
X
ON
ON
X
CNT/DLY
requires
OSC
1
0
0
X
X
0
ON
CNT/DLY
does not
require
OSC
1
0
0
0
OFF
Note 1 The OSC will run only when any macrocell that uses OSC is powered on.
To avoid metastability issue user can select synchronization type for Power-down signal:
registers [1483:1482], [1487:1486] = 00 – two-DFF synchronization. Oscillator will have from 1 to 2 output pulses after Power-
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down.
registers [1483:1482], [1487:1486] = 01 – one-DFF synchronization by clock falling edge. When Oscillator Power-down signal
comes, Oscillator generates full output pulse and then stops.
registers [1483:1482], [1487:1486] = 10 or 11 – without synchronization (asynchronous reset). When Oscillator Power-down
signal comes, Oscillator output goes low immediately.
If I2C is used to change the synchronization mode there will be a pulse at the Oscillator output when the synchronization mode
is changed from 10 or 11 (asynchronous reset).
13.2 OSCILLATOR0 (2.048 KHZ)
from Connection Matrix
Output [96]
PWR DOWN/Force On
to CNT/DLYs Clock Scheme
Matrix Output control register [1449]
OSC Power Mode
register [1450]
PWR DOWN/
FORCEON
2.048 kHz Pre-divider Clock
registers [1454:1453]
OSC0
(2.048 kHz)
Auto Power On
OUT
0
0
1
Force Power On
0
1
2
DIV /1 /2 /4/8
Ext. Clock
/2
/3
1
Predivider
OSC0 matrix out0 enable reg [1451]
to Connection Matrix
Ext. CLK Sel register [1448]
/4
3
4
5
6
7
OUT0
Input [57]
/8
to Connection Matrix
Input [58]
OUT1
/12
/24
/64
OSC0 matrix out1 enable reg [1452]
registers [1466:1464]
registers [1470:1468]
Second Stage
Divider
Figure 86: Oscillator0 Block Diagram
Note: It's highly recommended to use OSC0 without the startup delay (register[1484] = 1).
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13.3 OSCILLATOR1 (25 MHZ)
from Connection Matrix
Output [97]
PWR DOWN/Force On
to CNT/DLYs Clock Scheme
25 MHz Pre-divider Clock
Matrix Output control register [1457]
OSC Power Mode
PWR DOWN/
register [1458]
FORCE ON
registers [1462:1460]
OSC1
(25 MHz)
Auto Power On
OUT
0
0
1
Force Power On
DIV/1 /2 /4/8 /
12 /24 /48 /96
Startup delay
0
1
2
register [1480]
/2
/3
1
Predivider
Ext. Clock
OSC1 matrix out enable reg [1459]
Ext. CLK Sel register [1456]
/4
3
4
5
6
7
to Connection Matrix
/8
Input [59]
/12
/24
/64
registers [1474:1472]
Second Stage
Divider
Figure 87: Oscillator1 Block Diagram
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13.4 CNT/DLY CLOCK SCHEME
Each CNT/DLY within Multi-Function macrocell has its own additional clock divider connected to oscillators pre-divider. Available
dividers are:
OSC0/1, OSC0/8, OSC0/64, OSC0/512, OSC0/4096, OSC0/32768, OSC0/262144
OSC1/1, OSC1/4, OSC1/8, OSC1/64, OSC1/512
registers [3:0]
0
from 25 MHz Pre-divided clock
1
/4
/8
2
3
4
5
6
7
8
/64
/512
CNT/DLY/
ONESHOT/
FREQ_DET/
from 2.048 kHz Pre-divided clock
/8
/64
DLY_EDGE_DET
/512
/4096
/32768
/262144
9
CNT overflow
10
11
12
13
14
15
CNT (x-1) overflow
from Connection Matrix out
(separate for each CNT/DLY macrocell)
reserved
reserved
CNT0/CNT1/CNT2/CNT3/
CNT4/CNT5/CNT6/CNT7
Figure 88: Clock Scheme
13.5 EXTERNAL CLOCKING
The SLG47502/03 supports several ways to use an external, higher accuracy clock as a reference source for internal operations.
13.5.1 GPIO Source for Oscillator0 (2.048 kHz)
When register [1448] is set to 1, an external clocking signal on GPIOx will be routed in place of the internal oscillator derived
2.048 kHz clock source. See Figure 86. The low and high limits for external frequency that can be selected are 0 MHz and 10 MHz.
13.5.2 GPIO Source for Oscillator1 (25 MHz)
When register [1456] is set to 1, an external clocking signal on GPIOx will be routed in place of the internal oscillator derived
25 MHz clock source. See Figure 87. The external frequency range is 0 MHz to 20 MHz at VDD = 1.1 V, 30 MHz at VDD = 1.2 V,
50 MHz at VDD = 1.3 V.
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13.6 OSCILLATORS ACCURACY
Note: OSC power setting: Force Power-On; Clock to matrix input - enable; Bandgap: turn on by register - enable.
2.15
2.1
2.05
2
1.95
1.9
Fmax @ VDD = 1.1 V to 1.3 V
1.85
Ftyp @ VDD = 1.2 V
Fmin @ VDD = 1.1 V to 1.3 V
1.8
1.75
T (°C)
Figure 89: Oscillator0 Frequency vs. Temperature, OSC0 = 2.048 kHz
26
25.5
25
24.5
24
Fmax @ VDD = 1.1 V to 1.3 V
Ftyp @ VDD = 1.2 V
23.5
Fmin @ VDD = 1.1 V to 1.3 V
23
T (°C)
Figure 90: Oscillator1 Frequency vs. Temperature, OSC1 = 25 MHz
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Note: For more information see Section 3.9.
12
2.048 kHz Total Error @ VDD = 1.1 V to 1.3 V
25 MHz Total Error @ VDD = 1.1 V to 1.3 V
10
8
6
4
2
0
T (°C)
Figure 91: Oscillators Total Error vs. Temperature
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13.7 OSCILLATORS SETTLING TIME
490
488
486
484
482
480
478
476
474
472
470
0
1
2
3
4
Period
Figure 92: Oscillator0 Settling Time, VDD = 1.2 V, T = 25 °C, OSC0 = 2.048 kHz
90
80
70
60
50
40
30
20
0
1
2
3
4
5
6
7
8
Period
Figure 93: Oscillator1 Settling Time, VDD = 1.2 V, T = 25 °C, OSC1 = 25 MHz (Normal Start)
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160
140
120
100
80
60
40
20
0
1
2
3
4
5
6
7
8
Period
Figure 94: Oscillator1 Settling Time, VDD = 1.2 V, T = 25 °C, OSC1 = 25 MHz (Start with Delay)
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14 Power-On Reset
The SLG47502/03 has a Power-On Reset (POR) macrocell to ensure correct device initialization and operation of all macrocells
in the device. The purpose of the POR circuit is to have consistent behavior and predictable results when the VDD power is first
ramping to the device, and also while the VDD is falling during power-down. To accomplish this goal, the POR drives a defined
sequence of internal events that trigger changes to the states of different macrocells inside the device, and finally to the state of
the IOs.
14.1 GENERAL OPERATION
The SLG47502/03 is guaranteed to be powered down and non-operational when the VDD voltage (voltage on PIN1) is less than
Power-Off Threshold (see in Table 6), but not less than -0.6 V. Another essential condition for the chip to be powered down is
that no voltage higher (Note) than the VDD voltage is applied to any other PIN. For example, if VDD voltage is 0.3 V, applying a
voltage higher than 0.3 V to any other PIN is incorrect, and can lead to incorrect or unexpected device behavior.
Note: There is a 0.6 V margin due to forward drop voltage of the ESD protection diodes.
To start the POR sequence in the SLG47502/03, the voltage applied on the VDD should be higher than the Power-On Threshold
(Note). The full operational VDD range for the SLG47502/03 is 1.1 V to 1.3 V. This means that the VDD voltage must ramp up to
the operational voltage value, but the POR sequence will start earlier, as soon as the VDD voltage rises to the Power-On Thresh-
old. After the POR sequence has started, the SLG47502/03 will have a typical period of time to go through all the steps in the
sequence (noted in the datasheet for that device) and will be ready and completely operational after the POR sequence is
complete.
Note: The Power-On Threshold is defined in Table 5.
To power down the chip the VDD voltage should be lower than the operational and to guarantee that chip is powered down it
should be less than Power-Off Threshold.
All PINs are in high impedance state when the chip is powered down and while the POR sequence is taking place. The last step
in the POR sequence releases the IO structures from the high impedance state, at which time the device is operational. The pin
configuration at this point in time is defined by the design programmed into the chip. Also, as it was mentioned before the voltage
on PINs can’t be bigger than the VDD, this rule also applies to the case when the chip is powered on.
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14.2 POR SEQUENCE
The POR system generates a sequence of signals that enable certain macrocells. The sequence is shown in Figure 95.
VDD
t
t
t
t
t
t
t
t
POR_NVM
(reset for NVM)
NVM_ready_out
POR_GPI
(reset for input enable)
POR_LUT
(reset for LUT/FILTER)
POR_CORE
(reset for DLY/OSC/DFF/
LATCH/ACMP/
Edge Detector in Filter)
POR_OUT
(generate low to high to matrix)
POR_GPO
(reset for output enable)
Figure 95: POR Sequence
As can be seen from Figure 95 after the VDD has start ramping up and crosses the Power-On Threshold, first, the on-chip NVM
memory is reset. Next, the chip reads the data from NVM, and transfers this information to a CMOS LATCH, that serves to con-
figure each macrocell, and the Connection Matrix which routes signals between macrocells. The third stage causes the reset of
the input pins, and then to enable them. After that, the LUTs are reset and become active. After LUTs the Delay cells, RC OSC,
DFFs, and LATCHES are initialized. Only after all macrocells are initialized internal POR signal (POR macrocell output) goes
from LOW to HIGH. The last portion of the device to be initialized are the output pins, which transition from high impedance to
active at this point.
The typical time that takes to complete the POR sequence varies by device type in the GreenPAK family. It also depends on many
environmental factors, such as: slew rate, VDD value, temperature, and even will vary from chip to chip (process influence).
14.3 MACROCELLS OUTPUT STATES DURING POR SEQUENCE
To have a full picture of SLG47502/03 operation during powering and POR sequence, review the overview the macrocell output
states during the POR sequence (Figure 96 describes the output signals states).
First, before the NVM has been reset, all macrocells have their output set to logic LOW (except the output pins which are in high
impedance state). On the next step, some of the macrocells start initialization: input pins output state becomes LOW; LUTs also
output LOW. Only P DLY macrocell configured as edge detector becomes active at this time. After that input pins are enabled.
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Next, only LUTs are configured. Next, all other macrocells are initialized. After macrocells are initialized, internal POR matrix
signal switches from LOW to HIGH. The last are output pins that become active and determined by the input signals.
VDD
Guaranteed HIGH before POR_GPI
Unpredictable
t
VDD _out
to matrix
t
t
Input PIN _out
to matrix
Unpredictable
Unpredictable
Unpredictable
Unpredictable
Unpredictable
Determined by External Signal
Determined by Input signals
LUT/FILTER_out
to matrix
Determined by input signals
OUT = IN without Delay
t
t
t
t
t
t
Programmable Delay_out
to matrix
Determined by Input signals
Starts to detect input edges
Determined by initial state
DFF/LATCH/ACMP/
Edge Detector in
Filter_out to matrix
Determined by Input signals
Determined by input signals
OUT = IN without Delay
Delay_out
to matrix
Determined by Input signals
Starts to detect input edges
POR_out
to matrix
Unpredictable
Ext. GPO
Tri-state
Determined by input signals
Output State Unpredictable
Figure 96: Internal Macrocell States During POR Sequence
14.3.1 Initialization
All internal macrocells by default have initial low level. Starting from indicated power-up time of 0.811 V to 1.078 V, macrocells in
SLG47502/03 are powered on while forced to the reset state. All outputs are in Hi-Z and chip starts loading data from NVM. Then
the reset signal is released for internal macrocells and they start to initialize according to the following sequence:
1. Input pins, ACMP, Pull-up/down.
2. LUTs.
3. DFFs, Delays/Counters.
4. POR output to matrix.
5. Output pin corresponds to the internal logic.
The Vref output pin driving signal can precede POR output signal going high by 3 µs to 5 µs. The POR signal going high indicates
the mentioned power-up sequence is complete.
Note: The maximum voltage applied to any pin should not be higher than the VDD level. There are ESD Diodes between pin
→VDD and pin → GND on each pin. So, if the input signal applied to pin is higher than VDD, then current will sink through the
diode to VDD. Exceeding VDD results in leakage current on the input pin, and VDD will be pulled up, following the voltage on the
input pin.There is no effect from input pin when input voltage is applied at the same time as VDD
.
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14.3.2 Power-Down
VDD(V)
2 V
1 V
0.735 V
0.393 V
Time
Not guaranteed output state
Figure 97: Power-Down
During Power-down, macrocells in SLG47502/03 are powered off after VDD falling down below Power-Off Threshold. Please note
that during a slow rampdown, outputs can possibly switch state during this time.
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2
15 I C Serial Communications Macrocell
15.1 I2C SERIAL COMMUNICATIONS MACROCELL OVERVIEW
In the standard use case for the GreenPAK devices, the configuration choices made by the user are stored as bit settings in the
Non-Volatile Memory (NVM), and this information is transferred at startup time to volatile RAM registers that enable the configu-
ration of the macrocells. Other RAM registers in the device are responsible for setting the connections in the Connection Matrix
to route signals in the manner most appropriate for the user’s application.
The I2C Serial Communications Macrocell in this device allows an I2C bus Master to read and write this information via a serial
channel directly to the RAM registers, allowing the remote re-configuration of macrocells, and remote changes to signal chains
within the device.
The I2C bus Master is also able to read and write other register bits that are not associated with NVM memory.
The user has the flexibility to control read access and write access via registers bits registers [1723:1720]. See Section 15.5 for
more details on I2C read/write memory protection.
It is possible to use I2C in Standard/fast mode or Fast mode+. To use I2C in Fast mode+ registers [1312], [1328] should be enabled.
Note that extra current consumption can occur if I2C transaction was corrupted and Stop condition was not received. Next correct
I2C transaction restores normal current consumption.
15.2 I2C SERIAL COMMUNICATIONS DEVICE ADDRESSING
Each command to the I2C Serial Communications macrocell begins with a Control Byte. The bits inside this Control Byte are
shown in Figure 98. After the Start bit, the first four bits are a control code. Each bit in a control code can be sourced independently
from the register or by value defined externally by GPI, GPIO3, GPIO4, and GPIO8. The LSB of the control code is defined by
the value of GPI, while the MSB is defined by the value of GPIO8. The address source (either register bit or PIN) for each bit in
the control code is defined by registers [30:24]. This gives the user flexibility on the chip level addressing of this device and other
devices on the same I2C bus. The Block Address is the next three bits (A10, A9, A8), which will define the most significant bits
in the addressing of the data to be read or written by the command. The last bit in the Control Byte is the R/W bit, which selects
whether a read command or write command is requested, with a “1” selecting for a Read command, and a “0” selecting for a Write
command. This Control Byte will be followed by an Acknowledge bit (ACK), which is sent by this device to indicate successful
communication of the Control Byte data.
In the I2C -bus specification and user manual, there are two groups of eight addresses (0000 xxx and 1111 xxx) that are reserved
for the special functions, such as a system General Call address. If the user of this device choses to set the Control Code to either
“1111” or “0000” in a system with other slave device, please consult the I2C-bus specification and user manual to understand the
addressing and implementation of these special functions, to ensure reliable operation.
In the read and write command address structure, there are a total of 11 bits of addressing, each pointing to a unique byte of
information, resulting in a total address space of 2K bytes. Of this 2K byte address space, the valid addresses accessible to the
I2C Macrocell on the SLG47502/03 are in the range from 0 (0x00) to 255 (0xFF). The MSB address bits (A10, A9, and A8) will
be “0” for all commands to the SLG47502/03.
With the exception of the Current Address Read command, all commands will have the Control Byte followed by the Word
Address. Figure 98 shows this basic command structure.
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Start
bit
Acknowledge
bit
Control Byte
Word Address
A
10
A
9
A
8
A
7
A
0
S
X
X
X
X
R/W ACK
Control
Code
Block
Address
Not used, set to
0
Read/Write bit
(1 = Read, 0 = Write)
Figure 98: Basic Command Structure
15.3 I2C SERIAL GENERAL TIMING
General timing characteristics for the I2C Serial Communications macrocell are shown in Figure 99. Timing specifications can be
found in the AC Characteristics section.
tHIGH
tF
tR
tLOW
SCL
tSU_STA
tHD_DAT
tHD_STA
tSU_DAT
tSU_STO
SDA IN
tBUF
tVD_ACK
tVD_DAT
SDA OUT
Figure 99: I2C General Timing Characteristics
15.4 I2C SERIAL COMMUNICATIONS COMMANDS
15.4.1 Byte Write Command
Following the Start condition from the Master, the Control Code [4 bits], the Block Address [3 bits], and the R/W bit (set to “0”),
are placed onto the I2C bus by the Master. After the SLG47502/03 sends an Acknowledge bit (ACK), the next byte transmitted
by the Master is the Word Address. The Block Address (A10, A9, A8), combined with the Word Address (A7 through A0), together
set the internal address pointer in the SLG47502/03, where the data byte is to be written. After the SLG47502/03 sends another
Acknowledge bit, the Master will transmit the data byte to be written into the addressed memory location. The SLG47502/03 again
provides an Acknowledge bit and then the Master generates a Stop condition. The internal write cycle for the data will take place
at the time that the SLG47502/03 generates the Acknowledge bit.
It is possible to latch all IOs during I2C write command, register [1425] = 1 - Enable. It means that IOs will remain their state until
the write command is done.
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Acknowledge
bit
Acknowledge
Start
bit
Acknowledge
Bus Activity
bit
Control Byte
bit
Word Address
Data
A
10
A
9
A
8
A
7
A
0
D
7
D
0
S
X
X
X
X
W
ACK
ACK
ACK
SDA LINE
P
Control
Code
Block
Address
Stop
bit
Not used, set to
0
R/W bit = 0
Figure 100: Byte Write Command, R/W = 0
15.4.2 Sequential Write Command
The write Control Byte, Word Address and the first data byte are transmitted to the SLG47502/03 in the same way as in a Byte
Write command. However, instead of generating a Stop condition, the Bus Master continues to transmit data bytes to the
SLG47502/03. Each subsequent data byte will increment the internal address counter, and will be written into the next higher
byte in the command addressing. As in the case of the Byte Write command, the internal write cycle will take place at the time
that the SLG47502/03 generates the Acknowledge bit.
Acknowledge
Acknowledge
bit
Start
bit
bit
Bus Activity
Data (n + 1)
Data (n + x)
Control Byte
Word Address (n)
Data (n)
A
10
A
9
A
8
ACK
ACK
P
SDA LINE
S
X
X
X
X
W
ACK
ACK
ACK
Control
Code
Block
Address
Stop
bit
Not used, set
to 0
Write bit
Figure 101: Sequential Write Command
15.4.3 Current Address Read Command
The Current Address Read Command reads from the current pointer address location. The address pointer is incremented at the
first STOP bit following any write control byte. For example, if a Sequential Read command (which contains a write control byte)
reads data up to address n, the address pointer would get incremented to n + 1 upon the STOP of that command. Subsequently,
a Current Address Read that follows would start reading data at n + 1. The Current Address Read Command contains the Control
Byte sent by the Master, with the R/W bit = “1”. The SLG47502/03 will issue an Acknowledge bit, and then transmit eight data
bits for the requested byte. The Master will not issue an Acknowledge bit, and follow immediately with a Stop condition.
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Start
bit
Acknowledge
bit
Stop
bit
Bus Activity
Control Byte
Data (n)
A
10
A
9
A
8
S
X
X
X
X
R
ACK
SDA LINE
P
Control
Code
Block
Address
No ACK
bit
Not used, set to 0
R/W bit = 1
Figure 102: Current Address Read Command, R/W = 1
15.4.4 Random Read Command
The Random Read command starts with a Control Byte (with R/W bit set to “0”, indicating a write command) and Word Address
to set the internal byte address, followed by a Start bit, and then the Control Byte for the read (exactly the same as the Byte Write
command). The Start bit in the middle of the command will halt the decoding of a Write command, but will set the internal address
counter in preparation for the second half of the command. After the Start bit, the Bus Master issues a second control byte with
the R/W bit set to “1”, after which the SLG47502/03 issues an Acknowledge bit, followed by the requested eight data bits.
Acknowledge
Stop
bit
Start
bit
bit
Bus Activity
SDA LINE
Not used, s
Data (n)
Control Byte
Word Address (n)
Control Byte
A
A
9
A
8
A
A
9
A
8
R
ACK
P
S
ACK
X
X
X
X
W
ACK
S
X
X
X
X
10
10
Control
Code
Block
Address
Control
Code
Block
Address
No ACK
bit
et to 0
Write bit
Read bit
Figure 103: Random Read Command
15.4.5 Sequential Read Command
The Sequential Read command is initiated in the same way as a Random Read command, except that once the SLG47502/03
transmits the first data byte, the Bus Master issues an Acknowledge bit as opposed to a Stop condition in a random read. The
Bus Master can continue reading sequential bytes of data, and will terminate the command with a Stop condition.
Acknowledge
Start
bit
bit
Bus Activity
Data (n + 2)
Data (n + x)
Control Byte
Data (n)
Data (n + 1)
A
10
A
9
A
8
ACK
P
SDA LINE
S
X
X
X
X
R
ACK
ACK
ACK
Control
Code
Block
Address
Stop
bit
No ACK
bit
Read bit
Figure 104: Sequential Read Command
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15.4.6 I2C Serial Reset Command
If I2C serial communication is established with the device, it is possible to reset the device to initial power up conditions, including
configuration of all macrocells, and all connections provided by the Connection Matrix. This is implemented by setting
register [17:16] I2C reset bit to “1”, which causes the device to re-enable the Power-On Reset (POR) sequence, including the
reload of all register data from NVM. During the POR sequence, the outputs of the device will be in tri-state. After the reset has
taken place, the contents of register [17:16] will be set to “0” automatically. Figure 105 illustrates the sequence of events for this
reset function.
Acknowledge
bit
Acknowledge
bit
Start
bit
Acknowledge
bit
Bus Activity
Control Byte
Word Address
Data
A
10
A
9
A
8
A
7
A
0
D
7
D
0
S
X
X
X
X
W
ACK
ACK
ACK
SDA LINE
P
Internal Reset bit
Control
Code
Block
Address
Stop
bit
Not used, set to 0
Write bit
by I2C Stop Signal
Reset-bit register output
DFF output gated by stop signal
Internal POR for core only
Figure 105: Reset Command Timing
15.4.7 I2C Additional Options
When Output latching during I2C write, register [1425] = 1 allows all PINs output value to be latched until I2C write is done. It will
protect the output change due to configuration process during I2C write in case multiple register bytes are changed. Inputs and
internal macrocells retain their status during I2C write.
If the user sets GPIO0 and GPIO1 function to a selection other than SDA and SCL, all access via I2C will be disabled.
Note: Any write commands that come to the device via I2C that are not blocked, based on the protection bits, will change the
contents of the RAM register bits that mirror the NVM bits. These write commands will not change the NVM bits themselves, and
a POR event will restore the register bits to original programmed contents of the NVM.
See Section 17 for detailed information on all registers.
15.4.8 Reading Counter Data via I2C
The current count value in all counters in the device can be read via I2C.
15.4.9 I2C Byte Write Bit Masking
The I2C macrocell inside SLG47502/03 supports masking of individual bits within a byte that is written to the RAM memory space.
This function is supported across the entire RAM memory space. To implement this function, the user performs a Byte Write
Command (see Section 15.4.1 for details) on the I2C Byte Write Mask Register (address 0F6H) with the desired bit mask pattern.
This sets a bit mask pattern for the target memory location that will take effect on the next Byte Write Command to this register
byte. Any bit in the mask that is set to “1” in the I2C Byte Write Mask Register will mask the effect of changing that particular bit
in the target register, during the next Byte Write Command. The contents of the I2C Byte Write Mask Register are reset (set to
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00h) after valid Byte Write Command. If the next command received by the device is not a Byte Write Command, the effect of the
bit masking function will be aborted, and the I2C Byte Write Mask Register will be reset with no effect. Figure 106 shows an
example of this function.
User Actions
Byte Write Command, Address = F6h, Data = 11110000b [sets mask bits]
Byte Write Command, Address = 74h, Data = 10101010b [writes data with mask]
Memory Address 74h (original contents)
Mask to choose bit from new
write command
1
1
1
1
0
0
1
1
0
0
0
0
Mask to choose bit from
original register contents
Memory Address 74h (new data in write command)
0 1
1
0
1
0
Bit from new write command
Memory Address F6h (mask register)
1
1
1
0
0
0
Bit from original register
contents
Memory Address 74h (new contents after write command)
1
1
0
0
1
0
1
0
Figure 106: Example of I2C Byte Write Bit Masking
15.4.10 Writing a New Value to the Shift Register via I2C
The new value can be written to the Shift Register if low logic level presents at the CLK input of the macrocell. Otherwise, if the
logic level at CLK input is high, the new value will be ignored.
It’s recommended to perform the following actions to write the new value to the Shift Register:
Read Shift Register value (Old_Value);
Write new Shift Register value;
Read Shift Register value (New_Value) and compare it with the result of the last read (Old_Value). If New_Value isn’t equal to
the Old_Value, the writing procedure was successful. Otherwise, if New_Value is equal to the Old_Value, the content of the
Shift Register hasn’t been updated (the logic level at the CLK input is high). I2C master should perform the following steps:
Connect the CLK input of the Shift Register to the GND (connect the corresponding matrix output to the matrix input x00);
Analyze the LSB, if the new value to be written to the Shift Register, for example xxxx xxx(y). y is the LSB of the 8-bit value
to be written to the Shift Register.
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If (y) is 0, then connect D input of the Shift Register to GND (connect the corresponding matrix output to the matrix input x00);
If (y) is 1, then connect D input of the Shift Register to VDD (connect the corresponding matrix output to the matrix input x3F);
Shift the new value to one bit right and write it to the Shift Register, for example if the data to be written to the Shift Register
is x5A (1010 0101), then the I2C master should write x52 (01010010) to the Shift Register.
Connect CLK input of the Shift Register to its original source (change the matrix output setting from x00 to original source
code). This will clock the Shift Register to one bit left.
Connect D input of the Shift Register to its original source (change the matrix output setting from VDD (x3F) or GND (x00)
to the original source code).
15.5 I2C SERIAL COMMAND REGISTER MAP
There are seven read/write protect modes for the design sequence from being corrupted or copied. See Table 36 for details.
Table 36: Read/Write Protection Options
Protection Modes Configuration
Partly
Lock
Partly
Lock Read&
Configurations
Data
Output ter Ad-
From
Regis-
Partly
Lock
Read
Partly
Lock
Write
Lock Read& Partly
Lock
Read/
Write
Unlock
Read/
Write
Lock
Write
Lock
Write
Lock
Read
Lock
Write
dress
RPR[1:0]
WPR[1:0]
00
00
01
00
00
01
01
01
01
10
10
01
10
00
00
10
10
10
I2C Write Mask
ControlRegister
(section 15.4.9)
I2C Virtual Input
Control Register
(section 6.3)
I2C Reset
Control Register
(section 15.4.6)
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
W
R/W
R/W
R/W
R
R/W
R/W
R/W
R
R/W
R/W
R/W
R
R/W
R/W
R/W
R
R/W
R/W
R/W
R/W
W
R/W
R/W
R/W
R
R/W
R/W
R/W
R
Memory
00
01
02
Macro-
cell
Memory
I2C
Configuration
Register
Memory 03~04
Memory 05~4E
Matrix Output
Configuration
(section 6.2)
R
-
-
-
R
-
Combination
Function
Macrocell
R/W
W
R
-
-
-
W
R
-
Memory 4F~6C
Configuration
Multi-Function
Macrocell
Configuration
R/W
R/W
R/W
W
W
W
R
R
R
-
-
-
-
-
-
-
-
-
W
W
W
R
R
R
-
-
-
Memory 6D~A1
Memory A2~B2
Memory B3~C0
IO Configuration
OSC, ACMP,
Vref
Configuration
R/W
W
R
Allow Read and Write Data
Allow Write Data Only
Allow Read Data Only
-
The Data is protected for Read and Write
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It is possible to read some data from macrocells, such as counter current value, connection matrix, and connection matrix virtual
inputs. The I2C write will not have any impact on data in case data comes from macrocell output, except Connection Matrix Virtual
Inputs. The silicon identification service bits allows identifying silicon family, its revision, and others.
See Section 17 for detailed information on all registers.
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16 Analog Temperature Sensor
The SLG47502/03 has an Analog Temperature Sensor (TS) with an output voltage linearly-proportional to the Centigrade tem-
perature. The TS cell shares buffer with Vref 0, so it is impossible to use both cells simultaneously, its output can be connected
directly to the GPIO or to the ACPM1_H positive input. Using buffer causes low-output impedance, linear output and makes
interfacing to readout or control circuitry especially easy. The TS is rated to operate over a -40 °C to 85 °C temperature range.
The error in the whole temperature range does not exceed ±2.5 %. TS output voltage variation over VDD at constant temperature
is less than ±1.5 %. When changing power-down source settings or enable temperature sensor settings in the Analog Tempera-
ture Sensor block, similar changes of these settings automatically occur in the Voltage Reference block. For more details refer to
section 4.
The equation below calculates the typical analog voltage passed from the TS to the ACMPs' IN+ source input. It is important to
note that there will be a chip to chip variation of about ±2 °C.
VTS = -1.95 x T + 734
where:
TS (mV) - TS Output Voltage
V
T (°C) - Temperature
Temperature hysteresis can be setup by enabling the GreenPAK's internal ACMP hysteresis.
From Connectinon
Matrix Output [95]
TS
V
DD
TS Power Up
Buf_sel[1526:1525]
GPIO
register [1528] = 1
OUT
11
10
01
00
ACMP1H Vref
ACMP0H Vref
Reserved
Figure 107: Analog Temperature Sensor Structure Diagram
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Mixed-Signal Matrix
17 Register Definitions
17.1 REGISTER MAP
Table 37: Register Map
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
Matrix Output
0
1
2
3
4
Host write data bit-mask:
0: write
1: mask (don't change)
0
I2C Write Mask Control
(This mask does not effect on NVM write and masks register
update)
5
6
7
8
9
10
11
Host Virtual Input Bit 0
Host Virtual Input Bit 1
Host Virtual Input Bit 2
Host Virtual Input Bit 3
Host Virtual Input Bit 4
Host Virtual Input Bit 5
Host Virtual Input Bit 6
Host Virtual Input Bit 7
1
I2C Virtual Input Control
12
13
14
15
0: Normal
1: Reset
16
(Self-Clear Bit. Shuts down device (simulates a Chip POR))
Reserved
17
I2C Reset Control
18
2
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
19
20
21
22
23
24
25
26
27
Bit[6:3] can be optional selected to GPIOx with
I2C_CONTROL_CODE_BITx_SEL configuration
I2C Interfaces Base Address
I2C Mode Enable
3
28
29
30
0: I2C mode disable
1: I2C mode enable
31
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Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
0: Used I2C_CONTROL_CODE Value
1: Use SLA_0 Value
0: Used I2C_CONTROL_CODE Value
1: Use SLA_0 Value
0: Used I2C_CONTROL_CODE Value
1: Use SLA_0 Value
0: Used I2C_CONTROL_CODE Value
1: Use SLA_0 Value
32
33
34
35
I2C CONTROL CODE BIT3 SEL
I2C CONTROL CODE BIT4 SEL
I2C CONTROL CODE BIT5 SEL
I2C CONTROL CODE BIT6 SEL
4
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
Reserved
Reserved
Reserved
Reserved
OUT0:
IN0 of LUT2_0 or Clock Input of DFF0 or Clock Input of
Shift_Reg0
5
LUT2_0 & DFF0
OUT1:
IN1 of LUT2_0 or Data Input of DFF0 or Data Input of
Shift_Reg0
6
OUT2:
IN0 of LUT2_1 or Clock Input of DFF1 or Clock Input of
Shift_Reg1
LUT2_1 & DFF1
7
8
OUT3:
IN1 of LUT2_1 or Data Input of DFF1 or Data Input of
Shift_Reg1
OUT4:
LUT2_2 & DFF2
IN0 of LUT2_2 or Clock Input of DFF2 or Clock Input of
Shift_Reg2
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Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
70
Byte
8
71
72
73
74
OUT5:
LUT2_2 & DFF2
IN1 of LUT2_2 or Data Input of DFF2 or Data Input of
Shift_Reg2
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
9
A
B
C
D
OUT6:
IN0 of LUT2_3 or Clock Input of PGen0
LUT2_3 & PGen
OUT7:
IN1 of LUT2_3 or nRST of PGen0
OUT8:
IN0 of LUT3_0 or Clock Input of DFF3 or Clock Input of
Shift_Reg3
OUT9:
LUT3_0 & DFF3
IN1 of LUT3_0 or Data Input of DFF3 or Data Input of
Shift_Reg3
99
100
101
102
103
104
105
106
107
108
109
110
111
OUT10:
IN2 of LUT3_0 or nRST(nSET) of DFF3 or nRST (nSET) of
Shift_Reg3
OUT11:
LUT3_1 & DFF4
IN0 of LUT3_1 or Clock Input of DFF4 or Clock Input of
Shift_Reg4
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Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
OUT12:
IN1 of LUT3_1 or Data Input of DFF4 or Data Input of
Shift_Reg4
E
LUT3_1 & DFF4
OUT13:
IN2 of LUT3_1 or nRST (nSET) of DFF4 or nRST(nSET) of
Shift_Reg4
F
OUT14:
IN0 of LUT3_2 or Clock Input of DFF5 or Clock Input of
Shift_Reg5
10
11
12
13
OUT15:
LUT3_2 & DFF5
IN1 of LUT3_2 or Data Input of DFF5 or Data Input of
Shift_Reg5
OUT16:
IN2 of LUT3_2 or nRST(nSET) of DFF5 or nRST(nSET) of
Shift_Reg5
OUT17:
IN0 of LUT3_3 or Clock Input of DFF6 or Clock Input of
Shift_Reg6
OUT18:
LUT3_3 & DFF6
IN1 of LUT3_3 or Data Input of DFF6 or Data Input of
Shift_Reg6
OUT19:
IN2 of LUT3_3 or nRST(nSET) of DFF6 or nRST(nSET) of
Shift_Reg6
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Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
192
193
194
195
196
197
198
199
200
201
202
203
204
205
206
207
OUT20:
IN0 of LUT3_4 or Clock Input of DFF7 or Clock Input of
Shift_Reg7
14
OUT21:
LUT3_4 & DFF7
IN1 of LUT3_4 or Data Input of DFF7 or Data Input of
Shift_Reg7
15
16
17
18
19
OUT22:
IN2 of LUT3_4 or nRST(nSET) of DFF7 or nRST(nSET) of
Shift_Reg7
OUT23:
IN0 of LUT3_5 or Clock Input of DFF8 or Clock Input of
Shift_Reg8
OUT24:
LUT3_5 & DFF8
IN1 of LUT3_5 or Data Input of DFF8 or Data Input of
Shift_Reg8
OUT25:
IN2 of LUT3_5 or nRST(nSET) of DFF8 or nRST(nSET) of
Shift_Reg8
OUT26:
IN0 of LUT3_6 or Clock Input of DFF9 or Clock Input of
Shift_Reg9
LUT3_6 & DFF9
OUT27:
IN1 of LUT3_6 or Data Input of DFF9 or Data Input of
Shift_Reg9
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Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
208
209
210
211
212
213
214
215
216
217
218
219
220
221
222
223
224
225
226
227
228
229
230
231
232
233
234
235
236
237
238
239
240
241
242
243
244
245
246
247
248
249
OUT28:
LUT3_6 & DFF9
IN2 of LUT3_6 or nRST(nSET) of DFF9 or nRST(nSET) of
Shift_Reg9
1A
OUT29:
IN0 of LUT3_7 or Clock Input of DFF10 or Clock Input of
Shift_Reg10
1B
1C
1D
OUT30:
LUT3_7 & DFF10
IN1 of LUT3_7 or Data Input of DFF10 or Data Input of
Shift_Reg10
OUT31:
IN2 of LUT3_7 or nRST(nSET) of DFF10 or nRST(nSET) of
Shift_Reg10
OUT32:
IN0 of LUT3_8 or Clock Input of DFF11 or Clock Input of
Shift_Reg11
OUT33:
LUT3_8 & DFF11
IN1 of LUT3_8 or Data Input of DFF11 or Data Input of
Shift_Reg11
1E
1F
OUT34:
IN2 of LUT3_8 or nRST(nSET) of DFF11 or nRST(nSET) of
Shift_Reg11
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Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
250
251
252
253
254
255
256
257
258
259
260
261
262
263
264
265
266
267
268
269
270
271
272
273
274
275
276
277
278
279
280
281
282
283
284
285
286
287
288
289
290
291
OUT35:
1F
IN0 of LUT3_9 or Clock Input of DFF12 or Clock Input of
Shift_Reg12
OUT36:
LUT3_9 & DFF12
IN1 of LUT3_9 or Data Input of DFF12 or Data Input of
Shift_Reg12
20
21
22
OUT37:
IN2 of LUT3_9 or nRST(nSET) of DFF12 or nRST(nSET) of
Shift_Reg12
OUT38:
IN0 of LUT4_0 or Clock Input of DFF13 or Clock Input of
Shift_Reg13
OUT39:
IN1 of LUT4_0 or Data Input of DFF13 or Data Input of
Shift_Reg13
LUT4_0 & DFF13
OUT40:
IN2 of LUT4_0 or nRST(nSET) of DFF13 or nRST(nSET) of
Shift_Reg13
23
24
OUT41:
IN3 of LUT4_0 or Clock Enable of DFF13 or Clock Enable of
Shift_Reg13
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Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
292
293
294
295
296
297
298
299
300
301
302
303
304
305
306
307
308
309
310
311
312
313
314
315
316
317
318
319
320
321
322
323
324
325
326
327
24
OUT42:
IN0 of MLT0_LUT4_1 or Clock Input of DFF14 or Delay0 Input
(or Counter0 nRST Input)
25
26
27
28
OUT43:
IN1 of MLT0_LUT4_1 or nRST of DFF14 or Delay0 Input (or
Counter0 nRST Input or External Clock Source)
Multi-function0
OUT44:
IN2 of IN2 of MLT0_LUT4_1 or nSET of DFF14 or KEEP of
Delay0/Counter0
OUT45:
IN3 of MLT0_LUT4_1 or Data Input of DFF14 or UPof Delay0/
Counter0
OUT46:
IN0 of MLT1_LUT3_10 or Clock Input of DFF15 or Delay1
Input (or Counter1 nRST Input)
Multi-function1
OUT47:
IN1 of MLT1_LUT3_10 or nRST(nSET) of DFF15 or Delay1
Input (or Counter1 nRST Input or External Clock Source)
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Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
328
329
330
331
332
333
334
335
336
337
338
339
340
341
342
343
344
345
346
347
348
349
350
351
352
353
354
355
356
357
358
359
360
361
362
363
364
365
366
367
368
369
370
371
372
373
374
375
OUT48:
Multi-function1
IN2ofMLT1_LUT3_10orDataInputofDFF15orDelay1Input
(or Counter1 nRST Input)
29
OUT49:
IN0 of MLT2_LUT3_11 or Clock Input of DFF16 or Delay2
Input (or Counter2 nRST Input)
2A
2B
2C
2D
2E
OUT50:
Multi-function2
IN1 of MLT2_LUT3_11 or nRST(nSET) of DFF16 or Delay2
Input (or Counter2 nRST Input or External Clock Source
OUT51:
IN2ofMLT2_LUT3_11or DataInputofDFF16orDelay2 Input
(or Counter2 nRST Input)
OUT52:
IN0 of MLT3_LUT3_12 or Clock Input of DFF17 or Delay3
Input (or Counter3 nRST Input)
OUT53:
Multi-function3
IN1 of MLT3_LUT3_12 or nRST(nSET) of DFF17 or Delay3
Input (or Counter3 nRST Input or External Clock Source)
OUT54:
IN2ofMLT3_LUT3_12orDataInputofDFF17orDelay3Input
(or Counter3 nRST Input)
OUT55:
Multi-function4
IN0 of MLT4_LUT3_13 or Clock Input of DFF18 or Delay4
Input (or Counter4 nRST Input)
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Preliminary
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Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
376
377
378
379
380
381
382
383
384
385
386
387
388
389
390
391
392
393
394
395
396
397
398
399
400
401
402
403
404
405
406
407
408
409
410
411
412
413
414
415
416
417
418
419
420
421
422
423
OUT56:
IN1 of MLT4_LUT3_13 or nRST(nSET) of DFF18 or Delay4
Input (or Counter4 nRST Input or External Clock Source
2F
Multi-function4
OUT57:
IN2ofMLT4_LUT3_13orDataInputofDFF18orDelay4Input
(or Counter4 nRST Input)
30
31
32
33
34
OUT58:
IN0 of MLT5_LUT3_14 or Clock Input of DFF19 or Delay5
Input (or Counter5 nRST Input)
OUT59:
Multi-function5
IN1 of MLT5_LUT3_14 or nRST(nSET) of DFF19 or Delay5
Input (or Counter5 nRST Input or External Clock Source)
OUT60:
IN2ofMLT5_LUT3_14orDataInputofDFF19orDelay5Input
(or Counter5 nRST Input)
OUT61:
IN0 of MLT6_LUT3_15 or Clock Input of DFF20 or Delay6
Input (or Counter6 nRST Input)
OUT62:
Multi-function6
IN1 of MLT6_LUT3_15 or nRST(nSET) of DFF20 or Delay6
Input (or Counter6 nRST Input or External Clock Source)
OUT63:
IN2ofMLT6_LUT3_15orDataInputofDFF20orDelay6Input
(or Counter6 nRST Input)
Datasheet
16-Jul-2021
Revision 2.0
130 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
424
425
426
427
428
429
430
431
432
433
434
435
436
437
438
439
440
441
442
443
444
445
446
447
448
449
450
451
452
453
454
455
456
457
458
459
460
461
462
463
464
465
466
467
468
469
470
471
OUT64:
IN0 of MLT7_LUT3_16 or Clock Input of DFF21 or Delay7
Input (or Counter7 nRST Input)
35
OUT65:
Multi-function7
IN1 of MLT7_LUT3_16 or nRST(nSET) of DFF21 or Delay7
Input (or Counter7 nRST Input or External Clock Source)
36
37
38
39
3A
OUT66:
IN2ofMLT7_LUT3_16orDataInputofDFF21orDelay7Input
(or Counter7 nRST Input)
OUT67:
GPIO0 Digital Output
GPIO0
GPIO1
OUT68:
GPIO1 Digital Output
OUT69:
GPIO2 Digital Output OE
GPIO2
OUT70:
GPIO2 Digital Output
OUT71:
GPIO3 Digital Output OE
GPIO3
Datasheet
16-Jul-2021
Revision 2.0
131 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
472
473
474
475
476
477
478
479
480
481
482
483
484
485
486
487
488
489
490
491
492
493
494
495
496
497
498
499
500
501
502
503
504
505
506
507
508
509
510
511
512
513
514
515
516
517
518
519
OUT72:
GPIO3 Digital Output
GPIO3
3B
OUT73:
GPIO4 Digital Output OE
3C
3D
3E
3F
40
GPIO4
OUT74:
GPIO4 Digital Output
OUT75:
GPIO5 Digital Output OE
GPIO5
OUT76:
GPIO5 Digital Output
OUT77:
GPIO6 Digital Output OE
GPIO6
OUT78:
GPIO6 Digital Output
OUT79:
GPIO7 Digital Output OE
GPIO7
Datasheet
16-Jul-2021
Revision 2.0
132 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
520
521
522
523
524
525
526
527
528
529
530
531
532
533
534
535
536
537
538
539
540
541
542
543
544
545
546
547
548
549
550
551
552
553
554
555
556
557
558
559
560
561
562
563
564
565
566
567
OUT80:
GPIO7 Digital Output
GPIO7
41
OUT81:
GPIO8 Digital Output OE
42
43
44
45
46
GPIO8
OUT82:
GPIO8 Digital Output
OUT83:
GPIO9 Digital Output OE (16-PIN Version)
GPIO9
OUT84:
GPIO9 Digital Output (16-PIN Version)
OUT85:
GPIO10 Digital Output OE (16-PIN Version)
GPIO10
OUT86:
GPIO10 Digital Output (16-PIN Version)
OUT87:
GPIO11
GPIO11 Digital Output OE (16-PIN Version)
Datasheet
16-Jul-2021
Revision 2.0
133 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
568
569
570
571
572
573
574
575
576
577
578
579
580
581
582
583
584
585
586
587
588
589
590
591
592
593
594
595
596
597
598
599
600
601
602
603
604
605
606
607
608
609
610
611
612
613
614
615
OUT88:
GPIO11
GPIO11 Digital Output (16-PIN Version)
47
OUT89:
GPIO12 Digital Output OE (16-PIN Version)
48
49
4A
4B
4C
GPIO12
OUT90:
GPIO12 Digital Output (16-PIN Version)
OUT91:
Filter/Edge detect input
Filter/Edge detect
Programmable delay/edge detect
ACMP0H
OUT92:
Programmable delay/edge detect input
OUT93:
Power Up of ACMP0_H
OUT94:
Power Up of ACMP1_H
ACMP1H
OUT95:
Temp sensor
Temp sensor, Vref Out_0 Power Up
Datasheet
16-Jul-2021
Revision 2.0
134 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
616
617
618
619
620
621
622
623
624
625
626
627
628
629
630
631
632
633
634
635
636
637
638
639
640
641
642
643
644
645
646
647
648
649
650
651
652
653
654
655
656
657
658
659
660
661
662
663
OUT96:
OSC0
Oscillator0 (LFOSC) ENABLE
4D
OUT97:
OSC1
Oscillator1 (RINGOSC) ENABLE
4E
4F
50
51
52
Reserved
Reserved
Reserved
Reserved
LUT2_0 bit[0]/Shift_Reg0 bit[0]
LUT2_0 bit[1]/Shift_Reg0 bit[1]
LUT2_0 bit[2]/Shift_Reg0 bit[2]
LUT2_0 bit[3]/DFF0 /Shift_Reg0 bit[3]
LUT2_1 bit[0]/Shift_Reg1 bit[0]
LUT2_1 bit[1]/Shift_Reg1 bit[1]
LUT2_1 bit[2]/Shift_Reg1 bit[2]
LUT2_1 bit[3]/DFF1 /Shift_Reg1 bit[3]
LUT2_2 bit[0]/Shift_Reg2 bit[0]
LUT2_2 bit[1]/Shift_Reg2 bit[1]
LUT2_2 bit[2]/Shift_Reg2 bit[2]
LUT2_2 bit[3]/DFF2 /Shift_Reg2 bit[3]
LUT2_3 bit[0]/PGEN0 Size bit [0]
LUT2_3 bit[1]/PGEN0 Size bit [1]
LUT2_3 bit[2]/PGEN0 Size bit [2]
LUT2_3 bit[3]/PGEN0 Size bit [3]
LUT3_0 bit[0]/Shift_Reg3 bit[0]
LUT3_0 bit[1]/Shift_Reg3 bit[1]
LUT3_0 bit[2]/Shift_Reg3 bit[2]
LUT3_0 bit[3]/Shift_Reg3 bit[3]
LUT3_0 bit[4]/Shift_Reg3 bit[4]
LUT3_0 bit[5]/Shift_Reg3 bit[5]
LUT3_0 bit[6]/Shift_Reg3 bit[6]
LUT3_0 bit[7]/DFF3/Shift_Reg3 bit[7]
LUT3_1 bit[0]/Shift_Reg4 bit[0]
LUT3_1 bit[1]/Shift_Reg4 bit[1]
LUT3_1 bit[2]/Shift_Reg4 bit[2]
LUT3_1 bit[3]/Shift_Reg4 bit[3]
LUT3_1 bit[4]/Shift_Reg4 bit[4]
LUT3_1 bit[5]/Shift_Reg4 bit[5]
LUT3_1 bit[6]/Shift_Reg4 bit[6]
LUT3_1 bit[7]/DFF4/Shift_Reg4 bit[7]
LUT2_0_DFF0_SHR0
LUT2_1_DFF1_SHR1
LUT2_2_ DFF2_SHR2
LUT2_3_PGEN0
LUT3_0_DFF3_SHR3
LUT3_1_DFF4_SHR4
Datasheet
16-Jul-2021
Revision 2.0
135 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
664
665
666
667
668
669
670
671
672
673
674
675
676
677
678
679
680
681
682
683
684
685
686
687
688
689
690
691
692
693
694
695
696
697
698
699
700
701
702
703
704
705
706
707
708
709
710
711
LUT3_2 bit[0]/Shift_Reg5 bit[0]
LUT3_2 bit[1]/Shift_Reg5 bit[1]
LUT3_2 bit[2]/Shift_Reg5 bit[2]
LUT3_2 bit[3]/Shift_Reg5 bit[3]
LUT3_2 bit[4]/Shift_Reg5 bit[4]
LUT3_2 bit[5]/Shift_Reg5 bit[5]
LUT3_2 bit[6]/Shift_Reg5 bit[6]
LUT3_2 bit[7]/DFF5/Shift_Reg5 bit[7]
LUT3_3 bit[0]/Shift_Reg6 bit[0]
LUT3_3 bit[1]/Shift_Reg6 bit[1]
LUT3_3 bit[2]/Shift_Reg6 bit[2]
LUT3_3 bit[3]/Shift_Reg6 bit[3]
LUT3_3 bit[4]/Shift_Reg6 bit[4]
LUT3_3 bit[5]/Shift_Reg6 bit[5]
LUT3_3 bit[6]/Shift_Reg6 bit[6]
LUT3_3 bit[7]/DFF6/Shift_Reg6 bit[7]
LUT3_4 bit[0]/Shift_Reg7 bit[0]
LUT3_4 bit[1]/Shift_Reg7 bit[1]
LUT3_4 bit[2]/Shift_Reg7 bit[2]
LUT3_4 bit[3]/Shift_Reg7 bit[3]
LUT3_4 bit[4]/Shift_Reg7 bit[4]
LUT3_4 bit[5]/Shift_Reg7 bit[5]
LUT3_4 bit[6]/Shift_Reg7 bit[6]
LUT3_4 bit[7]/DFF7/Shift_Reg7 bit[7]
LUT3_5 bit[0]/Shift_Reg8 bit[0]
LUT3_5 bit[1]/Shift_Reg8 bit[1]
LUT3_5 bit[2]/Shift_Reg8 bit[2]
LUT3_5 bit[3]/Shift_Reg8 bit[3]
LUT3_5 bit[4]/Shift_Reg8 bit[4]
LUT3_5 bit[5]/Shift_Reg8 bit[5]
LUT3_5 bit[6]/Shift_Reg8 bit[6]
LUT3_5 bit[7]/DFF8/Shift_Reg8 bit[7]
LUT3_6 bit[0]/Shift_Reg9 bit[0]
LUT3_6 bit[1]/Shift_Reg9 bit[1]
LUT3_6 bit[2]/Shift_Reg9 bit[2]
LUT3_6 bit[3]/Shift_Reg9 bit[3]
LUT3_6 bit[4]/Shift_Reg9 bit[4]
LUT3_6 bit[5]/Shift_Reg9 bit[5]
LUT3_6 bit[6]/Shift_Reg9 bit[6]
LUT3_6 bit[7]/DFF9 /Shift_Reg9 bit[7]
LUT3_7 bit[0]/Shift_Reg10 bit[0]
LUT3_7 bit[1]/Shift_Reg10 bit[1]
LUT3_7 bit[2]/Shift_Reg10 bit[2]
LUT3_7 bit[3]/Shift_Reg10 bit[3]
LUT3_7 bit[4]/Shift_Reg10 bit[4]
LUT3_7 bit[5]/Shift_Reg10 bit[5]
LUT3_7 bit[6]/Shift_Reg10 bit[6]
LUT3_7 bit[7]/DFF10/Shift_Reg10 bit[7]
53
LUT3_2_DFF5_SHR5
54
55
56
57
58
LUT3_3_DFF6_SHR6
LUT3_4_DFF7_SHR7
LUT3_5_DFF8_SHR8
LUT3_6_DFF9_SHR9
LUT3_7_DFF10_SHR10
Datasheet
16-Jul-2021
Revision 2.0
136 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
712
713
714
715
716
717
718
719
720
721
722
723
724
725
726
727
728
729
730
731
732
733
734
735
736
737
738
739
740
741
742
743
LUT3_8 bit[0]/Shift_Reg11 bit[0]
LUT3_8 bit[1]/Shift_Reg11 bit[1]
LUT3_8 bit[2]/Shift_Reg11 bit[2]
LUT3_8 bit[3]/Shift_Reg11 bit[3]
LUT3_8 bit[4]/Shift_Reg11 bit[4]
LUT3_8 bit[5]/Shift_Reg11 bit[5]
LUT3_8 bit[6]/Shift_Reg11 bit[6]
LUT3_8 bit[7]/DFF11/Shift_Reg11 bit[7]
LUT3_9 bit[0]/Shift_Reg12 bit[0]
LUT3_9 bit[1]/Shift_Reg12 bit[1]
LUT3_9 bit[2]/Shift_Reg12 bit[2]
LUT3_9 bit[3]/Shift_Reg12 bit[3]
LUT3_9 bit[4]/Shift_Reg12 bit[4]
LUT3_9 bit[5]/Shift_Reg12 bit[5]
LUT3_9 bit[6]/Shift_Reg12 bit[6]
LUT3_9 bit[7]/DFF12/Shift_Reg12 bit[7]
LUT4_0 bit[0]/Shift_Reg13 bit[0]
LUT4_0 bit[1]/Shift_Reg13 bit[1]
LUT4_0 bit[2]/Shift_Reg13 bit[2]
LUT4_0 bit[3]/Shift_Reg13 bit[3]
LUT4_0 bit[4]/Shift_Reg13 bit[4]
LUT4_0 bit[5]/Shift_Reg13 bit[5]
LUT4_0 bit[6]/Shift_Reg13 bit[6]
LUT4_0 bit[7]/Shift_Reg13 bit[7]
LUT4_0 bit[8]/Shift_Reg13 bit[8]
LUT4_0 bit[9]/Shift_Reg13 bit[9]
LUT4_0 bit[10]/Shift_Reg13 bit[10]
LUT4_0 bit[11]/Shift_Reg13 bit[11]
LUT4_0 bit[12]/Shift_Reg13 bit[12]
LUT4_0 bit[13]/Shift_Reg13 bit[13]
LUT4_0 bit[14]/Shift_Reg13 bit[14]
LUT4_0 bit[15]/DFF13/Shift_Reg13 bit[15]
59
LUT3_8_DFF11_SHR11
5A
5B
5C
LUT3_9_DFF12_SHR12
LUT4_0_DFF13_SHR13
LUT2_0_DFF0_SHR0 DFF/Latch/Shift or LUT 0: LUT
744
745
Select
1: DFF/Latch/Shift Register
Value=0 DFF/Latch Mode,
Value=1 Length=2,
Value=2 Length=3,
LUT2_0_DFF0_SHR0 Shift Register Length
746
Value=3 Length=4...
0: DFF
747
748
LUT2_0_DFF0_SHR0 DFF or Latch Select
LUT2_0_DFF0_SHR0 Output Polarity Select
1: Latch
(Only valid when LUT_SEL=0 and SHR_LEN=0)
0: Non-inverted
1: Inverted
5D
LUT2_1_DFF1_SHR1 DFF/Latch/Shift or LUT 0: LUT
749
750
Select
1: DFF/Latch/Shift Register
Value=0 DFF/Latch Mode,
Value=1 Length=2,
LUT2_1_DFF1_SHR1 Shift Register Length
Value=2 Length=3,
751
Value=3 Length=4...
Datasheet
16-Jul-2021
Revision 2.0
137 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
0: DFF
LUT2_1_DFF1_SHR1 DFF or Latch Select
752
753
1: Latch
(Only valid when LUT_SEL=0 and SHR_LEN=0)
0: Non-inverted
1: Inverted
LUT2_1_DFF1_SHR1 Output Polarity Select
LUT2_2_DFF2_SHR2 DFF/Latch/Shift or LUT 0: LUT
754
755
Select
1: DFF/Latch/Shift Register
Value=0 DFF/Latch Mode,
Value=1 Length=2,
Value=2 Length=3,
5E
LUT2_2_DFF2_SHR2 Shift Register Length
756
757
Value=3 Length=4...
0: DFF
1: Latch
LUT2_2_DFF2_SHR2 DFF or Latch Select
(Only valid when LUT_SEL=0 and SHR_LEN=0)
0: Non-inverted
1: Inverted
0: LUT
1: Pattern Generator
0: Active Low Level for reset/set
1: Active High Level for reset/set
758
759
760
761
LUT2_2_DFF2_SHR2 Output Polarity Select
LUT2_3_PGEN0 Function Select
LUT2_3_PGEN0 Active Level Selection for
RST/SET
LUT3_0_DFF3_SHR3 DFF/Latch/Shift or LUT 0: LUT
Select
1: DFF/Latch/Shift Register
762
763
Value=0 DFF/Latch Mode,
Value=1 Length=2,
Value=2 Length=3,
LUT3_0_DFF3_SHR3 Shift Register Length
764
Value=3 Length=4...
5F
0: DFF
765
LUT3_0_DFF3_SHR3 DFF or Latch Select
LUT3_0_DFF3_SHR3 Output Polarity Select
LUT3_0_DFF3_SHR3 nRST/nSet Select
1: Latch
(Only valid when LUT_SEL=0 and SHR_LEN=0)
0: Non-inverted
1: Inverted
0: DFF/SHR use nRST
1: DFF/SHR use nSET
(Only valid in DFF/Latch mode)
766
767
0: Active Low
1: Active High
0: LUT
LUT3_0_DFF3_SHR3 Set/Reset active level
select
768
769
LUT3_1_DFF4_SHR4 DFF/Latch/Shift or LUT
Select
1: DFF/Latch/Shift Register
770
771
Value=0 DFF/Latch Mode,
Value=1 Length=2,
Value=2 Length=3,
LUT3_1_DFF4_SHR4 Shift Register Length
772
Value=3 Length=4...
60
0: DFF
1: Latch
LUT3_1_DFF4_SHR4 DFF or Latch Select.
Only valid when LUT_SEL=0 and SHR_LEN=0
773
(Only valid when LUT_SEL=0 and SHR_LEN=0)
0: Non-inverted
1: Inverted
0: DFF/SHR use nRST
1: DFF/SHR use nSET
(Only valid in DFF/Latch mode)
774
775
LUT3_1_DFF4_SHR4 Output Polarity Select
LUT3_1_DFF4_SHR4 nRST/nSet Select
Datasheet
16-Jul-2021
Revision 2.0
138 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
0: Active Low
1: Active High
LUT3_2_DFF5_SHR5 DFF/Latch/Shift or LUT 0: LUT
LUT3_1_DFF4_SHR4 Set/Reset active level
select
776
777
Select
1: DFF/Latch/Shift Register
778
779
Value=0 DFF/Latch Mode,
Value=1 Length=2,
Value=2 Length=3,
LUT3_2_DFF5_SHR5 Shift Register Length
780
Value=3 Length=4...
61
0: DFF
781
LUT3_2_DFF5_SHR5 DFF or Latch Select
LUT3_2_DFF5_SHR5 Output Polarity Select
LUT3_2_DFF5_SHR5 nRST/nSet Select
1: Latch
(Only valid when LUT_SEL=0 and SHR_LEN=0)
0: Non-inverted
1: Inverted
0: DFF/SHR use nRST
1: DFF/SHR use nSET
(Only valid in DFF/Latch mode)
782
783
0: Active Low
1: Active High
0: LUT
LUT3_2_DFF5_SHR5 Set/Reset active level
select
784
785
LUT3_3_DFF6_SHR6 DFF/Latch/Shift or LUT
Select
1: DFF/Latch/Shift Register
786
787
Value=0 DFF/Latch Mode,
Value=1 Length=2,
Value=2 Length=3,
LUT3_3_DFF6_SHR6 Shift Register Length
788
Value=3 Length=4...
62
0: DFF
789
LUT3_3_DFF6_SHR6 DFF or Latch Select
LUT3_3_DFF6_SHR6 Output Polarity Select
LUT3_3_DFF6_SHR6 nRST/nSet Select
1: Latch
(Only valid when LUT_SEL=0 and SHR_LEN=0)
0: Non-inverted
1: Inverted
0: DFF/SHR use nRST
1: DFF/SHR use nSET
(Only valid in DFF/Latch mode)
790
791
LUT3_3_DFF6_SHR6 Set/Reset active level 0: Active Low
792
793
select
1: Active High
0: LUT
LUT3_4_DFF7_SHR7 DFF/Latch/Shift or LUT
Select
1: DFF/Latch/Shift Register
794
795
Value=0 DFF/Latch Mode,
Value=1 Length=2,
Value=2 Length=3,
LUT3_4_DFF7_SHR7 Shift Register Length
796
Value=3 Length=4...
63
0: DFF
797
LUT3_4_DFF7_SHR7 DFF or Latch Select
LUT3_4_DFF7_SHR7 Output Polarity Select
LUT3_4_DFF7_SHR7 nRST/nSet Select
1: Latch
(Only valid when LUT_SEL=0 and SHR_LEN=0)
0: Non-inverted
1: Inverted
0: DFF/SHR use nRST
1: DFF/SHR use nSET
(Only valid in DFF/Latch mode)
798
799
800
0: Active Low
1: Active High
LUT3_4_DFF7_SHR7 Set/Reset active level
select
64
Datasheet
16-Jul-2021
Revision 2.0
139 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
LUT3_5_DFF8_SHR8 DFF/Latch/Shift or LUT 0: LUT
801
Select
1: DFF/Latch/Shift Register
802
803
Value=0 DFF/Latch Mode,
Value=1 Length=2,
Value=2 Length=3,
LUT3_5_DFF8_SHR8 Shift Register Length
804
Value=3 Length=4...
0: DFF
1: Latch
64
805
LUT3_5_DFF8_SHR8 DFF or Latch Select.
LUT3_5_DFF8_SHR8 Output Polarity Select
LUT3_5_DFF8_SHR8 nRST/nSet Select
(Only valid when LUT_SEL=0 and SHR_LEN=0)
0: Non-inverted
1: Inverted
0: DFF/SHR use nRST
1: DFF/SHR use nSET
(Only valid in DFF/Latch mode)
806
807
LUT3_5_DFF8_SHR8 Set/Reset active level 0: Active Low
808
809
select
1: Active High
0: LUT
LUT3_6_DFF9_SHR9 DFF/Latch/Shift or LUT
Select
1: DFF/Latch/Shift Register
810
811
Value=0 DFF/Latch Mode,
Value=1 Length=2,
Value=2 Length=3,
LUT3_6_DFF9_SHR9 Shift Register Length
812
Value=3 Length=4...
65
0: DFF
813
LUT3_6_DFF9_SHR9 DFF or Latch Select
LUT3_6_DFF9_SHR9 Output Polarity Select
LUT3_6_DFF9_SHR9 nRST/nSet Select
1: Latch
(Only valid when LUT_SEL=0 and SHR_LEN=0)
0: Non-inverted
1: Inverted
0: DFF/SHR use nRST
1: DFF/SHR use nSET
(Only valid in DFF/Latch mode)
814
815
0: Active Low
1: Active High
0: LUT
LUT3_6_DFF9_SHR9 Set/Reset active level
select
816
817
LUT3_7_DFF10_SHR10 DFF/Latch/Shift or
LUT Select
1: DFF/Latch/Shift Register
818
819
Value=0 DFF/Latch Mode,
Value=1 Length=2,
Value=2 Length=3,
LUT3_7_DFF10_SHR10 Shift Register Length
820
Value=3 Length=4...
66
0: DFF
821
LUT3_7_DFF10_SHR10 DFF or Latch Select 1: Latch
(Only valid when LUT_SEL=0 and SHR_LEN=0)
LUT3_7_DFF10_SHR10 Output Polarity Se- 0: Non-inverted
822
823
lect
1: Inverted
0: DFF/SHR use nRST
1: DFF/SHR use nSET
(Only valid in DFF/Latch mode)
LUT3_7_DFF10_SHR10 nRST/nSet Select
0: Active Low
1: Active High
0: LUT
LUT3_7_DFF10_SHR10Set/Resetactivelevel
select
824
825
67
LUT3_8_DFF11_SHR11 DFF/Latch/Shift or
LUT Select
1: DFF/Latch/Shift Register
Datasheet
16-Jul-2021
Revision 2.0
140 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
826
827
Value=0 DFF/Latch Mode,
Value=1 Length=2,
Value=2 Length=3,
LUT3_8_DFF11_SHR11 Shift Register Length
828
Value=3 Length=4...
0: DFF
829
LUT3_8_DFF11_SHR11 DFF or Latch Select 1: Latch
(Only valid when LUT_SEL=0 and SHR_LEN=0)
67
0: Non-inverted
1: Inverted
0: DFF/SHR use nRST
1: DFF/SHR use nSET
(Only valid in DFF/Latch mode)
830
831
LUT3_8_DFF11_SHR11 OutputPolarity Select
LUT3_8_DFF11_SHR11 nRST/nSet Select
LUT3_8_DFF11_SHR11 Set/Reset active level 0: Active Low
832
833
select
1: Active High
0: LUT
LUT3_9_DFF12_SHR12 DFF/Latch/Shift or
LUT Select
1: DFF/Latch/Shift Register
834
835
Value=0 DFF/Latch Mode,
Value=1 Length=2,
Value=2 Length=3,
LUT3_9_DFF12_SHR12 Shift Register Length
836
Value=3 Length=4...
68
0: DFF
837
LUT3_9_DFF12_SHR12 DFF or Latch Select 1: Latch
(Only valid when LUT_SEL=0 and SHR_LEN=0)
0: Non-inverted
1: Inverted
0: DFF/SHR use nRST
1: DFF/SHR use nSET
(Only valid in DFF/Latch mode)
LUT3_9_DFF12_SHR12 Output Polarity Se-
838
839
lect
LUT3_9_DFF12_SHR12 nRST/nSet Select
0: Active Low
1: Active High
0: LUT
LUT3_9_DFF12_SHR12Set/Resetactivelevel
select
840
841
LUT4_0_DFF13_SHR13 DFF/Latch/Shift or
LUT Select
1: DFF/Latch/Shift Register
842
843
844
845
Value=0 DFF/Latch Mode,
Value=1 Length=2,
Value=2 Length=3,
LUT4_0_DFF13_SHR13 Shift Register Length
69
Value=3 Length=4...
0: DFF
846
847
848
849
LUT4_0_DFF13_SHR13 DFF or Latch Select 1: Latch
(Only valid when LUT_SEL=0 and SHR_LEN=0)
0: Non-inverted
1: Inverted
0: DFF/SHR use nRST
1: DFF/SHR use nSET
(Only valid in DFF/Latch mode)
LUT4_0_DFF13_SHR13 Output Polarity Se-
lect
LUT4_0_DFF13_SHR13 nRST/nSet Select
LUT4_0_DFF13_SHR13Set/Resetactivelevel 0: Active Low
select
1: Active High
6A
6A
850
851
852
853
854
855
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Datasheet
16-Jul-2021
Revision 2.0
141 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
856
857
858
859
860
861
862
863
864
865
866
867
868
869
870
871
6B
LUT2_3_PGEN0_DATA_LSB[7:0]
Pattern Data LSB
6C
6D
6E
LUT2_3_PGEN0_DATA_MSB[7:0]
Pattern Data MSB
MLT0_LUT4_1 bit[0]/DFF14 DFF or Latch Select:
0: LUT: LUT[0]; DFF: DFF function
1: LUT: LUT[0]; DFF: Latch function
MLT0_LUT4_1 bit[1]/DFF14 Output Select:
0: LUT: LUT[1]; DFF: Q output
1: LUT: LUT[1]; DFF: QB output
MLT0_LUT4_1 bit[2]/DFF14 Initial Polarity Select:
0: LUT: LUT[2]; DFF: Low
1: LUT: LUT[2]; DFF: High
MLT0_LUT4_1 bit[3]
MLT0_LUT4_1 bit[4]
MLT0_LUT4_1 bit[5]
MLT0_LUT4_1 bit[6]
MLT0_LUT4_1 bit[7]
MLT0_LUT4_1 bit[8]
MLT0_LUT4_1 bit[9]
MLT0_LUT4_1 bit[10]
MLT0_LUT4_1 bit[11]
MLT0_LUT4_1 bit[12]
MLT0_LUT4_1 bit[13]
MLT0_LUT4_1 bit[14]
MLT0_LUT4_1 bit[15]
872
873
874
875
876
877
878
879
880
881
882
883
884
885
886
887
LUT4_1_DFF14_CNTDLY0
Datasheet
16-Jul-2021
Revision 2.0
142 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
888
889
890
0000: Both edge Delay
0001: Falling edge Delay
0010: Rising edge Delay
0011: Prohibited
0100: Both edge One Shot
0101: Falling edge One Shot
0110: Rising edge One Shot
0111: Prohibited
1000: Both edge frequency detect
1001: Falling edge frequency detect
1010: Rising edge frequency detect
1011: Prohibited
CNTDLY0 Function and Edge mode selection
891
1100: Both edge reset CNT
1101: Falling edge reset CNT
1110: Rising edge reset CNT
1111: High level reset CNT
6F
MLT0_LUT4_1_DFF14 LUT/DFF Function Se- 0: LUT
892
893
894
lect
1: DFF/Latch
0: Default Output
1: Inverted Output
CNT0 CNT/DLY output Polarity selection
0: Normal
CNT0 DLY mode edge detection selection
CNT0 CNT mode synchronizer selection
1: Enable DLY mode edge detection
0: Bypass synchronizer
1: Enable synchronizer (after two DFFs)
895
896
00: Single LUT or DFF (DLY input is low)
LUT4_1_DFF14_CNTDLY0 Multi function se- 01: Single CNT/DLY (DLY output connect to LUT/DFF)
lection
10: CNT/DLY connected to LUT or DFF
11: LUT or DFF connected to CNT/DLY
897
898
00: DLY input from matrix A;
DLY output connected to LUT's In3 or DFF's D
01: DLY input from matrix B;
MLT0_LUT4_1_DFF14_CNTDLY0 CNT/DLY
and LUT or DFF connection
(only works when multi_func_sel_reg is 2'b10)
DLY output connected to LUT's In2 or DFF's nSET
10: DLY input from matrix C;
899
DLY output connected to LUT's In1 or DFF's nRST
11: DLY input from matrix D;
70
DLY output connected to LUT's In0 or DFF's CLK
900
901
902
903
00: Bypass the initial
01: Bypass the initial
10: Initial 0
CNT0 CNT/DLY initial value selection
11: Initial 1
00: Connected to LOW
01: Form matrix B
CNT0 CNT external clock selection
(only works when multi_func_sel_reg is not
2'b00)
10: From matrix C
11: Connected to LOW
Datasheet
16-Jul-2021
Revision 2.0
143 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
904
905
906
0000: RingOSC(25 MHz)
0001: RingOSC(25 MHz)/4
0010: RingOSC(25 MHz)/8
0011: RingOSC(25 MHz)/64
0100: RingOSC(25 MHz)/512
0101: LFOSC(2 kHz)
0110: LFOSC(2 kHz)/8
0111: LFOSC(2 kHz)/64
1000: LFOSC(2KkHz)/512
1001: LFOSC(2 kHz)/4096
1010: LFOSC(2 kHz)/32768
1011: LFOSC(2 kHz)/262144
1100: CNTx_END
CNT0 CNT/DLY clock source selection
907
71
1101: External
1110: Not used
1111: Not used
908
909
910
911
912
913
914
915
916
917
918
919
920
921
922
923
924
925
926
927
928
929
930
931
932
933
934
935
936
937
938
939
940
941
942
943
Reserved
Reserved
Reserved
Reserved
72
73
74
75
CNT0 MSB of CNT Data
Data [15:8]
Data [7:0]
Data [15:8]
Data [7:0]
CNT0 LSB of CNT Data
CNT0 MSB of Current CNT Value
CNT0 LSB of Current CNT Value
Datasheet
16-Jul-2021
Revision 2.0
144 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
0: Reset to 0
1: Set to data
0: Bypass synchronizer
1: Enable synchronizer (after two DFFs)
0: Bypass synchronizer
1: Enable synchronizer (after two DFFs)
0: Low
1: High
944
945
946
947
CNT0 CNT set or rest selection
CNT0 CNT up signal synchronizer selection
CNT0 CNT keep signal synchronizer selection
CNT0 Wake sleep power-down state selection
76
0: Default mode
948
CNT0 CNT wake sleep mode selection
CNT0 ACMP Wake/Sleep time selection
1: Wake-up sleep mode
(func_sel_reg configure as CNT mode)
0: Normal
1: Short Time
0: Disable
1: Enable
949
950
951
952
953
CNT0 Allow short wake-up signal
Reserved
0: Disable
1: Enable
0: Disable
1: Enable
ACMP0 wake sleep enable
ACMP1 wake sleep enable
954
955
956
957
958
959
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
77
MLT1_LUT3_10 bit[0]/DFF15 DFF or Latch Select:
0: LUT: LUT[0]; DFF: DFF function
960
961
962
963
1: LUT: LUT[0]; DFF: Latch function
MLT1_LUT3_10 bit[1]/DFF15 Output Select:
0: LUT: LUT[1]; DFF: Q output
1: LUT: LUT[1]; DFF: QB output
MLT1_LUT3_10 bit[2]/DFF15 Initial Polarity Select:
0: LUT: LUT[2]; DFF: Low
1: LUT: LUT[2]; DFF: High
MLT1_LUT3_10 bit[3]/DFF15 nRST or nSET Select:
0: LUT: LUT[3]; DFF: nRST
1: LUT: LUT[3]; DFF: nSET
78
LUT3_10_DFF15_CNTDLY1
964
965
966
967
MLT1_LUT3_10 bit[4]
MLT1_LUT3_10 bit[5]
MLT1_LUT3_10 bit[6]
MLT1_LUT3_10 bit[7]
Datasheet
16-Jul-2021
Revision 2.0
145 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
968
969
970
0000: both edge Delay
0001: falling edge Delay
0010: rising edge Delay
0011: both edge One Shot
0100: falling edge One Shot
0101: rising edge One Shot
0110: both edge freq detect
0111: falling edge freq detect
1000: rising edge freq detect
1001: both edge detect
1010: falling edge detect
1011: rising edge detect
1100: both edge reset CNT
1101: falling edge reset CNT
1110: rising edge reset CNT
1111: high level reset CNT
CNTDLY1 Function and Edge mode selection
971
79
MLT1_LUT3_10_DFF15 LUT/DFF Function
Select
0: LUT
972
973
974
1: DFF/Latch
0: Default Output
1: Inverted Output
0: Normal
1: Enable DLY mode edge detection
0: Bypass synchronizer
1: Enable synchronizer (after two DFFs)
00: Single LUT or DFF (DLY input is low)
CNT1 CNT/DLY output Polarity selection
CNT1 DLY mode edge detection selection
CNT1 CNT mode synchronizer selection
975
976
LUT3_10_DFF15_CNTDLY1 Multi function se- 01: Single CNT/DLY (DLY output connect to LUT/DFF)
lection
10: CNT/DLY connected to LUT or DFF
11: LUT or DFF connected to CNT/DLY
977
978
00: DLY input from matrix A;
DLY output connected to LUT's In2 or DFF's D
MLT1_LUT3_10_DFF15_CNTDLY1 CNT/DLY 01: DLY input from matrix B;
and LUT or DFF connection
DLY output connected to LUT's In1 or DFF's nSET/nRST
979
(only works when multi_func_sel_reg is 2'b10) 10: DLY input from matrix C;
7A
DLY output connected to LUT's In0 or DFF's CLK
11: Prohibited
980
981
00: Bypass the initial
01: Bypass the initial
10: Initial 0
CNT1 CNT/DLY initial value selection
11: Initial 1
982
983
984
985
986
Reserved
Reserved
0000: RingOSC(25 MHz)
0001: RingOSC(25 MHz)/4
0010: RingOSC(25 MHz)/8
0011: RingOSC(25 MHz)/64
0100: RingOSC(25 MHz)/512
0101: LFOSC(2 kHz)
0110: LFOSC(2 kHz)/8
0111: LFOSC(2 kHz)/64
1000: LFOSC(2 kHz)/512
1001: LFOSC(2 kHz)/4096
1010: LFOSC(2 kHz)/32768
1011:LFOSC(2 kHz)/262144
1100: CNTx_END
7B
CNT1 CNT/DLY clock source selection
987
1101: External
1110: Not used
1111: Not used
Datasheet
16-Jul-2021
Revision 2.0
146 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
988
989
990
991
Reserved
Reserved
Reserved
Reserved
7B
992
993
994
995
996
7C
CNT1 CNT Data
Data [7:0]
997
998
999
1000
1001
1002
1003
1004
1005
1006
1007
7D
CNT1 Current CNT Value
Data [7:0]
MLT2_LUT3_11 bit[0]/DFF16 DFF or Latch Select:
0: LUT: LUT[0]; DFF: DFF function
1008
1009
1010
1011
1: LUT: LUT[0]; DFF: Latch function
MLT2_LUT3_11 bit[1]/DFF16 Output Select:
0: LUT: LUT[1]; DFF: Q output
1: LUT: LUT[1]; DFF: QB output
MLT2_LUT3_11 bit[2]/DFF16 Initial Polarity Select:
0: LUT: LUT[2]; DFF: Low
1: LUT: LUT[2]; DFF: High
MLT2_LUT3_11 bit[3]/DFF16 nRST or nSET Select:
0: LUT: LUT[3]; DFF: nRST
1: LUT: LUT[3]; DFF: nSET
7E
LUT3_11_DFF16_CNTDLY2
1012
1013
1014
1015
MLT2_LUT3_11 bit[4]
MLT2_LUT3_11 bit[5]
MLT2_LUT3_11 bit[6]
MLT2_LUT3_11 bit[7]
Datasheet
16-Jul-2021
Revision 2.0
147 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1016
1017
1018
0000: both edge Delay
0001: falling edge delay
0010: rising edge delay
0011: both edge One Shot
0100: falling edge One Shot
0101: rising edge One Shot
0110: both edge freq detect
0111: falling edge freq detect
1000: rising edge freq detect
1001: both edge detect
1010: falling edge detect
1011: rising edge detect
1100: both edge reset CNT
1101: falling edge reset CNT
1110: rising edge reset CNT
1111: high level reset CNT
CNTDLY2 Function and Edge mode selection
1019
7F
MLT2_LUT3_11_DFF16 LUT/DFF Function
Select
0: LUT
1020
1021
1022
1: DFF/Latch
0: Default Output
1: Inverted Output
0: Normal
1: Enable DLY mode edge detection
0: Bypass synchronizer
1: Enable synchronizer (after two DFFs)
00: Single LUT or DFF (DLY input is low)
CNT2 CNT/DLY output Polarity selection
CNT2 DLY mode edge detection selection
CNT2 CNT mode synchronizer selection
1023
1024
LUT3_11_DFF16_CNTDLY2 Multi function se- 01: Single CNT/DLY (DLY output connect to LUT/DFF)
lection
10: CNT/DLY connected to LUT or DFF
11: LUT or DFF connected to CNT/DLY
1025
1026
00: DLY input from matrix A;
DLY output connected to LUT's In2 or DFF's D
MLT2_LUT3_11_DFF16_CNTDLY2 CNT/DLY 01: DLY input from matrix B;
and LUT or DFF connection
DLY output connected to LUT's In1 or DFF's nSET/nRST
1027
(only works when multi_func_sel_reg is 2'b10) 10: DLY input from matrix C;
80
DLY output connected to LUT's In0 or DFF's CLK
11: Prohibited
1027
1029
00: Bypass the initial
01: Bypass the initial
10: Initial 0
CNT2 CNT/DLY initial value selection
11: Initial 1
1030
1031
1032
1033
1034
Reserved
Reserved
0000: RingOSC(25 MHz)
0001: RingOSC(25 MHz)/4
0010: RingOSC(25 MHz)/8
0011: RingOSC(25 MHz)/64
0100: RingOSC(25MHz)/512
0101: LFOSC(2 kHz)
0110: LFOSC(2 kHz)/8
0111: LFOSC(2 kHz)/64
1000: LFOSC(2 kHz)/512
1001: LFOSC(2 kHz)/4096
1010: LFOSC(2 kHz)/32768
1011: LFOSC(2 kHz)/262144
1100: CNTx_END
81
Matrix Divider Ratio Control
1035
1101: External
1110: Not used
1111: Not used
Datasheet
16-Jul-2021
Revision 2.0
148 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1036
1037
1038
1039
1040
1041
1042
1043
1044
1045
1046
1047
1048
1049
1050
1051
1052
1053
1054
1055
Reserved
Reserved
Reserved
Reserved
81
82
CNT2 CNT Data
Data [7:0]
83
CNT2 Current CNT Value
Data [7:0]
MLT3_LUT3_12 bit[0]/DFF17 DFF or Latch Select:
0: LUT: LUT[0]; DFF: DFF function
1056
1057
1058
1059
1: LUT: LUT[0]; DFF: Latch function
MLT3_LUT3_12 bit[1]/DFF17 Output Select:
0: LUT: LUT[1]; DFF: Q output
1: LUT: LUT[1]; DFF: QB output
MLT3_LUT3_12 bit[2]/DFF17 Initial Polarity Select:
0: LUT: LUT[2]; DFF: Low
1: LUT: LUT[2]; DFF: High
MLT3_LUT3_12 bit[3]/DFF17 nRST or nSET Select:
0: LUT: LUT[3]; DFF: nRST
1: LUT: LUT[3]; DFF: nSET
84
LUT3_12_DFF17_CNTDLY3
1060
1061
1062
1063
MLT3_LUT3_12 bit[4]
MLT3_LUT3_12 bit[5]
MLT3_LUT3_12 bit[6]
MLT3_LUT3_12 bit[7]
Datasheet
16-Jul-2021
Revision 2.0
149 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1064
1065
1066
0000: both edge Delay
0001: falling edge Delay
0010: rising edge Delay
0011: both edge One Shot
0100: falling edge One Shot
0101: rising edge One Shot
0110: both edge freq detect
0111: falling edge freq detect
1000: rising edge freq detect
1001: both edge detect
1010: falling edge detect
1011: rising edge detect
1100: both edge reset CNT
1101: falling edge reset CNT
1110: rising edge reset CNT
1111: high level reset CNT
CNTDLY3 Function and Edge mode selection
1067
85
MLT3_LUT3_12_DFF17 LUT/DFF Function
Select
0: LUT
1068
1069
1070
1: DFF/Latch
0: Default Output
1: Inverted Output
0: Normal
1: Enable DLY mode edge detection
0: Bypass synchronizer
1: Enable synchronizer (after two DFFs)
00: Single LUT or DFF (DLY input is low)
CNT3 CNT/DLY output Polarity selection
CNT3 DLY mode edge detection selection
CNT3 CNT mode synchronizer selection
1071
1072
LUT3_12_DFF17_CNTDLY3 Multi function se- 01: Single CNT/DLY (DLY output connect to LUT/DFF)
lection
10: CNT/DLY connected to LUT or DFF
11: LUT or DFF connected to CNT/DLY
1073
1074
00: DLY input from matrix A;
DLY output connected to LUT's In2 or DFF's D
MLT3_LUT3_12_DFF17_CNTDLY3 CNT/DLY 01: DLY input from matrix B;
and LUT or DFF connection
DLY output connected to LUT's In1 or DFF's nSET/nRST
1075
(only works when multi_func_sel_reg is 2'b10) 10: DLY input from matrix C;
86
DLY output connected to LUT's In0 or DFF's CLK
11: Prohibited
1076
1077
00: Bypass the initial
01: Bypass the initial
10: Initial 0
CNT3 CNT/DLY initial value selection
11: Initial 1
1078
1079
Reserved
Reserved
Datasheet
16-Jul-2021
Revision 2.0
150 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1080
1081
1082
0000: RingOSC(25 MHz)
0001: RingOSC(25 MHz)/4
0010: RingOSC(25 MHz)/8
0011:RingOSC(25 MHz)/64
0100: RingOSC(25 MHz)/512
0101: LFOSC(2 kHz)
0110: LFOSC(2 kHz)/8
0111: LFOSC(2 kHz)/64
1000:LFOSC(2 kHz)/512
1001: LFOSC(2 kHz)/4096
1010: LFOSC(2 kHz)/32768
1011:LFOSC(2 kHz)/262144
1100: CNTx_END
CNT3 CNT/DLY clock source selection
1083
87
1101: External
1110: Not used
1111: Not used
1084
1085
1086
1087
1088
1089
1090
1091
1092
1093
1094
1095
1096
1097
1098
1099
1100
1101
1102
1103
Reserved
Reserved
Reserved
Reserved
88
CNT3 CNT Data
Data [7:0]
89
CNT3 Current CNT Value
Data [7:0]
MLT4_LUT3_13 bit[0]/DFF18 DFF or Latch Select:
0: LUT: LUT[0]; DFF: DFF function
1104
1105
1106
1107
1: LUT: LUT[0]; DFF: Latch function
MLT4_LUT3_13 bit[1]/DFF18 Output Select:
0: LUT: LUT[1]; DFF: Q output
1: LUT: LUT[1]; DFF: QB output
MLT4_LUT3_13 bit[2]/DFF18 Initial Polarity Select:
0: LUT: LUT[2]; DFF: Low
1: LUT: LUT[2]; DFF: High
MLT4_LUT3_13 bit[3]/DFF18 nRST or nSET Select:
0: LUT: LUT[3]; DFF: nRST
1: LUT: LUT[3]; DFF: nSET
MLT4_LUT3_13 bit[4]
MLT4_LUT3_13 bit[5]
MLT4_LUT3_13 bit[6]
MLT4_LUT3_13 bit[7]
8A
8A
LUT3_13_DFF18_CNTDLY4
LUT3_13_DFF18_CNTDLY4
1108
1109
1110
1111
Datasheet
16-Jul-2021
Revision 2.0
151 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1112
1113
1114
0000: both edge Delay
0001: falling edge Delay
0010: rising edge Delay
0011: both edge One Shot
0100: falling edge One Shot
0101: rising edge One Shot
0110: both edge freq detect
CNTDLY4 Function and Edge mode selection 0111: falling edge freq detect
1000: rising edge freq detect
1001: both edge detect
1115
1010: falling edge detect
1011: rising edge detect
1100: both edge reset CNT
8B
1101: falling edge reset CNT
1110: rising edge reset CNT
1111: high level reset CNT
MLT4_LUT3_13_DFF18 LUT/DFF Function
Select
0: LUT
1116
1117
1118
1: DFF/Latch
0: Default Output
1: Inverted Output
0: Normal
1: Enable DLY mode edge detection
0: Bypass synchronizer
1: Enable synchronizer (after two DFFs)
00: Single LUT or DFF (DLY input is low)
CNT4 CNT/DLY output Polarity selection
CNT4 DLY mode edge detection selection
CNT4 CNT mode synchronizer selection
1119
1120
LUT3_13_DFF18_CNTDLY4 Multi function se- 01: Single CNT/DLY (DLY output connect to LUT/DFF)
lection
10: CNT/DLY connected to LUT or DFF
11: LUT or DFF connected to CNT/DLY
00: DLY input from matrix A;
DLY output connected to LUT's In2 or DFF's D
01: DLY input from matrix B;
DLY output connected to LUT's In1 or DFF's nSET/nRST
10: DLY input from matrix C;
DLY output connected to LUT's In0 or DFF's CLK
11: Prohibited
1121
1122
MLT4_LUT3_13_DFF18_CNTDLY4 CNT/DLY
and LUT or DFF connection
(only works when multi_func_sel_reg is 2'b10)
1123
8C
1124
1125
00: Bypass the initial
01: Bypass the initial
10: Initial 0
CNT4 CNT/DLY initial value selection
11: Initial 1
1126
1127
Reserved
Reserved
Datasheet
16-Jul-2021
Revision 2.0
152 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1128
1129
1130
0000: RingOSC(25 MHz)
0001: RingOSC(25 MHz)/4
0010: RingOSC(25 MHz)/8
0011:RingOSC(25 MHz)/64
0100: RingOSC(25 MHz)/512
0101: LFOSC(2 kHz)
0110: LFOSC(2 kHz)/8
0111: LFOSC(2 kHz)/64
1000:LFOSC(2 kHz)/512
1001: LFOSC(2 kHz)/4096
1010: LFOSC(2 kHz)/32768
1011:LFOSC(2 kHz)/262144
1100: CNTx_END
CNT4 CNT/DLY clock source selection
1131
8D
1101: External
1110: Not used
1111: Not used
1132
1133
1134
1135
1136
1137
1138
1139
1140
1141
1142
1143
1144
1145
1146
1147
1148
1149
1150
1151
Reserved
Reserved
Reserved
Reserved
8E
CNT4 CNT Data
Data [7:0]
8F
CNT4 Current CNT Value
Data [7:0]
MLT5_LUT3_14 bit[0]/DFF19 DFF or Latch Select:
0: LUT: LUT[0]; DFF: DFF function
1152
1153
1154
1155
1: LUT: LUT[0]; DFF: Latch function
MLT5_LUT3_14 bit[1]/DFF19 Output Select:
0: LUT: LUT[1]; DFF: Q output
1: LUT: LUT[1]; DFF: QB output
MLT5_LUT3_14 bit[2]/DFF19 Initial Polarity Select:
0: LUT: LUT[2]; DFF: Low
1: LUT: LUT[2]; DFF: High
MLT5_LUT3_14 bit[3]/DFF19 nRST or nSET Select:
0: LUT: LUT[3]; DFF: nRST
1: LUT: LUT[3]; DFF: nSET
MLT5_LUT3_14 bit[4]
MLT5_LUT3_14 bit[5]
MLT5_LUT3_14 bit[6]
MLT5_LUT3_14 bit[7]
90
90
LUT3_14_DFF19_CNTDLY5
LUT3_14_DFF19_CNTDLY5
1156
1157
1158
1159
Datasheet
16-Jul-2021
Revision 2.0
153 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1160
1161
1162
0000: both edge Delay
0001: falling edge Delay
0010: rising edge Delay
0011: both edge One Shot
0100: falling edge One Shot
0101: rising edge One Shot
0110: both edge freq detect
0111: falling edge freq detect
1000: rising edge freq detect
1001: both edge detect
1010: falling edge detect
1011: rising edge detect
1100: both edge reset CNT
1101: falling edge reset CNT
1110: rising edge reset CNT
1111: high level reset CNT
CNTDLY5 Function and Edge mode selection
1163
91
MLT5_LUT3_14_DFF19 LUT/DFF Function
Select
0: LUT
1164
1165
1166
1: DFF/Latch
0: Default Output
1: Inverted Output
0: Normal
1: Enable DLY mode edge detection
0: Bypass synchronizer
1: Enable synchronizer (after two DFFs)
00: Single LUT or DFF (DLY input is low)
CNT5 CNT/DLY output Polarity selection
CNT5 DLY mode edge detection selection
CNT5 CNT mode synchronizer selection
1167
1168
LUT3_14_DFF19_CNTDLY5 Multi function se-
lection
01: Single CNT/DLY (DLY output connect to LUT/DFF)
10: CNT/DLY connected to LUT or DFF
11: LUT or DFF connected to CNT/DLY
1169
1170
00: DLY input from matrix A;
DLY output connected to LUT's In2 or DFF's D
MLT5_LUT3_14_DFF19_CNTDLY5 CNT/DLY 01: DLY input from matrix B;
and LUT or DFF connection
DLY output connected to LUT's In1 or DFF's nSET/nRST
1171
(only works when multi_func_sel_reg is 2'b10) 10: DLY input from matrix C;
92
DLY output connected to LUT's In0 or DFF's CLK
11: Prohibited
1172
1173
00: Bypass the initial
01: Bypass the initial
10: Initial 0
CNT5 CNT/DLY initial value selection
11: Initial 1
1174
1175
Reserved
Reserved
Datasheet
16-Jul-2021
Revision 2.0
154 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1176
1177
1178
0000: RingOSC(25 MHz)
0001: RingOSC(25 MHz)/4
0010: RingOSC(25 MHz)/8
0011:RingOSC(25 MHz)/64
0100: RingOSC(25 MHz)/512
0101: LFOSC(2 kHz)
0110: LFOSC(2 kHz)/8
0111: LFOSC(2 kHz)/64
1000:LFOSC(2 kHz)/512
1001: LFOSC(2 kHz)/4096
1010: LFOSC(2 kHz)/32768
1011:LFOSC(2 kHz)/262144
1100: CNTx_END
CNT5 CNT/DLY clock source selection
1179
93
1101: External
1110: Not used
1111: Not used
1180
1181
1182
1183
1184
1185
1186
1187
1188
1189
1190
1191
1192
1193
1194
1195
1196
1197
1198
1199
Reserved
Reserved
Reserved
Reserved
94
CNT5 CNT Data
Data [7:0]
95
CNT5 Current CNT Value
Data [7:0]
MLT6_LUT3_15 bit[0]/DFF20 DFF or Latch Select:
0: LUT: LUT[0]; DFF: DFF function
1200
1201
1202
1203
1: LUT: LUT[0]; DFF: Latch function
MLT6_LUT3_15 bit[1]/DFF20 Output Select:
0: LUT: LUT[1]; DFF: Q output
1: LUT: LUT[1]; DFF: QB output
MLT6_LUT3_15 bit[2]/DFF20 Initial Polarity Select:
0: LUT: LUT[2]; DFF: Low
1: LUT: LUT[2]; DFF: High
MLT6_LUT3_15 bit[3]/DFF20 nRST or nSET Select:
0: LUT: LUT[3]; DFF: nRST
1: LUT: LUT[3]; DFF: nSET
MLT6_LUT3_15 bit[4]
MLT6_LUT3_15 bit[5]
MLT6_LUT3_15 bit[6]
MLT6_LUT3_15 bit[7]
96
96
LUT3_15_DFF20_CNTDLY6
LUT3_15_DFF20_CNTDLY6
1204
1205
1206
1207
Datasheet
16-Jul-2021
Revision 2.0
155 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1208
1209
1210
0000: both edge Delay
0001: falling edge Delay
0010: rising edge Delay
0011: both edge One Shot
0100: falling edge One Shot
0101: rising edge One Shot
0110: both edge freq detect
0111: falling edge freq detect
1000: rising edge freq detect
1001: both edge detect
1010: falling edge detect
1011: rising edge detect
1100: both edge reset CNT
1101: falling edge reset CNT
1110: rising edge reset CNT
1111: high level reset CNT
CNTDLY6 Function and Edge mode selection
1211
97
MLT6_LUT3_15_DFF20 LUT/DFF Function
Select
0: LUT
1212
1213
1214
1: DFF/Latch
0: Default Output
1: Inverted Output
0: Normal
1: Enable DLY mode edge detection
0: Bypass synchronizer
1: Enable synchronizer (after two DFFs)
00: Single LUT or DFF (DLY input is low)
CNT6 CNT/DLY output Polarity selection
CNT6 DLY mode edge detection selection
CNT6 CNT mode synchronizer selection
1215
1216
LUT3_15_DFF20_CNTDLY6 Multi function se- 01: Single CNT/DLY (DLY output connect to LUT/DFF)
lection
10: CNT/DLY connected to LUT or DFF
11: LUT or DFF connected to CNT/DLY
00: DLY input from matrix A;
DLY output connected to LUT's In2 or DFF's D
01: DLY input from matrix B;
DLY output connected to LUT's In1 or DFF's nSET/nRST
10: DLY input from matrix C;
DLY output connected to LUT's In0 or DFF's CLK
11: Prohibited
1217
1218
MLT6_LUT3_15_DFF20_CNTDLY6 CNT/DLY
and LUT or DFF connection (only works when
multi_func_sel_reg is 2'b10)
1219
98
1220
1221
00: Bypass the initial
01: Bypass the initial
10: Initial 0
CNT6 CNT/DLY initial value selection
11: Initial 1
1222
1223
Reserved
Reserved
Datasheet
16-Jul-2021
Revision 2.0
156 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1224
1225
1226
0000: RingOSC(25 MHz)
0001: RingOSC(25 MHz)/4
0010: RingOSC(25 MHz)/8
0011:RingOSC(25 MHz)/64
0100: RingOSC(25 MHz)/512
0101: LFOSC(2 kHz)
0110: LFOSC(2 kHz)/8
0111: LFOSC(2 kHz)/64
1000:LFOSC(2 kHz)/512
1001: LFOSC(2 kHz)/4096
1010: LFOSC(2 kHz)/32768
1011:LFOSC(2 kHz)/262144
1100: CNTx_END
CNT6 CNT/DLY clock source selection
1227
99
1101: External
1110: Not used
1111: Not used
1228
1229
1230
1231
1232
1233
1234
1235
1236
1237
1238
1239
1240
1241
1242
1243
1244
1245
1246
1247
Reserved
Reserved
Reserved
Reserved
9A
CNT6 CNT Data
Data [7:0]
9B
CNT6 Current CNT Value
Data [7:0]
MLT7_LUT3_16 bit[0]/DFF21 DFF or Latch Select:
0: LUT: LUT[0]; DFF: DFF function
1248
1249
1250
1251
1: LUT: LUT[0]; DFF: Latch function
MLT7_LUT3_16 bit[1]/DFF21 Output Select:
0: LUT: LUT[1]; DFF: Q output
1: LUT: LUT[1]; DFF: QB output
MLT7_LUT3_16 bit[2]/DFF21 Initial Polarity Select:
0: LUT: LUT[2]; DFF: Low
1: LUT: LUT[2]; DFF: High
MLT7_LUT3_16 bit[3]/DFF21 nRST or nSET Select:
0: LUT: LUT[3]; DFF: nRST
1: LUT: LUT[3]; DFF: nSET
MLT7_LUT3_16 bit[4]
MLT7_LUT3_16 bit[5]
MLT7_LUT3_16 bit[6]
MLT7_LUT3_16 bit[7]
9C
9C
LUT3_16_DFF21_CNTDLY7
LUT3_16_DFF21_CNTDLY7
1252
1253
1254
1255
Datasheet
16-Jul-2021
Revision 2.0
157 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1256
1257
1258
0000: both edge Delay
0001: falling edge Delay
0010: rising edge Delay
0011: both edge One Shot
0100: falling edge One Shot
0101: rising edge One Shot
0110: both edge freq detect
0111: falling edge freq detect
1000: rising edge freq detect
1001: both edge detect
1010: falling edge detect
1011: rising edge detect
1100: both edge reset CNT
1101: falling edge reset CNT
1110: rising edge reset CNT
1111: high level reset CNT
CNTDLY7 Function and Edge mode selection
1259
9D
MLT7_LUT3_16_DFF21 LUT/DFF Function
Select
0: LUT
1260
1261
1262
1: DFF/Latch
0: Default Output
1: Inverted Output
0: Normal
1: Enable DLY mode edge detection
0: Bypass synchronizer
1: Enable synchronizer (after two DFFs)
00: Single LUT or DFF (DLY input is low)
CNT7 CNT/DLY output Polarity selection
CNT7 DLY mode edge detection selection
CNT7 CNT mode synchronizer selection
1263
1264
LUT3_16_DFF21_CNTDLY7 Multi function se- 01: Single CNT/DLY (DLY output connect to LUT/DFF)
lection
10: CNT/DLY connected to LUT or DFF
11: LUT or DFF connected to CNT/DLY
00: DLY input from matrix A;
DLY output connected to LUT's In2 or DFF's D
01: DLY input from matrix B;
DLY output connected to LUT's In1 or DFF's nSET/nRST
10: DLY input from matrix C;
DLY output connected to LUT's In0 or DFF's CLK
11: Prohibited
1265
1266
MLT7_LUT3_16_DFF21_CNTDLY7 CNT/DLY
and LUT or DFF connection
(only works when multi_func_sel_reg is 2'b10)
1267
9E
1268
1269
00: Bypass the initial
01: Bypass the initial
10: Initial 0
CNT7 CNT/DLY initial value selection
11: Initial 1
1270
1271
Reserved
Reserved
Datasheet
16-Jul-2021
Revision 2.0
158 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1272
1273
1274
0000: RingOSC(25 MHz)
0001: RingOSC(25 MHz)/4
0010: RingOSC(25 MHz)/8
0011:RingOSC(25 MHz)/64
0100: RingOSC(25 MHz)/512
0101: LFOSC(2 kHz)
0110: LFOSC(2 kHz)/8
0111: LFOSC(2kHz)/64
1000:LFOSC(2 kHz)/512
1001: LFOSC(2 kHz)/4096
1010: LFOSC(2 kHz)/32768
1011:LFOSC(2 kHz)/262144
1100: CNTx_END
CNT7 CNT/DLY clock source selection
1275
9F
1101: External
1110: Not used
1111: Not used
1276
1277
1278
1279
1280
1281
1282
1283
1284
1285
1286
1287
1288
1289
1290
1291
1292
1293
1294
1295
1296
Reserved
Reserved
Reserved
Reserved
A0
CNT7 CNT Data
Data [7:0]
A1
CNT7 Current CNT Value
Data [7:0]
00: Digital in without Schmitt Trigger
01: Digital in with Schmitt Trigger
10: Low voltage digital in mode
11: Reserved/Analog IO
GPI0 input mode configuration
1297
1298
1299
1300
1301
1302
1303
Reserved
Reserved
Reserved
A2
Reserved
Reserved
Datasheet
16-Jul-2021
Revision 2.0
159 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1304
00: Digital in without Schmitt Trigger
01: Digital in with Schmitt Trigger
10: Low voltage digital in mode
11: Reserved/Analog IO
GPIO0 input mode configuration
1305
1306
1307
1308
1309
Reserved
Reserved
Reserved
A3
00: Floating (disconnected)
01: 10 kΩ
GPIO0 Pull-up or Pull-down resistor selection
10: 100 kΩ
1310
11: 1 MΩ
0: Pull-down
1: Pull-up
0: enable
1: disable
1311
1312
GPIO0 Pull-up or Pull-down mode selection
GPIO0 I2C fast mode plus enable
0: disable (Output = HiZ)
1: enable
1313
GPIO0 Open-Drain mode enable
(Applicable only when i2c_en = 0 )
1314
1315
1316
1317
1318
1319
1320
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
A4
A5
A6
00: Digital in without Schmitt Trigger
01: Digital in with Schmitt Trigger
10: Low voltage digital in mode
11: Reserved/Analog IO
GPIO1 input mode configuration
1321
1322
1323
1324
1325
Reserved
Reserved
Reserved
00: Floating (disconnected)
01: 10 kΩ
10: 100 kΩ
11: 1 MΩ
0: Pull-down
1: Pull-up
0: enable
1: disable
0: disable (Output = HiZ)
1: enable
(Applicable only when i2c_en = 0)
GPIO1 Pull-up or Pull-down resistor selection
1326
1327
1328
GPIO1 Pull-up or Pull-down mode selection
GPIO1 I2C fast mode plus enable
1329
GPIO1 Open-Drain mode enable
1330
1331
1332
1333
1334
1335
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Datasheet
16-Jul-2021
Revision 2.0
160 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1336
00: Digital in without Schmitt Trigger
01: Digital in with Schmitt Trigger
10: Low voltage digital in mode
11: Reserved/Analog IO
00: 1x Push-Pull
01: 2x Push-Pull
10: 1x Open-Drain pull down
11: 2x Open-Drain pull down
GPIO2 input mode configuration
1337
1338
1339
GPIO2 output mode configuration
Reserved
A7
1340
1341
00: Floating (disconnected)
01: 10 kΩ
10: 100 kΩ
11: 1 MΩ
GPIO2 Pull-up or Pull-down resistor selection
1342
0: Pull-down
1: Pull-up
00: Digital in without Schmitt Trigger
01: Digital in with Schmitt Trigger
10: Low voltage digital in mode
11: Reserved/Analog IO
00: 1x Push-Pull
01: 2x Push-Pull
10: 1x Open-Drain pull down
11: 2x Open-Drain pull down
1343
1344
GPIO2 Pull-up or Pull-down mode selection
GPIO3 input mode configuration
1345
1346
1347
GPIO3 output mode configuration
Reserved
A8
1348
1349
00: Floating (disconnected)
01: 10 kΩ
10: 100 kΩ
11: 1 MΩ
GPIO3 Pull-up or Pull-down resistor selection
1350
0: Pull-down
1: Pull-up
00: Digital in without Schmitt Trigger
01: Digital in with Schmitt Trigger
10: Low voltage digital in mode
11: Reserved/Analog IO
00: 1x Push-Pull
01: 2x Push-Pull
10: 1x Open-Drain pull down
11: 2x Open-Drain pull down
1351
1352
GPIO3 Pull-up or Pull-down mode selection
GPIO4 input mode configuration
1353
1354
1355
GPIO4 output mode configuration
Reserved
A9
1356
1357
00: Floating (disconnected)
01: 10 kΩ
10: 100 kΩ
11: 1 MΩ
0: Pull-down
1: Pull-up
GPIO4 Pull-up or Pull-down resistor selection
1358
1359
GPIO4 Pull-up or Pull-down mode selection
Datasheet
16-Jul-2021
Revision 2.0
161 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1360
00: Digital in without Schmitt Trigger
01: Digital in with Schmitt Trigger
10: Low voltage digital in mode
11: Reserved/Analog IO
00: 1x Push-Pull
01: 2x Push-Pull
10: 1x Open-Drain pull down
11: 2x Open-Drain pull down
GPIO5 input mode configuration
1361
1362
1363
GPIO5 output mode configuration
Reserved
AA
1364
1365
00: Floating (disconnected)
01: 10 kΩ
10: 100 kΩ
11: 1 MΩ
GPIO5 Pull-up or Pull-down resistor selection
1366
0: Pull-down
1: Pull-up
00: Digital in without Schmitt Trigger
01: Digital in with Schmitt Trigger
10: Low voltage digital in mode
11: Reserved/Analog IO
00: 1x Push-Pull
01: 2x Push-Pull
10: 1x Open-Drain pull down
11: 2x Open-Drain pull down
1367
1368
GPIO5 Pull-up or Pull-down mode selection
GPIO6 input mode configuration
1369
1370
1371
GPIO6 output mode configuration
Reserved
AB
1372
1373
00: Floating (disconnected)
01: 10 kΩ
10: 100 kΩ
11: 1 MΩ
GPIO6 Pull-up or Pull-down resistor selection
1374
0: Pull-down
1: Pull-up
00: Digital in without Schmitt Trigger
01: Digital in with Schmitt Trigger
10: Low voltage digital in mode
11: Reserved/Analog IO
00: 1x Push-Pull
01: 2x Push-Pull
10: 1x Open-Drain pull down
11: 2x Open-Drain pull down
1375
1376
GPIO6 Pull-up or Pull-down mode selection
GPIO7 input mode configuration
1377
1378
1379
GPIO7 output mode configuration
Reserved
AC
1380
1381
00: Floating (disconnected)
01: 10 kΩ
10: 100 kΩ
11: 1 MΩ
0: Pull-down
1: Pull-up
GPIO7 Pull-up or Pull-down resistor selection
1382
1383
GPIO7 Pull-up or Pull-down mode selection
Datasheet
16-Jul-2021
Revision 2.0
162 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1384
00: Digital in without Schmitt Trigger
01: Digital in with Schmitt Trigger
10: Low voltage digital in mode
11: Reserved/Analog IO
00: 1x Push-Pull
01: 2x Push-Pull
10: 1x Open-Drain pull down
11: 2x Open-Drain pull down
GPIO8 input mode configuration
1385
1386
1387
GPIO8 output mode configuration
Reserved
AD
1388
1389
00: Floating (disconnected)
01: 10 kΩ
10: 100 kΩ
11: 1 MΩ
GPIO8 Pull-up or Pull-down resistor selection
1390
0: Pull-down
1: Pull-up
00: Digital in without Schmitt Trigger
01: Digital in with Schmitt Trigger
10: Low voltage digital in mode
11: Reserved/Analog IO
00: 1x Push-Pull
01: 2x Push-Pull
10: 1x Open-Drain pull down
11: 2x Open-Drain pull down
1391
1392
GPIO8 Pull-up or Pull-down mode selection
GPIO9 input mode configuration
1393
1394
1395
GPIO9 output mode configuration
Reserved
AE
1396
1397
00: Floating (disconnected)
01: 10 kΩ
10: 100 kΩ
11: 1 MΩ
GPIO9 Pull-up or Pull-down resistor selection
1398
0: Pull-down
1: Pull-up
00: Digital in without Schmitt Trigger
01: Digital in with Schmitt Trigger
10: Low voltage digital in mode
11: Reserved/Analog IO
00: 1x Push-Pull
01: 2x Push-Pull
10: 1x Open-Drain pull down
11: 2x Open-Drain pull down
1399
1400
GPIO9 Pull-up or Pull-down mode selection
GPIO10 input mode configuration
1401
1402
1403
GPIO10 output mode configuration
Reserved
AF
1404
1405
00: Floating (disconnected)
01: 10 kΩ
10: 100 kΩ
11: 1 MΩ
0: Pull-down
1: Pull-up
GPIO10 Pull-up or Pull-down resistor selection
1406
1407
GPIO10 Pull-up or Pull-down mode selection
Datasheet
16-Jul-2021
Revision 2.0
163 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1408
00: Digital in without Schmitt Trigger
01: Digital in with Schmitt Trigger
10: Low voltage digital in mode
11: Reserved/Analog IO
00: 1x Push-Pull
01: 2x Push-Pull
10: 1x Open-Drain pull down
11: 2x Open-Drain pull down
GPIO11 input mode configuration
1409
1410
1411
GPIO11 output mode configuration
Reserved
B0
1412
1413
00: Floating (disconnected)
01: 10 kΩ
10: 100 kΩ
11: 1 MΩ
GPIO11 Pull-up or Pull-down resistor selection
1414
0: Pull-down
1: Pull-up
00: Digital in without Schmitt Trigger
01: Digital in with Schmitt Trigger
10: Low voltage digital in mode
11: Reserved/Analog IO
00: 1x Push-Pull
01: 2x Push-Pull
10: 1x Open-Drain pull down
11: 2x Open-Drain pull down
1415
1416
GPIO11 Pull-up or Pull-down mode selection
GPIO12 input mode configuration
1417
1418
1419
GPIO12 output mode configuration
Reserved
B1
1420
1421
00: Floating (disconnected)
01: 10 kΩ
10: 100 kΩ
11: 1 MΩ
GPIO12 Pull-up or Pull-down resistor selection
1422
0: Pull-down
1: Pull-up
0: Turn on I2C open drain fast
1: Turn on I2C open drain slow
1423
1424
1425
GPIO12 Pull-up or Pull-down mode selection
Turn on I2C open drain fast or slow
0: Disable
IO Latching Enable During Host Write
1: Pad digital output latches at previous state
0: Disable
1: Enable
1426
1427
Fast pull up or pull down during power up
Pull pad to high when gpi_from_pad is high
(During power-up, GPIO Pull-up/down resistance will switch
to 2.6 kΩ initially and then it will switch to normal setting value)
0: Disable
1: Enable
B2
1428
1429
1430
1431
Reserved
Reserved
Reserved
Reserved
0: Non-inverted
1: Inverted
00: Rising Edge Detector
01: Falling Edge Detector
10: Both Edge Detector
11: Both Edge Delay
1432
1433
Filter/Edge Detector Output Polarity
Edge Detect Mode
1434
B3
0: Filter
1: Edge Detect
1435
Edge Detect Filter Function Select
1436
1437
1438
1439
Reserved
Reserved
Reserved
Reserved
Datasheet
16-Jul-2021
Revision 2.0
164 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1440
00: Rising Edge Detector
01: Falling Edge Detector
10: Both Edge Detector
11: Both Edge Delay
00: 125 ns
01: 250 ns
10: 375 ns
11: 500 ns
Edge Detect Mode
1441
1442
1443
Programmable Delay Selection
B4
1444
1445
1446
1447
Reserved
Reserved
Reserved
Reserved
0: Use OSC
1: Use External Clock Source
0: Matrix Down
1: Matrix On
0: Auto on by Multi-Func CNT
1: Always On
0: Disable
1: Enable
0: Disable
1: Enable
00: DIV1
01: DIV2
10: DIV4
11: DIV8
1448
1449
1450
1451
OSC0 Divider Clock Source
OSC0 Matrix power down or on selection
OSC0 turn on by register
OSC0 Divider Output0 control by matrix
OSC0 Divider Output1 control by matrix
B5
1452
1453
OSC0 Pre-Divider Selection
1454
1455
1456
Reserved
0: Use OSC
1: Use External Clock Source
OSC1 Divider Clock Source
0: Matrix Down
1: Matrix On
0: Auto on by Multi-Func CNT
1: Always On
0: Disable
1: Enable
1457
1458
1459
OSC1 Matrix power down or on selection
OSC1 turn on by register
B6
OSC1 Divider Output0 control by matrix
1460
1461
000: DIV1
001: DIV2
010: DIV4
011: DIV8
100: DIV12
101: DIV24
110: DIV48
111: DIV96
OSC1 Pre-Divider Selection
Reserved
B6
1462
1463
Datasheet
16-Jul-2021
Revision 2.0
165 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1464
1465
000: DIV1
001: DIV2
010: DIV3
011: DIV4
100: DIV8
101: DIV12
110: DIV24
111: DIV64
OSC0 OUT0 Post-Divider Selection
Reserved
1466
1467
1468
1469
B7
000: DIV1
001: DIV2
010: DIV3
011: DIV4
100: DIV8
101: DIV12
110: DIV24
111: DIV64
OSC0 OUT1 Post-Divider Selection
Reserved
1470
1471
1472
1473
000: DIV1
001: DIV2
010: DIV3
011: DIV4
100: DIV8
101: DIV12
110: DIV24
111: DIV64
OSC1 OUT0 Post-Divider Selection
1474
B8
1475
1476
1477
1478
1479
Reserved
Reserved
Reserved
Reserved
Reserved
0: no delay
1: 100 ns delay
1480
OSC1 Enable 100 ns delay
0: Enable
1: Disable
1481
1482
OSC1 Enable startup 1st edge function
00: OSC will have 1-2 output pulses after Power Down
01: When OSC Power Down signal comes, OSC generates
full output pulse and then stops
10: When OSC Power Down signal comes, OSC output goes
low immediately
11: When OSC Power Down signal comes, OSC output goes
low immediately
B9
OSC1 output synchronous type select
1483
0: 500 µs delay
1: no delay
1484
OSC0 Enable 500 µs delay
1485
1486
Reserved
00: OSC will have 1-2 output pulses after Power Down
01: When OSC Power Down signal comes, OSC generates
full output pulse and then stops
B9
10: When OSC Power Down signal comes, OSC output goes
low immediately
OSC0 output synchronous type select
1487
11: When OSC Power Down signal comes, OSC output goes
low immediately
Datasheet
16-Jul-2021
Revision 2.0
166 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1488
1489
1490
1491
1492
000000: 25 mV
000001: 50 mV
011110: 775 mV
011111: 800 mV
100000: 825 mV
100001: 850 mV
100010~111110: Reserved
111111: external Vref
(Default 25 mV)
ACMP0 Vref Selection
BA
1493
1494
00: 0 mV
01: 25 mV
10: 50 mV
11: 150 mV
ACMP0 Hysteresis selection
1495
1496
1497
1498
Reserved
Reserved
00: 1x
01: 0.5x
ACMPH0 Input Divider
10: Reserved
11: Reserved
1499
BB
0: Do not pull
1: Pull to VDD
(Pull positive input up to VDD
1500
ACMP0 Input tie to VDD Enable
)
1501
1502
1503
1504
1505
1506
1507
1508
Reserved
Reserved
Reserved
000000: 25 mV
000001: 50 mV
011110: 775 mV
011111: 800 mV
100000: 825 mV
100001: 850 mV
100010~111110: Reserved
111111: external Vref
(Default: 25 mV)
BC
BC
ACMPH1 Vref Selection
1509
1510
00: 0 mV
01: 25 mV
10: 50 mV
11: 150 mV
ACMP1 Hysteresis selection
1511
1512
1513
1514
Reserved
Reserved
00: 1x
01: 0.5x
ACMPH1 Input Divider
10: Reserved
11: Reserved
1515
0: Do not pull
1: Pull to input of ACMPH0
(Pull positive input of ACMPH1 as the input of ACMPH0)
0: Vinn of ACMPH1 from Pin
1: Vinn of ACMPH1 from Vinn of ACMPH0
BD
1516
1517
ACMPH1 Input tie to ACMPH0 Enable
ACMP1 External Vref Select
1518
1519
Reserved
Reserved
Datasheet
16-Jul-2021
Revision 2.0
167 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
0: Disable
1: Enable
0: Disable
1: Enable
0: Enable by reg_buf_en
1: Enable by tempsense_en
0: Disable and pass input voltage directly to output
1: Enable and apply UGB
0: Disable discharge PIN9, GPIO5
1: Enable discharge PIN9, GPIO5
00: Reserved (GND)
01: avref_acmph0
10: avref_acmph1
11: Tempsense Output
1520
1521
1522
1523
ACMP reference voltage generator enable
ACMP Buffer Enable
ACMP Buffer Enable Selection
ACMP Unit-gain-buffer enable
ACMP Buffer Discharge
BE
1524
1525
ACMP Buffer Select
1526
1527
1528
Reserved
0: Do not select tempsense output as buffer out
1: Select tempsense output as buffer out
ACMP Temp Sensor Enable
0: Enable by tempsense_en
1529
1530
1531
1532
ACMP Temp Sensor Enable Select
Pass buffer output to ACMPH1 input
Bandgap control
1: Enable by tempsense_en_matrix
0: Do not pass
1: Pass
0: BG always wake, non sleep
1: Sleep when w/s sleep
0: No change in ibias_en
1: Force ibias_en equal to bg_en
BF
Option of Ibias enable
1533
1534
1535
Reserved
Reserved
Reserved
0: With hysteresis 0.1V
1: without hysteresis
1536
VDD detector hysteresis selection
0: Enable BG Vref gen and ACMP at same time
1: Enable BG first. After BG_ok, enable Vrefgen;After BG_ok
and Vref_ok, enable ACMP
BG, Vref gen and ACMP wake up sequence se-
lection
1537
1538
1539
1540
1541
1542
1543
1544
1545
1546
1547
1548
1549
1550
1551
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
C0
C1
Datasheet
16-Jul-2021
Revision 2.0
168 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1552
1553
1554
1555
1556
1557
1558
1559
1560
1561
1562
1563
1564
1565
1566
1567
1568
1569
1570
1571
1572
1573
1574
1575
1576
1577
1578
1579
1580
1581
1582
1583
1584
1585
1586
1587
1588
1589
1590
1591
1592
1593
1594
1595
1596
1597
1598
1599
C2
Reserved
Reserved
Reserved
Reserved
C3
C4
C5
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
C6
C6
Reserved
Reserved
Reserved
Reserved
Reserved
C7
Reserved
Reserved
Reserved
Reserved
Datasheet
16-Jul-2021
Revision 2.0
169 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1600
1601
1602
1603
1604
1605
1606
1607
1608
1609
1610
1611
1612
1613
1614
1615
1616
1617
1618
1619
1620
1621
1622
1623
1624
1625
1626
1627
1628
1629
1630
1631
1632
1633
1634
1635
1636
1637
1638
1639
1640
1641
1642
1643
1644
1645
1646
1647
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
C8
C9
C9
CA
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
CB
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
CC
CC
CD
Datasheet
16-Jul-2021
Revision 2.0
170 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1648
1649
1650
1651
1652
1653
1654
1655
1656
1657
1658
1659
1660
1661
1662
1663
1664
1665
1666
1667
1668
1669
1670
1671
1672
1673
1674
1675
1676
1677
1678
1679
1680
1681
1682
1683
1684
1685
1686
1687
1688
1689
1690
1691
1692
1693
1694
1695
Reserved
CE
Reserved
Reserved
Reserved
Reserved
CF
D0
D1
D2
D3
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Datasheet
16-Jul-2021
Revision 2.0
171 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1696
1697
1698
1699
1700
1701
1702
1703
1704
1705
1706
1707
1708
1709
1710
1711
1712
1713
1714
1715
1716
1717
1718
1719
1720
Reserved
D4
Reserved
Reserved
Reserved
D5
Reserved
D6
Reserved
Registers Read Protection Register.
Valid only when PROTECT_EN is 1
00: 1K register data is unprotected for read
01: 1K register data is partly protected for read
10: 1K register data is fully protected for read
11: 1K register data is fully protected for read
Registers Write Protection Register.
Valid only when PROTECT_EN is 1
00: 1K register data is unprotected for write
01: 1K register data is partly protected for write
10: 1K register data is fully protected for write
11: 1K register data is fully protected for write
RPR
1721
1722
1723
D7
WPR
1724
1725
1726
1727
1728
1729
1730
1731
1732
1733
1734
1735
Reserved
Reserved
Reserved
D8
Reserved
Datasheet
16-Jul-2021
Revision 2.0
172 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1736
1737
1738
1739
1740
1741
1742
1743
1744
1745
1746
1747
1748
1749
1750
1751
1752
1753
1754
1755
1756
1757
1758
1759
1760
1761
1762
1763
1764
1765
1766
1767
1768
1769
1770
1771
1772
1773
1774
1775
1776
1777
1778
1779
1780
1781
1782
1783
D9
Reserved
DA
DB
DC
DD
DE
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Datasheet
16-Jul-2021
Revision 2.0
173 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1784
1785
1786
1787
1788
1789
1790
1791
1792
1793
1794
1795
1796
1797
1798
1799
1800
1801
1802
1803
1804
1805
1806
1807
1808
1809
1810
1811
1812
1813
1814
1815
1816
1817
1818
1819
1820
1821
1822
1823
1824
1825
1826
1827
1828
1829
1830
1831
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
DF
E0
E1
E2
E3
E4
Datasheet
16-Jul-2021
Revision 2.0
174 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1832
1833
1834
1835
1836
1837
1838
1839
1840
1841
1842
1843
1844
1845
1846
1847
1848
1849
1850
1851
1852
1853
1854
1855
1856
1857
1858
1859
1860
1861
1862
1863
1864
1865
1866
1867
1868
1869
1870
1871
1872
1873
1874
1875
1876
1877
1878
1879
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
E5
E6
E7
E8
E9
EA
Datasheet
16-Jul-2021
Revision 2.0
175 of 191
CFR0011-120-00
© 2021 Dialog Semiconductor
SLG47502/03
Preliminary
Low Voltage GreenPAK Programmable
Mixed-Signal Matrix
Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1880
1881
1882
1883
1884
1885
1886
1887
1888
1889
1890
1891
1892
1893
1894
1895
1896
1897
1898
1899
1900
1901
1902
1903
1904
1905
1906
1907
1908
1909
1910
1911
1912
1913
1914
1915
1916
1917
1918
1919
1920
1921
1922
1923
1924
1925
1926
1927
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
EB
EC
ED
EE
EF
F0
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Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1928
1929
1930
1931
1932
1933
1934
1935
1936
1937
1938
1939
1940
1941
1942
1943
1944
1945
1946
1947
1948
1949
1950
1951
1952
1953
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
F1
F2
F3
1954
Reserved
1955
1956
1957
1958
1959
1960
1961
1962
1963
1964
1965
1966
1967
1968
1969
1970
1971
1972
1973
1974
1975
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
F4
F5
F6
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Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
1976
1977
1978
1979
1980
1981
1982
1983
1984
1985
1986
1987
1988
1989
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
F7
F8
F9
FA
FB
FC
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Table 37: Register Map (Continued)
Address
Signal Function
Register Bit Definition
Register
Bit
Byte
2024
2025
2026
2027
2028
2029
2030
2031
2032
2033
2034
2035
2036
2037
2038
2039
2040
2041
2042
2043
2044
2045
2046
2047
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
FD
FE
FF
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18 Package Top Marking Definitions
18.1 STQFN 12L 1.6 MM X 1.6 MM X 0.55 MM 0.4P FC
PPP
WWR
NN
Part Code
Date Code +
Revision Code
Pin 1 Identifier
Serial Number Code
18.2 MSTQFN 16L 1.6 MM X 1.6 MM X 0.55 MM 0.4P
PPP
WWR
NN
Part Code
Date Code +
Revision Code
Pin 1 Identifier
Serial Number Code
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19 Package Information
19.1 PACKAGE OUTLINES FOR STQFN 12L 1.6 MM X 1.6 MM X 0.55 MM 0.4P FC PACKAGE
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19.2 PACKAGE OUTLINES FOR MSTQFN 16L 1.6 MM X 1.6 MM X 0.55 MM 0.4P PACKAGE
Bottom View
Side View
Top View
Controlling Dimensions: mm
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19.3 MOISTURE SENSITIVITY LEVEL
The Moisture Sensitivity Level (MSL) is an indicator for the maximum allowable time period (floor lifetime) in which a moisture
sensitive plastic device, once removed from the dry bag, can be exposed to an environment with a specified maximum
temperature and a maximum relative humidity before the solder reflow process. The MSL classification is defined in Table 38.
For detailed information on MSL levels refer to the IPC/JEDEC standard J-STD-020, which can be downloaded from http://
www.jedec.org.
The <PACKAGE_NAME> package is qualified for MSL <n>.
Table 38: MSL Classification
MSL Level
Floor Lifetime
Conditions
MSL 4
MSL 3
MSL 2A
MSL 2
MSL 1
72 hours
168 hours
4 weeks
1 year
30 °C / 60 % RH
30 °C / 60 % RH
30 °C / 60 % RH
30 °C / 60 % RH
30 °C / 60 % RH
Unlimited
19.4 STQFN HANDLING
Be sure to handle STQFN package only in a clean, ESD-safe environment. Tweezers or vacuum pick-up tools are suitable for
handling. Do not handle STQFN package with fingers as this can contaminate the package pins and interface with solder reflow.
19.5 SOLDERING INFORMATION
Refer to the IPC/JEDEC standard J-STD-020 for relevant soldering information. This document can be downloaded from http://
www.jedec.org.
20 Ordering Information
The ordering number consists of the part number followed by a suffix indicating the packing method. For details and availability,
please consult Dialog Semiconductor’s customer support portal or your local sales representative.
Part Number
SLG47502V
Type
12-pin STQFN
SLG47502VTR
SLG47503M
SLG47503MTR
12-pin STQFN - Tape and Reel (3k units)
16-pin MSTQFN
16-pin MSTQFN - Tape and Reel (3k units)
20.1 TAPE AND REEL SPECIFICATIONS
Max Units
Leader (min)
Length
Trailer (min)
Length
Nominal
# of
Pins
Reel &
Hub Size
(mm)
Tape Part
Width Pitch
(mm) (mm)
Package Type
Package Size
(mm)
per Reel per Box
Pockets
Pockets
(mm)
(mm)
STQFN 12L
1.6 mm x 1.6 mm x
0.55 mm, 0.4P FCA
Green
12
1.6x1.6x0.55
1.6x1.6x0.55
3000
3000
3000
3000
178/60
178/60
100
100
400
100
100
400
8
8
4
4
MSTQFN 16L
1.6 mm x 1.6 mm x
0.55 mm, 0.4P FCA
Green
16
400
400
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20.2 CARRIER TAPE DRAWING AND DIMENSIONS
Index Hole Index Hole
PocketBTMPocketBTM Pocket IndexHole Pocket Index Hole
Tape
Width
(mm)
to Tape
Edge
(mm)
to Pocket
Center
(mm)
Length
(mm)
Width
(mm)
Depth
(mm)
Pitch
(mm)
Pitch Diameter
Package Type
(mm)
P1
(mm)
D0
A0
B0
K0
P0
E
F
W
STQFN 12L
1.6 mm x 1.6 mm x
1.80
1.80
0.70
4
4
4
1.5
1.5
1.75
3.5
8
0.55 mm, 0.4P FCA ±0.05 mm ±0.05 mm ±0.05 mm
Green
MSTQFN 16L
1.6 mm x 1.6 mm x
1.80
1.80
0.70
4
1.75
3.5
8
0.55 mm, 0.4P FCA ±0.05 mm ±0.05 mm ±0.05 mm
Green
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21 Layout Guidelines
21.1 STQFN 12L 1.6 MM X 1.6 MM X 0.55 MM 0.4P FC PACKAGE
Units: µm
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21.2 MSTQFN 16L 1.6 MM X 1.6 MM X 0.55 MM 0.4P PACKAGE
Unit: µm
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Mixed-Signal Matrix
Glossary
A
ACK
Acknowledge bit
ACMP
ACMPH
ACMPL
Analog Comparator
Analog Comparator High Speed
Analog Comparator Low Power
B
BG
Bandgap
C
CLK
CMO
CNT
Clock
Connection matrix output
Counter
D
DFF
DLY
D Flip-Flop
Delay
E
ESD
EV
Electrostatic discharge
End Value
F
FSM
Finite State Machine
G
GPI
GPIO
GPO
General Purpose Input
General Purpose Input/Output
General Purpose Output
I
IN
IO
Input
Input/Output
L
LPF
LSB
LUT
Low Pass Filter
Least Significant Bit
Look Up Table
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LV
Low Voltage
M
MSB
MUX
Most Significant Bit
Multiplexer
N
NPR
nRST
NVM
Non-Volatile Memory Read/Write/Erase Protection
Reset
Non-Volatile Memory
O
OD
Open-Drain
OE
Output Enable
Oscillator
OSC
OTP
OUT
One Time Programmable
Output
P
PD
Power-down
PGen
POR
PP
Pattern Generator
Power-On Reset
Push-Pull
PWR
P DLY
Power
Programmable Delay
R
R/W
Read/Write
S
SCL
SDA
SLA
SMT
SV
I2C Clock Input
I2C Data Input/Output
Slave Address
With Schmitt Trigger
nSET Value
T
TS
Temperature Sensor
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V
Vref
Voltage Reference
W
WOSMT
WS
Without Schmitt Trigger
Wake and Sleep Controller
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Revision History
Revision
Date
Description
2.0
16-Jul-2021
Preliminary version
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Status Definitions
Revision Datasheet Status
Product Status
Definition
1.<n>
Target
Development
This datasheet contains the design specifications for product development.
Specifications may change in any manner without notice.
2.<n>
Preliminary
Qualification
Production
This datasheet contains the specifications and preliminary characterization
data for products in pre-production. Specifications may be changed at any
time without notice in order to improve the design.
3.<n>
4.<n>
Final
This datasheet contains the final specifications for products in volume
production. The specifications may be changed at any time in order to
improve the design, manufacturing and supply. Major specification
changes are communicated via Customer Product Notifications. Datasheet
changes are communicated via www.dialog-semiconductor.com.
Obsolete
Archived
This datasheet contains the specifications for discontinued products. The
information is provided for reference only.
Disclaimer
Unless otherwise agreed in writing, the Dialog Semiconductor products (and any associated software) referred to in this document are not designed, authorized or warranted
to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of a Dialog Semiconductor product (or
associated software) can reasonably be expected to result in personal injury, death or severe property or environmental damage. Dialog Semiconductor and its suppliers
accept no liability for inclusion and/or use of Dialog Semiconductor products (and any associated software) in such equipment or applications and therefore such inclusion
and/or use is at the customer's own risk.
Information in this document is believed to be accurate and reliable. However, Dialog Semiconductor does not give any representations or warranties, express or implied, as
to the accuracy or completeness of such information. Dialog Semiconductor furthermore takes no responsibility whatsoever for the content in this document if provided by any
information source outside of Dialog Semiconductor.
Dialog Semiconductor reserves the right to change without notice the information published in this document, including, without limitation, the specification and the design of
the related semiconductor products, software and applications. Notwithstanding the foregoing, for any automotive grade version of the device, Dialog Semiconductor
reserves the right to change the information published in this document, including, without limitation, the specification and the design of the related semiconductor products,
software and applications, in accordance with its standard automotive change notification process.
Applications, software, and semiconductor products described in this document are for illustrative purposes only. Dialog Semiconductor makes no representation or warranty
that such applications, software and semiconductor products will be suitable for the specified use without further testing or modification. Unless otherwise agreed in writing,
such testing or modification is the sole responsibility of the customer and Dialog Semiconductor excludes all liability in this respect.
Nothing in this document may be construed as a license for customer to use the Dialog Semiconductor products, software and applications referred to in this document. Such
license must be separately sought by customer with Dialog Semiconductor.
All use of Dialog Semiconductor products, software and applications referred to in this document are subject to Dialog Semiconductor's Standard Terms and Conditions
of Sale, available on the company website (www.dialog-semiconductor.com) unless otherwise stated.
Dialog, Dialog Semiconductor and the Dialog logo are trademarks of Dialog Semiconductor Plc or its subsidiaries. All other product or service names and marks are
the property of their respective owners.
© 2021 Dialog Semiconductor. All rights reserved.
RoHS Compliance
Dialog Semiconductor's suppliers certify that its products are in compliance with the requirements of Directive 2011/65/EU of the European Parliament on the restriction
of the use of certain hazardous substances in electrical and electronic equipment. RoHS certificates from our suppliers are available on request.
Contacting Dialog Semiconductor
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Phone: +44 1793 757700
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Phone: +1 408 845 8500
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Phone: +852 2607 4271
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Phone: +86 755 2981 3669
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Phone: +49 7021 805-0
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191
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