2DD2661-13 [DIODES]

LOW VCE(SAT) NPN SURFACE MOUNT TRANSISTOR; 低VCE ( SAT) NPN表面贴装晶体管
2DD2661-13
型号: 2DD2661-13
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

LOW VCE(SAT) NPN SURFACE MOUNT TRANSISTOR
低VCE ( SAT) NPN表面贴装晶体管

晶体 晶体管
文件: 总4页 (文件大小:83K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
2DD2661  
LOW VCE(SAT) NPN SURFACE MOUNT TRANSISTOR  
Please click here to visit our online spice models database.  
Features  
Mechanical Data  
Epitaxial Planar Die Construction  
Case: SOT89-3L  
Case Material: Molded Plastic, "Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020D  
Terminals: Finish — Matte Tin annealed over Copper leadframe  
(Lead Free Plating). Solderable per MIL-STD-202, Method 208  
Marking Information: See Page 3  
Ordering Information: See Page 3  
Weight: 0.072 grams (approximate)  
Ideally Suited for Automated Assembly Processes  
Ideal for Medium Power Switching or Amplification Applications  
Complementary PNP Type Available (2DB1697)  
Lead Free By Design/RoHS Compliant (Note 1)  
"Green" Device (Note 2)  
TOR  
LLEC  
CO  
2,4  
3 E  
2 C  
1 B  
C 4  
T
1
ASE  
B
3
EMITTER  
VI  
EW  
OP  
Top View  
Device Schematic  
Pin Out Configuration  
Maximum Ratings @TA = 25°C unless otherwise specified  
Characteristic  
Collector-Base Voltage  
Collector-Emitter Voltage  
Emitter-Base Voltage  
Symbol  
VCBO  
VCEO  
VEBO  
ICM  
Value  
Unit  
V
V
V
A
15  
12  
6
Peak Pulse Current  
4
Continuous Collector Current  
2
A
IC  
Thermal Characteristics  
Characteristic  
Power Dissipation (Note 3) @ TA = 25°C  
Symbol  
PD  
Value  
0.9  
Unit  
W
139  
°C/W  
W
Thermal Resistance, Junction to Ambient Air (Note 3) @ TA = 25°C  
Power Dissipation (Note 4) @ TA = 25°C  
Rθ  
JA  
2
PD  
62.5  
°C/W  
°C  
Thermal Resistance, Junction to Ambient Air (Note 4) @ TA = 25°C  
Operating and Storage Temperature Range  
Rθ  
JA  
-55 to +150  
TJ, TSTG  
Electrical Characteristics @TA = 25°C unless otherwise specified  
Characteristic  
OFF CHARACTERISTICS  
Symbol  
Min  
Typ  
Max  
Unit  
Conditions  
Collector-Base Breakdown Voltage  
Collector-Emitter Breakdown Voltage (Note 5)  
Emitter-Base Breakdown Voltage  
Collector Cut-Off Current  
15  
12  
6
V
V
V(BR)CBO  
V(BR)CEO  
V(BR)EBO  
ICBO  
I
I
I
C = 10μA, IE = 0  
C = 1mA, IB = 0  
V
E = 10μA, IC = 0  
0.1  
μA  
μA  
VCB = 15V, IE = 0  
VEB = 6V, IC = 0  
Emitter Cut-Off Current  
0.1  
IEBO  
ON CHARACTERISTICS (Note 5)  
Collector-Emitter Saturation Voltage  
DC Current Gain  
180  
680  
mV  
VCE(SAT)  
hFE  
270  
IC = 1A, IB = 50mA  
VCE = 2V, IC = 200mA  
SMALL SIGNAL CHARACTERISTICS  
V
CB = 10V, IE = 0,  
f = 1MHz  
CE = 2V, IC = 100mA,  
f = 100MHz  
Output Capacitance  
26  
pF  
Cobo  
fT  
V
Current Gain-Bandwidth Product  
170  
MHz  
Notes:  
1. No purposefully added lead.  
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.  
3. Device mounted on FR-4 PCB with minimum recommended pad layout.  
4. Device mounted on FR-4 PCB with 1 inch2 copper pad layout.  
5. Measured under pulsed conditions. Pulse width = 300μs. Duty cycle 2%.  
1 of 4  
www.diodes.com  
December 2008  
© Diodes Incorporated  
2DD2661  
Document number: DS31635 Rev. 2 - 2  
2DD2661  
2.0  
1.6  
1.2  
0.8  
2.5  
2.0  
I
= 5mA  
= 4mA  
= 3mA  
B
I
B
1.5  
1.0  
I
B
I
= 2mA  
= 1mA  
B
0.4  
0
0.5  
0
I
B
0
4
8
12  
16  
20  
0
25  
TA, AMBIENT TEMPERATURE (°C)  
Fig. 1 Power Dissipation vs. Ambient Temperature  
50  
150  
100  
125  
75  
VCE, COLLECTOR-EMITTER VOLTAGE (V)  
Fig. 2 Typical Collector Current  
vs. Collector-Emitter Voltage  
1,000  
1
T
= 150°C  
A
I
/I = 20  
B
C
T
= 85°C  
= 25°C  
A
T
A
T
= 150°C  
A
0.1  
0.01  
T
= -55°C  
A
T
= 85°C  
A
T
= 25°C  
A
100  
T
= -55°C  
A
V
= 2V  
CE  
0.001  
10  
1
10  
IC, COLLECTOR CURRENT (mA)  
Fig. 3 Typical DC Current Gain vs. Collector Current  
100  
1,000  
10,000  
1
10  
100  
1,000  
10,000  
IC, COLLECTOR CURRENT (mA)  
Fig. 4 Typical Collector-Emitter Saturation Voltage  
vs. Collector Current  
1.2  
1.0  
0.8  
1.2  
1.0  
V
= 2V  
I
/I = 20  
B
CE  
C
0.8  
0.6  
0.4  
T
T
= -55°C  
A
T
= -55°C  
A
0.6  
0.4  
= 25°C  
= 85°C  
A
T
T
= 25°C  
= 85°C  
= 150°C  
A
T
A
A
T
= 150°C  
A
0.2  
0
T
A
0.2  
1
1
10  
100  
1,000  
10,000  
10  
100  
1,000  
10,000  
IC, COLLECTOR CURRENT (mA)  
IC, COLLECTOR CURRENT (mA)  
Fig. 5 Typical Base-Emitter Turn-On Voltage  
vs. Collector Current  
Fig. 6 Typical Base-Emitter Saturation Voltage  
vs. Collector Current  
2 of 4  
www.diodes.com  
December 2008  
© Diodes Incorporated  
2DD2661  
Document number: DS31635 Rev. 2 - 2  
2DD2661  
1,000  
100  
10  
1,000  
100  
f = 1MHz  
C
ibo  
10  
1
V
= 2V  
CE  
C
obo  
f = 100MHz  
0.1  
1
10  
100  
0
10 20 30 40 50 60 70 80 90 100  
IC, COLLECTOR CURRENT (mA)  
VR, REVERSE VOLTAGE (V)  
Fig. 7 Typical Capacitance Characteristics  
Fig. 8 Typical Gain-Bandwidth Product  
vs. Collector Current  
Ordering Information (Note 6)  
Part Number  
Case  
Packaging  
2DD2661-13  
SOT89-3L  
2500/Tape & Reel  
Notes:  
6. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.  
Marking Information  
2661 = Product Type Marking Code  
YWW  
2661  
YWW = Date Code Marking  
Y = Last digit of year (ex: 8 = 2008)  
WW = Week code 01 - 52  
Package Outline Dimensions  
D1  
SOT89-3L  
C
Dim Min Max Typ  
A
B
B1  
C
D
D1  
E
1.40 1.60 1.50  
0.45 0.55 0.50  
0.37 0.47 0.42  
0.35 0.43 0.38  
4.40 4.60 4.50  
1.50 1.70 1.60  
2.40 2.60 2.50  
E
H
L
B
e
B1  
e
1.50  
H
L
3.95 4.25 4.10  
0.90 1.20 1.05  
A
All Dimensions in mm  
D
3 of 4  
www.diodes.com  
December 2008  
© Diodes Incorporated  
2DD2661  
Document number: DS31635 Rev. 2 - 2  
2DD2661  
Suggested Pad Layout  
X1  
Dimensions Value (in mm)  
X1  
X2  
X3  
Y1  
Y2  
Y3  
C
1.7  
0.9  
0.4  
2.7  
1.3  
1.9  
3.0  
Y1  
X3  
X2  
Y2  
Y3  
C
IMPORTANT NOTICE  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product  
described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall  
assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,  
harmless against all damages.  
LIFE SUPPORT  
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written  
approval of the President of Diodes Incorporated.  
4 of 4  
www.diodes.com  
December 2008  
© Diodes Incorporated  
2DD2661  
Document number: DS31635 Rev. 2 - 2  

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