2N7002DW_17 [DIODES]

DUAL N-CHANNEL ENHANCEMENT MODE MOSFET;
2N7002DW_17
型号: 2N7002DW_17
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

DUAL N-CHANNEL ENHANCEMENT MODE MOSFET

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中文:  中文翻译
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2N7002DW  
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features  
Dual N-Channel MOSFET  
I
D max  
V(BR)DSS  
RDS(ON) max  
TA = +25°C  
Low On-Resistance  
Low Gate Threshold Voltage  
60V  
0.23A  
7.5@ VGS = 5V  
Low Input Capacitance  
Fast Switching Speed  
Description  
Low Input/Output Leakage  
This MOSFET has been designed to minimize the on-state resistance  
(RDS(ON)) and yet maintain superior switching performance, making it  
ideal for high efficiency power management applications.  
Ultra-Small Surface Mount Package  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Notes 3 & 4)  
Qualified to AEC-Q101 Standards for High Reliability  
Applications  
Mechanical Data  
Motor Control  
Power Management Functions  
Case: SOT363  
Case Material: Molded Plastic. “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe  
(Lead Free Plating). Solderable per MIL-STD-202, Method 208  
Terminal Connections: See Diagram  
Weight: 0.006 grams (approximate)  
SOT363  
D2  
G1  
S1  
S2  
G2  
D1  
Top View  
Top View  
Internal Schematic  
Ordering Information (Note 5)  
Part Number  
2N7002DW-7-F  
2N7002DWQ-7-F  
2N7002DW-13-F  
2N7002DWQ-13-F  
Compliance  
Standard  
Automotive  
Standard  
Case  
Packaging  
SOT363  
SOT363  
SOT363  
SOT363  
3,000/Tape & Reel  
3,000/Tape & Reel  
10,000/Tape & Reel  
10,000/Tape & Reel  
Automotive  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.  
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"  
and Lead-free.  
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date  
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.  
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html.  
Marking Information  
K72 = Product Type Marking Code  
YM = Date Code Marking for SAT (Shanghai Assembly/ Test site)  
YM = Date Code Marking for CAT (Chengdu Assembly/ Test site)  
Y or Y = Year (ex: A = 2013)  
YM  
2 K 7  
YM  
2 K 7  
K72  
Y M  
K72  
Y M  
M = Month (ex: 9 = September)  
Date Code Key  
Year  
1998  
1999  
2000  
2001  
2002  
2003  
2004  
2011  
2012  
2013  
2014  
2015  
2016  
2017  
Code  
J
K
L
M
N
P
R
Y
Z
A
B
C
D
E
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
1 of 5  
www.diodes.com  
November 2013  
© Diodes Incorporated  
2N7002DW  
Document number: DS30120 Rev. 16 - 2  
2N7002DW  
Maximum Ratings (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
VDSS  
Value  
60  
Units  
V
V
V
V
60  
Drain-Gate Voltage RGS 1.0MΩ  
VDGR  
VGSS  
Continuous  
±20  
±40  
Gate-Source Voltage  
Pulsed  
VGSS  
TA = +25°C  
0.23  
0.18  
0.14  
Steady  
State  
TA = +70°C  
A
Continuous Drain Current (Note 7) VGS = 5V  
ID  
TA = +100°C  
Maximum Continuous Body Diode Forward Current (Note 7)  
Pulsed Drain Current (10µs pulse, duty cycle = 1%)  
0.53  
0.8  
A
A
IS  
IDM  
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Symbol  
Value  
0.31  
0.2  
Units  
W
T
A = +25°C  
Total Power Dissipation (Note 6)  
TA = +70°C  
TA = +100°C  
Steady state  
PD  
0.12  
410  
Thermal Resistance, Junction to Ambient (Note 6)  
Total Power Dissipation (Note 7)  
°C/W  
W
Rθ  
JA  
0.4  
TA = +25°C  
0.25  
0.15  
318  
TA = +70°C  
TA = +100°C  
Steady state  
PD  
Thermal Resistance, Junction to Ambient (Note 7)  
Thermal Resistance, Junction to Case (Note 7)  
Operating and Storage Temperature Range  
°C/W  
°C/W  
°C  
Rθ  
Rθ  
JA  
Steady state  
135  
JC  
-55 to +150  
TJ, TSTG  
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 8)  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
60  
70  
V
BVDSS  
IDSS  
1.0  
500  
VGS = 0V, ID = 10µA  
VDS = 60V, VGS = 0V  
VGS = ±20V, VDS = 0V  
@ TC = +25°C  
@ TC = +125°C  
µA  
nA  
Gate-Body Leakage  
±10  
IGSS  
ON CHARACTERISTICS (Note 8)  
Gate Threshold Voltage  
1.0  
2.0  
V
VGS(th)  
3.2  
4.4  
VDS = VGS, ID = 250µA  
VGS = 5.0V, ID = 0.05A  
VGS = 10V, ID = 0.5A  
VGS = 10V, VDS = 7.5V  
VDS =10V, ID = 0.2A  
VGS = 0V, IS = 115mA  
Static Drain-Source On-Resistance  
@ TJ = +25°C  
@ TJ = +125°C  
7.5  
13.5  
RDS (ON)  
Ω
On-State Drain Current  
0.5  
80  
1.0  
0.78  
A
mS  
V
ID(ON)  
gFS  
1.5  
Forward Transconductance  
Diode Forward Voltage  
VSD  
DYNAMIC CHARACTERISTICS (Note 9)  
Input Capacitance  
22  
11  
50  
25  
pF  
pF  
pF  
Ciss  
Coss  
Crss  
V
DS = 25V, VGS = 0V  
Output Capacitance  
f = 1.0MHz  
Reverse Transfer Capacitance  
SWITCHING CHARACTERISTICS (Note 9)  
Turn-On Delay Time  
2.0  
5.0  
7.0  
20  
20  
tD(on)  
tD(off)  
VDD = 30V, ID = 0.2A,  
RL = 150Ω, VGEN = 10V,  
RGEN = 25Ω  
ns  
Turn-Off Delay Time  
11.0  
Notes:  
6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.  
7. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal vias to bottom layer 1inch square copper plate.  
8. Short duration pulse test used to minimize self-heating effect.  
9. Guaranteed by design. Not subject to product testing.  
2 of 5  
www.diodes.com  
November 2013  
© Diodes Incorporated  
2N7002DW  
Document number: DS30120 Rev. 16 - 2  
2N7002DW  
7
6
5
1.0  
0.8  
0.6  
0.4  
0.2  
0
4
3
2
1
0
1
2
3
4
5
0
0
0.2  
0.4  
ID, DRAIN CURRENT (A)  
Figure 2 On-Resistance vs. Drain Current  
0.6  
0.8  
1.0  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 1 On-Region Characteristics  
2.0  
1.5  
6
5
4
3
2
VGS = 5.0V, ID = 0.05A  
1.0  
0.5  
0
1
0
-55 -30  
-5  
20  
45  
70 95  
120 145  
C)  
0
2
4
6
8
10 12 14 16 18  
TJ, JUNCTION TEMPERATURE (  
°
VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 3 On-Resistance vs. Junction Temperature  
Figure 4 On-Resistance vs. Gate-Source Voltage  
1
R
DS(on)  
Limited  
DC  
P
= 10s  
0.1  
W
P
= 1s  
W
P
= 100ms  
W
P
= 10ms  
W
P
= 1ms  
W
0.01  
P
= 100µs  
W
T
T
= 150°C  
J(max)  
= 25°C  
A
Single Pulse  
0.001  
0.1  
1
10  
100  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 5 SOA, Safe Operation Area  
3 of 5  
www.diodes.com  
November 2013  
© Diodes Incorporated  
2N7002DW  
Document number: DS30120 Rev. 16 - 2  
2N7002DW  
Package Outline Dimensions  
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.  
A
SOT363  
Min  
0.10  
1.15  
2.00  
Dim  
Max  
0.30  
1.35  
2.20  
A
B
C
D
F
H
J
K
L
B C  
0.65 Typ  
0.40  
1.80  
0
0.90  
0.25  
0.10  
0°  
0.45  
2.20  
0.10  
1.00  
0.40  
0.22  
8°  
H
K
J
M
M
α
L
D
F
All Dimensions in mm  
Suggested Pad Layout  
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.  
C2  
C2  
Dimensions Value (in mm)  
Z
G
2.5  
1.3  
X
Y
C1  
C2  
0.42  
0.6  
1.9  
C1  
G
Y
Z
0.65  
X
4 of 5  
www.diodes.com  
November 2013  
© Diodes Incorporated  
2N7002DW  
Document number: DS30120 Rev. 16 - 2  
2N7002DW  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2013, Diodes Incorporated  
www.diodes.com  
5 of 5  
www.diodes.com  
November 2013  
© Diodes Incorporated  
2N7002DW  
Document number: DS30120 Rev. 16 - 2  

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