74LVC1G34 [DIODES]
SINGLE BUFFER GATE;
| 型号： | 74LVC1G34 |
| 厂家： | 
DIODES INCORPORATED |
| 描述： | SINGLE BUFFER GATE |
| 文件： | 总15页 (文件大小：438K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
74LVC1G34
SINGLE BUFFER GATE
Description
Pin Assignments
The 74LVC1G34 is a single buffer gate with a standard push-pull
output. The device is designed for operation with a power supply
range of 1.65V to 5.5V. The inputs are tolerant to 5.5V allowing this
device to be used in a mixed voltage environment. The device is fully
specified for partial power down applications using IOFF. The IOFF
circuitry disables the output preventing damaging current backflow
when the device is powered down.
Future
Product
Future
Product
The gate performs the positive Boolean function:
Future
Product
Y A
Future
Product
Future
Product
Future
Product
Features
Applications
Wide Supply Voltage Range from 1.65 to 5.5V
± 24mA Output Drive at 3.3V
Voltage Level Shifting
General Purpose Logic
CMOS low power consumption
Power Down Signal Isolation
Wide array of products such as.
IOFF Supports Partial-Power-Down Mode Operation
Inputs accept up to 5.5V
.
.
.
.
.
.
PCs, Networking, Notebooks, Netbooks, PDAs
ESD Protection Tested per JESD 22
Tablet Computers, E-readers
.
.
.
Exceeds 200-V Machine Model (A115)
Computer Peripherals, Hard Drives, CD/DVD ROM
TV, DVD, DVR, Set Top Box
Exceeds 2000-V Human Body Model (A114)
Exceeds 1000-V Charged Device Model (C101)
Cell Phones, Personal Navigation / GPS
MP3 players ,Cameras, Video Recorders
Latch-Up Exceeds 100mA per JESD 78, Class I
Range of Package Options
Direct Interface with TTL Levels
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
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© Diodes Incorporated
74LVC1G34
Document number: DS36108 Rev. 3 - 2
74LVC1G34
Ordering Information
74 LVC1G 34 XXX -7
Logic Device
Function
34 : 1-Input
Package
Packing
-7 : 7” Tape & Reel
74 : Logic Prefix
LVC : 1.65 to 5.5 V
Logic Family
W5 : SOT25
SE : SOT353
Z : SOT553
Buffer Gate
1G : One Gate
FS3 : X2-DFN0808-4
FW5 : X1-DFN1010-6
FW4 :X2-DFN1010-6
FX4 : X2- DFN1409-6
FZ4 : X2- DFN1410-6
Packa
ge
Package
Size
7” Tape and Reel
Package
Device
(Notes 4, 5)
Quantity
Part Number Suffix
Code
74LVC1G34W5-7
(Future Product)
74LVC1G34SE-7
(Future Product)
74LVC1G34Z-7
(Future Product)
SOT25
3.0mm X 2.8mm X 1.2mm
0.95mm lead pitch
W5
3000/Tape & Reel
3000/Tape & Reel
4000/Tape & Reel
5000/Tape & Reel
5000/Tape & Reel
5000/Tape & Reel
5000/Tape & Reel
5000/Tape & Reel
-7
(Future Product)
SOT353
2.0mm X 2.0mm X 1.1mm
0.65mm lead pitch
SE
Z
-7
-7
-7
-7
-7
-7
-7
(Future Product)
SOT553
1.6mm X 1.6 mm X 0.62mm
0.5mm lead pitch
(Future Product)
0.9mm X 0.9 mm X 0.35mm
0.5mm pad pitch (diamond)
1.0mm X 1.0mm X 0.5mm
0.35mm pad pitch
74LVC1G34FS3-7
FS3
FW5
FW4
FX4
FZ4
X2-DFN0808-4
74LVC1G34FW5-7
(Future Product)
74LVC1G34FW4-7
(Future Product)
74LVC1G34FX4-7
(Future Product)
X1-DFN1010-6
(Future Product)
X2-DFN1010-6
1.0mm X 1.0mm X 0.4mm
0.35mm pad pitch
(Future Product)
X2-DFN1409-6
1.4mm X 0.9mm X 0.4mm
0.5mm pad pitch
(Chip scale alternative)
X2-DFN1410-6
1.4mm X 1.0mm X 0.4mm
0.5mm pad pitch
74LVC1G34FZ4-7
(Future Product)
(Future Product)
Notes:
4. Pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
5. The taping orientation is located on our website at http://www.diodes.com/datasheets/ap02007.pdf
Pin Descriptions
Logic Diagram
Pin Name
Description
No Connection
Data Input
NC
A
GND
Y
Ground
Data Output
VCC
Supply Voltage
Function Table
Inputs
Output
A
H
L
Y
H
L
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74LVC1G34
Document number: DS36108 Rev. 3 - 2
74LVC1G34
Absolute Maximum Ratings (Notes 6, 7)
Symbol
ESD HBM
ESD CDM
ESD MM
VCC
Parameter
Rating
Unit
KV
KV
V
Human Body Model ESD Protection
Charged Device Model ESD Protection
Machine Model ESD Protection
Supply Voltage Range
2
1
200
-0.5 to 6.5
-0.5 to 6.5
V
Input Voltage Range
V
VI
-0.5 to 6.5
-0.5 to VCC +0.5
-50
V
VO
Voltage Applied to Output in High Impedance or IOFF State
Voltage Applied to Output in High or Low State.
Input Clamp Current VI < 0
V
VO
IIK
mA
mA
mA
mA
°C
Output Clamp Current
-50
IOK
Continuous Output Current
±50
IO
±100
ICC, IGN
TJ
Continuous Current Through VCC or GND
Operating Junction Temperature
Storage Temperature
-40 to +150
-65 to +150
°C
TSTG
Notes:
6. Stresses beyond the absolute maximum may result in immediate failure or reduced reliability. These are stress values and device
operation should be within recommend values.
7. Forcing the maximum allowed voltage could cause a condition exceeding the maximum current or conversely forcing the maximum current could
cause a condition exceeding the maximum voltage. The ratings of both current and voltage must be maintained within the controlled range..
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© Diodes Incorporated
74LVC1G34
Document number: DS36108 Rev. 3 - 2
74LVC1G34
Recommended Operating Conditions (Note 8)
Symbol
Parameter
Operating
Data Retention Only
CC = 1.65V to 1.95V
Min
1.65
Max
5.5
—
Unit
V
Operating Voltage
VCC
1.5
V
—
V
0.65 X VCC
1.7
—
—
—
VCC = 2.3V to 2.7V
VCC = 3V to 3.6V
High-Level Input Voltage
V
V
VIH
2
VCC = 4.5V to 5.5V
VCC = 1.65V to 1.95V
VCC = 2.3V to 2.7V
VCC = 3V to 3.6V
0.7 X VCC
—
—
—
—
0.35 X VCC
0.7
0.8
Low-Level Input Voltage
VIL
VCC = 4.5V to 5.5V
0.3 X VCC
5.5
Input Voltage
0
V
V
VI
Output Voltage
0
VO
VCC
—
—
—
-4
VCC = 1.65V
VCC = 2.3V
-8
-12
VCC = 2.7V
VCC = 3V
High-Level Output Current
mA
mA
IOH
—
—
—
-16
-24
-32
4
VCC = 4.5V
VCC = 1.65V
VCC = 2.3V
—
—
—
8
-12
VCC = 2.7V
VCC = 3V
Low-Level Output Current
IOL
—
—
—
—
16
24
32
20
10
VCC = 4.5V
V
CC = 1.8V ± 0.15V, 2.5V ± 0.2V
—
—
∆t/∆V
Input Transition Rise or Fall Rate
Operating Free-Air Temperature
ns/V
°C
VCC = 3.3V ± 0.3V
VCC = 5V ± 0.5V
5
-40
+125
TA
Note:
8. Unused inputs should be held at VCC or Ground.
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74LVC1G34
Document number: DS36108 Rev. 3 - 2
74LVC1G34
Electrical Characteristics (@VCC = 3.3V, TA = +25°C, unless otherwise specified.)
-40°C to +85°C
-40°C to +125°C
Symbol
Parameter
Test Conditions
IOH = -100μA
Unit
VCC
Min
VCC – 0.1
1.2
Typ
—
Max
—
Min
VCC – 0.1
0.95
1.7
Max
—
1.65V to 5.5V
1.65V
—
—
—
IOH = -4mA
IOH = -8mA
IOH = -12mA
IOH = -16mA
IOH = -24mA
IOH = -32mA
—
—
—
—
—
—
—
—
—
—
—
—
2.3V
1.9
High Level Output
Voltage
2.7V
2.2
1.9
V
VOH
2.4
2.2
3V
2.3
2.0
—
—
—
—
0.1
0.45
0.3
0.4
0.4
—
0.1
0.7
0.45
0.6
0.6
4.5V
1.65V to 5.5V
1.65V
3.8
3.4
—
—
I
OL = 100μA
—
—
IOL = 4mA
IOL = 8mA
IOL = 12mA
IOL = 16mA
—
—
—
—
—
—
—
—
—
—
—
—
2.3V
Low Level Output
Voltage
2.7V
V
VOL
3V
0.55
0.55
0.8
.8
IOL = 24mA
IOL = 32mA
—
—
—
—
—
4.5V
Input Current
0V to 5.5V
± 0.1
±5
± 100
±200
μA
μA
II
VI = 5.5V or GND
VI or VO = 5.5V
Power Down
Leakage Current
0V
—
—
—
±10
—
—
IOFF
VI = 5.5V or GND,
IO = 0
Supply Current
5.5V
0.1
10
200
μA
ICC
Additional Supply
Current
3V to 5.5V
3.3V
—
—
—
5
500
—
—
—
5000
—
μA
∆ICC
Input at VCC –0.6V
VI = VCC – or GND
Input Capacitance
pF
CI
Package Characteristics (@VCC = 3.3V, TA = +25°C, unless otherwise specified.)
Symbol
Parameter
Test Conditions
SOT25
VCC
Min
Typ.
204
371
231
400
435
445
470
460
52
Max
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Unit
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
SOT353
SOT553
X2-DFN0808-4
X1-DFN1010-6
X2-DFN1010-6
X2-DFN1409-6
X2-DFN1410-6
SOT25
Thermal Resistance
Junction-to-Ambient
(Note 9)
oC/W
θJA
SOT353
143
105
225
250
250
275
265
SOT553
X2-DFN0808-4
X1-DFN1010-6
X2-DFN1010-6
X2-DFN1409-6
X2-DFN1410-6
Thermal Resistance
Junction-to-Case
(Note 9)
oC/W
θJC
Note: 9. Test condition for each of the 8 package types: Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
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74LVC1G34
Document number: DS36108 Rev. 3 - 2
74LVC1G34
Switching Characteristics (Typical Values @ TA = +25°C and nominal voltages 1.8V, 2.5V, 2.7V, 3.3V, and 5.0V)
T
A = -40°C to +85°C
TA = -40°C to +125°C
From
Input
To
Output
Parameter
Unit
VCC
Min
1.0
0.5
0.5
0.5
0.5
Typ
3.0
2.0
2.3
2.0
1.6
Max
7.5
5.0
5.2
4.2
3.7
Min
1.0
0.5
0.5
0.5
0.5
Max
9.5
6.5
7.0
5.5
5.0
1.8V ± 0.15V
2.5V ± 0.2V
2.7V
A or B
Y
ns
tpd
3.3V ± 0.3V
5.0V ± 0.5V
Operating Characteristics (TA = +25°C, unless otherwise specified.)
VCC = 1.8V
Typ
VCC = 2.5V
Typ
VCC = 3.3V
Typ
VCC = 5V
Typ
Test
Conditions
Parameter
Unit
Power Dissipation
Capacitance
f = 10 MHz
16
16
16
16
pF
Cpd
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74LVC1G34
Document number: DS36108 Rev. 3 - 2
74LVC1G34
Parameter Measurement Information
Inputs
VCC
VM
CL
RL
VI
tr/tf
≤2ns
30pF
30pF
50pF
50pF
50pF
1 KΩ
500Ω
500Ω
500Ω
500Ω
1.8V ± 0.15V
2.5V ± 0.2V
2.7V
VCC
VCC
VCC
3.0 V
VCC
VCC/2
VCC/2
1.5V
≤2ns
≤2.5ns
≤2.5ns
≤2.5ns
3.3V ± 0.3V
5.0V ± 0.5V
1.5V
VCC/2
Voltage Waveform Pulse Duration
Voltage Waveform Propagation Delay Times
Inverting and Non Inverting Outputs
Figure 1. Load Circuit and Voltage Waveforms
Notes:
A. Includes test lead and test apparatus capacitance.
B. All pulses are supplied at pulse repetition rate ≤ 10MHz.
C. tPLH and tPHL are the same as tPD
.
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© Diodes Incorporated
74LVC1G34
Document number: DS36108 Rev. 3 - 2
74LVC1G34
Marking Information
(1) SOT25, SOT353 and SOT553
Part Number
Package
SOT25
Identification Code
74LVC1G34W5-7
74LVC1G34SE-7
74LVC1G34Z-7
UK
UK
UK
SOT353
SOT553
(2) DFN packages
(Top View)
XX : Identification Code
Y : Year 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week;
z represents 52 and 53 week
X : A~Z : Internal Code
XX
Y W X
Part Number
Package
Identification Code
74LVC1G34FS3-7
74LVC1G34FW5-7
74LVC1G34FW4-7
74LVC1G34FX4-7
74LVC1G34FZ4-7
X2-DFN0808-4
X1-DFN1010-6
X2-DFN1010-6
X2-DFN1409-6
X2-DFN1410-6
WK
VW
UK
MK
UK
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© Diodes Incorporated
74LVC1G34
Document number: DS36108 Rev. 3 - 2
74LVC1G34
Package Outline Dimensions (All Dimensions in mm)
(1) Package Type: SOT25
A
SOT25
Dim Min Max Typ
A
B
C
D
H
J
K
L
M
N
0.35 0.50 0.38
1.50 1.70 1.60
2.70 3.00 2.80
B C
0.95
2.90 3.10 3.00
0.013 0.10 0.05
1.00 1.30 1.10
0.35 0.55 0.40
0.10 0.20 0.15
0.70 0.80 0.75
H
K
M
N
0°
8°
J
L
D
All Dimensions in mm
(2) Package Type: SOT353
A
SOT353
Dim
A
Min
0.10
1.15
2.00
Max
0.30
1.35
2.20
B C
B
C
D
0.65 Typ
F
0.40
1.80
0
0.45
2.20
0.10
1.00
0.40
0.22
8°
H
H
J
K
0.90
0.25
0.10
0°
K
M
L
M
J
L
D
F
All Dimensions in mm
(3) Package Type: SOT553
D
e1
SOT553
Dim Min Max
Typ
A
b
c
D
E
E1
e
e1
F
L
0.55 0.62 0.60
0.15 0.30 0.20
0.10 0.18 0.15
1.50 1.70 1.60
1.55 1.70 1.60
1.10 1.25 1.20
0.50 BSC
e
E/2
E1/2
E1
E
L (5x)
c
b (5x)
F
1.00 BSC
R0.1 MAX.
TYP.
0.00 0.10
0.10 0.30 0.20
6° 8° 7°
––
a
A
All Dimensions in mm
TYP.
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74LVC1G34
Document number: DS36108 Rev. 3 - 2
74LVC1G34
Package Outline Dimensions (cont.)
(4) Package Type X2-DFN0808-4
X2-DFN0808-4
Dim
A
Min
0.25
0
Max
0.35
0.04
-
Typ
A3
0.30
0.02
0.13
0.22
0.80
0.25
0.80
0.25
0.48
-
A1
A
A1
A3
b
-
Seati ng Pl ane
0.17
0.75
0.15
0.75
0.15
-
0.27
0.85
0.35
0.85
0.35
-
D
D2
E
D
e
Pi n #1I D
R0. 05 TYP
E2
e
K
K
0.20
0.17
0.02
-
-
L
0.27
0.12
-
0.22
0.07
0.05
E
E2
D2
L1
Z
L
4x
4x
L1 4x
All Dimensions in mm
Z
b
4x
(5) Package Type: X1-DFN1010-6
A1
A
X1-DFN1010-6
Dim Min Max
Seati ng Pl ane
5x
Typ
0.39
-
A
A1
b
-
-
0.50
0.04
D
0.12 0.20
0.15
L
D
E
e
0.95 1.050 1.00
0.95 1.050 1.00
0.55 BSC
e1
L1
e1
L
0.35 BSC
0.27 0.35
0.30
0.35
E
e
L1 0.32 0.40
All Dimensions in mm
Pi n #1I D
b
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© Diodes Incorporated
74LVC1G34
Document number: DS36108 Rev. 3 - 2
74LVC1G34
Package Outline Dimensions (cont.)
(6) Package Type X2-DFN1010-6
X2-DFN1010-6
Dim Min Max
0.40 0.39
0.00 0.05 0.02
–– –– 0.13
A1
A
A3
Typ
A
A1
A3
b
––
0.14 0.20 0.17
0.05 0.15 0.10
0.95 1.05 1.00
0.95 1.05 1.00
D
b1
D
E
(Pin #1 ID)
e
e
L
––
––
0.35
b1
0.35 0.45 0.40
K
Z
0.15
––
––
––
––
0.065
E
K
All Dimensions in mm
L(6x)
Z(4x)
b(6x)
(7) Package Type: X2-DFN1409-6 6 CHIP SCALE ALTERNATIVE
A3
A1
X2-DFN1409-6
Dim Min Max
A
Typ
Seati ng Pl ane
A
A1
A3
Ø
D
E
-
0
-
0.40 0.39
0.05 0.02
-
0.13
D
0.20 0.30 0.25
1.35 1.45 1.40
0.85 0.95 0.90
e1
Ø
6x
Pi n #1I D
e2
e1
e2
Z1
Z2
-
-
-
-
-
-
-
-
0.50
0.50
0.075
0.075
E
All Dimensions in mm
Z1 4x
Z2 4x
(8) Package Type: X2-DFN1410-6
A3
A1
A
X2-DFN1410-6
Dim Min Max
0.40 0.39
0.00 0.05 0.02
–– –– 0.13
Seating Plane
Typ
A
A1
A3
b
––
D
e
0.15 0.25 0.20
1.35 1.45 1.40
0.95 1.05 1.00
(Pin #1 ID)
D
E
L(6x)
e
L
Z
––
0.25 0.35 0.30
–– –– 0.10
––
0.50
E
Z1(4x)
Z1 0.045 0.105 0.075
All Dimensions in mm
Z(4x)
Document number: DS36108 Rev. 3 - 2
b(6x)
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74LVC1G34
74LVC1G34
Suggested Pad Layout
(1) Package Type: SOT25
C2
C2
Dimensions Value (in mm)
Z
G
3.20
1.60
0.55
0.80
2.40
0.95
X
C1
G
Z
Y
C1
C2
Y
X
(2) Package Type: SOT353
C2
C2
Dimensions Value (in mm)
Z
G
2.5
1.3
X
0.42
0.6
C1
G
Z
Y
C1
C2
1.9
0.65
Y
X
(3) Package Type: SOT553
C2
C2
Dimensions Value (in mm)
Z
G
2.2
1.2
X
0.375
0.5
C1
G
Z
Y
1.7
C1
C2
0.5
Y
X
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74LVC1G34
Document number: DS36108 Rev. 3 - 2
74LVC1G34
Suggested Pad Layout (cont.)
(4) Package Type X2-DFN0808-4
X2
C
Value
(in mm)
Dimensions
C
X
X1
X2
Y
0.480
0.320
0.300
0.800
0.320
0.300
0.900
Y2
Y1
Y2
Y
4x
X
4x
(5)(Package Type X1-DFN1010-6
X1
C
Y 5x
Value
(in mm)
0.350
0.150
0.150
0.200
0.900
0.500
0.525
0.475
1.150
Dimensions
C
G
G1
X
X1
Y
Y1
Y2
Y3
Y2
Y3
G
G1
Y1
Pi n1
X
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© Diodes Incorporated
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Document number: DS36108 Rev. 3 - 2
74LVC1G34
Suggested Pad Layout (cont.)
(6)(Package Type X2-DFN1010-6
X1
C
Value
(in mm)
Dimensions
C
G
0.350
0.150
0.200
0.900
0.550
1.250
Y (6x)
X
X1
Y
Y1
Y1
1
G(4x)
X(6x)
(7) Package Type: X2-DFN1409-6
C
Value
(in mm)
Dimensions
D (6x)
G1
C
C1
D
1.000
0.500
0.300
0.200
0.200
0.400
0.150
Y
C1
G
G1
X
Pin1
X
Y
G
(8) Package Type: X2-DFN1410-6
X1
C
Value
Dimensions
Y(6x)
(in mm)
0.500
0.250
0.250
1.250
0.525
1.250
C
G
Y1
X
X1
Y
Y1
1
G(4x)
X(6x)
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© Diodes Incorporated
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Document number: DS36108 Rev. 3 - 2
74LVC1G34
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales
channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or
systems.
Copyright © 2014, Diodes Incorporated
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© Diodes Incorporated
74LVC1G34
Document number: DS36108 Rev. 3 - 2
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