AP21410FM-7 [DIODES]
Buffer/Inverter Based Peripheral Driver,;
| 型号： | AP21410FM-7 |
| 厂家： | 
DIODES INCORPORATED |
| 描述： | Buffer/Inverter Based Peripheral Driver, 驱动 光电二极管 接口集成电路 |
| 文件： | 总14页 (文件大小：891K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AP21410 / AP21510
0.2A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH
Description
Pin Assignments
The AP21410 and AP21510 are integrated high-side power switches
optimized for Universal Serial Bus (USB) and other hot-swap
applications. The family of devices complies with USB 2.0 and is
available with both polarities of Enable input. They offer current and
thermal limiting and short circuit protection as well as controlled rise
time and undervoltage lockout functionality.
(Top View)
1
GND
IN
6
5
4
OUT
OUT
NC
2
3
EN
All devices are available in U-DFN2018-6 packages.
U-DFN2018-6
Applications
Features
Consumer Electronics – LCD TVs & Monitors, Game Machines
Communications – Set-Top Boxes, GPS, Smartphones
Computing – Laptops, Desktops, Servers, Printers, Docking
Stations, HUBs
Single USB Port Power Switches
Overcurrent and Thermal Protection
0.4A Typical Current Limiting
Reverse Current Blocking
95mΩ On-Resistance
Input Voltage Range: 2.7V to 5.5V
0.4ms Typical Rise Time
Very Low Shutdown Current: 1µA (Max)
ESD Protection: 4KV HBM, 400V MM
Active Low (AP21410) or Active High (AP21510) Enable
Ambient Temperature Range -40°C to +85°C
U-DFN2018-6: Available in “Green” Molding Compound (No Br,
Sb)
15kV ESD Protection per IEC 61000-4-2 (with External
Capacitance)
UL Recognized, File Number E322375
IEC60950-1 CB Scheme Certified
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Typical Applications Circuit
Power Supply
2.7V to 5.5V
IN
Load
OUT
0.1μF 120μF
0.1μF
AP21410
10μF
OFF
EN
ON
GND
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June 2015
© Diodes Incorporated
AP21410 / AP21510
Document number: DS37707 Rev. 2 - 2
AP21410 / AP21510
Available Options
Part Number
AP21410
Channel
Enable Pin (EN)
Active Low
Current Limit (Typical) Recommended Maximum Continuous Load Current
1
1
0.4A
0.4A
0.2A
0.2A
AP21510
Active High
Pin Descriptions
Pin Number
Pin Name
GND
IN
Function
1
2
Ground
Voltage Input Pin (all IN pins must be tied together externally).
Enable Input. Active Low (AP21410) and Active High (AP21510)
No internal connection
3
EN
4
NC
5, 6
OUT
Voltage Output Pin (all OUT pins must be tied together externally).
Exposed Pad.
It should be externally connected to GND plane and thermal mass for enhanced thermal impedance.
It should not be used as electrical ground conduction path.
Exposed
Pad
Exposed
Pad
Functional Block Diagram
AP21410, AP21510
Current
Sense
IN
OUT
UVLO
Current
Driver
Limit
EN
Thermal
Sense
GND
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© Diodes Incorporated
AP21410 / AP21510
Document number: DS37707 Rev. 2 - 2
AP21410 / AP21510
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Symbol
Parameter
Ratings
Units
kV
HBM
MM
Human Body Model ESD Protection
Machine Model ESD Protection
4
400
V
ESD
Surges per EN61000-4-2. 1999 applied to
output terminals of EVM (Note 5)
Air
15
8
kV
kV
IEC System
Level
Surges per EN61000-4-2. 1999 applied to
output terminals of EVM (Note 5)
Contact
Input Voltage
Output Voltage
Enable Voltage
6.5
VIN +0.3
6.5
V
V
V
VIN
VOUT
VEN
Maximum Continuous Load Current
Maximum Junction Temperature
Storage Temperature Range (Note 4)
Internal Limited
+150
A
ILOAD
TJ(MAX)
TST
°C
°C
-65 to +150
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices.
Notes:
4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C).
5. External capacitors need to be connected to the output, EVM board was tested with capacitor 2.2μF 50V 0805.
This level is a pass test only and not a limit.
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Symbol
VIN
Parameter
Min
2.7
0
Max
5.5
Units
V
Input Voltage
Output Current
200
+85
0.8
mA
°C
V
IOUT
TA
Operating Ambient Temperature
EN Input Logic Low Voltage
EN Input Logic High Voltage
-40
0
VIL
2
V
VIH
VIN
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June 2015
© Diodes Incorporated
AP21410 / AP21510
Document number: DS37707 Rev. 2 - 2
AP21410 / AP21510
Electrical Characteristics (@TA = +25°C, VIN = +5.0V, unless otherwise specified.)
Symbol
VUVLO
ISHDN
IQ
Parameter
Conditions
Min
1.6
—
Typ
1.9
0.5
45
Max
2.5
1
Unit
V
Input UVLO
RLOAD = 1kΩ
Input Shutdown Current
Input Quiescent Current
Input Leakage Current
Reverse Leakage Current
µA
µA
µA
µA
Disabled, IOUT = 0
Enabled, IOUT = 0
—
70
Disabled, OUT Grounded
—
—
1
ILEAK
IREV
—
0.01
80
1
Disabled, VIN = 0V, VOUT = 5V, IREV at VIN
U-DFN2018-6
—
110
140
140
170
—
TA = +25°C
VIN = 5V,
IOUT = 0.2A
—
—
-40°C ≤ TA ≤ +85°C
TA = +25°C
Switch On-Resistance
mΩ
RDS(ON)
—
100
—
VIN = 3.3V,
IOUT = 0.2A
—
-40°C ≤ TA ≤ +85°C
Short-Circuit Current Limit
Enabled into Short Circuit
—
250
mA
µs
ISHORT
VOUT = 0V to IOUT = ISHORT (OUT shorted to ground)
Note: See Figure 2
Short-Circuit Response Time
—
2
—
TSHORT
Over-Load Current Limit
EN Input Leakage
300
—
—
—
—
—
—
—
400
—
500
1
mA
µA
ms
ms
ms
ms
°C
ILIMIT
ISINK
tD(ON)
tR
VIN = 5V, VOUT = 4.5V, -40C ≤ TA ≤ +85°C
VEN = 5V
Output Turn-On Delay Time
Output Turn-On Rise Time
Output Turn-Off Delay Time
Output Turn-Off Fall Time
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
0.05
0.4
—
RLOAD = 25Ω
RLOAD = 25Ω
RLOAD = 25Ω
RLOAD = 25Ω
Enabled, RLOAD = 1kΩ
—
1.5
—
0.14
0.04
+140
+25
tD(OFF)
tF
TSHDN
THYS
0.1
—
—
°C
Thermal Resistance Junction-to-
Ambient
U-DFN2018-6 (Note 6)
—
70
—
°C/W
θJA
Note:
6. Test condition for U-DFN2018-6: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom
layer 1.0” x 1.4” ground plane.
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June 2015
© Diodes Incorporated
AP21410 / AP21510
Document number: DS37707 Rev. 2 - 2
AP21410 / AP21510
Performance Characteristics
VEN
VEN
50%
50%
50%
50%
tD(OFF)
tD(OFF)
tR
tR
tF
tF
tD(ON)
tD(ON)
90%
90%
90%
90%
10%
VOUT
VOUT
10%
10%
10%
Figure 1. Voltage Waveforms: AP21410 (Left), AP21510 (Right)
Figure 2. Response Time to Short Circuit Waveform
Turn-On Delay and Rise time
Turn-Off Delay and Fall time
VEN
5V/div
VEN
5V/div
TA = +25°C
RL =25Ω
CL = 1µF
VOUT
2V/div
VOUT
2V/div
TA = +25°C
RL =25Ω
CL = 1µF
500µs/div
100µs/div
Turn-Off Delay and Fall Time
Turn-On Delay and Rise Time
VEN
5V/div
VEN
5V/div
TA = +25°C
RL =25Ω
CL = 100µF
VOUT
2V/div
VOUT
2V/div
TA = +25°C
RL =25Ω
CL = 100µF
500µs/div
2ms/div
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© Diodes Incorporated
AP21410 / AP21510
Document number: DS37707 Rev. 2 - 2
AP21410 / AP21510
Performance Characteristics (continued)
Turn On Delay and Rise Time
Turn Off Delay and Fall time
VEN
5V/div
VEN
5V/div
TA = +25°C
RL = 25Ω
CL = 0µF
VOUT
2V/div
VOUT
2V/div
TA = +25°C
RL = 25Ω
CL = 0µF
500µs/div
500us/div
Short Circuit Current,
Short Circuit Current
Device Enabled Into Short
Device Enabled Into Short
VEN
VEN
5V/div
5V/div
IOUT
100mA/div
IOUT
100mA/div
VIN = 5V
TA = +25°C
CL = 120µF
VIN = 5V
TA = +25°C
CL = 0µF
20ms/div
20ms/div
Inrush Current
Over Load Current Limit
VEN
5V/div
VOUT
2V/div
CL = 120µF
IIN
200mA/div
IOUT
100mA/div
V
= 5V
IN
CL = 220µF
CL = 470µF
T
= +25°C
= 120µF
A
C
L
VIN = 5V
TA = +25°C
20ms/div
200us/div
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June 2015
© Diodes Incorporated
AP21410 / AP21510
Document number: DS37707 Rev. 2 - 2
AP21410 / AP21510
Performance Characteristics (cont.)
Power On
Power On
VEN
VEN
5V/div
5V/div
VOUT
VOUT
2V/div
2V/div
IOUT
100mA/div
IOUT
100mA/div
TA = +25°C
RL = 25Ω
CL = 0µF
T
= +25°C
= 120µF
= 25Ω
A
C
L
L
R
500us/div
500us/div
UVLO Increasing
UVLO Decreasing
VIN
2V/div
VIN
2V/div
TA = +25°C
RL = 25Ω
CL = 1µF
IOUT
100mA/div
IOUT
100mA/div
TA = +25°C
RL = 25Ω
CL = 1µF
1ms/div
10ms/div
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© Diodes Incorporated
AP21410 / AP21510
Document number: DS37707 Rev. 2 - 2
AP21410 / AP21510
Performance Characteristics (cont.)
CL = 1uF
RL = 25Ω
TA = +25°C
CL = 1uF
RL = 25Ω
TA = +25°C
CL = 1uF
RL = 25Ω
TA = +25°C
CL = 1uF
RL = 25Ω
TA = +25°C
VIN = 5.5V
VIN = 5.0V
VIN = 5.5V
VIN = 5.0V
VIN = 3.3V
VIN = 2.7V
VIN = 2.7V
VIN = 3.3V
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© Diodes Incorporated
AP21410 / AP21510
Document number: DS37707 Rev. 2 - 2
T
= +25°C
A
AP21410 / AP21510
Performance Characteristics (cont.)
V
= 2.7V
IN
VIN = 2.7V
VIN = 3.3V
V
= 5.5V
IN
V
= 5.0V
IN
VIN = 5.0V
UVLO Rising
UVLO Falling
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© Diodes Incorporated
AP21410 / AP21510
Document number: DS37707 Rev. 2 - 2
AP21410 / AP21510
Application Information
Power Supply Considerations
A 0.01μF to 0.1μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value
electrolytic capacitor on the input (10μF minimum) and output pin(s) is recommended when the output load is heavy. This precaution reduces
power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01μF to 0.1μF ceramic capacitor improves
the immunity of the device to short-circuit transients.
Overcurrent and Short Circuit Protection
An internal sensing FET is employed to check for overcurrent conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN
has been applied. The AP21410 / AP21510 short circuit and clamps output current to a certain safe level namely ISHORT
.
In the second condition, an overload occurs while the device is enabled. At the instance the overload occurs, higher current may flow for a very
short period of time before the current-limit function can react. After the current limit function has tripped (reached the overcurrent trip threshold),
the device switches into current limiting mode and the current is clamped at ILIMIT
.
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the
current-limit threshold is reached or until the thermal limit of the device is exceeded. The AP21410 / AP21510 is capable of delivering current up to
the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into overload current limiting
mode and is set at ILIMIT. If the load current keeps going higher, the device will switch into short-circuit current limiting mode and is set at ISHORT
.
Note that when the output has been shorted to GND at extremely low temperatures (< -30°C), a minimum 120μF electrolytic capacitor on the output
pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that the
capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature
characteristics of less than 10% variation of capacitance change when operated at extremely low temp. Our recommended aluminum electrolytic
capacitor type is Panasonic FC series.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:
PD = RDS(ON) × I2
Finally, calculate the junction temperature:
TJ = PD x RθJA + TA
Where:
TA = Ambient temperature °C
RθJA = Thermal resistance
PD = Total power dissipation
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June 2015
© Diodes Incorporated
AP21410 / AP21510
Document number: DS37707 Rev. 2 - 2
AP21410 / AP21510
Application Information (continued)
Thermal Protection
Thermal protection prevents the IC from damage when heavy overload or short-circuit faults are present for extended periods of time. The AP21410
/ AP21510 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature
rises to approximately +140°C due to excessive power dissipation in an overcurrent or short-circuit condition, the internal thermal sense circuitry
turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the device to
cool down approximately +25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is
removed.
Undervoltage Lockout (UVLO)
Undervoltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V, even
if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the design
of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.
Generic Hot-Plug Applications
In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug
applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most
effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a
power supply normally turns on. Due to the controlled rise times and fall times of the AP21410 / AP21510, these devices can be used to provide a
softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP21410 / AP21510 also ensures that the switch is
off after the card has been removed, and that the switch is off during the next insertion.
By placing the AP21410 / AP21510 between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion.
The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls
system surge current and provides a hot-plugging mechanism for any device.
Dual-Purpose Port Applications
AP21410/AP21510 is suitable for use in dual-purpose port applications in which a single port is used for data communication between the host and
peripheral devices while simultaneously maintaining a charge to the battery of the peripheral device. An example of this is a shared HDMI/MHL
(Mobile High-definition Link) port that allows streaming video between an HDTV or set-top box and a smartphone or tablet while maintaining a
charge to the smartphone or tablet battery. In such dual-purpose port applications, it is important to insure Vin of the AP21410/AP21510 is ramped
to its operating voltage prior to enabling the output.
No Output Capacitor Applications
For certain applications, no output capacitor is allowed. It is recommended to add a schottky diode at the output pin to prevent the device damaged
by output accidently short to ground.
Note: All previous Typical Performance Characteristics charts marked CL=0µF have the schottky diode added.
Power Supply
2.7V to 5.5V
Load
IN
OUT
B320A
0.1μF
AP21510
10μF
OFF
EN
ON
GND
Figure 3. No Output Capacitor Application
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© Diodes Incorporated
AP21410 / AP21510
Document number: DS37707 Rev. 2 - 2
AP21410 / AP21510
Ordering Information (Note 7)
AP21X10 XX - X
Packing
Enable
Package
4: Active Low
5: Active High
FM : U-DFN2018-6 7 : 7" Tape & Reel
7” Tape and Reel
Part Number
Package Code
Packaging
Quantity
Part Number Suffix
AP21410FM-7
AP21510FM-7
FM
FM
U-DFN2018-6
U-DFN2018-6
3,000/Tape & Reel
3,000/Tape & Reel
-7
-7
Note:
7. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
.
Marking Information
(1) U-DFN2018-6
(Top View)
XX : Identification Code
Y : Year : 0~9
XX
W : Week : A~Z : 1~26 week;
Y W X
a~z : 27~52 week; z represents
52 and 53 week
X : Internal Code
Device
Package Type
U-DFN2018-6
Identification Code
AP21410FM
AP21510FM
GA
GP
U-DFN2018-6
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© Diodes Incorporated
AP21410 / AP21510
Document number: DS37707 Rev. 2 - 2
AP21410 / AP21510
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
(1) Package Type: U-DFN2018-6
A3
U-DFN2018-6
Dim Min Max Typ
A
SEATING PLANE
A
A1
A3
b
0.545 0.605 0.575
A1
0
0.05 0.02
0.13
Pin#1 ID
D
0.15 0.25 0.20
1.750 1.875 1.80
D2
D
L
D2 1.30 1.50 1.40
e
E
E2
L
0.50
1.95 2.075 2.00
0.90 1.10 1.00
0.20 0.30 0.25
E2
E
z
0.30
All Dimensions in mm
z
b
e
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1) Package Type: U-DFN2018-6
X
C
Y
Dimensions
Value (in mm)
0.50
C
G
0.20
X
0.25
Y1
X1
Y
1.60
0.35
Y1
1.20
G
X1
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© Diodes Incorporated
AP21410 / AP21510
Document number: DS37707 Rev. 2 - 2
AP21410 / AP21510
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2015, Diodes Incorporated
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© Diodes Incorporated
AP21410 / AP21510
Document number: DS37707 Rev. 2 - 2
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