AP384XC [DIODES]

CURRENT MODE PWM CONTROLLER;
AP384XC
型号: AP384XC
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

CURRENT MODE PWM CONTROLLER

文件: 总14页 (文件大小:359K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Data Sheet  
CURRENT MODE PWM CONTROLLER  
AP384XC  
General Description  
Features  
The AP3842C/3C/4C/5C are high performance fixed  
frequency current-mode PWM controller series.  
·
Low Start-up Current: 50μA  
Robust VREF Line/Load Regulation  
·
Low Line Regulation : 4mV  
Low Load Regulation : 4mV  
High Stability of Reference Voltage over a Full  
Temperature Range: 0.2mV/ oC  
Operating Frequency up to 500kHz  
High PWM Frequency Stability over a Full Tem-  
perature Range: 2.5%  
High PWM Frequency Stability under a Full Sup-  
ply Voltage Range: 0.2%  
These integrated circuits are optimized for off-line and  
DC-DC converter applications with minimum external  
components. They feature under-voltage lockout  
(UVLO) circuit with low start-up current, trimmed  
oscillator for precise duty cycle control, current sense  
comparator providing maximum current limiting and a  
totem pole output stage for increasing output current.  
In addition, these ICs also feature accurate protection  
against over-temperature, over-current and maximal  
output power.  
·
·
·
·
·
·
Accurate Over-temperature Protection with Hys-  
teresis  
UVLO with Hysteresis  
The AP3842C and AP3844C have UVLO thresholds  
of 16V(on) and 10V(off); The corresponding thresh-  
olds for AP3843C and AP3845C are 8.4 V(on) and  
7.6V(off).  
Applications  
·
·
·
·
·
·
Off-line Converter  
DC-DC Converter  
Voltage Adapter  
CRT Monitor Power Supply  
Desktop Power Supply  
DVD/STB Power Supply  
The AP3842C and AP3843C can operate approaching  
100% duty cycle; AP3844C and AP3845C can operate  
from zero to 50% duty cycle.  
These ICs are available in SOIC-8 and DIP-8 pack-  
ages.  
Option 1  
Option 2  
SOIC-8  
DIP-8  
Figure 1. Package Types of AP3842C/3C/4C/5C  
Jul. 2013 Rev. 2. 0  
BCD Semiconductor Manufacturing Limited  
1
Data Sheet  
CURRENT MODE PWM CONTROLLER  
AP384XC  
Pin Configuration  
P Package  
(DIP-8)  
M Package  
(SOIC-8)  
VREF  
VCC  
1
2
8
7
COMP  
VFB  
COMP  
VFB  
VREF  
8
7
1
2
3
4
VCC  
OUTPUT  
GND  
ISENSE  
RT/CT  
3
4
6
5
ISENSE  
RT/CT  
OUTPUT  
GND  
6
5
Figure 2. Pin Configuration of AP3842C/3C/4C/5C (Top View)  
Pin Description  
Pin Number  
Pin Name  
Function  
1
2
COMP  
VFB  
This pin is the Error Amplifier output and is made available for loop compensation.  
The inverting input of the Error Amplifier. It is normally connected to the switching  
power supply output through a resistor divider.  
3
4
ISENSE  
RT/CT  
A voltage proportional to inductor current is connected to this input. The PWM uses  
this information to terminate the output switch conduction.  
The Oscillator frequency and maximum output duty cycle are programmed by con-  
necting resistor RT to VREF and capacitor CT to ground. Operation to 500 kHz is possi-  
ble.  
5
6
GND  
The combined control circuitry and power ground.  
OUTPUT  
This output directly drives the gate of a power MOSFET. Peak currents up to 1.0 A are  
sourced and sunk by this pin.  
7
8
VCC  
The positive supply of the control IC.  
VREF  
This is the reference output. It provides charging current for capacitor CT through  
resistor RT.  
Jul. 2013 Rev. 2. 0  
BCD Semiconductor Manufacturing Limited  
2
Data Sheet  
CURRENT MODE PWM CONTROLLER  
AP384XC  
Functional Block Diagram  
VCC  
7
34V  
UVLO  
5V  
REF  
S/R  
VREF  
5
8
GND  
INTERNAL  
BIAS  
2.50V  
VREF  
GOOD  
LOGIC  
OUTPUT  
6
4
OSC  
T
RT/CT  
(Note)  
OVER TEMP  
PROTECT  
ERROR  
AMP  
S
R
2R  
2
1
VFB  
COMP  
ISENSE  
PWN  
LATCH  
1V  
R
CURRENT  
SENSE  
COMPARATOR  
Note: Toggle flip-flop used  
for 3844C/45C only  
3
Figure 3. Functional Block Diagram of AP3842C/3C/4C/5C  
Jul. 2013 Rev. 2. 0  
BCD Semiconductor Manufacturing Limited  
3
Data Sheet  
CURRENT MODE PWM CONTROLLER  
AP384XC  
Ordering Information  
AP384XC  
-
E1: Lead Free  
G1: Green  
Circuit Type  
2: AP3842C  
3: AP3843C  
4: AP3844C  
5: AP3845C  
TR: Tape and Reel  
Blank: Tube  
Package  
M: SOIC-8  
P: DIP-8  
Part Number  
Marking ID  
Tempera-  
ture Range  
Packing  
Type  
Package  
Lead Free  
AP3842/3/4/5CM-E1  
Green  
Lead Free  
3842/3/4/5CM-E1  
Green  
AP3842/3/4/5CM-G1  
3842/3/4/5CM-G1  
3842/3/4/5CM-G1  
Tube  
SOIC-8  
DIP-8  
o
AP3842/3/4/5CMTR-E1 AP3842/3/4/5CMTR-G1 3842/3/4/5CM-E1  
Tape & Reel  
-40 to 85 C  
AP3842/3/4/5CP-E1  
AP3842/3/4/5CP-G1  
AP3842/3/4/5CP-E1 AP3842/3/4/5CP-G1  
Tube  
BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant. Products with  
"G1" suffix are available in green packages.  
Jul. 2013 Rev. 2. 0  
BCD Semiconductor Manufacturing Limited  
4
Data Sheet  
CURRENT MODE PWM CONTROLLER  
AP384XC  
Absolute Maximum Ratings (Note 1, 2)  
Parameter  
Symbol  
Value  
Unit  
Supply Voltage  
VCC  
30  
V
Output Current  
IO  
A
1
-0.3 to 6.3  
10  
Analog Inputs  
V(ANA)  
V
Error Amp Output Sink Current  
I
SINK(E.A)  
mA  
Power Dissipation at TA< 25 oC (DIP-8)  
P
P
D (Note 3)  
D (Note 3)  
TJ  
1000  
460  
mW  
mW  
Power Dissipation at TA<25 oC (SOIC-8)  
Junction Operating Temperature  
oC  
oC/W  
oC/W  
oC  
-40 to 150  
DIP-8  
140  
160  
θJA  
Thermal Resistance (Junction to Ambient)  
SOIC-8  
Storage Temperature Range  
Lead Temperature (Soldering, 10sec)  
ESD (Machine Model)  
TSTG  
-65 to 150  
+300  
oC  
V
TLEAD  
250  
Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the  
device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indi-  
cated under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended  
periods may affect device reliability.  
Note 2: All voltages are with respect to pin 5 and all currents are positive into specified terminal.  
Note 3: Board thickness 1.6mm, board dimension 90mm x 90mm.  
Recommended Operating Conditions  
Symbol  
Parameter  
Min  
Max  
500  
85  
Unit  
f
Oscillation Frequency  
Ambient Temperature  
KHz  
oC  
TA  
-40  
Jul. 2013 Rev. 2. 0  
BCD Semiconductor Manufacturing Limited  
5
Data Sheet  
CURRENT MODE PWM CONTROLLER  
AP384XC  
Electrical Characteristics  
(VCC=15V, RT=10kΩ CT=3.3nF, TA=25oC, unless otherwise specified.)  
Parameter  
Symbol  
Conditions  
Min  
Typ  
Max  
Unit  
REFERENCE SECTION  
Reference Output Voltage  
Total Output Variation  
Line Regulation  
TA=25oC, IREF=1mA  
Line, Load, Temp.  
12V VCC 25V  
VREF  
4.90  
4.82  
5.00  
5.10  
5.18  
15  
V
V
ΔVREF  
ΔVREF  
ISC  
4
4
mV  
mV  
mA  
Load Regulation  
1mA IREF 20mA  
15  
TA=25oC  
(Note 6)  
Short Circuit Output Current  
Temperature Stability  
OSCILLATOR SECTION  
Oscillation Frequency  
Oscillator Amplitude  
Temperature Stability  
Voltage Stability  
-100  
0.3  
-180  
mV/oC  
TA=25oC  
f
47  
52  
1.7  
2.5  
0.2  
9.5  
57  
KHz  
V
VOSC  
Pin 4, peak to peak (Note 6)  
(Note 6)  
%
1
%
12V VCC 25V  
Discharge Current  
Vpin 4 =2V(Note 7)  
8.5  
10.5  
mA  
ERROR AMPLIFIER SECTION  
Input Voltage  
VI  
ISINK  
ISOURCE  
VOH  
Vpin 1=2.5V  
2.45  
5
2.50  
8
2.55  
1.1  
V
mA  
mA  
V
Output Sink Current  
Output Source Current  
High Output Voltage  
Low Output Voltage  
Voltage Gain  
Vpin1=1.1V  
Vpin1=5V  
-0.5  
5
-0.8  
7
RL=15kΩ to GND  
RL=15kΩ to pin 8  
2V VO 4V  
12V VCC 25V  
VOL  
0.7  
90  
70  
V
65  
60  
dB  
dB  
Power Supply Rejection Ratio  
CURRENT SENSE SECTION  
Maximum Input Signal  
Gain  
PSRR  
VI(MAX)  
GV  
Vpin1=5V(Note 4)  
(Note 4, 5)  
0.9  
1
3
1.1  
V
V/V  
dB  
ns  
2.85  
3.15  
Power Supply Rejection Ratio  
Delay to Output  
PSRR  
12VVCC25V (Note 4, 6)  
Vpin3 = 0 to 2V (Note 6)  
70  
150  
-3  
300  
-10  
Input Bias Current  
IBIAS  
μA  
OUTPUT SECTION  
Low Output Voltage  
ISINK = 20mA  
0.1  
1.4  
14  
13  
50  
50  
0.4  
2.2  
V
V
V
V
ns  
ns  
VOL  
ISINK = 200mA  
ISOURCE = 20mA  
ISOURCE = 200mA  
High Output Voltage  
13  
12  
VOH  
TA=25oC, CL=1nF (Note 6)  
TA=25oC, CL=1nF (Note 6)  
Rise Time  
Fall Time  
tR  
tF  
150  
150  
Jul. 2013 Rev. 2. 0  
BCD Semiconductor Manufacturing Limited  
6
Data Sheet  
CURRENT MODE PWM CONTROLLER  
AP384XC  
Electrical Characteristics (Continued)  
Parameter  
Symbol  
Conditions  
Min  
Typ  
Max  
Unit  
UNDER -VOLTAGE LOCKOUT SECTION  
Start Threshold  
VTH(ST)  
AP3842C/AP3844C  
AP3843C/AP3845C  
AP3842C/AP3844C  
AP3843C/AP3845C  
15  
7.8  
8.5  
7.0  
16  
8.4  
17  
9.0  
V
V
V
V
Min. Operation Voltage  
(After Turn On)  
VOPR  
10.0  
7.6  
11.5  
8.2  
(Min.)  
PWM SECTION  
D(Max.)  
D(Max.)  
D(Min.)  
AP3842C/AP3843C  
AP3844C/AP3845C  
95  
46  
97  
48  
100  
50  
0
%
%
%
Max. Duty Cycle  
Min. Duty Cycle  
TOTAL STANDBY CURRENT SECTION  
Start-up Current  
IST  
AP3842C/AP3844C, VCC=14V  
AP3843C/AP3845C, VCC=6.5V  
Vpin3=Vpin2=0V  
50  
50  
8
80  
80  
12  
μA  
Operating Supply Current  
Zener Voltage  
ICC(OPR)  
VZ  
mA  
V
ICC=25mA  
30  
34  
OVER-TEMPERATURE PROTECT SECTION  
oC  
oC  
Shutdown Temperature  
Temperature Hysteresis  
TSHUT  
THYS  
(Note 6)  
(Note 6)  
155  
25  
Note 4: Parameters are tested at trip point of latch with Vpin2 = 0.  
Note 5: Here gain is defined as:  
ΔVPin 1  
A=  
, 0 Vpin3 0.8V  
ΔVPin 3  
Note 6: These parameters, although guaranteed, are not 100% tested in production.  
Note 7: This parameter is measured with RT=10kΩ to VREF, it contributes 0.3mA of current to the measured value.  
So the total current flowing into the CT pin will be 0.3mA higher than the measured value approximately.  
VREF  
RT  
AP384XC  
4.7k  
2N2222  
100k  
A
VCC  
1
2
3
VREF  
8
7
6
5
COMP  
1k  
VCC  
VFB  
ERROR AMP  
ADJUST  
1K  
1W  
0.1μF  
5k  
ISENSE  
ADJUST  
OUTPUT  
ISENSE  
OUTPUT  
GND  
4.7k  
0.1μF  
GND  
4 RT/CT  
CT  
Figure 4. Basic Test Circuit  
Jul. 2013 Rev. 2. 0  
BCD Semiconductor Manufacturing Limited  
7
Data Sheet  
CURRENT MODE PWM CONTROLLER  
AP384XC  
ELectrical Characteristics (Continued)  
Figure 4 is the basic test circuit for AP384XC. In testing, the high peak currents associated with capacitive loads  
necessitate careful grounding techniques. Timing and bypass capacitors should be connected close to pin 5 in a  
single point ground. The transistor and 5k potentiometer are used to sample the oscillator waveform and apply an  
adjustable ramp to pin 3.  
Typical Performance Characteristics  
Figure 5. Oscillator Dead Time vs. Timing Capacitor  
Figure 6. Timing Resistor vs. Frequency  
5.015  
4.0  
VCC=15V, IO=1mA  
5.010  
VCC=15V, TA=25oC  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
-0.5  
5.005  
5.000  
4.995  
4.990  
4.985  
4.980  
0
50 100 150 200 250 300 350 400 450 500 550 600  
Output Sink Current (mA)  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
Ambient Temperature (oC)  
Figure 8. Output Saturation Characteristics  
Figure 7. Reference Voltage vs. Ambient Temperature  
Jul. 2013 Rev. 2. 0  
BCD Semiconductor Manufacturing Limited  
8
Data Sheet  
CURRENT MODE PWM CONTROLLER  
AP384XC  
Typical Performance Characteristics (Continued)  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
90  
80  
70  
60  
50  
40  
30  
VCC=15V, TA=25oC  
AP3842C/44C, VCC=14V  
AP3843C/45C, VCC=6.5V  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
10  
100  
1k  
10k  
100k  
1M  
Ambient Temperature (oC)  
Frequency (Hz)  
Figure 9. Error Amplifier Open-Loop Frequency Response  
Figure 10. Start-up Current vs. Ambient Temperature  
80  
70  
60  
AP3843C/45C  
50  
AP3842C/44C  
40  
30  
20  
10  
0
0
2
4
6
8
10  
12  
14  
16  
18  
Supply Voltage (V)  
Figure 11. Start-up Current vs. Supply Voltage  
Jul. 2013 Rev. 2. 0  
BCD Semiconductor Manufacturing Limited  
9
Data Sheet  
CURRENT MODE PWM CONTROLLER  
AP384XC  
Typical Application  
NTC  
Bridge Diode  
1N4007*4  
R19  
10  
C2  
0.01μ  
600V  
R3  
39k  
2W  
+
C15  
2.2n  
R2  
1M/  
0.25W  
C14  
100μ/400V  
L3  
10μ  
C11  
1μ  
C10  
1000μ  
R20  
2K  
Z2  
SA12A  
J1  
T
AC 90 to 265V  
D1  
Byv26e  
+
+
D3  
8TQ100  
C1 47μ  
C9  
2200μ  
R4 10  
D2  
1N4001  
J2  
12V/5A  
C3  
0.1μ  
7
2
1
5
8
VCC  
VREF  
R12  
100  
R5  
10k  
C4  
3.3n  
C8  
VFB  
RT/CT  
4
6
3
C5  
220p  
0.22μ  
C15  
100p  
R6  
20  
C6  
2200p/600V  
R16  
8.2k  
R15  
100  
COMP OUTPUT  
R14  
130k  
Q1  
IRF830  
R7  
1k  
GND  
ISENSE  
W1  
1k  
U3  
AZ431  
R18  
3.9k  
C7  
680p  
U1  
AP3842C/3C/4C/5C  
R10  
0.51/1W  
R9  
7.5k  
R13  
15k  
Z1  
1N5819  
R17  
2k  
R11  
820  
U2 PC817  
Figure 12. Typical Application of AP3842C/3C/4C/5C  
Jul. 2013 Rev. 2. 0  
BCD Semiconductor Manufacturing Limited  
10  
Data Sheet  
CURRENT MODE PWM CONTROLLER  
AP384XC  
Mechanical Dimensions  
SOIC-8  
Unit: mm(inch)  
4.700(0.185)  
0.320(0.013)  
TYP  
1.350(0.053)  
5.100(0.201)  
1.750(0.069)  
0.675(0.027)  
0.725(0.029)  
D
5.800(0.228)  
6.200(0.244)  
1.270(0.050)  
TYP  
D
20:1  
0.100(0.004)  
0.300(0.012)  
Option 1  
0°  
8°  
1.000(0.039)  
TYP  
3.800(0.150)  
4.000(0.157)  
Option 1  
0.150(0.006)  
0.250(0.010)  
1°  
7°  
0.300(0.012)  
0.510(0.020)  
0.900(0.035)  
TYP  
6)  
(0.00  
150  
R0.  
0.450(0.017)  
0.800(0.031)  
Option 2  
0.350(0.014)  
TYP  
Note: Eject hole, oriented hole and mold mark is optional  
.
Jul. 2013 Rev. 2. 0  
BCD Semiconductor Manufacturing Limited  
11  
Data Sheet  
CURRENT MODE PWM CONTROLLER  
AP384XC  
Mechanical Dimensions (Continued)  
DIP-8  
Unit: mm(inch)  
0.700(0.028)  
7.620(0.300)TYP  
5°  
1.524(0.060) TYP  
6°  
3.200(0.126)  
3.600(0.142)  
3.710(0.146)  
4.310(0.170)  
0.510(0.020)MIN  
3.000(0.118)  
3.600(0.142)  
0.204(0.008)  
0.360(0.014)  
0.254(0.010)TYP  
8.200(0.323)  
9.400(0.370)  
2.540(0.100) TYP  
0.130(0.005)MIN  
0.360(0.014)  
0.560(0.022)  
6.200(0.244)  
6.600(0.260)  
R0.750(0.030)  
Φ3.000(0.118)  
Depth  
0.100(0.004)  
0.200(0.008)  
9.000(0.354)  
9.600(0.378)  
Note: Eject hole, oriented hole and mold mark is optional.  
Jul. 2013 Rev. 2. 0  
BCD Semiconductor Manufacturing Limited  
12  
Data Sheet  
CURRENT MODE PWM CONTROLLER  
AP384XC  
Mounting Pad Layout  
SOIC-8  
Unit: mm(inch)  
Grid  
placement  
courtyard  
G
Y
Z
E
X
Dimensions  
Value  
Z
G
X
Y
E
(mm)/(inch)  
(mm)/(inch)  
(mm)/(inch)  
(mm)/(inch)  
(mm)/(inch)  
6.900/0.272  
3.900/0.154  
0.650/0.026  
1.500/0.059  
1.270/0.050  
Jul. 2013 Rev. 2. 0  
BCD Semiconductor Manufacturing Limited  
13  
BCD Semiconductor Manufacturing Limited  
http://www.bcdsemi.com  
IMPORTANT NOTICE  
BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-  
cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any  
particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use  
of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or  
other rights nor the rights of others.  
MAIN SITE  
- Headquarters  
- Wafer Fab  
BCD (Shanghai) Micro-electronics Limited  
No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, P. R.C.  
Tel: +86-021-2416-2266, Fax: +86-021-2416-2277  
Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.  
800 Yishan Road, Shanghai 200233, China  
Tel: +021-6485-1491, Fax: +86-021-5450-0008  
REGIONAL SALES OFFICE  
Taiwan Office (Taipei)  
Shenzhen Office  
Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office  
BCD Semiconductor (Taiwan) Company Limited  
Unit A Room 1203,Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District  
3F, No.17, Lane 171, Sec. 2, Jiu-Zong Rd., Nei-Hu Dist., Taipei(114), Taiwan, R.O.C  
Tel: +886-2-2656 2808  
Shenzhen 518057, China  
Tel: +86-0755-8660-4900, Fax: +86-0755-8660-4958  
Fax: +886-2-2656-2806/26562950  
Taiwan Office (Hsinchu)  
USA Office Korea Office  
BCD Semiconductor Limited Korea office.  
BCD Semiconductor (Taiwan) Company Limited  
BCD Semiconductor Corp.  
8F, No.176, Sec. 2, Gong-Dao 5th Road, East District  
48460 Kato Road, Fremont, CA 94538, USA  
Room 101-1112, Digital-Empire II, 486 Sin-dong,  
HsinChu City 300, Taiwan, R.O.C  
Tel: +1-510-668-1950 Yeongtong-Gu, Suwon-city, Gyeonggi-do, Korea  
Tel: +886-3-5160181, Fax: +886-3-5160181  
Fax: +1-510-668-1990  
Tel: +82-31-695-8430  

相关型号:

AP384XG

GREEN MODE PWM CONTROLLER
ANALOGICTECH

AP384XG

GREEN MODE PWM CONTROLLER
BCDSEMI

AP384XG

GREEN MODE PWM CONTROLLER
DIODES

AP3860FNTR-G1

Superior Multi-touch Capacitive Touch Screen Controller
DIODES

AP3861FN-G1

Superior Multi-touch Capacitive Touch Screen Controller
DIODES

AP3861FNTR-G1

Superior Multi-touch Capacitive Touch Screen Controller
DIODES

AP386X

Superior Multi-touch Capacitive Touch Screen Controller
DIODES

AP388

Analog IC
ETC

AP389

Analog IC
ETC

AP3890FN-G1

暂无描述
DIODES

AP3890FNTR-G1

Telecom Circuit, 1-Func, 7 X 7 MM, GREEN, QFN-56
DIODES

AP3891FN-G1

Telecom Circuit, 1-Func, 8 X 8 MM, GREEN, QFN-68
DIODES