BAV99DW_09 [DIODES]
SURFACE MOUNT SWITCHING DIODE ARRAY; 表面贴装开关二极管阵列
| 型号： | BAV99DW_09 |
| 厂家： | 
DIODES INCORPORATED |
| 描述： | SURFACE MOUNT SWITCHING DIODE ARRAY |
| 文件： | 总3页 (文件大小：75K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BAV99DW
SURFACE MOUNT SWITCHING DIODE ARRAY
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Features
Mechanical Data
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•
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•
•
•
•
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Fast Switching Speed
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Case: SOT-363
Case Material: Molded Plastic, “Green” Molding Compound
(Note 5). UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Ultra-Small Surface Mount Package
For General Purpose Switching Applications
High Conductance
Two “BAV99” Circuits In One Package
Lead Free/RoHS Compliant (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
"Green" Device (Notes 4 and 5)
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•
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Polarity: See Diagram
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.006 grams (approximate)
SOT-363
AC
1
A2
C2
AC
2
C1
A1
TOP VIEW
TOP VIEW
Internal Schematic
Maximum Ratings @T = 25°C unless otherwise specified
A
Characteristic
Non-Repetitive Peak Reverse Voltage
Symbol
VRM
Value
100
Unit
V
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
75
V
RMS Reverse Voltage
53
V
VR(RMS)
IFM
Forward Continuous Current
(Note 1)
215
mA
2.0
1.0
0.5
Non-Repetitive Peak Forward Surge Current
@ t = 1.0μs
@ t = 1.0ms
@ t = 1.0s
A
IFSM
Thermal Characteristics
Characteristic
Power Dissipation
Symbol
PD
Value
200
Unit
mW
mW
(Note 1)
(Note 2)
(Note 1)
(Note 2)
Power Dissipation
300
PD
Thermal Resistance Junction to Ambient Air
625
°C/W
°C/W
°C
Rθ
Rθ
JA
Thermal Resistance Junction to Ambient Air
Operating and Storage Temperature Range
417
JA
-65 to +150
TJ , TSTG
Electrical Characteristics @T = 25°C unless otherwise specified
A
Characteristic
Symbol
Min
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 6)
75
V
V(BR)R
⎯
IR = 2.5μA
IF = 1.0mA
IF = 10mA
IF = 50mA
IF = 150mA
0.715
0.855
1.0
Forward Voltage
V
VF
⎯
⎯
1.25
VR = 75V
μA
μA
μA
nA
2.5
50
30
25
VR = 75V, TJ = 150°C
VR = 25V, TJ = 150°C
VR = 20V
Reverse Current (Note 6)
IR
Total Capacitance
2.0
4.0
pF
CT
trr
⎯
⎯
VR = 0, f = 1.0MHz
IF = IR = 10mA,
Irr = 0.1 x IR, RL = 100Ω
Reverse Recovery Time
ns
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Device mounted on Alumina PCB, 0.4 inch x 0.3 inch x 0.024 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
6. Short duration pulse test used to minimize self-heating effect.
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January 2009
© Diodes Incorporated
BAV99DW
Document number: DS30145 Rev. 13 - 2
BAV99DW
300
250
200
1
Note 1
0.1
150
100
0.01
50
0
0.001
0
25
TA, AMBIENT TEMPERATURE (
Fig. 1 Power Derating Curve, Total Package
50
75
100
125
150
0.5
1.0
1.5
0
°C)
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics, Per Element
10,000
1,000
100
2.0
1.8
1.6
1.4
1.2
1.0
0.8
10
1
0.6
0.4
0.2
0.0
0
0.1
60
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
Fig. 3 Typical Reverse Characteristics, Per Element
80
100
20
40
10
VR, DC REVERSE VOLTAGE (V)
0
30
40
20
Fig. 4 Total Capacitance vs. Reverse Voltage, Per Element
Ordering Information (Note 7)
Part Number
Case
Packaging
BAV99DW-7-F
SOT-363
3000/Tape & Reel
Notes:
7. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
KJG = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: N = 2002)
KJG YM
Y M K J G
M = Month (ex: 9 = September)
Date Code Key
Year
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2111
2012
Code
M
N
P
R
S
T
U
V
W
X
Y
Z
Month
Code
Jan
Feb
Mar
Apr
May
Jun
Jul
Aug
Sep
Oct
Nov
Dec
1
2
3
4
5
6
7
8
9
O
N
D
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January 2009
© Diodes Incorporated
BAV99DW
Document number: DS30145 Rev. 13 - 2
BAV99DW
Package Outline Dimensions
A
SOT-363
Min
0.10
1.15
2.00
Dim
A
B
C
D
F
H
J
K
L
Max
0.30
1.35
2.20
B C
0.65 Typ
0.40
1.80
0
0.90
0.25
0.10
0°
0.45
2.20
0.10
1.00
0.40
0.22
8°
H
K
J
M
M
α
L
D
F
All Dimensions in mm
Suggested Pad Layout
C2
C2
Dimensions Value (in mm)
Z
G
2.5
1.3
X
Y
C1
C2
0.42
0.6
1.9
C1
G
Z
0.65
Y
X
IMPORTANT NOTICE
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product
described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall
assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,
harmless against all damages.
LIFE SUPPORT
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written
approval of the President of Diodes Incorporated.
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January 2009
© Diodes Incorporated
BAV99DW
Document number: DS30145 Rev. 13 - 2
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