DMN26D0UDJ-7 [DIODES]

DUAL N-CHANNEL ENHANCEMENT MODE MOSFET; 双N沟道增强型MOSFET
DMN26D0UDJ-7
型号: DMN26D0UDJ-7
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
双N沟道增强型MOSFET

晶体 小信号场效应晶体管 开关 光电二极管 PC
文件: 总5页 (文件大小:107K)
中文:  中文翻译
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DMN26D0UDJ  
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features and Benefits  
Dual N-Channel MOSFET  
Low On-Resistance:  
ID  
V(BR)DSS  
RDS(on)  
TA = 25°C  
3.0 Ω @ 4.5V  
4.0 Ω @ 2.5V  
6.0 Ω @ 1.8V  
10 Ω @ 1.5V  
240mA  
170mA  
3.0mΩ @ VGS= 4.5V  
6.0mΩ @ VGS= 1.8V  
20V  
Very Low Gate Threshold Voltage, 1.05V max  
Low Input Capacitance  
Fast Switching Speed  
Ultra-Small Surface Mount Package  
ESD Protected Gate (HBM 300V)  
Description and Applications  
This new generation MOSFET has been designed to minimize the on-  
state resistance (RDS(on)) and yet maintain superior switching  
performance, making it ideal for high efficiency power management  
applications.  
Lead, Halogen, and Antimony Free By Design/RoHS  
Compliant (Note 1)  
"Green" Device (Note 2)  
DC-DC Converters  
Power management functions  
Mechanical Data  
Case: SOT-963  
Case Material: Molded Plastic, “Green” Molding Compound. UL  
Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminal Connections: See Diagram  
Terminals: Finish – Matte Tin annealed over Copper leadframe.  
Solderable per MIL-STD-202, Method 208  
Weight: 0.0027 grams (approximate)  
D1  
G2  
S2  
SOT-963  
Top View  
D2  
G1  
S1  
ESD PROTECTED  
Top View  
Schematic and Transistor Diagram  
Ordering Information (Note 3)  
Part Number  
DMN26D0UDJ-7  
Case  
SOT-963  
Packaging  
10,000/Tape & Reel  
Notes:  
1. No purposefully added lead.  
2. Diodes Inc.’s “Green” policy can be found on our website at http://www.diodes.com.  
3. For packaging details, go to our website at http://www.diodes.com.  
Marking Information (Note 4)  
D1  
G2  
S2  
M1 = Product Type Marking Code  
M1  
D2  
G1  
S1  
Notes:  
4. Package is non-polarized. Parts may be on reel in orientation illustrated, 180° rotated, or mixed (both ways).  
1 of 5  
www.diodes.com  
December 2010  
© Diodes Incorporated  
DMN26D0UDJ  
Document number: DS31481 Rev. 5 - 2  
DMN26D0UDJ  
Maximum Ratings @TA = 25°C unless otherwise specified  
Characteristic  
Drain Source Voltage  
Symbol  
VDSS  
Value  
20  
Unit  
V
Gate-Source Voltage  
V
VGSS  
±10  
T
A = 25°C  
Steady  
Continuous Drain Current (Note 5) VGS = 4.5V  
State  
240  
190  
mA  
ID  
TA = 70°C  
T
T
A = 25°C  
A = 70°C  
Steady  
Continuous Drain Current (Note 5) VGS = 1.8V  
State  
180  
140  
mA  
mA  
ID  
805  
Pulsed Drain Current - TP = 10µs  
IDM  
Thermal Characteristics  
Characteristic  
Total Power Dissipation (Note 5)  
Symbol  
Value  
300  
409  
Unit  
mW  
°C/W  
°C  
PD  
Thermal Resistance, Junction to Ambient (Note 5)  
Operating and Storage Temperature Range  
Rθ  
JA  
-55 to +150  
TJ, TSTG  
Electrical Characteristics @TA = 25°C unless otherwise specified  
Characteristic  
OFF CHARACTERISTICS (Note 6)  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
20  
V
BVDSS  
IDSS  
500  
VGS = 0V, ID = 100μA  
VDS = 20V, VGS = 0V  
VGS = ±10V, VDS = 0V  
VGS = ±5V, VDS = 0V  
nA  
@ TC = 25°C  
±1  
±100  
μA  
nA  
Gate-Body Leakage  
IGSS  
ON CHARACTERISTICS (Note 6)  
Gate Threshold Voltage  
0.45  
0.8  
1.8  
2.5  
3.4  
4.7  
9.5  
240  
0.8  
1.05  
3.0  
4.0  
6.0  
10.0  
V
VGS(th)  
VDS = VGS, ID = 250μA  
VGS = 4.5V, ID = 100mA  
VGS = 2.5V, ID = 50mA  
VGS = 1.8V, ID = 20mA  
VGS = 1.5V, ID = 10mA  
Static Drain-Source On-Resistance  
RDS (ON)  
Ω
180  
VGS = 1.2V, ID = 1mA  
Forward Transconductance  
Source-Drain Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 7)  
Input Capacitance  
mS  
V
|Yfs|  
VSD  
1.0  
VDS =10V, ID = 0.1A  
VGS = 0V, IS = 10mA  
0.5  
14.1  
2.9  
pF  
pF  
pF  
Ciss  
Coss  
Crss  
V
DS = 15V, VGS = 0V  
Output Capacitance  
f = 1.0MHz  
Reverse Transfer Capacitance  
1.6  
SWITCHING CHARACTERISTICS, VGS = 4.5V (Note 7)  
Turn-On Delay Time  
Rise Time  
3.8  
7.9  
td(on)  
tr  
td(off)  
tf  
VGS = 4.5V, VDD = 10V  
ID = 200mA, RG = 2.0  
ns  
Turn-Off Delay Time  
Fall Time  
13.4  
15.2  
Notes:  
5. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch with minimum recommended pad layout; pad layout as shown on Diodes Inc. suggested  
pad layout document AP02001, which can be found on our website at http://www.diodes.com.  
6. Short duration pulse test used to minimize self-heating effect.  
7. Switching characteristics are independent of operating junction temperature. Guaranteed by design, not subject to production testing.  
2 of 5  
www.diodes.com  
December 2010  
© Diodes Incorporated  
DMN26D0UDJ  
Document number: DS31481 Rev. 5 - 2  
DMN26D0UDJ  
0.8  
0.7  
0.4  
0.3  
V
= -10V  
V
= 8V  
DS  
V
= 4.5V  
GS  
GS  
T
= -55°C  
A
0.6  
0.5  
V
= 3.0V  
= 2.5V  
T
= 25°C  
GS  
A
T
= 85°C  
A
T
= 125°C  
A
V
0.2  
0.1  
0
0.4  
0.3  
0.2  
GS  
T
= 150°C  
A
V
= 2.0V  
GS  
0.1  
0
V
= 1.5V  
GS  
0
0.5  
1
1.5  
2
2.5  
3
0
0.5  
1
1.5  
2
2.5  
3
VGS, GATE-SOURCE VOLTAGE (V)  
Fig. 2 Typical Transfer Characteristic  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Fig. 1 Typical Output Characteristic  
10  
9
4
3
2
V
= 4.5V  
GS  
8
7
6
5
4
T
= 150°C  
A
V
= 1.2V  
GS  
T
= 125°C  
A
T
= 85°C  
A
V
= 1.5V  
T
= 25°C  
3
2
GS  
A
1
0
V
= 1.8V  
= 2.5V  
GS  
T
= -55°C  
A
V
V
GS  
1
0
= 4.5V  
GS  
1
10  
100  
1,000  
0.01  
0.1  
1
ID, DRAIN-SOURCE CURRENT (mA)  
Fig. 3 Typical On-Resistance  
vs. Drain Current and Gate Voltage  
ID, DRAIN CURRENT (A)  
Fig. 4 Typical On-Resistance  
vs. Drain Current and Temperature  
2.0  
1.8  
4.0  
3.5  
1.6  
1.4  
V
I
= 4.5V  
3.0  
GS  
= 500mA  
D
2.5  
2.0  
1.5  
V
= 2.5V  
GS  
1.2  
1.0  
I
= 150mA  
V
= 2.5V  
GS  
D
I
= 150mA  
D
0.8  
V
= 4.5V  
GS  
1.0  
0.5  
I
= 500mA  
D
0.6  
0.4  
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
TA, AMBIENT TEMPERATURE (°C)  
Fig. 5 On-Resistance Variation with Temperature  
TA, AMBIENT TEMPERATURE (°C)  
Fig. 6 On-Resistance Variation with Temperature  
3 of 5  
www.diodes.com  
December 2010  
© Diodes Incorporated  
DMN26D0UDJ  
Document number: DS31481 Rev. 5 - 2  
DMN26D0UDJ  
0.8  
0.7  
1.4  
1.2  
T
= 25°C  
0.6  
0.5  
A
1.0  
0.8  
0.6  
0.4  
I
= 1mA  
D
0.4  
0.3  
I
= 250µA  
D
0.2  
0.2  
0
0.1  
0
-50 -25  
0
25  
50  
75 100 125 150  
0
0.2 0.4  
0.6 0.8  
1
1.2 1.4 1.6  
TA, AMBIENT TEMPERATURE (°C)  
VSD, SOURCE-DRAIN VOLTAGE (V)  
Fig. 7 Gate Threshold Variation vs. Ambient Temperature  
Fig. 8 Diode Forward Voltage vs. Current  
20  
10,000  
1,000  
f = 1MHz  
T
= 150°C  
A
15  
T
= 125°C  
A
C
iss  
100  
10  
5
T
= 85°C  
A
10  
1
T
= 25°C  
C
A
oss  
T
= -55°C  
A
C
rss  
0
0.1  
0
5
10  
15  
20  
0
2
4
6
8
10 12 14 16 18 20  
VDS, DRAIN-SOURCE VOLTAGE (V)  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Fig. 9 Typical Total Capacitance  
Fig. 10 Typical Leakage Current vs. Drain-Source Voltage  
Package Outline Dimensions  
D
e1  
SOT-963  
L
Dim Min  
Max Typ  
A
A1  
c
0.40  
0
0.50 0.45  
0.05  
-
E
E1  
0.120 0.180 0.150  
D
E
E1  
L
b
0.95  
0.95  
0.75  
0.05  
0.10  
1.05 1.00  
1.05 1.00  
0.85 0.80  
0.15 0.10  
0.20 0.15  
e
c
b (6 places)  
e
e1  
0.35 Typ  
0.70 Typ  
A
All Dimensions in mm  
A1  
4 of 5  
www.diodes.com  
December 2010  
© Diodes Incorporated  
DMN26D0UDJ  
Document number: DS31481 Rev. 5 - 2  
DMN26D0UDJ  
Suggested Pad Layout  
C
C
Dimensions Value (in mm)  
C
X
Y
0.350  
0.200  
0.200  
1.100  
Y1  
Y1  
Y (6X)  
X (6X)  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2010, Diodes Incorporated  
www.diodes.com  
5 of 5  
www.diodes.com  
December 2010  
© Diodes Incorporated  
DMN26D0UDJ  
Document number: DS31481 Rev. 5 - 2  

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