DMP3085LSD_15 [DIODES]

P-CHANNEL ENHANCEMENT MODE MOSFET;
DMP3085LSD_15
型号: DMP3085LSD_15
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

P-CHANNEL ENHANCEMENT MODE MOSFET

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中文:  中文翻译
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DMP3085LSD  
P-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features  
ID  
TA = +25°C  
-3.9A  
Low On-Resistance  
Package  
V(BR)DSS  
RDS(ON) MAX  
Low Input Capacitance  
70m@VGS = -10V  
95m@VGS = -4.5V  
Fast Switching Speed  
-30V  
SO-8  
-3.3A  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Qualified to AEC-Q101 standards for High Reliability  
Description  
This MOSFET has been designed to minimize the on-state resistance  
(RDS(ON)) and yet maintain superior switching performance, making it  
ideal for high efficiency power management applications.  
Mechanical Data  
Case: SO-8  
Case Material: Molded Plastic, "Green" Molding Compound  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminal Connections Indicator: See diagram  
Terminals: Finish Matte Tin annealed over Copper lead frame  
Solderable per MIL-STD-202, Method 208  
Weight: 0.074 grams (approximate)  
Applications  
Backlighting  
Power Management Functions  
DC-DC Converters  
D1  
D2  
S1  
G1  
S2  
D1  
D1  
D2  
D2  
SO-8  
G1  
G2  
G2  
S1  
S2  
Top View  
Internal Schematic  
Top View  
Equivalent Circuit  
Ordering Information (Note 4)  
Part Number  
Case  
Packaging  
DMP3085LSD-13  
SO-8  
2500/Tape & Reel  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant  
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.  
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at http://www.diodes.com.  
Marking Information  
Top View  
8
5
Logo  
Part no.  
P3085SD  
YY WW  
Xth week: 01~53  
Year: “12” = 2012  
1
4
1 of 6  
www.diodes.com  
May 2013  
© Diodes Incorporated  
DMP3085LSD  
Document number: DS36194 Rev. 1 - 0  
DMP3085LSD  
Maximum Ratings (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
VDSS  
Value  
-30  
Units  
V
V
Gate-Source Voltage  
±20  
VGSS  
TA = +25°C  
TA = +70°C  
Steady  
State  
-3.9  
-3.1  
A
A
ID  
ID  
Continuous Drain Current (Note 6) VGS = -10V  
TA = +25°C  
A = +70°C  
-4.9  
-3.9  
t<10s  
T
Maximum Continuous Body Diode Forward Current (Note 6)  
Pulsed Drain Current (10µs pulse, duty cycle = 1%)  
-2.5  
20  
A
A
IS  
IDM  
Thermal Characteristics  
Characteristic  
Symbol  
Value  
Units  
TA = +25°C  
1.1  
Total Power Dissipation (Note 5)  
W
PD  
RθJA  
PD  
TA = +70°C  
Steady State  
t<10s  
0.7  
107  
70  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
°C/W  
W
TA = +25°C  
1.7  
TA = +70°C  
Steady State  
t<10s  
1.1  
75  
50  
Thermal Resistance, Junction to Ambient (Note 6)  
RθJA  
°C/W  
°C  
Thermal Resistance, Junction to Case  
RθJC  
14.5  
Operating and Storage Temperature Range  
T
J, TSTG  
-55 to +150  
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 8)  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
-30  
-1  
V
BVDSS  
IDSS  
VGS = 0V, ID = -250µA  
VDS =-30V, VGS = 0V  
VGS = ±20V, VDS = 0V  
µA  
nA  
±100  
IGSS  
ON CHARACTERISTICS (Note 8)  
Gate Threshold Voltage  
-1  
50  
-3  
70  
V
VGS(th)  
VDS = VGS, ID = -250µA  
V
V
GS = -10V, ID = -5.3A  
GS = -4.5V, ID = -4.2A  
Static Drain-Source On-Resistance  
mΩ  
RDS (ON)  
75  
95  
Forward Transfer Admittance  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 9)  
Input Capacitance  
5.8  
-0.7  
S
V
|Yfs|  
VSD  
VDS = -5V, ID = -5.3A  
VGS = 0V, IS = -1A  
-1.2  
563  
48  
Ciss  
Coss  
Crss  
RG  
Output Capacitance  
pF  
VDS = -25V, VGS = 0V, f = 1.0MHz  
VDS = 0V, VGS = 0V, f = 1.0MHz  
Reverse Transfer Capacitance  
Gate Resistance  
41  
10.3  
5.2  
11  
Total Gate Charge (VGS = -4.5V)  
Total Gate Charge (VGS = -10V)  
Gate-Source Charge  
Qg  
Qg  
nC  
nS  
VDS = -15V, ID = -3.8A  
1.7  
1.9  
4.8  
5
Qgs  
Qgd  
tD(on)  
tr  
Gate-Drain Charge  
Turn-On Delay Time  
Turn-On Rise Time  
VDS = -15V, VGS = -10V,  
ID = -1A, RG = 6.0Ω  
Turn-Off Delay Time  
31  
tD(off)  
tf  
Turn-Off Fall Time  
14.6  
Notes:  
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.  
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.  
7. IAR and EAR rating are based on low frequency and duty cycles to keep TJ = 25°C.  
8. Short duration pulse test used to minimize self-heating effect.  
9. Guaranteed by design. Not subject to product testing.  
2 of 6  
www.diodes.com  
May 2013  
© Diodes Incorporated  
DMP3085LSD  
Document number: DS36194 Rev. 1 - 0  
DMP3085LSD  
20  
16  
12  
8
20.0  
16.0  
12.0  
8.0  
T
= 150°C  
V
= -10V  
= -4.5V  
V
= -5.0V  
A
GS  
DS  
T
A
= 85°C  
A
V
= -4.0V  
GS  
T
= 125°C  
A
T
= 25°C  
V
GS  
T
= -55°C  
A
V
= -3.0V  
GS  
4.0  
4
V
= -2.5V  
GS  
V
= -2.0V  
GS  
0.0  
0
0
1
2
3
4
5
0
1
2
3
4
5
6
-VDS, DRAIN-SOURCE VOLTAGE (V)  
-VGS, GATE-SOURCE VOLTAGE (V)  
Figure 1 Typical Output Characteristics  
Figure 2 Typical Transfer Characteristics  
1.0  
0.4  
0.35  
0.3  
V
= -4.5V  
GS  
T
= 150C  
A
0.25  
0.2  
T
A
= 125C  
V
= -4.5V  
GS  
0.1  
T
= 85C  
A
0.15  
0.1  
T
= 25C  
A
V
= -10V  
GS  
T
= -55C  
A
0.05  
0
0.01  
0
4
8
12  
16  
20  
-ID, DRAIN SOURCE CURRENT (A)  
-ID, DRAIN SOURCE CURRENT (A)  
Figure 3 Typical On-Resistance vs.  
Drain Current and Gate Voltage  
Figure 4 Typical On-Resistance vs.  
Drain Current and Temperature  
0.16  
0.14  
0.12  
0.1  
2
1.8  
1.6  
1.4  
1.2  
1
V
I
= -10V  
GS  
= -5.3A  
D
V
I
= -4.5V  
GS  
= -4.2A  
D
V
I
= -4.5V  
GS  
= -4.2A  
D
0.08  
0.06  
0.04  
0.02  
0
0.8  
0.6  
0.4  
0.2  
0
V
= -10V  
GS  
I
= -5.3A  
D
-50 -25  
TJ, JUNCTION TEMPERATURE (  
Figure 6 On-Resistance Variation with Temperature  
0
25  
50  
75 100 125 150  
75  
TJ, JUNCTION TEMPERATURE (  
Figure 5 On-Resistance Variation with Temperature  
-50 -25  
0
25  
50  
100 125 150  
C)  
C)  
3 of 6  
www.diodes.com  
May 2013  
© Diodes Incorporated  
DMP3085LSD  
Document number: DS36194 Rev. 1 - 0  
DMP3085LSD  
2.4  
1.6  
0.8  
0
20  
16  
12  
8
-I = 1mA  
D
-I = 250µA  
D
T = 25°C  
A
4
0
-50 -25  
0
25  
50  
75 100 125 150  
0
0.3  
0.6  
0.9  
1.2  
1.5  
-VSD, SOURCE-DRAIN VOLTAGE (V)  
TA, AMBIENT TEMPERATURE (°C)  
Figure 8 Diode Forward Voltage vs. Current  
Figure 7 Gate Threshold Variation vs. Ambient Temperature  
1000  
10  
9
8
7
6
5
4
3
2
1
0
f = 1MHz  
C
iss  
V
I
= -15V  
DS  
= -3.8A  
D
100  
C
oss  
C
rss  
10  
0
2
4
6
8
10  
Qg, TOTAL GATE CHARGE (nC)  
Figure 10 Gate-Charge Characteristics  
12  
0
5
10  
15  
20  
25  
30  
-VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 9 Typical Junction Capacitance  
4 of 6  
www.diodes.com  
May 2013  
© Diodes Incorporated  
DMP3085LSD  
Document number: DS36194 Rev. 1 - 0  
DMP3085LSD  
Package Outline Dimensions  
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.  
SO-8  
Min  
-
0.10  
1.30  
0.15  
0.3  
Dim  
A
A1  
A2  
A3  
b
Max  
1.75  
0.20  
1.50  
0.25  
0.5  
E1  
E
Gauge Plane  
Seating Plane  
A1  
L
D
E
E1  
e
h
L
  
4.85  
5.90  
3.85  
1.27 Typ  
-
0.62  
0  
4.95  
6.10  
3.95  
Detail ‘A’  
7°~9°  
h
°
45  
0.35  
0.82  
8  
Detail ‘A’  
A2  
A3  
A
All Dimensions in mm  
b
e
D
Suggested Pad Layout  
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.  
X
Dimensions Value (in mm)  
X
Y
C1  
C2  
0.60  
1.55  
5.4  
C1  
1.27  
C2  
Y
5 of 6  
www.diodes.com  
May 2013  
© Diodes Incorporated  
DMP3085LSD  
Document number: DS36194 Rev. 1 - 0  
DMP3085LSD  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2013, Diodes Incorporated  
www.diodes.com  
6 of 6  
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May 2013  
© Diodes Incorporated  
DMP3085LSD  
Document number: DS36194 Rev. 1 - 0  

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