DMP3085LSD_15 [DIODES]
P-CHANNEL ENHANCEMENT MODE MOSFET;型号: | DMP3085LSD_15 |
厂家: | DIODES INCORPORATED |
描述: | P-CHANNEL ENHANCEMENT MODE MOSFET |
文件: | 总6页 (文件大小:240K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DMP3085LSD
P-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
Features
ID
TA = +25°C
-3.9A
Low On-Resistance
Package
V(BR)DSS
RDS(ON) MAX
Low Input Capacitance
70mΩ @VGS = -10V
95mΩ @VGS = -4.5V
Fast Switching Speed
-30V
SO-8
-3.3A
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 standards for High Reliability
Description
This MOSFET has been designed to minimize the on-state resistance
(RDS(ON)) and yet maintain superior switching performance, making it
ideal for high efficiency power management applications.
Mechanical Data
Case: SO-8
Case Material: Molded Plastic, "Green" Molding Compound
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections Indicator: See diagram
Terminals: Finish Matte Tin annealed over Copper lead frame
Solderable per MIL-STD-202, Method 208
Weight: 0.074 grams (approximate)
Applications
Backlighting
Power Management Functions
DC-DC Converters
D1
D2
S1
G1
S2
D1
D1
D2
D2
SO-8
G1
G2
G2
S1
S2
Top View
Internal Schematic
Top View
Equivalent Circuit
Ordering Information (Note 4)
Part Number
Case
Packaging
DMP3085LSD-13
SO-8
2500/Tape & Reel
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com.
Marking Information
Top View
8
5
Logo
Part no.
P3085SD
YY WW
Xth week: 01~53
Year: “12” = 2012
1
4
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© Diodes Incorporated
DMP3085LSD
Document number: DS36194 Rev. 1 - 0
DMP3085LSD
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Drain-Source Voltage
Symbol
VDSS
Value
-30
Units
V
V
Gate-Source Voltage
±20
VGSS
TA = +25°C
TA = +70°C
Steady
State
-3.9
-3.1
A
A
ID
ID
Continuous Drain Current (Note 6) VGS = -10V
TA = +25°C
A = +70°C
-4.9
-3.9
t<10s
T
Maximum Continuous Body Diode Forward Current (Note 6)
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
-2.5
20
A
A
IS
IDM
Thermal Characteristics
Characteristic
Symbol
Value
Units
TA = +25°C
1.1
Total Power Dissipation (Note 5)
W
PD
RθJA
PD
TA = +70°C
Steady State
t<10s
0.7
107
70
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
°C/W
W
TA = +25°C
1.7
TA = +70°C
Steady State
t<10s
1.1
75
50
Thermal Resistance, Junction to Ambient (Note 6)
RθJA
°C/W
°C
Thermal Resistance, Junction to Case
RθJC
14.5
Operating and Storage Temperature Range
T
J, TSTG
-55 to +150
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
Symbol
Min
Typ
Max
Unit
Test Condition
-30
—
—
—
—
—
-1
V
BVDSS
IDSS
VGS = 0V, ID = -250µA
VDS =-30V, VGS = 0V
VGS = ±20V, VDS = 0V
µA
nA
—
±100
IGSS
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
-1
—
—
—
—
—
50
-3
70
V
VGS(th)
VDS = VGS, ID = -250µA
V
V
GS = -10V, ID = -5.3A
GS = -4.5V, ID = -4.2A
Static Drain-Source On-Resistance
mΩ
RDS (ON)
75
95
Forward Transfer Admittance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
5.8
-0.7
—
S
V
|Yfs|
VSD
VDS = -5V, ID = -5.3A
VGS = 0V, IS = -1A
-1.2
—
—
—
—
—
—
—
—
—
—
—
—
563
48
—
—
—
—
—
—
—
—
—
—
—
—
Ciss
Coss
Crss
RG
Output Capacitance
pF
VDS = -25V, VGS = 0V, f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1.0MHz
Reverse Transfer Capacitance
Gate Resistance
41
10.3
5.2
11
Ω
Total Gate Charge (VGS = -4.5V)
Total Gate Charge (VGS = -10V)
Gate-Source Charge
Qg
Qg
nC
nS
VDS = -15V, ID = -3.8A
1.7
1.9
4.8
5
Qgs
Qgd
tD(on)
tr
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
VDS = -15V, VGS = -10V,
ID = -1A, RG = 6.0Ω
Turn-Off Delay Time
31
tD(off)
tf
Turn-Off Fall Time
14.6
Notes:
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. IAR and EAR rating are based on low frequency and duty cycles to keep TJ = 25°C.
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.
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© Diodes Incorporated
DMP3085LSD
Document number: DS36194 Rev. 1 - 0
DMP3085LSD
20
16
12
8
20.0
16.0
12.0
8.0
T
= 150°C
V
= -10V
= -4.5V
V
= -5.0V
A
GS
DS
T
A
= 85°C
A
V
= -4.0V
GS
T
= 125°C
A
T
= 25°C
V
GS
T
= -55°C
A
V
= -3.0V
GS
4.0
4
V
= -2.5V
GS
V
= -2.0V
GS
0.0
0
0
1
2
3
4
5
0
1
2
3
4
5
6
-VDS, DRAIN-SOURCE VOLTAGE (V)
-VGS, GATE-SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristics
Figure 2 Typical Transfer Characteristics
1.0
0.4
0.35
0.3
V
= -4.5V
GS
T
= 150C
A
0.25
0.2
T
A
= 125C
V
= -4.5V
GS
0.1
T
= 85C
A
0.15
0.1
T
= 25C
A
V
= -10V
GS
T
= -55C
A
0.05
0
0.01
0
4
8
12
16
20
-ID, DRAIN SOURCE CURRENT (A)
-ID, DRAIN SOURCE CURRENT (A)
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
Figure 4 Typical On-Resistance vs.
Drain Current and Temperature
0.16
0.14
0.12
0.1
2
1.8
1.6
1.4
1.2
1
V
I
= -10V
GS
= -5.3A
D
V
I
= -4.5V
GS
= -4.2A
D
V
I
= -4.5V
GS
= -4.2A
D
0.08
0.06
0.04
0.02
0
0.8
0.6
0.4
0.2
0
V
= -10V
GS
I
= -5.3A
D
-50 -25
TJ, JUNCTION TEMPERATURE (
Figure 6 On-Resistance Variation with Temperature
0
25
50
75 100 125 150
75
TJ, JUNCTION TEMPERATURE (
Figure 5 On-Resistance Variation with Temperature
-50 -25
0
25
50
100 125 150
C)
C)
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DMP3085LSD
Document number: DS36194 Rev. 1 - 0
DMP3085LSD
2.4
1.6
0.8
0
20
16
12
8
-I = 1mA
D
-I = 250µA
D
T = 25°C
A
4
0
-50 -25
0
25
50
75 100 125 150
0
0.3
0.6
0.9
1.2
1.5
-VSD, SOURCE-DRAIN VOLTAGE (V)
TA, AMBIENT TEMPERATURE (°C)
Figure 8 Diode Forward Voltage vs. Current
Figure 7 Gate Threshold Variation vs. Ambient Temperature
1000
10
9
8
7
6
5
4
3
2
1
0
f = 1MHz
C
iss
V
I
= -15V
DS
= -3.8A
D
100
C
oss
C
rss
10
0
2
4
6
8
10
Qg, TOTAL GATE CHARGE (nC)
Figure 10 Gate-Charge Characteristics
12
0
5
10
15
20
25
30
-VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 9 Typical Junction Capacitance
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DMP3085LSD
Document number: DS36194 Rev. 1 - 0
DMP3085LSD
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
SO-8
Min
-
0.10
1.30
0.15
0.3
Dim
A
A1
A2
A3
b
Max
1.75
0.20
1.50
0.25
0.5
E1
E
Gauge Plane
Seating Plane
A1
L
D
E
E1
e
h
L
4.85
5.90
3.85
1.27 Typ
-
0.62
0
4.95
6.10
3.95
Detail ‘A’
7°~9°
h
°
45
0.35
0.82
8
Detail ‘A’
A2
A3
A
All Dimensions in mm
b
e
D
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
X
Dimensions Value (in mm)
X
Y
C1
C2
0.60
1.55
5.4
C1
1.27
C2
Y
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DMP3085LSD
Document number: DS36194 Rev. 1 - 0
DMP3085LSD
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
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Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
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use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
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Document number: DS36194 Rev. 1 - 0
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