DT1452-02SO-7 [DIODES]

Trans Voltage Suppressor Diode, 5.5V V(RWM), Unidirectional, 1 Element, Silicon;
DT1452-02SO-7
型号: DT1452-02SO-7
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

Trans Voltage Suppressor Diode, 5.5V V(RWM), Unidirectional, 1 Element, Silicon

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DT1452-02SO  
2 CHANNEL LOW CAPACITANCE TVS DIODE ARRAY  
Features  
Mechanical Data  
IEC 61000-4-2 (ESD): Air – ±16kV, Contact – ±16kV  
Case: SOT23  
IEC 61000-4-4 (EFT) Additional Level, 55A (5/50ns)  
IEC 61000-4-5 (Lightning): 5A (8/20µs)  
Case Material: Molded Plastic, “Green” Molding Compound. UL  
Flammability Classification Rating 94V-0  
2 Channels of ESD protection  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals: Matte Tin Finish annealed over Alloy 42 lead frame  
(Lead Free Plating). Solderable per MIL-STD-202, Method 208  
Weight: 0.009 grams (approximate)  
Low Channel Input Capacitance of 1.2pF Typical  
Typically Used at High Speed Ports such as USB 2.0,  
IEEE1394, Serial ATA, DVI, HDMI, PCI  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
SOT23  
I/O 1  
VSS  
I/O 2  
Top View  
Device Schematic  
Ordering Information (Note 4)  
Product  
Compliance  
Marking  
Reel Size (inches)  
Tape Width (mm)  
Quantity per Reel  
DT1452-02SO-7  
Standard  
BD1  
7
8
3,000/Tape & Reel  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.  
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"  
and Lead-free.  
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.  
Marking Information  
BD1 = Product Type Marking Code  
YM = Date Code Marking  
Y = Year (ex: A = 2013)  
BD1  
M = Month (ex: 5 = May)  
Date Code Key  
Year  
2013  
2014  
2015  
2016  
2017  
2018  
Code  
A
B
C
D
E
F
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
1 of 5  
www.diodes.com  
December 2013  
© Diodes Incorporated  
DT1452-02SO  
Document number: DS36355 Rev. 2 - 2  
DT1452-02SO  
Maximum Ratings (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Symbol  
IPP_I/O  
Value  
5
Unit  
A
Conditions  
Peak Pulse Current  
I/O to VSS, 8/20µs  
ESD Protection – Contact Discharge  
ESD Protection – Air Discharge  
±16  
±16  
kV  
kV  
VESD_I/O_Contact  
VESD_I/O_Air  
I/O to VSS, per IEC 61000-4-2  
I/O to VSS, per IEC 61000-4-2  
Thermal Characteristics  
Characteristic  
Power Dissipation (Note 5)  
Symbol  
Value  
Unit  
mW  
300  
417  
PD  
Thermal Resistance, Junction to Ambient (Note 5)  
Operating and Storage Temperature Range  
°C/W  
RθJA  
-55 to +150  
°C  
TJ, TSTG  
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Reverse Working Voltage  
Reverse Leakage Current (Note 6)  
Reverse Breakdown Voltage  
Forward Voltage  
Symbol  
VRWM  
IR  
Min  
7
Typ  
Max  
5.5  
1.0  
10  
Unit  
V
Test Conditions  
μA  
V
VR =5V, I/O to VSS  
VBR  
VF  
IR = 1mA, I/O to VSS  
IF = 15mA, VSS to I/O  
IPP = 5A, I/O to VSS, 8/20µs  
0.85  
8.5  
11  
1.1  
V
Reverse Clamping Voltage (Note 7)  
ESD Clamping Voltage  
V
VC  
V
VESD  
RDIF  
CI/O  
TLP, 20A, tp = 100 ns, I/O to VSS, per Figure7  
TLP, 20A, tp = 100 ns, I/O to VSS, per Figure7  
VR = 2.5V, f = 1MHz  
Dynamic Resistance  
0.22  
1.2  
Channel Input Capacitance  
1.7  
pF  
V
SS = 0V, I/O = 2.5V, f =1MHz, T=+25°C ,  
Variation of Channel Input Capacitance  
0.03  
pF  
CI/O  
I/O_x to VSS – I/O_y to VSS  
Notes:  
5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website  
at http://www.diodes.com.  
6. Short duration pulse test used to minimize self-heating effect.  
7. Clamping voltage value is based on an 8x20µs peak pulse current (Ipp) waveform.  
100  
75  
50  
25  
0
9.5  
9.0  
8.5  
8.0  
7.5  
7.0  
6.5  
6.0  
VTRIG  
BV  
0
25  
50  
75 100 125 150 175 200  
-60-45-30-15 0 15 30 45 60 75 90 10 12 13 15  
TA, AMBIENT TEMPERATURE (°C )  
Figure 2 BV, Trigger Voltage vs. Ambient Temperature  
TA, AMBIENT TEMPERATURE (°C)  
Figure 1 Pulse Derating Curve  
2 of 5  
www.diodes.com  
December 2013  
© Diodes Incorporated  
DT1452-02SO  
Document number: DS36355 Rev. 2 - 2  
DT1452-02SO  
2.4  
2.1  
1.8  
1.5  
1.2  
0.9  
0.6  
0.3  
0.0  
12  
11  
10  
9
F=1MHz  
8
7
6
5
6
7
8
9
10  
11  
12  
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0  
CURRENT FROM I/O TO Vss(A)  
VI/O, INPUT VOLTAGE (V)  
Figure 4 Clamping Voltage Characteristic  
Figure 3 Input Capacitance vs. Input Voltage  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
9
8
7
6
5
4
3
2
1
0
Voltage  
Ampere  
-40 -30 -20 -10  
0
10 20 30 40 50 60 70  
4
5
6
7
8
9
10  
11  
12  
t, TIME (µs)  
CURRENT FROM VSS TO I/O (A)  
Figure 6 Waveform of Clamping Voltage,Current vs.  
Time (8/20µs, I/O to VSS  
Figure 5 Forward Voltage Characteristic  
)
20  
18  
16  
14  
12  
10  
8
6
4
2
0
0
2
4
6
8
10  
12  
14  
TLP VOLTAGE (V)  
Figure 7 Transmission Line Pulsing (TLP)  
Current vs. Voltage  
3 of 5  
www.diodes.com  
December 2013  
© Diodes Incorporated  
DT1452-02SO  
Document number: DS36355 Rev. 2 - 2  
DT1452-02SO  
Package Outline Dimensions  
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.  
SOT23  
Dim  
A
B
C
D
F
G
H
J
Min  
Max  
0.51  
1.40  
2.50  
1.03 0.915  
0.60 0.535  
Typ  
0.37  
1.20  
2.30  
0.89  
0.45  
1.78  
2.80  
0.40  
1.30  
2.40  
2.05  
3.00  
1.83  
2.90  
0.05  
0.013 0.10  
0.890 1.00 0.975  
0.903 1.10 1.025  
K
K1  
0.45  
0.25  
0.61  
0.55  
0.55  
0.40  
L
L1  
M
0.085 0.150 0.110  
8°  
  
All Dimensions in mm  
Suggested Pad Layout  
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.  
Dimensions Value (in mm)  
Z
X
Y
C
E
2.9  
0.8  
0.9  
2.0  
1.35  
4 of 5  
www.diodes.com  
December 2013  
© Diodes Incorporated  
DT1452-02SO  
Document number: DS36355 Rev. 2 - 2  
DT1452-02SO  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2013, Diodes Incorporated  
www.diodes.com  
5 of 5  
www.diodes.com  
December 2013  
© Diodes Incorporated  
DT1452-02SO  
Document number: DS36355 Rev. 2 - 2  

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