MMBD4448DW_09 [DIODES]
SURFACE MOUNT SWITCHING DIODE; 表面贴装开关二极管型号: | MMBD4448DW_09 |
厂家: | DIODES INCORPORATED |
描述: | SURFACE MOUNT SWITCHING DIODE |
文件: | 总3页 (文件大小:77K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MMBD4448DW
SURFACE MOUNT SWITCHING DIODE
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Features
Mechanical Data
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•
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•
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Fast Switching Speed
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Case: SOT-363
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Surface Mount Package Ideally Suited for Automated Insertion
For General Purpose Switching Applications
High Conductance
•
•
Ultra Miniature Package
Lead Free/RoHS Compliant (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
"Green" Device (Notes 4 and 5)
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•
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Polarity: See Diagram
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.006 grams (approximate)
SOT-363
NC
C1
A2
A1
C2
NC
TOP VIEW
Internal Schematic
TOP VIEW
Maximum Ratings @T = 25°C unless otherwise specified
A
Characteristic
Non-Repetitive Peak Reverse Voltage
Symbol
VRM
Value
100
Unit
V
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
75
V
RMS Reverse Voltage
53
V
VR(RMS)
Forward Continuous Current
(Note 1)
(Note 1)
500
250
4
2
mA
mA
IFM
Average Rectified Output Current
Non-Repetitive Peak Forward Surge Current
IO
@ t < 1μs
@ t < 1s
A
IFSM
Thermal Characteristics
Characteristic
Power Dissipation
Symbol
PD
Value
200
Unit
mW
°C/W
°C
(Note 1)
(Note 1)
Thermal Resistance Junction to Ambient Air
Operating and Storage Temperature Range
625
Rθ
JA
-65 to +150
TJ , TSTG
Electrical Characteristics @T = 25°C unless otherwise specified
A
Characteristic
Reverse Breakdown Voltage
Symbol
V(BR)R
Min
75
Max
⎯
Unit
V
Test Condition
IR = 10μA
(Note 2)
IF = 5.0mA
IF = 10mA
IF = 50mA
IF = 150mA
0.62
⎯
⎯
0.720
0.855
1.0
Forward Voltage
Reverse Current
V
VF
1.25
⎯
VR = 75V
μA
μA
μA
nA
2.5
50
30
25
VR = 75V, TJ = 150°C
VR = 25V, TJ = 150°C
VR = 20V
(Note 2)
IR
⎯
Total Capacitance
4.0
4.0
pF
CT
trr
⎯
⎯
VR = 0, f = 1.0MHz
IF = IR = 10mA,
Irr = 0.1 x IR, RL = 100Ω
Reverse Recovery Time
ns
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
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February 2009
© Diodes Incorporated
MMBD4448DW
Document number: DS31035 Rev. 11 - 2
MMBD4448DW
250
200
1,000
100
150
100
50
10
1
0.1
0
120
TA, AMBIENT TEMPERATURE (
Fig. 1 Power Derating Curve, Total Package
0
40
80
160
200
0.4
0.8
1.2
1.6
0
°
C)
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics, Per Elelment
10,000
1,000
100
3
2.5
2
1.5
1
10
1
0.5
0
0
0.1
40
20
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
Fig. 3 Typical Reverse Characteristics, Per Element
40
60
80
100
20
VR,DC REVERSE VOLTAGE (V)
10
30
0
Fig. 4 Total Capacitance vs. Reverse Voltage, Per Element
Ordering Information (Note 6)
Part Number
Case
Packaging
MMBD4448DW-7-F
SOT-363
3000/Tape & Reel
Notes:
6. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
KA3 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: N = 2002)
KA3 YM
M Y
K A 3
M = Month (ex: 9 = September)
Date Code Key
Year
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
Code
L
M
N
P
R
S
T
U
V
W
X
Y
Z
Month
Code
Jan
Feb
Mar
Apr
May
Jun
Jul
Aug
Sep
Oct
Nov
Dec
1
2
3
4
5
6
7
8
9
O
N
D
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February 2009
© Diodes Incorporated
MMBD4448DW
Document number: DS31035 Rev. 11 - 2
MMBD4448DW
Package Outline Dimensions
A
SOT-363
Min
0.10
1.15
2.00
Dim
A
B
C
D
F
H
J
K
L
Max
0.30
1.35
2.20
B C
0.65 Typ
0.40
1.80
0
0.90
0.25
0.10
0°
0.45
2.20
0.10
1.00
0.40
0.22
8°
H
K
M
J
M
α
L
D
F
All Dimensions in mm
Suggested Pad Layout
C2
C2
Dimensions Value (in mm)
Z
G
2.5
1.3
X
Y
0.42
0.6
C1
G
Z
C1
C2
1.9
0.65
Y
X
IMPORTANT NOTICE
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product
described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall
assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,
harmless against all damages.
LIFE SUPPORT
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written
approval of the President of Diodes Incorporated.
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February 2009
© Diodes Incorporated
MMBD4448DW
Document number: DS31035 Rev. 11 - 2
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