PAM2804AAB010 [DIODES]
LED DISPLAY DRIVER, PDSO5, TSOT-25, 5 PIN;![PAM2804AAB010](http://pdffile.icpdf.com/pdf2/p00225/img/icpdf/PAM2804AAB01_1319871_icpdf.jpg)
型号: | PAM2804AAB010 |
厂家: | ![]() |
描述: | LED DISPLAY DRIVER, PDSO5, TSOT-25, 5 PIN PC 驱动 光电二极管 接口集成电路 |
文件: | 总10页 (文件大小:443K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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PAM2804
1A STEP-DOWN CONSTANT CURRENT, HIGH EFFICIENCY LED DRIVER
Description
Pin Assignments
The PAM2804 is a step-down constant current LED driver. When the
input voltage is down to lower than LED forward voltage, then
PAM2804 goes into LDO mode.
Top View
TSOT25
The PAM2804 supports a range of input voltages from 2.5V to 6.0V,
allowing the use of a single Li+/Li-polymer cell, 3AA or 4AA cell, USB,
and other standard power sources.
The FB voltage is only 0.1V to achieve high efficiency.
PAM2804 employs internal power switch and synchronous rectifier to
minimize external part count and realize high efficiency.
Applications
During shutdown, the input is disconnected from the output and the
shutdown current is less than 1µA. Other key features include
undervoltage lockout to prevent deep battery discharge of the Li+
battery.
3AA or 4AA Batteries Powered Flashlight
1 Cell Li-Ion Battery Powered Flashlight
Features
Efficiency up to 93%
180µA(typ) Quiescent Current
Output Current: Up to 1A
Internal Synchronous Rectifier
1.5MHz Switching Frequency
Soft-Start
Undervoltage Lockout
Short LED Protection
Open LED Protection
Thermal Shutdown
5-Pin Small TSOT25 Packages
Pb-Free Package
Typical Applications Circuit
ILED = 0.1/RS
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© Diodes Incorporated
PAM2804
Document number: DS36403 Rev. 3 - 2
PAM2804
Pin Description
Pin
Name
Pin
Number
Function
Enable control input. Force this pin voltage above 1.5V, enables the chip,
and below 0.3V shuts down the device.
EN
1
GND
SW
VIN
FB
Ground
2
3
4
5
The drains of the internal main and synchronous power MOSFET.
Chip main power supply pin.
Feedback voltage to internal error amplifier, the threshold voltage is 0.1V.
Block Diagram
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
These are stress ratings only and functional operation is not implied. Exposure to absolute maximum ratings for prolonged time periods may
affect device reliability. All voltages are with respect to ground.
Parameter
Input Pin Voltage
Rating
Unit
-0.3 to +6.5
-0.3 to VIN
EN, FB Pin Voltage
V
SW Pin Voltage
-0.3 to (VIN +0.3)
150
Junction Temperature Range
Storage Temperature Range
Soldering Temperature
-65 to +150
+300, 5sec
°C
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© Diodes Incorporated
PAM2804
Document number: DS36403 Rev. 3 - 2
PAM2804
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Parameter
Rating
2.5 to 6.0
-40 to +85
-40 to +125
Unit
Supply Voltage
Operation Temperature Range
Junction Temperature Range
°C
Thermal Information
Parameter
Symbol
θJC
Package
TSOT25 (Note 1)
TSOT25
Max
130
250
400
Unit
Thermal Resistance (Junction to Case)
Thermal Resistance (Junction to Ambient)
Internal Power Dissipation
°C/W
mW
θJA
TSOT25
PD
Note:
1. The maximum output current for TSOT25 package is limited by internal power dissipation capacity as described in Application Information herein after.
Electrical Characteristics
(@TA = +25°C, VIN = 4.2V, Real WLED load, L = 4.7µH, CIN = 10µF, CO = 10µF, unless otherwise specified.)
Parameter
Input Voltage Range
Regulated Feedback Voltage
Peak Inductor Current
Quiescent Current
Symbol
VIN
Test Conditions
Min
Typ
-
Max
Units
V
-
-
2.5
6.0
0.095
0.100
1.5
180
-
0.105
V
VFB
IPK
-
-
A
VIN = 5V
No Load
-
-
1
µA
µA
MHz
Ω
IQ
Shutdown Current
-
ISD
VEN = 0V
Oscillator Frequency
1.2
1.5
0.30
0.35
±0.01
93
1.8
0.45
0.50
1
fOSC
VO = 100%
P MOSFET
N MOSFET
-
Drain-Source On-State Resistance
RDS(ON)
IDS = 100mA
-
-
Ω
SW Leakage Current
High Efficiency
-
-
-
µA
%
ILSW
η
-
-
EN Threshold High
1.5
-
-
V
VEH
VEL
IEN
EN Threshold Low
-
-
-
-
-
-
-
-
-
0.3
V
EN Leakage Current
Over-Temperature Protection
OTP Hysteresis
±0.01
+150
+30
-
-
-
µA
°C
°C
OTP
OTH
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© Diodes Incorporated
PAM2804
Document number: DS36403 Rev. 3 - 2
PAM2804
Typical Performance Characteristics (@TA = +25°C, L = 4.7µF, CIN = 10µF, CO = 10µF, unless otherwise specified.)
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© Diodes Incorporated
PAM2804
Document number: DS36403 Rev. 3 - 2
PAM2804
Typical Performance Characteristics (cont.) @TA = +25°C, L = 4.7µF, CIN = 10µF, CO = 10µF, unless otherwise specified.)
Start up with Enable
PWM Dimming: ILED vs. Duty Cycle
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© Diodes Incorporated
PAM2804
Document number: DS36403 Rev. 3 - 2
PAM2804
Application Information
PWM Dimming
The PAM2804 can be used to dim LED current dimming by driving the EN pin via PWM waveform. The SW pin current is then effectively
switched on and off causing the LED current to turn on and off. The recommended PWM frequency is 500Hz (see Figure on page 5 for details).
Inductor Selection
The basic PAM2804 application circuit is shown in Page 1. External component selection is determined by the load requirement, selecting L first
and then CIN and COUT
.
For most applications, the value of the inductor will fall within the range of 1μH to 4.7μH. Its value is chosen based on the desired ripple current.
Large value inductors lower ripple current and small value inductors result in higher ripple currents. Higher VIN or VOUT also increases the ripple
current as shown in equation 1. A reasonable starting point for setting ripple current is ΔIL = 400mA (40% of 1A).
OUT
1
V
OUT
IL
1
Equation (1)
V
f
L
VIN
The DC current rating of the inductor should be at least equal to the maximum load current plus half the ripple current to prevent core saturation.
Thus, a 1.4A rated inductor should be enough for most applications (1A + 400mA). For better efficiency, choose a low DC-resistance inductor.
Using Ceramic Input Output Capacitors
Higher values, lower cost ceramic capacitors are now becoming available in smaller case sizes. Their high ripple current, high voltage rating and
low ESR make them ideal for switching regulator applications. Using ceramic capacitors can achieve very low output ripple and small circuit size.
When choosing the input and output ceramic capacitors, choose the X5R or X7R dielectric formulations. These dielectrics have the best
temperature and voltage characteristics of all the ceramics for a given value and size.
Thermal Consideration
Thermal protection limits power dissipation in the PAM2804. When the junction temperature exceeds +150°C, the OTP (Overtemperature
Protection) starts the thermal shutdown and turns the pass transistor off. The pass transistor resumes operation after the junction temperature
drops below +120°C.
For continuous operation, the junction temperature should be maintained below +125°C. The power dissipation is defined as:
VORDS(ON)H VIN VO RDS(ON)L
2
FSIO
PD IO
tSW
IQ VIN
VIN
IQ is the step-down converter quiescent current. The term tsw is used to estimate the full load step-down converter switching losses.
For the condition where the step-down converter is in dropout at 100% duty cycle, the total device dissipation reduces to:
2
PD IO RDS(ON)H IQ VIN
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© Diodes Incorporated
PAM2804
Document number: DS36403 Rev. 3 - 2
PAM2804
Application Information (cont.)
Since RDS(ON), quiescent current, and switching losses all vary with input voltage, the total losses should be investigated over the complete input
voltage range. The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of surrounding airflow
and temperature difference between junction and ambient. The maximum power dissipation can be calculated by the following formula:
TJ(MAX) TA
PD
JA
Where TJ(MAX) is the maximum allowable junction temperature +125°C. TA is the ambient temperature and θJA is the thermal resistance from the
junction to the ambient. Based on the standard JEDEC for a two layers thermal test board, the thermal resistance θJA of TSOT25 package is
250°C/W. The maximum power dissipation at TA = +25°C can be calculated by following formula:
125C 25C / 250C /W 0.4W
PD
Setting the Output Current
The internal feedback (FB) voltage is 0.1V (Typical). The output current is calculated as below:
0.1/
ILED
RS
The output Current is given by the following table.
RS(Ω)
0.286
0.143
0.1
ILED(mA)
350
700
1,000
As the input voltage approaches the LED forward voltage, the PAM2804 turns the P-Channel transistor continuously on. In this mode, the voltage
drop on LED is equal to the input voltage minus the voltage drop across the P-Channel transistor, Inductor and current resistor:
ILED
VLEDDROP VIN
RDS(ON) RL RS
Where RDS(ON) = P-Channel switch ON resistance, ILED = LED current, RL = Inductor DC Resistance, RS = Inductor DC Resistance.
Thermal Shutdown
When the die temperature exceeds +150°C, a reset occurs and the reset remains until the temperature decrease to +120°C, at which time the
circuit can be restarted.
PCB Layout Check List
When laying out the printed circuit board, the following checklist should be used to ensure proper operation of the PAM2804. These items are
also illustrated graphically in Figure 1. Check the following in your layout:
1. The power traces, consisting of the GND trace, the SW trace and the VIN trace should be kept short, direct and wide.
2. Does the VFB pin connect directly to the current sense resistor? The current sense resistor to GND trace should be kept short, direct and wide.
3. Does the (+) plate of CIN connect to VIN as closely as possible? This capacitor provides the AC current to the internal power MOSFETs.
4. Keep the switching node, SW, away from the sensitive VFB node.
5. Keep the (–) plates of CIN and COUT as close as possible.
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© Diodes Incorporated
PAM2804
Document number: DS36403 Rev. 3 - 2
PAM2804
Ordering Information
PAM2804 X X X xxx
Package Type
Number of Pins
B: 5
FB Voltage
010: 0.1V
Pin Configuration
A Type:
A: TSOT25
1. EN
2. GND
3. SW
4. VIN
5. FB
Part Number
Marking
Package Type
Standard Package
3,000 Units/Tape & Reel
Refer to Marking
Information Below
PAM2804AAB010
TSOT25
Marking Information
Top View
TSOT25
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© Diodes Incorporated
PAM2804
Document number: DS36403 Rev. 3 - 2
PAM2804
Package Outline Dimensions
TSOT25
D
e1
01( 4x)
E1/2
E1
TSOT25
Min Max
- 1.00
0.01 0.10
0.84 0.90
0.30 0.45
0.12 0.20
Dim
A
A1
A2
b
Typ
-
-
-
-
-
E/2
c
E
Gauge Plane
Seating Plane
0
c
D
E
E1
e
e1
L
L2
θ
θ1
-
-
-
-
-
-
2.90
2.80
1.60
L
L2
01( 4x)
e
b
0.95 BSC
1.90 BSC
A2
0.30 0.50
0.25 BSC
8°
12°
A1
A
0°
4°
4°
-
Seating Plane
All Dimensions in mm
Suggested Pad Layout
TSOT25
C
Dimensions Value (in mm)
C
X
Y
0.950
0.700
1.000
3.199
Y1
Y1
Y
X
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© Diodes Incorporated
PAM2804
Document number: DS36403 Rev. 3 - 2
PAM2804
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and
any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or
systems.
Copyright © 2015, Diodes Incorporated
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© Diodes Incorporated
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Document number: DS36403 Rev. 3 - 2
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