RH02-T [DIODES]
0.5A SURFACE MOUNT GLASS PASSIVATED FAST RECOVERY BRIDGE RECTIFIER; 0.5A表面安装玻璃钝化快速恢复整流桥
| 型号： | RH02-T |
| 厂家： | 
DIODES INCORPORATED |
| 描述： | 0.5A SURFACE MOUNT GLASS PASSIVATED FAST RECOVERY BRIDGE RECTIFIER |
| 文件： | 总3页 (文件大小：70K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SPICE MODELS: RH02 RH04 RH06
RH02 - RH06
0.5A SURFACE MOUNT GLASS PASSIVATED FAST
RECOVERY BRIDGE RECTIFIER
Features
·
·
·
·
·
·
Glass Passivated Die Construction
Low Forward Voltage Drop
MiniDIP
Surge Overload Rating to 30A Peak
Ideally Suited for Automatic Assembly
Miniature Package Saves Space on PC Boards
Lead Free Finish, RoHS Compliant (Note 4)
Dim
B
C
D
E
Min
3.6
0.15
¾
Max
4.0
L
G
0.35
0.20
7.0
B
D E
Mechanical Data
¾
·
·
Case: MiniDIP
F
¾
3.00
1.10
4.9
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
G
H
J
0.70
4.5
2.3
2.3
0.50
H
C
J
·
Terminals: Finish ¾ Bright Tin. Plated Leads, Solderable
per MIL-STD-202, Method 208
F
2.7
K
K
L
2.7
·
·
·
Polarity: As Marked on Case
Marking: Type Number
0.80
Weight: 0.125 grams (approx.)
All Dimensions in mm
@ TA = 25°C unless otherwise specified
Maximum Ratings and Electrical Characteristics
Characteristic
Symbol
RH02
200
RH04
RH06
600
Unit
VRMM
VRWM
VDC
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
400
V
VRMS
IO
RMS Reverse Voltage
140
280
0.5
420
V
A
Average Forward Rectified Current (Note 1) TA = @ 40°C
Non-Repetitive Peak Forward Surge Current, 8.3 ms
Single half-sine-wave Superimposed on Rated Load
(JEDEC method)
IFSM
30
A
VF
IR
Instantaneous Voltage Drop @ 0.4A (per element)
1.15
V
Peak Reverse Current at Rated
@ TA = 25°C
@ TA = 125°C
5.0
100
mA
DC Blocking Voltage (per element)
trr
Cj
Maximum Reverse Recovery Time
(Note 3)
150
250
ns
pF
Typical Junction Capacitance (per element)
(Note 2)
13.0
85
RqJA
Tj, TSTG
Typical Thermal Resistance, Junction to Ambient (Note 1)
Operating and Storage Temperature Range
K/W
°C
-55 to +150
Notes:
1. Mounted on Glass Epoxy PC Board.
2. Measured at 1.0 MHz and Applied Reverse Voltage of 4.0 V.
3. t test conditions: I = 0.5A, I = 1.0A, I = 0.25A.
rr rr
F
R
4. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
DS30137 Rev. 6 - 2
1 of 3
RH02 - RH06
www.diodes.com
ã Diodes Incorporated
10
1.0
0.8
0.6
0.4
Alumina Substrate
Glass Epoxy PC Board
0.1
0.2
0
Resistive or Inductive Load
0.01
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0
40
80
120
160
TA, AMBIENT TEMPERATURE (°C)
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics (per leg)
Fig. 1 Output Current Derating Curve
100
35
Tj = 25°C
f = 1.0MHz
30
20
10
10
0
TA = 25°C
Single Half Sine-Wave
Pulse Width = 5.3ms
(JEDEC Method)
1
1
10
100
1.0
10
NUMBER OF CYCLES AT 60 Hz
Fig. 3 Maximum Peak Forward Surge Current (per leg)
VR, REVERSE VOLTAGE (V)
Fig. 4 Typical Junction Capacitance
100
Tj = 125°C
10
1.0
Tj = 25°C
0.1
0.01
0
20
40
60
80
100 120 140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Fig. 5 Typical Reverse Characteristics (per element)
DS30137 Rev. 6 - 2
2 of 3
RH02 - RH06
www.diodes.com
(Note 5)
Ordering Information
Device
Packaging
Shipping
RH0x-T
MiniDIP
3000/Tape & Reel
Notes:
5. For Packaging Details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
DS30137 Rev. 6 - 2
3 of 3
RH02 - RH06
www.diodes.com
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