SOT563 [DIODES]

SUGGESTED PAD LAYOUT; 拟议的焊盘布局

SOT563


型号：	SOT563
厂家：	DIODES INCORPORATED
描述：	SUGGESTED PAD LAYOUT 拟议的焊盘布局
文件：	总27页 (文件大小：388K)
下载：	下载PDF数据表文档文件

SOT-563

5 Volts ESD Protection Device

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19 MCC

SOT-563

OUTLINE

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193 SYNC-POWER

SOT570-3

32-bit ARM Cortex-M4/M0 MCU; up to 264 kB SRAM; Ethernet; two High-speed USBs; advanced configurable peripherals

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22 PHILIPS

SOT570-3

32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD, and external memory controller

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9 PHILIPS

SOT666

SUGGESTED PAD LAYOUT

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20 DIODES

SOT666

GPS HIGH GAIN LNA ICs

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81 STMICROELECTR

SOT666

SUGGESTED PAD LAYOUT

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50 DIODES

SOT666

GPS HIGH GAIN LNA ICs

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49 STMICROELECTR

SOT684-2

Package outline

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13 PHILIPS

SOT684-2

Package outline

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17 PHILIPS

SOT685-1

Package outline

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8 PHILIPS

SOT685-1

Package outline

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13 PHILIPS

SOT740-2

32-bit ARM Cortex-M4/M0 MCU; up to 264 kB SRAM; Ethernet; two High-speed USBs; advanced configurable peripherals

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22 PHILIPS

SOT740-2

32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD, and external memory controller

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13 PHILIPS

SOT765-1

plastic very thin shrink small outline package; 8 leads; body width 2.3 mm

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59 PHILIPS

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