SOT89-3 [DIODES]
SUGGESTED PAD LAYOUT; 拟议的焊盘布局
| 型号： | SOT89-3 |
| 厂家： | 
DIODES INCORPORATED |
| 描述： | SUGGESTED PAD LAYOUT |
| 文件： | 总14页 (文件大小：183K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SUGGESTED PAD LAYOUT
Based on IPC-7351A
X1-DFN1006-2 / X2-DFN1006-2 / MiniMELF / MELF / SOD323 / SOD123 / SOD523 / SMA / SMB / SMC
C
X
G
Z
Y
X1-DFN1006-2 /
X2-DFN1006-2
Dimensions
MiniMELF
MELF
SOD123
SOD323
SOD523
SMA
SMB
SMC
Z
G
X
Y
C
1.1
0.3
0.7
0.4
0.7
4.7
2.1
1.7
1.3
3.5
6.3
3.3
2.7
1.5
4.8
4.9
2.5
0.7
1.2
3.7
3.75
1.05
0.65
1.35
2.40
2.3
1.1
0.8
0.6
1.7
6.5
1.5
1.7
2.5
4.0
6.8
1.8
2.3
2.5
4.3
9.4
4.4
3.3
2.5
6.8
X3-DFN0603-2
X1-DFN1006-3 / X2-DFN1006-3
C
Z
Dimensions Value (in mm)
C
X
1
Z
G1
G2
X
1.1
0.3
0.2
0.7
0.25
0.4
0.7
Dimensions Value (in mm)
C
X
Y
Z
0.355
0.230
0.300
0.610
G2
X
Y (2x)
X1
Y
G1
C
Y
X (2x)
Z
X1-DFN1212-3
X
Y
Dimensions
Value (in mm)
0.80
C
X
0.42
X1
(2x)
X1
Y
0.32
0.50
Y2
Y1
Y2
0.50
1.50
Y1
(2x)
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
1 of 14
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Suggested Pad Layout
© Diodes Incorporated
X1-DFN1212-3
Type B
X
Dimensions
Value (in mm)
0.80
Y
C
X
0.42
X2
X1
X2
Y
Y1
Y2
Y3
0.32
0.90
0.50
0.50
0.20
1.50
Y3 Y2
X1(2x)
Y1
(2x)
C
X1-DFN1411-3
C
Dimensions
Value (in mm)
1.38
Z
G1
G2
X
X2
0.15
0.15
0.95
X1
X
G2
X1
X2
Y
0.75
0.40
0.75
Y
C
0.76
G1
Z
X1-DFN1612-6 / X2-DFN1310-6
G2
X2
Dimensions X1-DFN1612-6 X2- DFN1310-6
G1
G2
G3
X1
X2
Y1
Y2
a
0.15
0.175
0.15
0.60
0.25
0.65
0.45
0.10
0.15
0.16
0.17
0.15
0.52
0.20
0.52
0.375
0.09
0.06
Y2
G1
b
Y1
X1
b
a
G3
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
2 of 14
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
U-DFN1616-6
U-DFN1616-8
Y
X2
a
G2
C
Dimensions Value (in mm)
Y2
Y1
Dimensions Value (in mm)
X2
G1
G2
X1
X2
Y1
Y2
C
0.15
0.20
0.65
0.25
1.25
0.50
0.40
0.10
Z
G
X1
X2
Y
1.3
0.175
0.50
0.525
0.30
0.50
G
X1
G1
C
a
C
X1
Z
U-DFN2018-6
X
C
Y
Dimensions
Value (in mm)
0.50
C
G
0.20
Y1
X
0.25
X1
Y
1.60
0.35
Y1
1.20
G
X1
U-DFN2020-3
X
X2
Value
(in mm)
Value
(in mm)
Dimensions
Dimensions
X4
X3
R2
Y
Y3
C
G
X
X1
X2
X3
X4
Y
1.00
0.15
1.40
0.35
0.45
0.322
0.60
Y1
Y2
Y3
Y4
Y5
R1
R2
R3
0.60
0.45
0.45
0.698
0.313
0.225
0.05
Y4
Y2
R1
Y5
R3
G
Y1
X1
C
1.10
0.20
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
3 of 14
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
U-DFN2020-3
Type B
U-DFN2020-6
X
Y
C
Value
(in mm)
1.30
0.24
0.35
1.52
1.09
0.47
0.50
Dimensions
Value
(in mm)
1.67
0.15
0.90
0.45
0.37
0.65
G
Y1
Y
Dimensions
X2
C
G
X
X1
Y
Y1
Y2
Z
G
X1
X2
Y
X1
G
G
X1
C
C
Y2
Y
Z
U-DFN2020-6
U-DFN2020-6
Type E
Type B
C
Y
Value
(in mm)
1.67
Value
(in mm)
0.650
0.400
0.285
1.050
0.500
0.920
1.600
2.300
Dimensions
Dimensions
G
Z
G
X2
C
X
X1
X2
Y
Y1
Y2
Y3
0.20
G1
X1
X2
Y
Y1
C
0.40
1.0
0.45
0.37
0.70
0.65
X2
G1
Y1
Y3 Y2
X1
X1
G
Y1
Z
Y (2x)
X (6x)
C
U-DFN2510-8
U-DFN2523-6
X1
X
X1
Value
(in mm)
0.5
1.0
0.2
0.2
0.4
0.6
Y1
Dimensions
Dimensions Value (in mm)
C
X
0.650
0.400
1.700
0.650
0.450
1.830
2.700
Y
c
c1
G
X
X1
Y
Y2
Y1
X1
Y
G
Y3
Y1
Y2
Y3
Y
Y1
1.4
c
c1
C
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
4 of 14
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
W-DFN3020-8
Type B
C
X
Dimensions Value (in mm)
C
G
G1
X
X1
Y
Y1
Y2
0.650
0.285
0.090
0.400
1.120
0.730
0.500
0.365
Y1
Y
G1
G
Y2
X1
U-DFN3030-4
Dimensions Value (in mm)
U-DFN3030-8
C
1.300
0.100
0.150
0.830
0.115
0.135
0.170
0.500
0.500
0.150
0.500
1.375
1.225
1.175
1.980
1.015
0.715
0.650
C
G1
G2
G3
G4
G5
G6
G7
G8
R
Z
Y3 (2x)
Y2
G6
Dimensions Value (in mm)
G4
X3
G1
R
Z
G
X1
X2
Y
2.59
0.11
2.49
0.65
0.39
0.65
G3
X1
Y
G2
X2
G5
X1
Y1
X
X1
X2
X3
Y
Y1
Y2
Y3
C
X2
G
G7
G8
Y
C
X (4x)
U-DFN3030-8
Type E
X (x8)
C
Y
(x8)
Dimensions
Value (in mm)
0.65
C
C1
X
2.35
0.30
Y1
Y2
Y
0.65
Y1
Y2
1.60
2.75
C1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
5 of 14
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
U-DFN3030-10
U-DFN3030-12
Y
C
Y
C
X1
X1
Dimensions Value (in mm)
Dimensions Value (in mm)
G
G
Z
G
X
2.60
0.15
1.80
0.60
0.30
0.50
Z
G
X
2.60
0.15
1.80
0.60
0.28
0.45
X
X
X1
Y
X1
Y
G
G
C
C
Z
Z
DFN322
C
C
Value
(in mm)
0.65
X (3x)
Dimensions
C
G
Y (2x)
0.20
G
X
0.35
X1
Y
Y1
Y2
Y3
Y4
1.52
0.55
0.98
0.47
0.63
2.20
Y4
Y1
Y3
Y2
X1
W-DFN5020-6
W-DFN5060-4
Z
C
Y
G
Dimensions Value (in mm)
X
C
C
G
X
X1
X2
Y
Y2
Y3
0.50
0.35
0.35
0.90
1.80
0.70
1.60
3.20
Dimensions Value (in mm)
X1
Y2
C
X
4.00
0.75
0.95
6.20
4.75
Y3
Y
Y1
X2
Y1
Z
X (4x)
Y (4x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
6 of 14
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
MSOP-8
DF-S / MiniDIP
X
X
Dimensions DF-S MiniDIP
Dimensions Value (in mm)
Z
X
Y
C
10.26
1.2
1.52
5.2
6.91
0.60
0.76
2.67
X
Y
C1
C2
0.45
1.4
4.4
C1
Z
0.65
C2
Y
Y
C
MSOP-8L-EP
MSOP-10
X
X
Dimensions Value (in mm)
X1
C1
C2
X
X1
Y
4.2
0.65
0.32
1.95
0.8
Dimensions Value (in mm)
X
Y
0.30
1.4
C1
C1
Y1
C2
C1
C2
4.4
0.50
C2
Y1
1.65
Y
Y
POWERDI®5
POWERDI®123 / POWERDI®323
X
X1
G
X2
Y
Y2
Y1
X1
(2x)
G
Y1
(2x)
C
Dimensions Value (in mm)
POWERDI®123 POWERDI®323
Dimensions
C
G
1.840
0.852
3.360
1.390
4.860
1.400
G
1.0
2.2
0.9
1.4
1.4
0.5
2.0
0.8
0.8
1.1
X1
X2
Y1
Y2
X
X1
Y
Y1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
7 of 14
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Suggested Pad Layout
© Diodes Incorporated
POWERDI®123 Type B
X
Value
(in mm)
2.000
Dimensions
Y
G
X
1.050
X1
Y
4.100
1.500
G
X1
POWERDI®3333-8
POWERDI®5060-8
X
X
G
Y2
8
5
4
Y2
Y3
X1
G1
Y1
Y1
Y
Y
G1
1
C
Y3 (4x)
X2 (8x)
G
X2
C
Dimensions
Value (in mm)
1.270
Dimensions
Value (in mm)
0.650
C
G
G1
X
X1
X2
Y
Y1
Y2
Y3
C
G
G1
Y
Y1
Y2
Y3
X
0.660
0.820
4.420
4.100
0.610
6.610
3.810
1.020
0.230
0.420
3.700
2.250
1.850
0.700
2.370
0.420
X2
1.270
SM-8
SO-8
X
Y (8x)
Dimensions Value (in mm)
C1
Dimensions Value (in mm)
C
C1
X
1.52
4.6
0.95
2.80
6.80
Y1
X
Y
C1
C2
0.60
1.55
5.4
C1
Y
1.27
Y1
C2
Y
X (8x)
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
8 of 14
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
SOD323F
X1
Dimensions Value (in mm)
X
X1
Y
0.710
2.700
0.403
Y (2x)
X (2x)
SOP-14
X
Dimensions Value (in mm)
X
Y
C1
C2
0.60
1.50
5.4
C1
1.27
C2
Y
SOP-16
X
Dimensions Value (in mm)
X
Y
C1
C2
0.60
1.50
5.4
C1
1.27
C2
Y
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
9 of 14
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
SOT143
SOT223
X1
X
X2
Y1
Y
C1
C
G
Z
Y2
C2
X2
Dimensions Value (in mm)
X1
X2
Dimensions Value (in mm)
Z
G
X
X1
X2
Y
2.70
1.30
2.50
1.0
0.60
0.70
2.0
X1
X2
Y1
Y2
C1
C2
3.3
1.2
1.6
1.6
6.4
2.3
C
SOT523 / SOT323 / SOT23 / SC59
Y
Z
C
X
E
Dimensions
SOT523
1.8
0.4
0.51
1.3
0.7
SOT323
2.8
0.7
0.9
1.9
SOT23
2.9
0.8
0.9
2.0
SC59
3.4
0.8
1.0
2.4
Z
X
Y
C
E
1.0
1.35
1.35
SOT23F
C
Dimensions Value (in mm)
C
X
Y
0.95
0.60
0.80
1.80
Y1
Y1
Y (3x)
X (3x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
10 of 14
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
SC74R / SOT26 / SOT363 / SOT563
C2
SOT25 / SOT353 / SOT553
C2
C2
C2
C1
G
Y
C1
G
Y
Z
Z
X
X
Dimensions
SC74R / SOT26
SOT363
2.5
1.3
0.42
0.6
1.9
SOT563
2.2
1.2
0.375
0.5
1.7
Dimensions
SOT25
3.20
1.60
0.55
0.80
2.40
0.95
SOT353
2.5
1.3
0.42
0.6
1.9
SOT553
2.2
1.2
0.375
0.5
1.7
Z
G
X
Y
C1
C2
3.20
1.60
0.55
0.80
2.40
0.95
Z
G
X
Y
C1
C2
0.65
0.5
0.65
0.5
SOT666
C
Y (6x)
Dimensions Value (in mm)
C
G
X
Y
0.50
0.80
0.35
0.50
G
X
(6x)
SOT953
C
C
Dimensions Value (in mm)
C
X
Y
0.350
0.200
0.200
1.100
Y1
Y1
Y (5X)
X (5X)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
11 of 14
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Suggested Pad Layout
© Diodes Incorporated
SOT963
C
C
Dimensions Value (in mm)
C
X
Y
0.350
0.200
0.200
1.100
Y1
Y1
Y (6X)
X (6X)
SOT89-3
SOT89-5
X1
X1
Dimensions Value (in mm)
Dimensions Value (in mm)
X
0.900
1.733
0.416
1.300
4.600
1.475
0.950
1.125
1.500
Y4
X1
X2
X3
Y1
Y2
Y3
Y4
C
1.7
0.55
0.4
4.6
1.2
0.5
1.1
3.0
X1
X2
Y
X2 (2x)
Y1
Y1
Y3
Y
Y4
Y1
Y2
Y3
Y4
C
X2
Y2
Y2
X3
Y3
C
C
X (3x)
TO252 (DPAK) / TO263 (D2PAK)
X2
Dimensions
TO252 / DPAK TO263 / D2PAK
Z
11.6
1.5
7.0
2.5
7.0
6.9
2.3
16.9
1.1
10.8
3.5
11.4
9.5
2.5
Y2
X1
X2
Y1
Y2
C
Z
C
Y1
E1
X1
E1
TO252-4
X1
Dimensions
Value (in mm)
c
c1
X
X1
Y
Y1
Y2
Y3
1.27
2.54
1.00
5.73
2.00
6.17
1.64
2.66
Y1
Y2
Y3
c1
Y
c
X (4x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
12 of 14
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
TO252-5
TO263-5
X
X
Y1
Y1
Y2
Y
Y
C1
Y2
X1
X1
C2
C
Dimensions
Value (in mm)
Dimensions
Value (in mm)
X
X1
Y
Y1
Y2
C1
C2
5.6
0.6
11.0
5.6
2.0
7.2
X
X1
Y
Y1
Y2
C
10.9
1.05
15.7
9.1
2.5
1.7
1.27
TSOT25
C
C
Dimensions Value (in mm)
C
X
Y
0.950
0.700
1.000
3.199
Y1
Y1
Y (5x)
X (5x)
TSOT26
C
C
Dimensions Value (in mm)
C
X
Y
0.950
0.700
1.000
3.199
Y1
Y1
Y (6x)
X (6x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
13 of 14
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
TSSOP-14
X
Dimensions Value (in mm)
X
Y
C1
C2
0.45
1.45
5.9
C1
0.65
C2
Y
U-WLB1010-4
ØD
Dimensions
Value (in mm)
C
C
D
0.50
0.25
C
U-WLB1510-6
D
Value
(in mm)
0.50
1.00
0.25
Dimensions
C1
C
C1
D
C
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
14 of 14
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
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