U-QFN4040-16 [DIODES]
SUGGESTED PAD LAYOUT; 拟议的焊盘布局型号: | U-QFN4040-16 |
厂家: | DIODES INCORPORATED |
描述: | SUGGESTED PAD LAYOUT |
文件: | 总27页 (文件大小:388K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SUGGESTED PAD LAYOUT
Based on IPC-7351A
X1-DFN1006-2 / X2-DFN1006-2 / MiniMELF / MELF / SOD323 / SOD123 / SOD523 / SMA / SMB / SMC
C
X
G
Z
Y
X1-DFN1006-2 /
X2-DFN1006-2
Dimensions
MiniMELF
MELF
SOD123
SOD323
SOD523
SMA
SMB
SMC
Z
G
X
Y
C
1.1
0.3
0.7
0.4
0.7
4.7
2.1
1.7
1.3
3.5
6.3
3.3
2.7
1.5
4.8
4.9
2.5
0.7
1.2
3.7
3.75
1.05
0.65
1.35
2.40
2.3
1.1
0.8
0.6
1.7
6.5
1.5
1.7
2.5
4.0
6.8
1.8
2.3
2.5
4.3
9.4
4.4
3.3
2.5
6.8
X3-DFN0603-2
X2-DFN0806-3
X1
Z
Y1
Value
(in mm)
0.350
0.200
0.450
0.550
0.375
0.475
1.000
Dimensions
C
C
X
X1
X2
Y
Dimensions Value (in mm)
C
X
Y
Z
0.355
0.230
0.300
0.610
Y2
X (2x)
Y (2x)
Y1
Y2
Y (2x)
X (2x)
C
X2
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
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www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
X1-DFN1006-3 / X2-DFN1006-3
C
Dimensions Value (in mm)
X1
Z
G1
G2
X
1.1
0.3
0.2
0.7
0.25
0.4
0.7
G2
X
X1
Y
G1
C
Y
Z
X2-DFN1010-6
X1
C
Value
(in mm)
0.350
0.150
0.200
0.900
0.550
1.250
Dimensions
Y (6x)
C
G
X
X1
Y
Y1
Y1
1
G(4x)
X(6x)
X1-DFN1212-3
Type B
X1-DFN1212-3
X
X
Dimensions Value (in mm)
Y
Dimensions Value (in mm)
Y
C
X
X1
X2
Y
Y1
Y2
Y3
0.80
0.42
0.32
0.90
0.50
0.50
0.20
1.50
C
X
0.80
0.42
0.32
0.50
0.50
1.50
X2
X1
(2x)
X1
Y
Y2
Y3 Y2
X1(2x)
Y1
Y2
Y1
(2x)
Y1
(2x)
C
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
2 of 27
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
X2-DFN1410-6
X1
C
Value
(in mm)
0.500
0.250
0.250
1.250
0.525
1.250
Dimensions
Y(6x)
C
G
X
X1
Y
Y1
Y1
1
G(4x)
X(6x)
X1-DFN1411-3
C
Dimensions
Value (in mm)
1.38
Z
G1
G2
X
X2
0.15
0.15
0.95
X1
X
G2
X1
X2
Y
0.75
0.40
0.75
Y
C
0.76
G1
Z
X1-DFN1612-6 / X2-DFN1310-6
G2
X2
Dimensions
G1
X1-DFN1612-6
X2- DFN1310-6
0.16
0.15
0.175
0.15
0.60
0.25
0.65
0.45
0.10
0.15
Y2
G1
G2
G3
X1
X2
Y1
Y2
a
0.17
0.15
0.52
0.20
0.52
0.375
0.09
b
Y1
X1
b
0.06
a
G3
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
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www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
U-DFN1616-6
X1-DFN1616-6 Type E
X3
Y
C
Value
(in mm)
0.500
0.300
0.200
0.720
0.400
0.475
0.620
1.900
Dimensions
Y (2x)
Y1
Dimensions Value (in mm)
X2
C
X
X1
X2
X3
Y
Z
1.3
0.175
0.50
0.525
0.30
0.50
G
G
X1
X2
Y
Y2
X1
X2
X1
C
Y1
Y2
Z
X (6x)
C
U-DFN1616-8
X2
a
G2
Dimensions Value (in mm)
Y2
Y1
G1
G2
X1
X2
Y1
Y2
C
0.15
0.20
0.65
0.25
1.25
0.50
0.40
0.10
G1
a
C
X1
U-DFN2018-6
X
C
Y
Dimensions
Value (in mm)
0.50
C
G
0.20
Y1
X
0.25
X1
Y
1.60
0.35
Y1
1.20
G
X1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
4 of 27
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
U-DFN2020-3
X
Value
(in mm)
1.00
0.15
1.40
0.35
0.45
0.322
0.60
1.10
Value
(in mm)
0.60
0.45
0.45
0.698
0.313
0.225
0.05
X2
Dimensions
Dimensions
X4
X3
R2
Y
Y3
Y4
C
G
X
X1
X2
X3
X4
Y
Y1
Y2
Y3
Y4
Y5
R1
R2
R3
Y2
R1
Y5
R3
G
Y1
X1
C
0.20
U-DFN2020-6
X2
X1
Y (6x)
Value
(in mm)
0.650
0.350
1.650
1.700
0.525
1.010
2.400
Dimensions
C
X
X1
X2
Y
Y2
Y1
Y1
Y2
X (6x)
C
X2-DFN2020-6
X2
X1
Value
(in mm)
0.650
0.400
1.050
1.700
0.500
1.600
1.600
2.300
Dimensions
Y
C
X
X1
X2
Y
Y1
Y2
Y3
Y3 Y2
Y1
X (6x)
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
5 of 27
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
U-DFN2020-3
Type B
U-DFN2020-6
X
Y
C
Value
(in mm)
1.30
0.24
0.35
1.52
1.09
0.47
0.50
Dimensions
Value
(in mm)
1.67
0.15
0.90
0.45
0.37
0.65
G
Y1
Y
Dimensions
X2
C
G
X
X1
Y
Y1
Y2
Z
G
X1
X2
Y
X1
G
G
X1
C
C
Y2
Y
Z
U-DFN2020-6
U-DFN2020-6
Type E
Type B
C
Y
Value
(in mm)
1.67
Value
(in mm)
0.650
0.400
0.285
1.050
0.500
0.920
1.600
2.300
Dimensions
Dimensions
G
Z
G
X2
C
X
X1
X2
Y
Y1
Y2
Y3
0.20
X2
G1
X1
X2
Y
Y1
C
0.40
1.0
0.45
0.37
0.70
0.65
Y1
G1
Y3 Y2
X1
X1
G
Y1
Y (2x)
Z
X (6x)
C
U-DFN2510-8
U-DFN2523-6
X1
X
X1
Value
(in mm)
0.5
1.0
0.2
0.2
0.4
0.6
Y1
Dimensions
Dimensions Value (in mm)
C
X
0.650
0.400
1.700
0.650
0.450
1.830
2.700
Y
c
c1
G
X
X1
Y
Y2
Y1
X1
Y
G
Y3
Y1
Y2
Y3
Y
Y1
1.4
c
c1
C
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
6 of 27
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
U-DFN2626-10
X2
Y
Value
(in mm)
0.500
0.300
2.250
2.300
0.600
1.360
3.000
Dimensions
C
X
X1
X2
Y
X1
Y2
Y1
Y1
Y2
Pin1
C
X
U-DFN3016-12
X1
Y
(12x)
Value
(in mm)
0.500
0.300
2.800
2.250
0.600
0.450
2.050
Dimensions
C
X
X1
X2
Y
X2
Y1
Y2
Y1
Y2
C
X
(12x)
W-DFN3020-8
Type B
C
X
Dimensions Value (in mm)
C
G
G1
X
X1
Y
Y1
Y2
0.650
0.285
0.090
0.400
1.120
0.730
0.500
0.365
Y1
Y
G1
G
Y2
X1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
7 of 27
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
W-DFN3020-8
Type K
Value
(in mm)
0.650
0.600
0.400
0.825
0.675
1.250
2.750
0.675
0.550
0.850
0.755
1.455
1.000
0.650
1.455
2.300
X5
C
Dimensions
X (2x)
C
X
X1
X2
X3
X4
X5
Y
Y (4x)
X4
Y8
X3
Y3
X2
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
Y7
Y4
Y5
Y2
Y6
Y1
X1 (6x)
U-DFN3020-8
Type E
C
G
Value
(in mm)
0.650
0.200
0.150
0.400
1.100
1.100
0.550
0.900
0.900
2.300
Dimensions
C
G
G1
X
X1
X2
Y
Y1
Y2
Y3
Y3
Y1
Y2
X2
X1
G1
Y (8x)
X (8x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
8 of 27
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
U-DFN3020-8
Type M
X1 (2x)
Value
(in mm)
0.650
0.400
0.600
1.320
1.200
0.200
2.750
0.750
0.550
0.680
0.450
0.430
2.400
0.250
X (8x)
Dimensions
C
X
X4
Y6
Y (4x)
X1
X2
X3
X4
X5
Y
Y1
Y2
Y3
Y4
Y5
Y6
Y5
Y2
X2
X3
Y4
Y1 (2x)
Y3
Pin1
C
X5
U-DFN3020-10
X2
Value
(in mm)
0.650
0.150
0.600
0.300
0.350
2.800
0.500
1.000
2.300
Dimensions
C
G
G1
X
X1
X2
Y
Y1
Y2
Y
G1
Y1
Y2
G
X1
C
X
U-DFN3030-4
Dimensions Value (in mm)
U-DFN3030-8
C
1.300
0.100
0.150
0.830
0.115
0.135
0.170
0.500
0.500
0.150
0.500
1.375
1.225
1.175
1.980
1.015
0.715
0.650
C
G1
G2
G3
G4
G5
G6
G7
G8
R
Z
Y3 (2x)
Y2
G6
Dimensions Value (in mm)
G4
X3
G1
R
Z
2.59
0.11
2.49
0.65
0.39
0.65
G3
G
X1
X2
Y
X1
Y
G2
X2
G5
X1
Y1
X
X1
X2
X3
Y
Y1
Y2
Y3
C
X2
G
G7
G8
Y
C
X (4x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
9 of 27
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
U-DFN3030-8
Type E
X (x8)
C
Y
(x8)
Dimensions
Value (in mm)
0.65
C
C1
X
2.35
0.30
Y1
Y2
Y
0.65
Y1
Y2
1.60
2.75
C1
U-DFN3030-10
U-DFN3030-12
Y
C
Y
C
X1
X1
G
Dimensions Value (in mm)
Dimensions Value (in mm)
G
Z
G
X
2.60
0.15
1.80
0.60
0.30
0.50
Z
G
X
2.60
0.15
1.80
0.60
0.28
0.45
X
X
X1
Y
X1
Y
G
G
C
C
Z
Z
U-DFN3030-14
X2
Y (14x)
Value
(in mm)
0.400
0.250
2.350
2.650
0.600
1.750
3.400
Dimensions
C
X
X1
X2
Y
X1
Y2
Y1
Y1
Y2
Pin1
X (14x)
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
10 of 27
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
U-DFN4030-12
X2
Y (12x)
Value
(in mm)
0.500
0.300
2.800
3.350
0.600
1.750
3.400
Dimensions
X1
C
X
X1
X2
Y
Y1
Y2
Y1
Y2
Pin1
X (12x)
C
U-DFN4030-12 Type B
Value
(in mm)
0.500
0.350
1.160
0.900
1.720
0.850
3.700
0.700
0.870
0.500
0.550
0.350
1.710
0.940
3.300
Dimensions
X (12X)
C
C
X
Y
X1
X2
X3
X4
X5
Y
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y2
Y1
X1(2x)
X2
Y6
Y7
Y5 (2x)
X3 (2x)
Y3
1
Y4
X4
X5
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
11 of 27
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
U-DFN4030-12 Type C
DFN322
X5
Value
(in mm)
0.500
0.225
0.300
0.800
0.890
0.990
1.150
3.590
0.600
0.600
0.440
1.030
1.750
3.400
0.275
Dimensions
G
Y6
X1
C
G
X
C
C
Value
(in mm)
0.65
0.20
0.35
1.52
0.55
0.98
0.47
X (3x)
Dimensions
Y
X1
X2
X3
X4
X5
Y
Y1
Y2
Y3
Y4
Y5
Y6
C
G
X
X1
Y
Y1
Y2
Y3
Y4
Y (2x)
Y2
X2
G
X3
Y4
Y4 Y5
Y1
Y3
Y2
Y3
X4
0.63
2.20
X1
Y1 (6x)
X (12x)
1
C
W-DFN5020-6
W-DFN5060-4
Z
C
Y
G
Dimensions Value (in mm)
X
C
C
G
X
X1
X2
Y
Y2
Y3
0.50
0.35
0.35
0.90
1.80
0.70
1.60
3.20
Dimensions Value (in mm)
X1
Y2
C
X
4.00
0.75
0.95
6.20
4.75
Y3
Y
Y1
X2
Y1
Z
X (4x)
Y (4x)
MSOP-8
DF-S / MiniDIP
X
C
X
Y
Value
Dimensions DF-S MiniDIP
Dimensions
(in mm)
0.650
0.450
1.350
5.300
Z
X
Y
C
10.26
1.2
1.52
5.2
6.91
0.60
0.76
2.67
C
X
Y
Z
Y1
Y1
Y
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
12 of 27
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
MSOP8-EP
MSOP-10
X
C
Value
(in mm)
0.650
0.450
0.450
2.000
1.350
1.700
5.300
Y
Dimensions
G
X
Value
(in mm)
0.30
1.4
4.4
C
G
X
X1
Y
Y1
Y2
Dimensions
X
Y
C1
C2
C1
Y2
Y1
X1
0.50
C2
Y
POWERDI®5
POWERDI®123 / POWERDI®323
X
X1
G
X2
Y
Y2
Y1
X1
(2x)
G
Y1
(2x)
C
Dimensions Value (in mm)
POWERDI®123 POWERDI®323
Dimensions
C
G
1.840
0.852
3.360
1.390
4.860
1.400
G
1.0
2.2
0.9
1.4
1.4
0.5
2.0
0.8
0.8
1.1
X1
X2
Y1
Y2
X
X1
Y
Y1
POWERDI®123 Type B
X
Value
(in mm)
2.000
Dimensions
Y
G
X
1.050
X1
Y
4.100
1.500
G
X1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
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Suggested Pad Layout
© Diodes Incorporated
POWERDI®3333-8
POWERDI®3333-8
Type B
X1
G
X
X2 (3x)
G
Y1
Y4
Y2
X3
8
5
4
Y3
Y2
Y3
G1
Y1
Y6
Y
Y5
X4
1
Y
(5x)
X2
C
X (5x)
Dimensions
C
Value (in mm)
0.650
C
G
X
0.230
0.420
2.370
0.420
1.890
2.710
0.700
0.400
1.160
1.850
0.405
1.295
Dimensions
Value (in mm)
0.650
C
G
G1
Y
Y1
Y2
Y3
X
X1
X2
X3
X4
Y
Y1
Y2
Y3
Y4
Y5
Y6
0.230
0.420
3.700
2.250
1.850
0.700
2.370
0.420
X2
3.700
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
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Suggested Pad Layout
© Diodes Incorporated
POWERDI®5060-8
POWERDI®5060-8
Type B
X1
X
Y1
Y4
Y2
Y3
Y2
X1
Y1
Y
Y6
Y5
G1
C
Y3 (4x)
Y
5x
C
X
X2 (8x)
G
Dimensions
Value (in mm)
1.270
Dimensions Value (in mm)
C
G
G1
X
X1
X2
Y
Y1
Y2
Y3
C
1.270
0.610
4.420
0.910
0.910
0.895
2.130
0.585
2.550
6.550
0.660
0.820
4.420
4.100
0.610
6.610
3.810
1.020
X
X1
Y
Y1
Y2
Y3
Y4
Y5
Y6
1.270
POWERDI®3030-8
C
Value
Y (8x)
Dimensions
(in mm)
0.650
0.400
0.850
3.400
C
X
Y1
Y
Y1
X (8x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
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Suggested Pad Layout
© Diodes Incorporated
QSOP-16
X1
Y 16x
Value
(in mm)
0.635
0.350
4.795
1.450
6.400
Dimensions
C
X
X1
Y
Y
C
Y1
1
X 16x
QSOP-20
X1
Y20x
Value
(in mm)
0.635
0.350
6.065
1.450
6.400
Dimensions
C
X
X1
Y
Y1
C
Y1
1
X 20x
SM-8
SO-8
X
Y (8x)
Dimensions Value (in mm)
C1
Dimensions Value (in mm)
C
C1
X
1.52
4.6
0.95
2.80
6.80
Y1
X
Y
C1
C2
0.60
1.55
5.4
C1
Y
1.27
Y1
C2
Y
X (8x)
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
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Suggested Pad Layout
© Diodes Incorporated
SOD323F
X1
Dimensions Value (in mm)
X
X1
Y
0.710
2.700
0.403
Y (2x)
X (2x)
SOP-14
X
Dimensions Value (in mm)
X
Y
C1
C2
0.60
1.50
5.4
C1
1.27
C2
Y
SOP-16
X1
Value
(in mm)
1.270
0.670
9.560
1.450
6.400
Dimensions
C
X
X1
Y
Y1
Y (16x)
Y1
1
X (16x)
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
17 of 27
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Suggested Pad Layout
© Diodes Incorporated
SOT143
SOT223
X1
X
X2
Y1
Y
C1
C
G
Z
Y2
C2
X2
Dimensions Value (in mm)
X1
X2
Dimensions Value (in mm)
Z
G
X
X1
X2
Y
2.70
1.30
2.50
1.0
0.60
0.70
2.0
X1
X2
Y1
Y2
C1
C2
3.3
1.2
1.6
1.6
6.4
2.3
C
SOT523 / SOT323 / SOT23 / SC59
Y
Z
C
X
E
Dimensions
SOT523
1.8
0.4
0.51
1.3
0.7
SOT323
2.8
0.7
0.9
1.9
SOT23
2.9
0.8
0.9
2.0
SC59
3.4
0.8
1.0
2.4
Z
X
Y
C
E
1.0
1.35
1.35
SOT23F
C
Dimensions Value (in mm)
C
X
Y
0.95
0.60
0.80
1.80
Y1
Y1
Y (3x)
X (3x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
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Suggested Pad Layout
© Diodes Incorporated
SC74R / SOT26 / SOT363 / SOT563
C2
SOT25 / SOT353 / SOT553
C2
C2
C2
C1
G
Y
C1
G
Y
Z
Z
X
X
Dimensions
SC74R / SOT26
SOT363
2.5
1.3
0.42
0.6
1.9
SOT563
2.2
1.2
0.375
0.5
1.7
Dimensions
SOT25
3.20
1.60
0.55
0.80
2.40
0.95
SOT353
2.5
1.3
0.42
0.6
1.9
SOT553
2.2
1.2
0.375
0.5
1.7
Z
G
X
Y
C1
C2
3.20
1.60
0.55
0.80
2.40
0.95
Z
G
X
Y
C1
C2
0.65
0.5
0.65
0.5
SOT666
C
Y (6x)
Dimensions Value (in mm)
C
G
X
Y
0.50
0.80
0.35
0.50
G
X
(6x)
SOT953
C
C
Dimensions Value (in mm)
C
X
Y
0.350
0.200
0.200
1.100
Y1
Y1
Y (5X)
X (5X)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
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Suggested Pad Layout
© Diodes Incorporated
SOT963
C
C
Dimensions Value (in mm)
C
X
Y
0.350
0.200
0.200
1.100
Y1
Y1
Y (6X)
X (6X)
SOT89-3
SOT89-5
X1
X1
Dimensions Value (in mm)
Dimensions Value (in mm)
X
0.900
1.733
0.416
1.300
4.600
1.475
0.950
1.125
1.500
Y4
X1
X2
X3
Y1
Y2
Y3
Y4
C
1.7
0.55
0.4
4.6
1.2
0.5
1.1
3.0
X1
X2
Y
X2 (2x)
Y1
Y1
Y3
Y
Y4
Y1
Y2
Y3
Y4
C
X2
Y2
Y2
X3
Y3
C
C
X (3x)
TO252 (DPAK)
X2
Dimensions
Value (in mm)
Z
11.6
1.5
7.0
2.5
7.0
6.9
2.3
Y2
X1
X2
Y1
Y2
C
Z
C
Y1
E1
X1
E1
TO263 (D2PAK)
X1
Dimensions
Value (in mm)
5.08
Y
C
X
1.10
X1
Y
Y1
Y2
10.41
3.50
7.01
15.99
Y2
X
Y1
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
20 of 27
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Suggested Pad Layout
© Diodes Incorporated
TO252-4
X1
Dimensions
Value (in mm)
1.27
c
Y1
c1
X
2.54
1.00
Y2
Y3
X1
Y
Y1
Y2
Y3
5.73
2.00
6.17
1.64
c1
Y
2.66
c
X (4x)
TO252-5
TO263-5
X
X
Y1
Y1
Y2
Y
Y
C1
Y2
X1
X1
C2
C
Dimensions
Value (in mm)
Dimensions
Value (in mm)
X
X1
Y
Y1
Y2
C1
C2
5.6
0.6
11.0
5.6
2.0
7.2
X
X1
Y
Y1
Y2
C
10.9
1.05
15.7
9.1
2.5
1.7
1.27
TSOT25
C
C
Dimensions Value (in mm)
C
X
Y
0.950
0.700
1.000
3.199
Y1
Y1
Y (5x)
X (5x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
21 of 27
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Suggested Pad Layout
© Diodes Incorporated
TSOT26
C
C
Dimensions Value (in mm)
C
X
Y
0.950
0.700
1.000
3.199
Y1
Y1
Y (6x)
X (6x)
TSSOP-14
X
Dimensions Value (in mm)
X
Y
C1
C2
0.45
1.45
5.9
C1
0.65
C2
Y
TSSOP-16
X1
Value
(in mm)
0.650
0.350
4.900
1.400
6.800
Dimensions
C
X
X1
Y
Y1
Y (16x)
Y1
1
X (16x)
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
22 of 27
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Suggested Pad Layout
© Diodes Incorporated
TSSOP-16EP
X2
Y (16x)
Value
(in mm)
0.650
0.450
3.290
5.000
1.450
3.290
4.450
7.350
Dimensions
C
X
X1
X2
Y
Y1
Y2
Y3
Y3
Y1
Y2
X1
C
X (16x)
TSSOP-20
X (20x)
C
Value
(in mm)
0.650
0.420
6.270
1.780
4.160
7.720
Dimensions
C
X
X1
Y
Y1
Y2
Y1
Y2
Y (20x)
X1
TSSOP-20EP
X (20x)
C
Value
(in mm)
0.650
0.420
4.490
6.270
1.780
3.290
4.160
7.720
Dimensions
C
X
X1
X2
Y
Y1
Y2
Y3
Y1
Y2
Y3
X1
Y (20x)
X2
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
23 of 27
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Suggested Pad Layout
© Diodes Incorporated
U-QFN3030-16 Type B
C
G
G1
Value
(in mm)
0.500
0.150
0.150
0.350
1.800
0.600
1.800
Dimensions
C
G
G1
X
X1
Y
Y1
Y1
X1
Y (16x)
X (16x)
U-QFN4040-16 Type C
C
X (8x)
Value
(in mm)
0.650
0.400
2.075
0.550
2.075
4.400
0.650
0.400
1.225
2.075
0.550
4.400
Dimensions
Y (4x)
Y1 (8x)
C
X
X1
X2
X3
X4
Y
Y1
Y2
Y3
Y4
Y5
Y5
Y2
Y3
X1
X2 (8x)
Y4 (4x)
1
X3
X4
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
24 of 27
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
U-QFN4040-20
X3
X1(10x)
Y1(10x)
Value
(in mm)
0.500
0.350
0.600
2.500
4.300
0.600
0.350
2.500
4.300
Dimensions
C
X
X1
X2
X3
Y
Y1
Y2
Y3
Y2
Y3
X2
Y(10x)
1
C
X(10x)
X2-WLB0505-3
X1
Value
(in mm)
0.17
Dimensions
Y
X
X1
Y
0.50
0.22
Y2
Y1
Y2
0.12
0.50
Y1
X
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
25 of 27
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Suggested Pad Layout
© Diodes Incorporated
X2-WLB0808-4
4X- ØD
Value
(in mm)
0.40
C
Dimensions
C
D
0.20
C
U-WLB1010-4
ØD
Dimensions
Value (in mm)
C
C
D
0.50
0.25
C
U-WLB1510-6
D
Value
(in mm)
0.50
1.00
0.25
Dimensions
C1
C
C1
D
C
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
26 of 27
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Suggested Pad Layout
© Diodes Incorporated
X2-WLB1818-4
C 2
D
1
A
Value
(in mm)
0.65
Dimensions
C
D
0.30
B
X2-WLB2718-6
D
6x
1
2
A
C
Value
(in mm)
0.65
Dimensions
B
C
C
D
C
0.30
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
27 of 27
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
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