ZXBM5210-S-13 [DIODES]
REVERSIBLE DC MOTOR DRIVE WITH SPEED CONTROL;
| 型号： | ZXBM5210-S-13 |
| 厂家： | 
DIODES INCORPORATED |
| 描述： | REVERSIBLE DC MOTOR DRIVE WITH SPEED CONTROL |
| 文件： | 总17页 (文件大小：607K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ZXBM5210
REVERSIBLE DC MOTOR DRIVE WITH SPEED CONTROL
Description
Pin Assignments
The ZXBM5210 is a single chip solution for driving a single-coil
reversible direct current (DC) fans and motors. The integrated full-
bridge driver output stage is designed to minimize audible switching
noise and electromagnetic interference (EMI) providing a low noise
solution
For system flexibility, the device has four modes of operation:
Forward, Reverse, Brake and Standby selected via FWD and REV
pins. The Forward and Reverse modes provide the motor rotation
direction control, the Brake mode allows quick stop and the Standby
mode helps system efficiency by powering down most of the internal
circuits to consume less than 32uA typical. The motor speed can be
adjusted by changing the duty ratio of the PWM signal on the FWD or
REV pins in the PWM mode or alternatively by adjusting DC voltage
input signal to the VREF pin in the VREF speed control mode.
SO-8
To help protect the IC and the motor coil the ZXBM5210 includes
under voltage, over voltage, over current and over temperature
protections. Once the safe operating range has been exceeded the
device shuts down the output drive to help prevent over stress on the
IC or the coil. The device internal current protection threshold is 1.5A
typical.
SO-8EP
The ZXBM5210 is available in the standard SO8 and thermally
enhanced SO8-EP packages.
Applications
•
•
•
•
•
•
5V / 9V/ 12V / 15V DC reversible motors and actuators
Home appliances
Features
Handheld power tools
•
•
•
Supports single-coil reversible DC motor applications
Operating voltage: 3V to 18V
Valve open and close
Remote control motorized toys
Medium Voltage/ Low Power DC Motors
Four modes of operations: Forward, Reverse, Brake and
Standby
•
Low quiescent current of 0.85mA typical in normal operation
and 32µA in standby mode
•
•
•
•
•
•
•
•
Internal over current protection
Under voltage lockout and over voltage protection
Over temperature protection
-40°C to +85°C /105°C operating temperature
6kV ESD withstand capability
Standard SO-8 and thermally enhanced SO-8EP
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
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© Diodes Incorporated
ZXBM5210
Document number: DS36765 Rev. 1 - 2
ZXBM5210
Typical Applications Circuit
Note:
4. C1 is for power stabilization and to strengthen the noise immunity, the recommended capacitance is 100nF to 1µF or more.
C2 is a re-circulating capacitor for back rush voltage and recommended capacitance is 100nF for low current applications to 10µF or more for large
current applications. See application note section
Pin Descriptions
Package: SO-8
Pin #
Pin Name
OUT1
VM
Function
1
2
3
4
5
6
7
8
Driver output
Power Supply Voltage
Power Supply Voltage
VDD
FWD
REV
Forward Control Input (logic level, 5.5V max)
Reverse Control Input (logic level, 5.5V max)
Input reference voltage to set the internal PWM oscillator duty ratio
Driver Output
VREF
OUT2
GND
Ground
Package: SO8-EP
Pin #
Pin Name
Function
1
2
3
4
5
6
7
8
OUT1
VM
Driver output
Power Supply Voltage
Power Supply Voltage
VDD
FWD
REV
VREF
OUT2
GND
Forward Control Input (logic level, 5.5V max)
Reverse Control Input (logic level, 5.5V max)
Input reference voltage to set the internal PWM oscillator duty ratio
Driver Output
Ground
The exposed pad is for thermal dissipation and it is internally connected to the ground.
On the PCB layout, it can be connected to GND or left open circuit.
Pad
Pad
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ZXBM5210
Document number: DS36765 Rev. 1 - 2
ZXBM5210
Functional Block Diagram
Absolute Maximum Ratings (Note 5) @TA = +25°C, unless otherwise specified.)
Symbol
Characteristic
Values
Unit
Supply voltage (Note 6)
24
V
VM and VDD,
VOUT1, VOUT2
VREF
All other pins except FWD and REV pins
24
V
FWD and REV pin voltage
7
-0.3
V
V
VFWD and VREV
VREVERSE
Reverse supply Voltage on all pins
Output current (source and sink)- Peak
1500
mA
mW
mW
°C
IOUTPUT
SO8 (Note 7)
1043
Package power dissipation
PD
SO8-EP (Note 8)
2980
Ts
TJ
Storage temperature range
-65 to +150
150
Maximum junction temperature
°C
Human Body Model ESD withstand
capability
VDD, VM, VREF, FWD, REV,
GND and OUT1 OUT2 pins
ESD HBM
6
kV
Notes:
5. Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings
only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device
reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time
6. The absolute maximum supply voltage of 24V is a transient stress rating and is not meant as a functional operating condition. It is not recommended
to operate the device at the absolute maximum rated conditions for any period of time.
7. SO-8 soldered to minimum recommended landing pads (see Package Outline Dimension section) on a 1”x1” two-layer 2oz.copper FR4 PCB
(1.6mm thickness) without any via or copper flood on the bottom layer. See thermal de-rating curves in the thermal performance section.
8. SO-8EP exposed pad soldered to minimum recommended landing pads (see Package Outline Dimension section) on a 2”x2” two-layer 2oz.copper
FR4 PCB (1.6mm thickness) with four thermal vias in the exposed PAD to the copper flood on the bottom layer. See thermal de-rating curves in the
thermal performance section.
Recommended Operating Conditions
Symbol
Characteristic
Supply Voltage
Conditions
Min
3
Max
Unit
V
18
Operating
VDD
+85
Operating, SO8 package
-40
-40
°C
°C
Operating Temperature Range
TA
+105
Operating, SO8-EP package
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© Diodes Incorporated
ZXBM5210
Document number: DS36765 Rev. 1 - 2
ZXBM5210
Electrical Characteristics (Note 9)(@TA = +25°C, VDD = 12V, unless otherwise specified.)
Symbol
IDD
Characteristics
Supply Current
Conditions
Min
—
Typ
0.85
32
Max
Unit
mA
uA
V
No Load
2.5
45
—
—
Standby Supply Current
FWD=REV=LOW (GND)
Voltage Decreasing
IDD_STNDBY
VUV_TH
—
Under Voltage lock Out Threshold
2.6
—
Under Voltage Lock Out Release Threshold Voltage Increasing
2.8
3.0
—
V
VUVLO_R
VUV_HYS
VOV_TH
VOV_RLTH
—
Under Voltage Hysteresis
Overvoltage Threshold
Voltage Increasing
Voltage Increasing
Voltage Decreasing
200
20.7
19
mV
V
—
24
—
Overvoltage Release Threshold
17.0
V
IOUT = 300mA,
—
V
V
V
V
V
V
V
Ω
V
V
DD - 0.25 VDD - 0.15
DD - 0.43 VDD - 0.25
TA = -40°C to +105°C
Output Voltage High
Output Voltage Low
VOH
IOUT =500mA
—
TA = -40°C to +105°C
IOUT = 300mA,
—
—
—
—
—
—
0.15
0.25
0.3
0.25
0.43
0.5
TA = -40°C to +105°C
VOL
IOUT = 500mA,
TA = -40°C to +105°C
I
OUT = 300mA,
TA = -40°C to +105°C
IOUT = 500mA,
Output voltage of N- and PMOS and bond
wire voltage drop combined
0.5
0.86
0.66
1.72
2.2
VOH+ VOL
TA = -40°C to +105°C
IOUT = 300mA, VDD = 3V
0.39
1
TA = -40°C to +105°C
I
OUT = 500mA,
TA = -40°C to +105°C
Combined N- and PMOS RDSON including
bond wire resistance
RON_Total
IOUT = 300mA, VDD = 3V
—
1.2
3
1.3
1.5
—
Ω
A
V
TA = -40°C to +105°C
Over current protection threshold
ILIM_TH
VREF
IVREF
FOUT
FFWD_REV
TDEAD
V
REF voltage range
( DC voltage speed control mode)
REF bias current
VDD
(18V max)
V
-15
0
15
μA
VREF = VDD
( DC voltage speed control mode)
VREF control mode
20
20
26.5
—
35
kHz
kHz
Output PWM switching frequency
(Internal PWM oscillator)
PWM speed control mode
100
Input PWM frequency of speed control
signal
PWM control mode
20
—
3
100
3.9
kHz
VDD = 3V to 18V
Dead time between current reversal
2.1
μs
TA = -40°C to +105°C
Shutdown delay – Internal circuits active
after FWD = REV = L
(except from brake mode)
FWD = GND
REV = GND
125
180
—
μs
tSDN_DELAY
FWD Input H Level
2
0
—
—
50
50
—
—
50
50
5.5
0.8
—
V
V
VFWDH
VFWDL
IFWDH
FWD Input L Level
FWD pin current – H Level
FWD pin current – L Level
REV Input H Level
—
—
2
μA
μA
V
FWD pin: VFWD = 5V
FWD pin: VFWD = 0V
—
IFWDL
5.5
0.8
—
VREVH
VREVL
IREVH
REV Input L Level
0
V
REV pin current – H Level
REV pin current – L Level
Output minimum duty ratio
—
—
0%
μA
μA
%
REV pin: VRVS = 5V
REV pin: VRVS = 0V
—
IREVL
100
DPWM_MIN
IC junction temperature thermal shutdown
threshold
—
—
165
25
—
—
oC
oC
Tj_SDN_TH
IC junction temperature thermal shutdown
hysteresis
Tj_SDN_HYST
Note:
9. Typical data is at T = +25°C, VDD = 12V. The maximum and minimum parameters values over the operating temperature range are not tested in
A
production, they are guaranteed by design, characterization and process control.
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ZXBM5210
Document number: DS36765 Rev. 1 - 2
ZXBM5210
Application Note
Rotation Control and Standby Modes
The device has FWD and REV pins for controlling the motor rotation directions. The device has four motor operation modes: 1) Standby mode,
2) Forward mode, 3) Reverse mode and 4) Brake mode. The four modes are controlled by the FWD and REV logic pins.
Supply
Supply
S1
Off
S3
Off
S1
Off
S3
Off
OUT1
M
OUT2
OUT1
M
OUT2
S4
S2
On
S4
Off
S2
Off
On
GND
Brake mode
GND
Standby mode
FWD
REV
OUT1
OUT2
Operating mode
Standby mode – All switches are off
VREF
L
H
L
L
x
Open
Open
H
L
H
3V to VDD
Forward mode – Current flows from OUT1 to OUT2; VREF duty control
Reverse mode – Current flows from OUT2 to OUT1; VREF duty control
Brake mode – Short circuit brake with low side switches on
L
H
L
L
3V to VDD
H
H
x
L
Forward mode – Current flows from OUT1 to OUT2; PWM control mode
Reverse mode – Current flows from OUT2 to OUT1; PWM control mode
PWM
L
L
H
PWM
H
VDD
VDD
x
PWM
H
PWM
L
H
L
Brake mode – Short circuit brake with low side switches on
In the brake mode, switches S2 and S4 are ON allowing the motor to stop quickly. All the internal control circuits are fully operational.
In the standby mode all the output drive switches are off and additionally, the internal circuits are also turned off to minimize power consumption.
The power consumption in the standby mode is less than in the brake mode. If running motor enters the Standby mode, due to the body diodes
the motor free wheels to idle state. Whenever the motor enters the standby mode from any mode (except the brake mode) the control logic will
remain active in previous mode for at least 125µs before shutting down the internal circuits. To prevent device entering the standby mode during
operating mode changes, the mode change signals should be completed within 125µs.
In the forward mode, with switches S1-S2 ON and S3-S4 OFF, OUT1 is high and OUT2 is low. The motor current flows from OUT1 to OUT2. In
the reverse mode, switches S1-S4 are ON while S1-S2 are OFF to allow motor current flow from OUT2 to OUT1.
In the forward or reverse mode, for VREF speed control, the output drive duty ratio is generated internally based on the voltage on the VREF pin.
For PWM speed control, external PWM signals applied to the FWD or REV pins control the PWM switching of the low side S2 (forward mode)
or S4 (reverse mode). See application section for further details.
The ZXBM5210 has three modes of speed control: VREF speed control mode, PWM speed control mode and by adjusting the supply voltage
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ZXBM5210
Document number: DS36765 Rev. 1 - 2
ZXBM5210
Application Note (cont.)
Motor Speed Control with DC Voltage on VREF Pin
Motor speed can be controlled by adjusting the DC voltage into the VREF pin. The output drive PWM duty ratio is defined by the ratio of the VREF
voltage to the supply VDD voltage.
In VREF speed control mode, FWD and REV pins are only used for direction control and therefore high frequency PWM control signal should not
be applied to the FWD and REV pins. If repetitive direction changes required, it is recommended to keep direction change frequency of below
400Hz.
The speed and direction control is given by:
Operating mode
Standby mode – All switches are off
FWD
REV
L
OUT1
OUT2
VREF
L
H
H
L
x
VDD
Open
Open
Forward mode – Current flows from OUT1 to OUT2; 100% duty
L
H
H
L
L
L
L
3V to VDD
VDD
Forward mode – Current flows from OUT1 to OUT2; VREF duty control
Reverse mode – Current flows from OUT2 to OUT1; 100% duty
H
H
H
L
L
H
L
3V to VDD
x
Reverse mode – Current flows from OUT2 to OUT1; VREF duty control
Brake mode – Short circuit brake with low side switches on
H
H
L
Motor Speed Control with a PWM Input Signal
Motor speed can be controlled by adjusting the duty cycle of the PWM speed control signal into the FWD or REV while keeping the VDD pin at
the nominal motor voltage. In this mode the input voltage on the VREF pin must be greater than or equal to VDD
.
In PWM speed control mode the high side switches S1 and S3 are kept fixed while the low side switches S2 or S4 are switched. In the forward
mode, S1 is kept switched on, S2 is switched in accordance with the PWM signal and S3 and S4 are switched off. In reverse mode, S3 is
switched on, S4 is switched in accordance with the PWM signal and S1 and S2 are switched off.
The speed and direction control is given by:
FWD
REV
L
OUT1
OUT2
Operating mode
Standby mode – All switches are off
VREF
x
L
H
L
Open
Open
Forward mode – Current flows from OUT1 to OUT2; 100% duty
Reverse mode – Current flows from OUT2 to OUT1; 100% duty
Brake mode – Short circuit brake with low side switches on
L
H
L
L
L
H
L
VDD
VDD
x
H
H
H
Forward mode – Current flows from OUT1 to OUT2;
PWM control mode
PWM
L
H
PWM
VDD
Reverse mode – Current flows from OUT2 to OUT1
PWM control mode
L
PWM
H
PWM
L
H
L
VDD
x
H
Brake mode – Short circuit brake with low side switches on
The motor speed is proportional to the input PWM signal duty. For example, for a 12V motor the VDD pin is maintained at 12V while varying the
PWM control signal duty to adjust the motor speed linearly. The timing diagram below shows the output O1 and O2 in relation to PWM speed
control signal at PWM pin.
Frequency of PWM speed control signal can be between 8kHz to 100kHz. Recommended typical PWM signal frequency is 25kHz to keep
switching frequency away from the audible band.
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ZXBM5210
Document number: DS36765 Rev. 1 - 2
ZXBM5210
Application Note (cont.)
Motor Speed Control with a PWM Input Signal (cont.)
Depending on the motor design and its inertia the minimum start-up PWM duty required can be typically between 30% - 50%. While the motor is
rotating minimum PWM duty can generally be reduced down to 20%. How small the PWM duty can be without stalling the motor depends on the
motor mechanical and coil design parameters and not limited by the output capability of the device. If voltage at VDD is lower than the nominal
motor voltage, both start-up PWM duty and minimum running PWM duty required will be higher.
Motor Speed Control by DC Supply Voltage
Motor speed can be controlled by varying the VDD supply voltage while the FWD and REV pins are set to either a logic high or low depending on
forward or reverse direction needed. The VREF must be equal to VDD in this mode. For example, if the VDD for a 12V motor is changed from
12V to 3V the speed will be reduced from 100% to 25%.
Re-Circulating Capacitor
During motor operation when the low side switch is turned off the bridge or the motor voltage may overshoot to high levels if there is no current
path for the energy in the motor to flow. Such high voltages can damage the IC. A current path can be provided by adding a bypass capacitor
from the VDD or VM to the GND. The value of the bypass capacitor depends on the motor coil design, motor current, motor voltage and the
IC voltage limits. This could be in the range of 0.47µF for low current applications to 10uF or more for large current applications.
Dead-Time
During motor current reversal (for motor rotation direction reversal), switch position changes between S1-S2 and S3-S4. Such change may result
in cross conduction between high side and low side MOSFETS, e.g. S1 and S4 or S2 and S3. To prevent cross conduction the IC provides a
dead time 3µs typical during current reversal or fast turn on of the low side MOSFETs.
Back-Rush Voltage
Depending on motor characteristics, the environment and the ambient conditions back-rush voltage (at the bridge) may fluctuate during brush
commutation and PWM switching. Due to the energy in the coil this back-rush voltage can reach high levels if no adequate alternative current
path is provided when inductor current path is interrupted. The back-rush voltage overshoot should not be allowed to go beyond the operating
voltage range of the IC. This backrush voltage overshoot can be minimized by using a re-circulating bypass capacitor at the VDD and VM pins.
The value of the re-circulating bypass capacitor depends on the motor coil design, motor current, motor voltage and the IC voltage limits. This
could be 0.47µF for low current applications to 10uF or more for large current applications.
Under Voltage Lockout
To make sure the minimum voltage needed to operate the driver is supplied, the driver has an under voltage lock out. At start up the device will
only start if the supply voltage is typically 2.8 or greater. During normal operation, the device will switch off all the output switches and power
down if the supply voltage drops below 2.6V typical.
Over Voltage Protection
When the supply voltage exceeds 20.7V (typical) the driver will turn-off all the output switches. The driver will return to normal condition if the
supply voltage drops below 19V (typical) provided no other fault condition or signals are preventing it to enter normal operation.
In-Rush Current
It is recommended to use the PWM duty cycle to control the average voltage supplied to the motor during power up, standby mode, brake mode
or during motor direction reversal. If a PWM signal is not available it is recommended to use a current limiting resistor or other protection
devices if needed.
Over-Current Setting and Protection
The internal over current protection (OCP) threshold is 1.5A typical at 12V supply +25°C.
When the motor current exceeds the OCP threshold for longer than 10µs typical on any of the H-Bridge switches, the device will switch of all the
output switches and remain off for 5ms typical. The IC returns to normal operation after the 5ms if over current condition has gone away. If the
motor current is still higher than the OCP threshold, the device will enter another 5ms standby mode.
Thermal Shutdown
The device has an internal thermal shutdown to prevent a thermal run-away scenario. The thermal shutdown is triggered when the junction
temperature of the device reaches +165°C. It will remain in standby mode until the junction temperature falls by +25°C.
Reverse Voltage Protection
If reverse protection is needed this can be achieved by adding an external diode to the VDD and VM pins.
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ZXBM5210
Document number: DS36765 Rev. 1 - 2
ZXBM5210
Application Note (cont.)
Motor Electromagnetic and Audible Noise
To help reduce electromagnetic and audible nose, capacitor can be connected from OUT1 to GND and OUT2 to GND pins. Alternatively, a
capacitor can be connected between OUT1 and OUT2 with diodes between the output pins and GND as shown below. To prevent large currents
it is recommended to keep any capacitor used at the output pins as small as possible and less than 1µF.
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ZXBM5210
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ZXBM5210
Typical Operating Characteristics
Supply Current
2.0
2.0
TA = +25 °C
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.5
1.0
0.5
0.0
18V
12V
3V
2
4
6
8
10
12
14
16
18
20
-50
-25
0
25
50
75
100
125
Supply Voltage (V)
Supply Current vs. Supply Voltage
Temperature (°C)
Supply Current vs. Temperature
Standby Current
80.0
70.0
60.0
50.0
40.0
30.0
20.0
10.0
0.0
60
50
40
30
20
10
0
TA = +25 °C
18V
12V
3V
-50
-25
0
25
50
75
100
125
2
4
6
8
10
12
14
16
18
20
Supply Voltage (V)
Temperature (°C)
Standby Supply Current vs. Supply Voltage
Standby Supply Current vs. Temperature
Under Voltage Lockout (UVLO)
Over Voltage Protection (OVP)
25.0
23.0
21.0
19.0
17.0
15.0
3.5
3.3
3.0
2.8
2.5
2.3
2.0
UVLO Release Threshold
UVLO Trigger Threshold
OVP Trigger Threshold
OVP Release Threshold
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Temperature (°C)
OVP Trigger and Release Thresholds vs Temperature
Temperature (°C)
UVLOTrigger and Release Thresholds vs Temperature
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ZXBM5210
Document number: DS36765 Rev. 1 - 2
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Typical Operating Characteristics
Output PWM Duty in PWM Speed Control Mode
Output PWM Duty in VREF Speed Control Mode
100
100
TA = 25oC, VREF Mode, No Load
18V
TA = 25oC, Mode A PWM, Input PWM Frequency 25kHz
90
90
80
70
60
50
40
30
20
10
0
80
18V
70
12V
60
50
40
30
12V
3V
3V
20
10
0
0
0.2
0.4
0.6
0.8
1
0
10
20
30
40
50
60
70
80
90
100
VREF/VDD Ratio
Input PWM Duty (%)
Output PWM Duty vs Input PWM Duty
OutputPWM Duty vs VREF/VDD Ratio
PWM Oscillator Frequency
30
28
26
24
22
20
30
TA = 25oC
28
26
24
22
20
3V
12V
18V
-50
-25
0
25
50
75
100
125
2
4
6
8
10
12
14
16
18
20
Temperature (°C)
PWM Oscillator Frequency vs. Temperature
Supply Voltage (V)
PWM Oscillator Frequency vs. Supply Voltage
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ZXBM5210
Document number: DS36765 Rev. 1 - 2
ZXBM5210
Typical Operating Characteristics
Low Side Switch On Voltage (VOL
)
0.5
0.5
IOUT = 300mA TA = +25 °C
IOUT = 500mA TA = +25 °C
0.4
0.3
0.2
0.1
0.0
0.4
0.3
0.2
0.1
0.0
0
2
4
6
8
10
12
14
16
18
20
0
2
4
6
8
10
12
14
16
18
20
Supply Voltage (V)
Supply Voltage (V)
Low Side Switch ON Voltage VOL vs. Supply Voltage
Low Side Switch ON Voltage VOL vs. Supply Voltage
0.5
0.4
0.3
0.2
0.1
0.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
IOUT = 500mA
IOUT = 300mA
3V
3V
12V
18V
12V
18V
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Temperature (°C)
Low Side Switch On Voltage VOL vs. Temperature
Temperature (°C)
Low Side Switch On Voltage VOL vs. Temperature
High Side Switch On Voltage (VDD - VOH
)
0.5
0.5
0.4
0.3
0.2
0.1
0.0
IOUT = 500mA TA = +25 °C
IOUT = 300mA TA = +25 °C
0.4
0.3
0.2
0.1
0.0
0
2
4
6
8
10
12
14
16
18
20
0
2
4
6
8
10
12
14
16
18
20
Supply Voltage (V)
High Side Switch ON Voltage (VDD-VOH) vs Supply Voltage
Supply Voltage (V)
High Side Switch ON Voltage (VDD-VOH) vs Supply Voltage
11 of 17
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Document number: DS36765 Rev. 1 - 2
ZXBM5210
Typical Operating Characteristics
High Side Switch On Voltage (VDD - VOH) (cont.)
0.5
0.4
0.3
0.2
0.1
0.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
IOUT = 500mA
IOUT = 300mA
3V
3V
12V
18V
18V
12V
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Temperature (°C)
HighSide Switch On Voltage (VDD-VOL)vs. Temperature
Temperature (°C)
HighSide Switch On Voltage (VDD-VOL) vs. Temperature
H-Bridge Resistance – Total Resistance On (RDSON_TOTAL) of the High and the Low Side Switches
3.0
2.5
2.0
1.5
1.0
0.5
0.0
3.0
IOUT = 300mA
IOUT = 500mA
2.5
2.0
1.5
1.0
0.5
0.0
0
2
4
6
8
10
12
14
16
18
20
0
2
4
6
8
10
12
14
16
18
20
Supply Voltage (V)
Supply Voltage (V)
High+Low Side Resistance RDSON_TOTAL vs. Voltage
High+Low Side Resistance RDSON_TOTAL vs. Voltage
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
I
OUT = 500mA
IOUT = 300mA
3V
3V
12V
12V
18V
18V
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Temperature (°C)
High+Low Side ON Resistance RDSON_TOTAL vs. Temperature
Temperature (°C)
High+Low Side ON Resistance RDSON_TOTAL vs. Temperature
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Document number: DS36765 Rev. 1 - 2
ZXBM5210
Thermal Performance
(1) Package Type: SO-8
MSOP8-EP Power Dissipation De-rating Curve (Note 11)
-40
0
25
50
60
70
80
85
90
95
100
105
110
120
125
130
140
150
TA (°C)
1043 1043 1043 835
751
668
584
543
501
459
417
376
334
250
209
167
83
0
PD (mW)
1200
o
Rthja = 120 C/W; Rthjc = 19.9 oC/W
1000
800
600
400
200
0
-40
-20
0
20
40
60
80
100
120
140
160
Temperature (°C)
SO-8 Thermal Derating Curve
Note:
11. SO-8 soldered to minimum recommended landing pads (see Package Outline Dimension section) on a 1”x1” two-layer 2oz.copper FR4 PCB
(1.6mm thickness) without any via or copper flood on the bottom layer.
(2) Package Type: SO-8EP
SO-8EP Power Dissipation De-rating Curve (Note 12)
-40
0
25
50
60
70
80
85
90
95
100
105
110
120
125
130
140
150
TA (°C)
2980 29080 2980 2384 2146 1907 1669 1550 1430 1430 1192 1073 954
715
596
477
238
0
PD (mW)
3500
Rthja = 42.1 oC/W; Rthjc = 8.5 oC/W
3250
3000
2750
2500
2250
2000
1750
1500
1250
1000
750
500
250
0
-40
-20
0
20
40
60
80
100
120
140
160
Temperature (°C)
SO-8EP Thermal Derating Curve
Note:
12. SO-8EP exposed pad soldered to minimum recommended landing pads (see Package Outline Dimension section) on a 2”x2” two-layer
2oz.copper FR4 PCB (1.6mm thickness) with four thermal vias in the exposed PAD to the copper flood on the bottom layer
13 of 17
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ZXBM5210
Document number: DS36765 Rev. 1 - 2
ZXBM5210
Ordering Information
13” Tape and Reel
Part Number Suffix
Part Number
Package Code
Packaging
Quantity
ZXBM5210-S-13
ZXBM5210-SP-13
S
SO-8
2500/Tape & Reel
2500/Tape & Reel
-13
-13
SP
SO-8EP
Marking Information
(1) Package type: SO-8
Part Number
Package
Identification Code
BM5210
YY WW XX
ZXBM5210-S-13
SO-8
(2) Package type: SO-8EP
Part Number
Package
Identification Code
BM5210
YY WW XX E
ZXBM5210-SP-13
SO-8EP
14 of 17
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ZXBM5210
Document number: DS36765 Rev. 1 - 2
ZXBM5210
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
(1) Package Type: SO-8
SO-8
Min
-
0.10
1.30
0.15
0.3
Dim
A
A1
A2
A3
b
Max
1.75
0.20
1.50
0.25
0.5
E1
E
Gauge Plane
Seating Plane
A1
L
D
E
E1
e
h
L
θ
4.85
5.90
3.85
1.27 Typ
-
0.62
0°
4.95
6.10
3.95
Detail ‘A’
7°~9°
h
°
45
0.35
0.82
8°
Detail ‘A’
A2
A3
A
b
e
All Dimensions in mm
D
(2) Package Type: SO-8EP
SO-8EP (SOP-8L-EP)
Dim Min Max Typ
Exposed Pad
8
1
5
4
A
1.40 1.50 1.45
A1 0.00 0.13
-
E1
b
C
D
E
0.30 0.50 0.40
0.15 0.25 0.20
4.85 4.95 4.90
3.80 3.90 3.85
H
F
E0 3.85 3.95 3.90
E1 5.90 6.10 6.00
b
Bottom View
E
e
F
H
L
-
-
1.27
2.75 3.35 3.05
2.11 2.71 2.41
0.62 0.82 0.72
9° (All sides)
N
45°
7°
Q
C
4° ± 3°
N
Q
-
-
0.35
A
Gauge Plane
Seating Plane
0.60 0.70 0.65
e
E0
All Dimensions in mm
A1
L
D
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ZXBM5210
Document number: DS36765 Rev. 1 - 2
ZXBM5210
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1) Package Type: SO-8
X
Dimensions Value (in mm)
X
Y
C1
C2
0.60
1.55
5.4
C1
1.27
C2
Y
(2) Package Type: SO-8EP
X2
Dimensions Value (in mm)
C
X
X1
X2
Y
1.270
0.802
3.502
4.612
1.505
2.613
6.500
Y1
Y2
X1
Y1
Y2
Y
C
X
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ZXBM5210
Document number: DS36765 Rev. 1 - 2
ZXBM5210
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
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Document number: DS36765 Rev. 1 - 2
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