ZXLD1350Q [DIODES]

AUTOMOTIVE COMPLIANT 350mA BUCK LED DRIVER;
ZXLD1350Q
型号: ZXLD1350Q
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

AUTOMOTIVE COMPLIANT 350mA BUCK LED DRIVER

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ZXLD1350Q  
AUTOMOTIVE COMPLIANT 350mA BUCK LED DRIVER  
Description  
Pin Assignments  
The ZXLD1350Q is a hysteretic mode inductive step-down converter  
with integrated switch and high side current sense.  
(Top View)  
It operates from an input supply from 7V to 30V driving single or  
multiple series connected LEDs efficiently external adjustable output  
current up to 350mA.  
The output current can be adjusted by applying a DC voltage or a  
PWM waveform. 100:1 adjustment of output current is possible using  
PWM control. Applying a voltage of 0.2V or lower to the ADJ pin turns  
the output off and switches the device into a low current standby  
state.  
TSOT25  
The ZXLD1350Q has been qualified to AEC-Q100 grade 2 and is  
Automotive Compliant supporting PPAPs.  
Features  
Simple Low Parts Count  
Internal 30V NDMOS Switch  
Internal PWM Filter  
High Efficiency (Up to 95%)  
Wide Input Voltage Range: 7V to 30V  
40V Transient Capability  
Up to 1MHz Switching Frequency  
Typical 4% Output Current Accuracy  
Green Molding (No Br, Sb) in TSOT25  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Automotive Compliant  
Qualified to AEC-Q100 Standards for High Reliability  
PPAP Capable (Note 4)  
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.  
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated‘s definitions of Halogen- and Antimony-free, "Green"  
and Lead-free.  
3. Halogen- and Antimony-free "Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. Automotive products are AEC-Q100 qualified and are PPAP capable. Refer to https://www.diodes.com/quality/product-compliance-definitions/.  
Typical Application Circuit  
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ZXLD1350Q  
Document number: DS37076 Rev. 2 - 2  
ZXLD1350Q  
Block Diagram  
RS  
VIN  
L1  
D1  
V
IN  
ISENSE  
LX  
V
IN  
R1  
Current sense circuit  
Voltage  
regulator  
5V  
-
+
Shutdown  
circuit  
C1  
Comparator  
-
MN  
+
ADJ  
R2  
4KHz  
200k  
Vref  
1.25V  
R3  
GND  
Block Diagram Pin Connection  
Pin Description  
Pin Number  
Pin Name  
Description  
1
2
LX  
Drain of NDMOS switch  
GND  
Ground (0V)  
Multi-function On/Off and brightness control pin:  
Leave floating for normal operation  
.
VADJ = VREF = 1.25V giving nominal average output current IOUTnom = 0.1/RS  
Drive to voltage below 0.2V to turn off output current.  
Drive with Analog voltage:  
3
ADJ  
.
0.3V < VADJ < 2.5V adjusts output current from 25% to 200%(†) of IOUTnom  
Drive with PWM signal from open-collector or open-drain transistor, to adjust output current.  
.
Adjustment range 25% to 100% of IOUTnom for f > 10kHz and 1% to 100% of IOUTnom for f < 500Hz  
Connect a capacitor from this pin to ground to increase soft-start time. (Default soft-start time = 0.5ms.  
.
Additional soft-start time is approx.0.5ms/nF)  
Connect resistor RS from this pin to VIN to define nominal average output current IOUTnom = 0.1/RS  
(Note: RSMIN = 0.27with ADJ pin open circuit)  
4
5
ISENSE  
VIN  
Input voltage (7V to 30V). Decouple to ground with 1µF of higher X7R ceramic capacitor close to device  
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Absolute Maximum Ratings (Voltages to GND Unless Otherwise Stated)  
Symbol  
Parameter  
Rating  
-0.3 to +30  
Unit  
VIN  
Input Voltage  
V
(40V for 0.5 sec)  
+0.3 to -5  
VSENSE  
ISENSE Voltage  
LX Output Voltage  
V
(measured with respect to VIN)  
-0.3 to +30  
VLX  
V
(40V for 0.5 sec)  
-0.3 to +6  
VADJ  
ILX  
Adjust Pin Input Voltage  
Switch Output Current  
Power Dissipation  
V
500  
mA  
PTOT  
450  
mW  
(Refer to Package Thermal De-rating Curve on Page 17)  
Storage Temperature  
TST  
-55 to +150  
+150  
° C  
° C  
TJ MAX  
Junction Temperature  
ESD Susceptibility  
HBM  
CDM  
MM  
Human Body Model  
500  
1000  
75  
V
V
V
Charged Device Model  
Machine Model  
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings  
only; functional operation of the device at conditions between maximum recommended operating conditions and absolute maximum ratings is not  
implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time.  
(Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling  
and transporting these devices.)  
Thermal Resistance  
Symbol  
Parameter  
Rating  
Unit  
JA  
Junction to Ambient  
200  
°C/W  
Recommended Operating Conditions  
Symbol  
VIN  
Parameter  
Min  
7
Typ.  
Max  
30  
Units  
V
Input Voltage  
tOFFMIN  
tONMIN  
DLX  
Minimum Switch Off-time  
800  
800  
0.99  
+105  
0.37  
1
ns  
Minimum Switch On-time  
ns  
Duty Cycle Range  
0.01  
-40  
TA  
Ambient Operating Temperature Range  
Average/RMS LX Switch Current  
Recommended Maximum Operating Frequency  
Internal Comparator Propagation Delay  
° C  
ILX_CONT  
fLXmax  
tPD  
A
MHz  
ns  
50  
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Document number: DS37076 Rev. 2 - 2  
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Electrical Characteristics (Test conditions: VIN = 12V, Tamb = +25°C, unless otherwise specified.)  
Symbol  
VSU  
Parameter  
Condition  
Min.  
Typ.  
4.8  
Max.  
Unit  
V
Internal Regulator Start-up Threshold  
Quiescent Supply Current with Output Off  
Quiescent Supply Current with Output Switching  
VIN rising  
IINQoff  
IINQon  
ADJ pin grounded  
15  
20  
µ A  
µ A  
ADJ pin floating, f = 250kHz  
250  
500  
Measured on ISENSE pin with  
respect to VIN  
Mean Current Sense Threshold Voltage  
(Defines LED Current Setting Accuracy)  
VSENSE  
95  
100  
105  
mV  
VADJ = 1.25V  
VSENSEHYS Sense Threshold Hysteresis  
15  
%
ISENSE  
ISENSE Pin Input Current  
VSENSE = VIN -0.1  
1.25  
10  
µ A  
Measured on ADJ pin with pin  
floating  
VREF  
Internal Reference Voltage  
1.21  
1.25  
50  
1.29  
V
ppm/°C  
V
VREF/T Temperature Coefficient of VREF  
External Control Voltage Range on ADJ Pin for DC  
VADJ  
0.3  
2.5  
Brightness Control (Note 5)  
DC Voltage on ADJ Pin to Switch Device from Active  
(On) State to Quiescent (Off) State  
VADJoff  
VADJ falling  
VADJ rising  
0.15  
0.2  
0.2  
0.25  
0.3  
V
V
DC Voltage on ADJ Pin to Switch Device from  
Quiescent (Off) State to Active (On) State  
VADJon  
0.25  
RADJ  
ILXmean  
RLX  
Resistance between ADJ Pin and VREF  
Continuous LX Switch Current  
LX Switch ‗On‘ Resistance  
135  
250  
0.37  
2
kΩ  
A
1.5  
ILX(leak)  
LX Switch Leakage Current  
1
µ A  
Duty Cycle Range of PWM Signal Applied to ADJ Pin  
during Low Frequency PWM Dimming Mode  
PWM frequency <500Hz PWM  
amplitude = VREF  
0.01  
100:1  
1
1
DPWM(LF)  
Measured on ADJ pin  
Brightness Control Range  
Duty Cycle Range of PWM Signal Applied to ADJ Pin  
during High Frequency PWM Dimming Mode  
PWM frequency <10kHz PWM  
amplitude = VREF  
0.16  
DPWM(HF)  
Measured on ADJ pin  
ADJ pin floating  
Brightness Control Range  
5:1  
Operating Frequency  
L = 100H (0.82V)  
fLX  
250  
500  
kHz  
µ s  
(See Graphs for More Details)  
IOUT = 350mA @ VLED = 3.4V  
Driving 1 LED  
Time taken for output current to  
reach 90% of final value after  
voltage on ADJ pin has risen  
above 0.3V.  
Start Up Time  
tSS  
(See Graphs for More Details)  
Note:  
5. 100% brightness corresponds to VADJ = VADJ(nom) = VREF. Driving the ADJ pin above VREF will increase the VSENSE threshold and output current  
proportionally.  
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ZXLD1350Q  
Document number: DS37076 Rev. 2 - 2  
ZXLD1350Q  
Device Description  
The device, in conjunction with the coil (L1) and current sense resistor (RS), forms a self-oscillating continuous-mode buck converter.  
Device Operation (Refer to block diagram and Figure 1 - Operating waveforms)  
tOFF  
tON  
Figure 1. Theoretical Operating Waveforms  
Operation can be best understood by assuming that the ADJ pin of the device is unconnected and the voltage on this pin (VADJ) appears directly at  
the (+) input of the comparator.  
When input voltage VIN is first applied, the initial current in L1 and RS is zero and there is no output from the current sense circuit. Under this  
condition, the (-) input to the comparator is at ground and its output is high. This turns MN on and switches the LX pin low, causing current to flow  
from VIN to ground, via RS, L1 and the LED(s). The current rises at a rate determined by VIN and L1 to produce a voltage ramp (VSENSE) across RS.  
The supply referred voltage VSENSE is forced across internal resistor R1 by the current sense circuit and produces a proportional current in internal  
resistors R2 and R3. This produces a ground referred rising voltage at the (-) input of the comparator. When this reaches the threshold voltage  
(VADJ), the comparator output switches low and MN turns off. The comparator output also drives another NMOS switch, which bypasses internal  
resistor R3 to provide a controlled amount of hysteresis. The hysteresis is set by R3 to be nominally 15% of VADJ.  
When MN is off, the current in L1 continues to flow via D1 and the LED(s) back to VIN. The current decays at a rate determined by the LED and  
diode forward voltages to produce a falling voltage at the input of the comparator. When this voltage returns to VADJ, the comparator output  
switches high again. This cycle of events repeats, with the comparator input ramping between limits of VADJ 15%.  
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Device Description (Cont.)  
Switching Thresholds  
With VADJ = VREF, the ratios of R1, R2 and R3, define an average VSENSE switching threshold of 100mV (measured on the ISENSE pin with respect  
to VIN). The average output current IOUTnom is then defined by this voltage and RS according to:  
IOUTnom = 100mV/RS  
Nominal ripple current is 15mV/RS.  
Adjusting Output Current  
The device contains a low pass filter between the ADJ pin and the threshold comparator and an internal current limiting resistor (200knom)  
between ADJ and the internal reference voltage. This allows the ADJ pin to be overdriven with either DC or pulse signals to change the VSENSE  
switching threshold and adjust the output current. The filter is third order, comprising three sections, each with a cut-off frequency of nominally  
4kHz.  
Details of the different modes of adjusting output current are given in the applications section.  
Output Shutdown  
The output of the low pass filter drives the shutdown circuit. When the input voltage to this circuit falls below the threshold (0.2V nom), the internal  
regulator and the output switch are turned off. The voltage reference remains powered during shutdown to provide the bias current for the  
shutdown circuit. Quiescent supply current during shutdown is nominally 15mA and switch leakage is below 1mA.  
Typical Operating Waveforms [VIN = 12V, RS = 0.3, L = 100μH]  
Normal Operation. Output Current (Ch3) and LX Voltage (Ch1)  
Start-up Waveforms. Output Current (Ch3), LX Voltage (Ch1) and  
VADJ (Ch2)  
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Typical Operating Conditions  
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Typical Characteristics (Cont.)  
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Typical Characteristics (Cont.)  
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Application Information  
Setting Nominal Average Output Current with External Resistor RS  
The nominal average output current in the LED(s) is determined by the value of the external current sense resistor (RS) connected between VIN  
and ISENSE and is given by:  
IOUTnom = 0.1/RS [for RS 0.27]  
The table below gives values of nominal average output current for several preferred values of current setting resistor (RS) in the typical  
application circuit shown on page 1:  
RS (Ω)  
0.27  
0.30  
0.33  
0.39  
Nominal Average Output Current (mA)  
370  
333  
300  
256  
The above values assume that the ADJ pin is floating and at a nominal voltage of VREF (=1.25V). Note that RS = 0.27is the minimum allowed  
value of sense resistor under these conditions to maintain switch current below the specified maximum value.  
It is possible to use different values of RS if the ADJ pin is driven from an external voltage. (See next section).  
Output Current Adjustment by External DC Control Voltage  
The ADJ pin can be driven by an external dc voltage (VADJ), as shown, to adjust the output current to a value above or below the nominal average  
value defined by RS.  
ZXLD1350Q  
ADJ  
+
GND  
DC  
GND  
The nominal average output current in this case is given by:  
IOUTdc = 0.08*VADJ /RS  
for 0.3 < VADJ < 2.5V  
Note that 100% brightness setting corresponds to VADJ = VREF. When driving the ADJ pin above 1.25V, RS must be increased in proportion to  
prevent IOUTdc exceeding 370mA maximum.  
The input impedance of the ADJ pin is 200kΩ ±25%.  
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Application Information (Cont.)  
Output Current Adjustment by PWM Control  
Directly Driving ADJ Input  
A Pulse Width Modulated (PWM) signal with duty cycle DPWM can be applied to the ADJ pin, as shown below, to adjust the output current to a  
value above or below the nominal average value set by resistor RS:  
PWM  
VADJ  
ZXLD1350Q  
ADJ  
GND  
0V  
GND  
Driving the ADJ Input via Open Collector Transistor  
The recommended method of driving the ADJ pin and controlling the amplitude of the PWM waveform is to use a small NPN switching transistor  
as shown below:  
ADJ  
ZXLD1350Q  
PWM  
GND  
GND  
This scheme uses the 200kresistor between the ADJ pin and the internal voltage reference as a pull-up resistor for the external transistor.  
Driving the ADJ Input from a Microcontroller  
Another possibility is to drive the device from the open drain output of a microcontroller. The diagram below shows one method of doing this:  
MCU  
10k  
ZXLD1350Q  
ADJ  
GND  
The diode and resistor suppress possible high amplitude negative spikes on the ADJ input resulting from the drain-source capacitance of the FET.  
Negative spikes at the input to the device should be avoided as they may cause errors in output current, or erratic device operation.  
PWM dimming can be further split into high frequency and low frequency PWM dimming and how the device responds to these.  
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Application Information (Cont.)  
Low Frequency PWM Mode  
When the ADJ pin is driven with a low frequency PWM signal (eg 100Hz), with a high level voltage V  
and a low level of zero, the output of the  
ADJ  
internal low pass filter will swing between 0V and V  
, causing the input to the shutdown circuit to fall below its turn-off threshold (200mV nom)  
ADJ  
when the ADJ pin is low. This will cause the output current to be switched on and off at the PWM frequency, resulting in an average output current  
proportional to the PWM duty cycle. (See Figure 2 - Low frequency PWM operating waveforms).  
I
OUTavg  
tON  
tOFF  
Figure 2. Low Frequency PWM Operating Waveforms  
The average value of output current in this mode is given by:  
IOUTavg = 0.1DPWM/RS for DPWM >0. 01  
This mode is preferable if optimum LED 'whiteness' is required. It will also provide the widest possible dimming range (approx. 100:1) and higher  
efficiency at the expense of greater output ripple.  
Note that the low pass filter introduces a small error in the output duty cycle due to the difference between the start-up and shut-down time. This  
time difference is a result of the 200mV shutdown threshold and the rise and fall times at the output of the filter. To minimize this error, the PWM  
duty cycle should be as low as possible consistent with avoiding flicker in the LED.  
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Application Information (Cont.)  
High Frequency PWM Mode  
At PWM frequencies above 10kHz and for duty cycles above 0.16, the output of the internal low pass filter will contain a DC component that is  
always above the shutdown threshold. This will maintain continuous device operation and the nominal average output current will be proportional  
to the average voltage at the output of the filter, which is directly proportional to the duty cycle. (See Figure 3 High frequency PWM operating  
waveforms). For best results, the PWM frequency should be maintained above the minimum specified value of 10kHz, in order to minimize ripple  
at the output of the filter. The shutdown comparator has approximately 50mV of hysteresis, to minimize erratic switching due to this ripple. An  
upper PWM frequency limit of approximately one tenth of the operating frequency is recommended, to avoid excessive output modulation and to  
avoid injecting excessive noise into the internal reference.  
tON  
tOFF  
Figure 3. High Frequency PWM Operating Waveforms  
The nominal average value of output current in this mode is given by:  
IOUTnom »0.1DPWM/RS for DPWM > 0.16  
This mode will give minimum output ripple and reduced radiated emission, but with a reduced dimming range (approx.5:1). The restricted dimming  
range is a result of the device being turned off when the DC component on the filter output falls below 200mV.  
Shutdown Mode  
Taking the ADJ pin to a voltage below 0.2V for more than approximately 100μs, will turn off the output and supply current will fall to a low standby  
level of 15μA nominal.  
Note that the ADJ pin is not a logic input. Taking the ADJ pin to a voltage above V  
average value. (See graphs for details).  
will increase output current above the 100% nominal  
REF  
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Application Information (Cont.)  
Soft-start  
The device has inbuilt soft-start action due to the delay through the PWM filter. An external capacitor from the ADJ pin to ground will provide  
additional soft-start delay, by increasing the time taken for the voltage on this pin to rise to the turn-on threshold and by slowing down the rate of  
rise of the control voltage at the input of the comparator. With no external capacitor, the time taken for the output to reach 90% of its final value is  
approximately 500μs. Adding capacitance increases this delay by approximately 0.5ms/nF.  
The graph below shows the variation of soft-start time for different values of capacitor.  
Inherent Open-circuit LED Protection  
If the connection to the LED(s) is open-circuited, the coil is isolated from the LX pin of the chip, so the device will not be damaged, unlike in many  
boost converters, where the back EMF may damage the internal switch by forcing the drain above its breakdown voltage.  
Capacitor Selection  
A low ESR capacitor should be used for input decoupling, as the ESR of this capacitor appears in series with the supply source impedance and  
lowers overall efficiency. This capacitor has to supply the relatively high peak current to the coil and smooth the current ripple on the input supply.  
A minimum value of 1μF is acceptable if the input source is close to the device, but higher values will improve performance at lower input voltages,  
especially when the source impedance is high. The input capacitor should be placed as close as possible to the IC.  
For maximum stability over temperature and voltage, capacitors with X7R, X5R, or better dielectric are recommended. Capacitors with Y5V  
dielectric are not suitable for decoupling in this application and should NOT be used.  
A table of recommended manufacturers is provided below:  
Manufacturer  
Murata  
Website  
www.murata.com  
www.t-yuden.com  
www.kemet.com  
www.avxcorp.com  
Taiyo Yuden  
Kemet  
AVX  
Inductor Selection  
Recommended inductor values for the ZXLD1350Q are in the range 47µH to 220µH.  
Higher values of inductance are recommended at higher supply voltages in order to minimize errors due to switching delays, which result in  
increased ripple and lower efficiency. Higher values of inductance also result in a smaller change in output current over the supply voltage range.  
(See graphs). The inductor should be mounted as close to the device as possible with low resistance connections to the LX and V pins.  
IN  
The chosen coil should have a saturation current higher than the peak output current and a continuous current rating above the required mean  
output current.  
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Application Information (Cont.)  
Suitable coils for use with the ZXLD1350Q are listed in the table below:  
ISAT (A)  
0.5  
Part Number  
L (µH)  
47  
DCR (V)  
0.64  
Manufacturer  
DO1608C  
47  
0.38  
0.56  
0.47  
0.39  
0.53  
0.38  
CoilCraft  
MSS6132ML  
68  
0.58  
100  
220  
47  
0.82  
CD104-MC  
0.55  
Sumida  
NP04SB470M  
0.27  
Taiyo Yuden  
The inductor value should be chosen to maintain operating duty cycle and switch 'on'/'off' time within the specified limits over the supply voltage  
and load current range.  
The following equations can be used as a guide, with reference to Figure 1 - Operating waveforms.  
LX Switch 'On' Time  
LI  
tON  
V
IN VLED Iavg  
RS rL RLX  
Note: t  
ONnmin  
> 200ns  
LX Switch 'Off' Time  
LI  
tOFF  
VLED VD Iavg  
RS rL  
Note: t  
> 200ns  
OFFmin  
Where:  
L is the coil inductance (H)  
rL is the coil resistance ()  
I
is the required LED current (A)  
avg  
I is the coil peak-peak ripple current (A) {Internally set to 0.3 x Iavg  
}
V
V
is the supply voltage (V)  
IN  
is the total LED forward voltage (V)  
LED  
R
LX  
is the switch resistance ()  
V
is the rectifier diode forward voltage at the required load current (V)  
D
Example:  
For VIN = 12V, L = 47µH, rL = 0.64, V  
= 3.4V, Iavg = 350mA and VD = 0.36V  
LED  
tON = (47e-6 x 0.105)/(12 - 3.4 - 0.672) = 0.622µs  
tOFF = (47e-6 x 0.105)/(3.4 + 0.36 + 0.322) = 1.21µs  
This gives an operating frequency of 546kHz and a duty cycle of 0.34.  
These and other equations are available as a spreadsheet calculator from the Diodes website.  
Note that in practice, the duty cycle and operating frequency will deviate from the calculated values due to dynamic switching delays, switch  
rise/fall times and losses in the external components.  
Optimum performance will be achieved by setting the duty cycle close to 0.5 at the nominal supply voltage. This helps to equalize the undershoot  
and overshoot and improves temperature stability of the output current.  
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Application Information (Cont.)  
Diode Selection  
For maximum efficiency and performance, the rectifier (D1) should be a fast low capacitance Schottky diode with low reverse leakage at the  
maximum operating voltage and temperature. The recommended diode for use with this part is the DFLS140Q. This has approximately ten times  
lower leakage than standard Schottky diodes, which are unsuitable for use above +85°C. It also provides better efficiency than silicon diodes, due  
to a combination of lower forward voltage and reduced recovery time.  
The table below gives the typical characteristics for the DFLS140Q:  
Continuous  
Current  
(mA)  
Reverse Leakage  
@ 30V +85°C  
(µA)  
Forward Voltage @  
300mA (mV)  
Diode  
Package  
®
PowerDI 123  
DFLS140Q  
410  
1000  
100  
If alternative diodes are used, it is important to select parts with a peak current rating above the peak coil current and a continuous current rating  
higher than the maximum output load current. It is very important to consider the reverse leakage of the diode when operating above +85°C.  
Excess leakage will increase the power dissipation in the device.  
The higher forward voltage and overshoot due to reverse recovery time in silicon diodes will increase the peak voltage on the LX output. If a silicon  
diode is used, care should be taken to ensure that the total voltage appearing on the LX pin including supply ripple, does not exceed the specified  
maximum value.  
Reducing Output Ripple  
Peak to peak ripple current in the LED(s) can be reduced, if required, by shunting a capacitor Cled across the LED(s) as shown below:  
RS  
VIN  
LED  
L1  
Cled  
D1  
VIN  
ISENSE  
LX  
ZXLD1350Q  
A value of 1μF will reduce nominal ripple current by a factor three (approx.). Proportionally lower ripple can be achieved with higher capacitor  
values. Note that the capacitor will not affect operating frequency or efficiency, but it will increase start-up delay, by reducing the rate of rise of  
LED voltage.  
Operation at low supply voltage  
The internal regulator disables the drive to the switch until the supply has risen above the start-up threshold (VSU). Above this threshold, the  
device will start to operate. However, with the supply voltage below the specified minimum value, the switch duty cycle will be high and the device  
power dissipation will be at a maximum. Care should be taken to avoid operating the device under such conditions in the application, in order to  
minimize the risk of exceeding the maximum allowed die temperature. (See next section on thermal considerations).  
Note that when driving loads of two or more LEDs, the forward drop will normally be sufficient to prevent the device from switching below  
approximately 6V. This will minimize the risk of damage to the device.  
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ZXLD1350Q  
Document number: DS37076 Rev. 2 - 2  
ZXLD1350Q  
Application Information (Cont.)  
Thermal Considerations  
When operating the device at high ambient temperatures, or when driving maximum load current, care must be taken to avoid exceeding the  
package power dissipation limits. The graph below gives details for power derating. This assumes the device to be mounted on a (25mm)2 PCB  
with 1oz copper standing in still air.  
Note that the device power dissipation will most often be a maximum at minimum supply voltage. It will also increase if the efficiency of the circuit  
is low. This may result from the use of unsuitable coils, or excessive parasitic output capacitance on the switch output.  
Thermal Compensation of Output Current  
High luminance LEDs often need to be supplied with a temperature compensated current in order to maintain stable and reliable operation at all  
drive levels. The LEDs are usually mounted remotely from the device, so for this reason, the temperature coefficients of the internal circuits for the  
ZXLD1350Q have been optimized to minimize the change in output current when no compensation is employed. If output current compensation is  
required, it is possible to use an external temperature sensing network - normally using Negative Temperature Coefficient (NTC) thermistors  
and/or diodes, mounted very close to the LED(s). The output of the sensing network can be used to drive the ADJ pin in order to reduce output  
current with increasing temperature.  
Layout Considerations  
LX Pin  
The LX pin of the device is a fast switching node, so PCB tracks should be kept as short as possible. To minimize ground 'bounce', the ground pin  
of the device should be soldered directly to the ground plane.  
Coil and Decoupling Capacitors  
It is particularly important to mount the coil and the input decoupling capacitor close to the device to minimize parasitic resistance and inductance,  
which will degrade efficiency. It is also important to take account of any track resistance in series with current sense resistor RS.  
ADJ Pin  
The ADJ pin is a high impedance input, so when left floating, PCB tracks to this pin should be as short as possible to reduce noise pickup. A  
100nF capacitor from the ADJ pin to ground will reduce frequency modulation of the output under these conditions. An additional series 10kΩ  
resistor can also be used when driving the ADJ pin from an external circuit (see below). This resistor will provide filtering for low frequency noise  
and provide protection against high voltage transients.  
10k  
ZXLD1350Q  
GND  
ADJ  
100nF  
GND  
High Voltage Tracks  
Avoid running any high voltage tracks close to the ADJ pin, to reduce the risk of leakage due to board contamination. Any such leakage may raise  
the ADJ pin voltage and cause excessive output current. A ground ring placed around the ADJ pin will minimize changes in output current under  
these conditions.  
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© Diodes Incorporated  
ZXLD1350Q  
Document number: DS37076 Rev. 2 - 2  
ZXLD1350Q  
Ordering Information  
Q : Automotive  
Compliant  
Packing: 7” Tape and Reel  
Package Part  
(Note 6) Mark  
Package  
Qualification Grade  
(Note 7)  
Device  
Code  
Quantity Per Reel Tape Width Part Number Suffix  
ZXLD1350QET5TA  
ET5  
TSOT25 1350  
3000  
8mm  
TA  
Automotive Compliant  
Note:  
6. Pad layout as shown in Diodes Incorporateds package outline PDFs, which can be found on our website at http://www.diodes.com/package-outlines.html.  
7. ZXLD1350Q has been qualified to AEC-Q100 grade 2 and is classified as ―Automotive Compliant‖ supporting PPAP documentation.  
See ZXLD1350 datasheet for commercial qualified versions.  
Marking Information  
TSOT25  
XXXX : Identification Code : 1350  
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© Diodes Incorporated  
ZXLD1350Q  
Document number: DS37076 Rev. 2 - 2  
ZXLD1350Q  
Package Outline Dimensions  
Please see http://www.diodes.com/package-outlines.html for the latest version.  
TSOT25  
D
e1  
TSOT25  
Min Max  
1.00  
01( 4x)  
Dim  
A
Typ  
-
-
-
-
-
E1/2  
A1  
A2  
b
c
D
E
E1  
e
e1  
L
L2  
θ
0.01 0.10  
0.84 0.90  
0.30 0.45  
0.12 0.20  
E/2  
c
E1  
E
-
Gauge Plane  
Seating Plane  
-
-
-
-
-
-
2.90  
2.80  
1.60  
0
L
L2  
0.95 BSC  
1.90 BSC  
01( 4x)  
e
b
A2  
0.30 0.50  
0.25 BSC  
8°  
12°  
A1  
0°  
4°  
4°  
-
A
θ1  
Seating Plane  
All Dimensions in mm  
Suggested Pad Layout  
Please see http://www.diodes.com/package-outlines.html for the latest version.  
TSOT25  
C
Dimensions Value (in mm)  
C
X
Y
0.950  
0.700  
1.000  
3.199  
Y1  
Y1  
Y
X
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September 2017  
© Diodes Incorporated  
ZXLD1350Q  
Document number: DS37076 Rev. 2 - 2  
ZXLD1350Q  
Revision History  
Date  
December  
2014  
Revision  
1-2  
Changes  
Initial release  
Added further clarification of Automotive Compliance and reference to Diodes’ definition (Page 1, Note  
4 and page 18, Note 7)  
Corrected device part mark to include pin 1 identifier (Pages 1 and 18)  
Correction of ESD ratings (Page 3) (Note 8):  
Incorrect revision 1-2  
specification  
Corrected revision 2-2  
specification  
January 2017  
2-2  
ESD Rating  
Unit  
HBM  
MM  
Human Body Model  
500  
100  
500  
75  
V
V
V
Machine Model  
CDM  
Charged Device Model  
1000  
1000  
Note 8. The actual physical ESD withstand capability is unaltered.  
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Document number: DS37076 Rev. 2 - 2  
ZXLD1350Q  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2017, Diodes Incorporated  
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© Diodes Incorporated  
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Document number: DS37076 Rev. 2 - 2  

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