US1K [DIOTEC]
Ultrafast Switching Surface Mount Si-Diodes; 超快开关表面贴装硅二极管型号: | US1K |
厂家: | DIOTEC SEMICONDUCTOR |
描述: | Ultrafast Switching Surface Mount Si-Diodes |
文件: | 总2页 (文件大小:68K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
US1A ... US1M
US1A ... US1M
Ultrafast Switching Surface Mount Si-Diodes
Ultraschnelle Si-Dioden für die Oberflächenmontage
Version 2006-04-18
Nominal current – Nennstrom
1 A
5± 0.2
Repetitive peak reverse voltage
Periodische Spitzensperrspannung
50...1000 V
Plastic case
Kunststoffgehäuse
~ SMA
~ DO-214AC
1
0.15
Weight approx. – Gewicht ca.
0.07 g
Type
Typ
Plastic material has UL classification 94V-0
Gehäusematerial UL94V-0 klassifiziert
4.6± 0.2
Standard packaging taped and reeled
Standard Lieferform gegurtet auf Rolle
Dimensions - Maße [mm]
Maximum ratings
Grenzwerte
Type
Typ
Repetitive peak reverse voltage
Periodische Spitzensperrspannung
Surge peak reverse voltage
Stoßspitzensperrspannung
VRSM [V]
V
RRM [V]
US1A
US1B
US1D
US1G
US1J
US1K
US1M
50
50
100
200
400
600
800
1000
100
200
400
600
800
1000
Max. average forward rectified current, R-load
Dauergrenzstrom in Einwegschaltung mit R-Last
TT = 100°C
f > 15 Hz
TA = 25°C
TA = 25°C
IFAV
1 A
Repetitive peak forward current
Periodischer Spitzenstrom
IFRM
IFSM
i2t
6 A 1)
30 A
Peak forward surge current, 50 Hz half sine-wave
Stoßstrom für eine 50 Hz Sinus-Halbwelle
Rating for fusing, t < 10 ms
Grenzlastintegral, t < 10 ms
4.5 A2s
Junction temperature – Sperrschichttemperatur
Storage temperature – Lagerungstemperatur
-50...+150°C
-50...+150°C
Tj
TS
1
Max. temperature of the terminals TT = 100°C – Max. Temperatur der Anschlüsse TT = 100°C
© Diotec Semiconductor AG
http://www.diotec.com/
1
US1A ... US1M
Characteristics
Kennwerte
Type
Typ
Reverse recovery time
Sperrverzugszeit
trr [ns] 1)
Forward voltage
Durchlass-Spannung
VF [V]
at / bei
IF [A]
US1A...US1D
US1G
< 50
< 50
< 75
< 1.0
< 1.25
< 1.7
1
1
1
US1J...US1M
Leakage current
Sperrstrom
Tj = 25°C VR = VRRM
Tj = 100°C VR = VRRM
IR
IR
< 10 µA
< 100 µA
Thermal resistance junction to ambient air
RthA
< 70 K/W 2)
Wärmewiderstand Sperrschicht – umgebende Luft
Thermal resistance junction to terminal
RthT
< 30 K/W
Wärmewiderstand Sperrschicht – Anschluss
10
120
[%]
[A]
100
US1A...D
1
US1G
80
US1J...M
60
0.1
40
10-2
IF
20
IFAV
0
Tj = 25°C
10-3
VF
[V]
0
TT
100
150
50
[°C]
Forward characteristics (typical values)
Durchlasskennlinien (typische Werte)
Rated forward current vs. temp. of the terminals
Zul. Richtstrom in Abh. v. d. Temp. der Terminals
1
2
IF = 0.5 A through/über IR = 1 A to/auf IR = 0.25 A
Mounted on P.C. board with 25 mm2 copper pads at each terminal
Montage auf Leiterplatte mit 25 mm2 Kupferbelag (Lötpad) an jedem Anschluss
2
http://www.diotec.com/
© Diotec Semiconductor AG
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