US1K [DIOTEC]

Ultrafast Switching Surface Mount Si-Diodes; 超快开关表面贴装硅二极管
US1K
型号: US1K
厂家: DIOTEC SEMICONDUCTOR    DIOTEC SEMICONDUCTOR
描述:

Ultrafast Switching Surface Mount Si-Diodes
超快开关表面贴装硅二极管

整流二极管 开关 光电二极管
文件: 总2页 (文件大小:68K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
US1A ... US1M  
US1A ... US1M  
Ultrafast Switching Surface Mount Si-Diodes  
Ultraschnelle Si-Dioden für die Oberflächenmontage  
Version 2006-04-18  
Nominal current – Nennstrom  
1 A  
5± 0.2  
Repetitive peak reverse voltage  
Periodische Spitzensperrspannung  
50...1000 V  
Plastic case  
Kunststoffgehäuse  
~ SMA  
~ DO-214AC  
1
0.15  
Weight approx. – Gewicht ca.  
0.07 g  
Type  
Typ  
Plastic material has UL classification 94V-0  
Gehäusematerial UL94V-0 klassifiziert  
4.6± 0.2  
Standard packaging taped and reeled  
Standard Lieferform gegurtet auf Rolle  
Dimensions - Maße [mm]  
Maximum ratings  
Grenzwerte  
Type  
Typ  
Repetitive peak reverse voltage  
Periodische Spitzensperrspannung  
Surge peak reverse voltage  
Stoßspitzensperrspannung  
VRSM [V]  
V
RRM [V]  
US1A  
US1B  
US1D  
US1G  
US1J  
US1K  
US1M  
50  
50  
100  
200  
400  
600  
800  
1000  
100  
200  
400  
600  
800  
1000  
Max. average forward rectified current, R-load  
Dauergrenzstrom in Einwegschaltung mit R-Last  
TT = 100°C  
f > 15 Hz  
TA = 25°C  
TA = 25°C  
IFAV  
1 A  
Repetitive peak forward current  
Periodischer Spitzenstrom  
IFRM  
IFSM  
i2t  
6 A 1)  
30 A  
Peak forward surge current, 50 Hz half sine-wave  
Stoßstrom für eine 50 Hz Sinus-Halbwelle  
Rating for fusing, t < 10 ms  
Grenzlastintegral, t < 10 ms  
4.5 A2s  
Junction temperature – Sperrschichttemperatur  
Storage temperature – Lagerungstemperatur  
-50...+150°C  
-50...+150°C  
Tj  
TS  
1
Max. temperature of the terminals TT = 100°C – Max. Temperatur der Anschlüsse TT = 100°C  
© Diotec Semiconductor AG  
http://www.diotec.com/  
1
US1A ... US1M  
Characteristics  
Kennwerte  
Type  
Typ  
Reverse recovery time  
Sperrverzugszeit  
trr [ns] 1)  
Forward voltage  
Durchlass-Spannung  
VF [V]  
at / bei  
IF [A]  
US1A...US1D  
US1G  
< 50  
< 50  
< 75  
< 1.0  
< 1.25  
< 1.7  
1
1
1
US1J...US1M  
Leakage current  
Sperrstrom  
Tj = 25°C VR = VRRM  
Tj = 100°C VR = VRRM  
IR  
IR  
< 10 µA  
< 100 µA  
Thermal resistance junction to ambient air  
RthA  
< 70 K/W 2)  
Wärmewiderstand Sperrschicht – umgebende Luft  
Thermal resistance junction to terminal  
RthT  
< 30 K/W  
Wärmewiderstand Sperrschicht – Anschluss  
10  
120  
[%]  
[A]  
100  
US1A...D  
1
US1G  
80  
US1J...M  
60  
0.1  
40  
10-2  
IF  
20  
IFAV  
0
Tj = 25°C  
10-3  
VF  
[V]  
0
TT  
100  
150  
50  
[°C]  
Forward characteristics (typical values)  
Durchlasskennlinien (typische Werte)  
Rated forward current vs. temp. of the terminals  
Zul. Richtstrom in Abh. v. d. Temp. der Terminals  
1
2
IF = 0.5 A through/über IR = 1 A to/auf IR = 0.25 A  
Mounted on P.C. board with 25 mm2 copper pads at each terminal  
Montage auf Leiterplatte mit 25 mm2 Kupferbelag (Lötpad) an jedem Anschluss  
2
http://www.diotec.com/  
© Diotec Semiconductor AG  

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