DNB61 [DYNEX]
Rectifier Diode; 整流器器二极管
| 型号： | DNB61 |
| 厂家： | 
Dynex Semiconductor |
| 描述： | Rectifier Diode |
| 文件： | 总7页 (文件大小：94K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DNB61
Rectifier Diode
Replaces January 2000 version, DS4178-4.0
DS4178-5.0 July 2001
FEATURES
KEY PARAMETERS
■ Double Side Cooling
■ High Surge Capability
VRRM
IF(AV)
IFSM
2500V
3438A
32000A
APPLICATIONS
■ Rectification
■ Freewheel Diode
■ DC Motor Control
■ Power Supplies
■ Welding
■ Battery Chargers
VOLTAGE RATINGS
Type Number
Repetitive Peak
Conditions
Reverse Voltage
VRRM
V
Outline type code: DO200AD
See Package Details for further information.
DNB61 25
DNB61 24
DNB61 22
DNB61 20
DNB61 18
DNB61 16
VRSM = VRRM + 100V
2500
2400
2200
2000
1800
1600
Fig. 1 Package outline
Lower voltage grades available.
ORDERING INFORMATION
When ordering, select the required part number shown in the
Voltage Ratings selection table, e.g.:
DNB61 24
Note: Please use the complete part number when ordering
and quote this number in any future correspondance relating
to your order.
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DNB61
CURRENT RATINGS
Tcase = 75oC unless otherwise stated
Symbol
Parameter
Conditions
Max.
Units
Double Side Cooled
IF(AV)
IF(RMS)
IF
Mean forward current
Half wave resistive load
3438
5401
4997
A
A
A
RMS value
-
-
Continuous (direct) forward current
Single Side Cooled (Anode side)
IF(AV)
IF(RMS)
IF
Mean forward current
RMS value
Half wave resistive load
2589
4066
3586
A
A
A
-
-
Continuous (direct) forward current
T
case = 100oC unless otherwise stated
Symbol
Parameter
Conditions
Max.
Units
Double Side Cooled
IF(AV)
IF(RMS)
IF
Mean forward current
RMS value
Continuous (direct) forward current
Half wave resistive load
2880
4520
4100
A
A
A
-
-
Single Side Cooled (Anode side)
IF(AV)
IF(RMS)
IF
Mean forward current
RMS value
Half wave resistive load
1870
2940
2550
A
A
A
-
-
Continuous (direct) forward current
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DNB61
SURGE RATINGS
Parameter
Conditions
10ms half sine; Tcase = 175oC
VR = 50% VRRM - 1/4 sine
10ms half sine; Tcase = 175oC
VR = 0
Max.
Units
Symbol
IFSM
I2t
Surge (non-repetitive) forward current
I2t for fusing
25.5
kA
3.25 x 106
32.0
A2s
kA
Surge (non-repetitive) forward current
I2t for fusing
IFSM
I2t
5.12 x 106
A2s
THERMAL AND MECHANICAL DATA
Conditions
Min.
Max. Units
0.013 oC/W
0.025 oC/W
Parameter
Symbol
dc
Double side cooled
-
-
Rth(j-c)
Anode dc
Thermal resistance - junction to case
Single side cooled
Cathode dc
Double side
-
0.027 oC/W
0.003 oC/W
-
Clamping force 45.0kN
with mounting compound
Thermal resistance - case to heatsink
Virtual junction temperature
Rth(c-h)
Single side
-
0.006
185
oC/W
oC
Forward (conducting)
Reverse (blocking)
-
-
Tvj
oC
175
Tstg
-
Storage temperature range
Clamping force
–55
200
oC
40.0
48.0
kN
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DNB61
CHARACTERISTICS
Symbol
Parameter
Forward voltage
Peak reverse current
Conditions
At 1500A peak, Tcase = 25oC
At VRRM, Tcase = 175oC
Typ.
Max. Units
VFM
IRRM
QS
IRR
trr
-
1.05
100
-
V
mA
µC
A
-
3000
140
30
-
Total stored charge
Peak recovery current
Reverse recovery time
Threshold voltage
IF = 1000A, dIRR/dt = 5A/µs
-
Tcase = 125˚C, VR = 100V
-
µs
V
VTO
rT
At Tvj = 175˚C
At Tvj = 175˚C
0.79
0.15
Slope resistance
-
mΩ
CURVES
10000
10000
8000
6000
4000
2000
0
Measured under
pulse conditions
dc
Half wave
8000
6000
4000
2000
3 phase
6 phase
Tj = 25˚C
T = 175
˚C
j
0
0
0
2000
4000
6000
1.0
2.0
3.0
Mean forward current, IF(AV) - (A)
Instantaneous forward voltage, VF - (V)
Fig.2 Maximum (limit) forward characteristics
VFM Equation:-
Fig.3 Dissipation curves
Where
A = 0.827166
B = –0.03596
C = 0.000111
D = 0.007187
VFM = A + Bln (IF) + C.IF+D.√IF
these values are valid for Tj = 125˚C for IF 500A to 10000A
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DNB61
0.1
60
50
40
30
I2t = Î2 x t
2
VR = 50% VRRM
Anode side cooled
6
5
4
0.01
Double side cooled
0.001
20
10
0
3
2
1
I2t
Effective thermal resistance
Junction to case ˚C/W
Conduction
Double side
0.0130
0.0141
Anode side
0.0250
0.0261
d.c.
Halfwave
3 phase 120˚
6 phase 60˚
0.0170
0.0200
0.0290
0.0320
0.0001
0.001
0.01
0.1
Time - (s)
1
10
100
1
10
1
2
3
5
10 20
50
ms
Cycles at 50Hz
Duration
Fig.4 Surge (non-repetitive) forward current vs time (with
50% VRRM at Tcase 175˚C)
Fig.5 Maximum (limit) transient thermal impedance -
junction to case
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DNB61
PACKAGE DETAILS
For further package information, please contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
Hole Ø3.6 x 2.0 deep
(One in each electrode)
Cathode
Ø102 max
Ø63nom
Ø63nom
Ø92 max
Anode
Nominal weight: 1100g
Clamping force: 45kN ±10%
Package outine type code: DO200AD
Note:
1. Package maybe supplied with pins and/or tags.
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DNB61
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor,
and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current
capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our
customers.
Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution
(PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of pre-loaded
clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm
Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies.
Please refer to our application note on device clamping, AN4839
HEATSINKS
Power Assembly has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance
or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or Customer
Services.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
CUSTOMER SERVICE CENTRES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
Fax: 00-44-(0)1522-500550
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
DYNEX POWER INC.
99 Bank Street, Suite 410,
Ottawa, Ontario, Canada, K1P 6B9
Tel: 613.723.7035
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2001 Publication No. DS4178-5 Issue No. 5.0 July 2001
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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