DS2103SY24 [DYNEX]
Rectifier Diode; 整流器器二极管
| 型号： | DS2103SY24 |
| 厂家： | 
Dynex Semiconductor |
| 描述： | Rectifier Diode |
| 文件： | 总7页 (文件大小：94K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DS2103SY
Rectifier Diode
Replaces October 2001 version, DS4172-5.0
DS4172-5.1 December 2001
FEATURES
KEY PARAMETERS
VRRM 2600V
■ Double Side Cooling
■ High Surge Capability
IF(AV) 5788A
IFSM 81000A
APPLICATIONS
■ Rectification
■ Freewheel Diode
■ DC Motor Control
■ Power Supplies
■ Welding
■ Battery Chargers
VOLTAGE RATINGS
Type Number
Repetitive Peak
Conditions
Reverse Voltage
VRRM
V
DS2103SY26
DS2103SY25
DS2103SY24
DS2103SY23
DS2103SY22
DS2103SY21
VRSM = VRRM + 100V
2600
2500
2400
2300
2200
2100
Outline type code: F
See Package Details for further information.
Fig. 1 Package outline
Lower voltage grades available.
ORDERING INFORMATION
When ordering, select the required part number shown in the
Voltage Ratings selection table, e.g.:
DS2103SY22
Note: Please use the complete part number when ordering and
quote this number in any future correspondance relating to your
order.
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DS2103SY
CURRENT RATINGS
Tcase = 75oC unless otherwise stated
Symbol
Parameter
Conditions
Max.
Units
Double Side Cooled
IF(AV)
IF(RMS)
IF
Half wave resistive load
5788
9076
8278
A
A
A
Mean forward current
RMS value
-
-
Continuous (direct) forward current
Single Side Cooled (Anode side)
IF(AV)
IF(RMS)
IF
Mean forward current
RMS value
Half wave resistive load
3751
5892
4955
A
A
A
-
-
Continuous (direct) forward current
Tcase = 100oC unless otherwise stated
Symbol
Parameter
Conditions
Max.
Units
Double Side Cooled
IF(AV)
IF(RMS)
IF
Mean forward current
RMS value
Continuous (direct) forward current
Half wave resistive load
4785
7516
6725
A
A
A
-
Tcase = 100oC
Single Side Cooled (Anode side)
IF(AV)
IF(RMS)
IF
Mean forward current
RMS value
Half wave resistive load
3060
4807
3950
A
A
A
-
-
Continuous (direct) forward current
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DS2103SY
SURGE RATINGS
Parameter
Conditions
10ms half sine; Tcase = 175oC
VR = 50% VRRM - 1/4 sine
10ms half sine; Tcase =175oC
VR = 0
Max.
65.0
Units
kA
Symbol
IFSM
I2t
Surge (non-repetitive) forward current
I2t for fusing
21.1 x 106
81.0
A2s
kA
Surge (non-repetitive) forward current
I2t for fusing
IFSM
I2t
33 x 106
A2s
THERMAL AND MECHANICAL DATA
Conditions
Min.
Max. Units
0.0095 oC/W
0.019 oC/W
Parameter
Symbol
dc
Double side cooled
-
-
Rth(j-c)
Anode dc
Thermal resistance - junction to case
Single side cooled
Cathode dc
Double side
-
0.019 oC/W
0.002 oC/W
-
Clamping force 43.0kN
with mounting compound
Thermal resistance - case to heatsink
Virtual junction temperature
Rth(c-h)
Single side
-
0.004
200
oC/W
oC
Forward (conducting)
Reverse (blocking)
-
-
Tvj
175
oC
Tstg
-
Storage temperature range
Clamping force
–55
175
oC
38.0
47.0
kN
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DS2103SY
CHARACTERISTICS
Symbol
Parameter
Forward voltage
Peak reverse current
Conditions
At 3000A peak, Tcase = 25oC
At VRRM, Tcase = 175oC
Min.
Max. Units
VFM
IRM
QS
Irr
-
-
-
-
-
-
1.05
150
V
mA
µC
A
3000
125
Total stored charge
Peak reverse recovery current
Threshold voltage
IF = 2000A, dIRR/dt = 3A/µs
Tcase = 175˚C, VR = 100V
VTO
rT
At Tvj = 175˚C
At Tvj = 175˚C
0.75
0.063
V
Slope resistance
mΩ
CURVES
10000
12000
10000
8000
6000
4000
2000
0
Measured under pulse conditions
Tj = 175˚C
8000
6000
4000
2000
0
dc
Half wave
3 phase
6 phase
0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5
0
2000
4000
6000
8000
10000
Mean forward current, IF(AV) - (A)
Instantaneous forward voltage, VF - (V)
Fig.2 Maximum (limit) forward characteristics
Fig.3 Dissipation curves
VFM Equation:-
Where
A = –0.51826
B = 0.195881
C = 6.39 x 10–5
D = –0.00544
VFM = A + Bln (IF) + C.IF+D.√IF
these values are valid for Tj = 125˚C for IF 500A to 9000A
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DS2103SY
140
120
100
80
1000
100000
10000
1000
I
Conditions:
Tj = 175˚C
VR = 100V
IF = 2000A
F
I2t = Î2 x t
2
Q
S
25
dI /dt
F
I
RM
20
15
10
5
Max. Irr
100
I2t
Max. QS
60
40
20
1
10
100
0
10
1
2
3
5
10 20
50
0.1
1.0
10
Rate of decay of forward current, dI/dt - (A/µs)
ms
Cycles at 50Hz
Duration
Fig.4 Total stored charge and maximum reverse
recovery current
Fig.5 Surge (non-repetitive) forward current vs time
(with 50% VRRM at Tcase 175˚C)
0.1
Anode side cooled
Double side cooled
0.01
0.001
Effective thermal resistance
Junction to case ˚C/W
Conduction
Double side
0.0095
0.0105
Single side
0.019
0.020
d.c.
Halfwave
3 phase 120˚
6 phase 60˚
0.0112
0.0139
0.0207
0.0234
0.0001
0.001
0.01
0.1
Time - (s)
1
10
100
Fig.6 Maximum (limit) transient thermal impedance -
junction to case
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DS2103SY
PACKAGE DETAILS
For further package information, please contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
Hole Ø3.6 x 2.0 deep (One in each electrode)
Cathode
Ø112.5 max
Ø73 nom
Ø73 nom
Anode
Nominal weight: 1600g
Clamping force: 50kN ±10%
Package outine type code: Y
Note:
1. Package maybe supplied with pins and/or tags.
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DS2103SY
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor,
and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current
capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our
customers.
Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution
(PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of pre-loaded
clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm
Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies.
Please refer to our application note on device clamping, AN4839
HEATSINKS
Power Assembly has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance
or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or Customer
Services.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
CUSTOMER SERVICE CENTRES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
Fax: 00-44-(0)1522-500550
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
DYNEX POWER INC.
99 Bank Street, Suite 410,
Ottawa, Ontario, Canada, K1P 6B9
Tel: 613.723.7035
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2001 Publication No. DS4172-5 Issue No. 5.1 December 2001
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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