MF70-1600R [DYNEX]
暂无描述;型号: | MF70-1600R |
厂家: | Dynex Semiconductor |
描述: | 暂无描述 整流二极管 快恢复二极管 高压 高压快速恢复二极管 |
文件: | 总8页 (文件大小:69K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MF70
Fast Recovery Diode
Advance Information
Replaces March 1998 version, DS4195-2.1
DS1955-3.0 January 2000
APPLICATIONS
KEY PARAMETERS
VRRM
IF(AV)
IFSM
Qr
1600V
70A
700A
26µC
915ns
■ Inverse Parallel Or Series Connected Diode
■ Power Supplies
■ High Frequency Applications
trr
FEATURES
■ Glass Passivation
■ Fast Recovery Characteristics
■ High Voltage Capabilities
VOLTAGE RATINGS
Type Number
Repetitive Peak
Conditions
Reverse Voltage
VRRM
V
MF70-1600
MF70-1400
MF70-1200
V
RSM = VRRM + 100V
1600
1400
1200
Lower voltage grades available.
For stud anode add suffix 'R' to type number.
Outline type code: DO5.
See Package Details for further information.
CURRENT RATINGS
Symbol
Parameter
Mean forward current
Conditions
Half wave resistive load, Tcase = 75oC
Tcase = 75oC
Max.
70
Units
IF(AV)
A
A
RMS value
110
IF(RMS)
IF
Continuous (direct) forward current
T
case = 75oC
90
A
1/8
MF70
SURGE RATINGS
Conditions
Symbol
Parameter
Max.
700
Units
A
10ms half sine; with 100% VRRM, Tj = 125oC
10ms half sine; Tj = 125oC
IFSM
I2t
Surge (non-repetitive) forward current
I2t for fusing
2450
A2s
THERMAL AND MECHANICAL DATA
Conditions
Min.
Max. Units
Parameter
Symbol
Rth(j-c)
oC/W
oC/W
dc
Thermal resistance - junction to case
Thermal resistance - case to heatsink
-
-
0.37
0.2
Mounting torque 3.5Nm
with mounting compound
Rth(c-h)
Forward (conducting)
Reverse (blocking)
-
125
125
125
3.8
oC
oC
Tvj
Virtual junction temperature
-
˚C
Tstg
-
Storage temperature range
Mounting torque
-55
3.2
Use torque wrench
Nm
CHARACTERISTICS
Symbol
Typ.
Units
V
Parameter
Conditions
At 210A peak, Tcase = 25oC
At VRRM, Tcase = 100oC
Max.
2.0
VFM
IRM
trr
Forward voltage
-
-
-
10
mA
ns
Peak reverse current
Reverse recovery time
IF = 1A, diRR/dt = 25A/µs
300
Tcase = 25oC, VR = 100V
Qr
trr
IF = 100A, diRR/dt = 100A/µs
Recovered charge
Reverse recovery time
Threshold voltage
-
-
26
915
1.3
3.34
-
µC
ns
V
Tcase = 25oC, VR = 100V
At Tvj = 125oC
-
VTO
rT
Slope resistance
At Tvj = 125oC
-
mΩ
V
VFRM
Forward recovery voltage
di/dt = 1000A/µs, Tj = 125oC
80
2/8
MF70
CURVES
500
Measured under pulse
conditions
80
60
40
20
0
Tcase = 25˚C
400
300
200
100
0
95%
5%
Tj = 125˚C
Tj = 25˚C
0
200 400 600 800 1000 1200
Rate of rise of forward current - (A/µs)
0
1.0
2.0
3.0
Instantaneous forward voltage - (V)
Fig.1 Maximum (limit) forward characteristics
Fig.2 Forward recovery voltage vs rate of rise of
forward voltage
0.5
0.4
0.3
0.2
0.1
0
d.c.
1.0
0.001
0.01
0.1
10
Time - (s)
Fig.3 Maximum transient thermal impedance - junction to case
3/8
MF70
1.05
1.0
Tcase = 125˚C
0.9
0.8
0.7
IF = 100A
95%
IF = 50A
IF = 100A
5%
0.6
IF = 50A
0.55
1000
1
10
100
Rate of rise of reverse current - (A/µs)
Fig.4 Recovery time vs dIR/dt
40
36
32
28
24
20
16
12
8
IF = 100A
Tcase = 125˚C
95%
IF = 50A
IF = 100A
5%
IF = 50A
4
0
1000
1
10
100
Rate of change of reverse current - (A/µs)
Fig.5 Recovered charge vs dIR/dt
5000
Tcase = 55˚
1000
100
10
100 1000
Pulse width - (µs)
10000
Fig.6 Frequency curves - square waveform
4/8
MF70
500
100
Tcase = 85˚
10
10
100 1000
Pulse width - (µs)
10000
Fig.7 Frequency curves - square waveform
500
100
2.0J
1.0
0.5
0.2
0.1
10
10
100 1000
Pulse width - (µs)
10000
Fig.8 Energy per pulse - square waveform
5000
1000
Tcase = 55˚
100
10
100
Pulse width - (µs)
Fig.9 Frequency curves - sine waveform
1000
10000
5/8
MF70
5000
1000
Tcase = 85˚
100
10
100 1000
Pulse width - (µs)
10000
Fig.10 Frequency curves - sine waveform
500
100
2.0J
1.0
0.5
0.2
0.1
20
10
100 1000
Pulse width - (µs)
10000
Fig.11 Energy per pulse - sine waveform
6/8
MF70
PACKAGE DETAILS
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated
otherwise. DO NOT SCALE.
Hex. 17.35mm AF max
Ø4.0
Thread 1/4 in
28 UNF 2A
Weight: 20g
ASSOCIATED PUBLICATIONS
Title
Application Note
Number
Calculating the junction temperature or power semiconductors
Thyristor and diode measurement with a multi-meter
Use of VTO, rT on-state characteristic
AN4506
AN4853
AN5001
7/8
MF70
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconduc-
tor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and
current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
solution (PACs).
HEATSINKS
Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the
performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the
factory.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS
CUSTOMER SERVICE CENTRES
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
SALES OFFICES
Fax: 00-44-(0)1522-500550
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
Germany Tel: 07351 827723
DYNEX POWER INC.
Unit 7 - 58 Antares Drive,
Nepean, Ontario, Canada K2E 7W6.
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2000 Publication No. DS4195-3 Issue No. 3.0 January 2000
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
8/8
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