MP02G175-14 [DYNEX]
Rectifier Diode, 1 Phase, 2 Element, 170A, 1400V V(RRM), Silicon, MP02, 3 PIN;
| 型号： | MP02G175-14 |
| 厂家： | 
Dynex Semiconductor |
| 描述： | Rectifier Diode, 1 Phase, 2 Element, 170A, 1400V V(RRM), Silicon, MP02, 3 PIN 局域网 二极管 |
| 文件： | 总7页 (文件大小：83K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MP02XX175 Series
Dual Diode Modules
Replaces January 2000 version, DS5101-4.0
DS5101-5.0 July 2002
FEATURES
KEY PARAMETERS
■ Dual Device Module
VRRM
2000V
5625A
170A
■ Electrically Isolated Package
■ Pressure Contact Construction
■ International Standard Footprint
IFSM
IF(AV)(per arm)
Visol
3000V
■ Alumina (non-toxic) Isolation Medium
Code
Circuit
APPLICATIONS
■ Rectifier Bridges
■ DC Power Supplies
■ Plating Rectifiers
■ Traction Systems
1
2
3
3
HB
1
2
2
G
1
3
GN
Fig.1 Circuit diagrams
VOLTAGE RATINGS
Type
Number
Repetitive
Peak
Conditions
Voltages
VDRM VRRM
Tvj = 150oC
IDRM = IRRM = 30mA
VDSM & VRSM
MP02XX175-20
MP02XX175-18
MP02XX175-16
MP02XX175-14
MP02XX175-12
MP02XX175-10
MP02XX175-08
2000
1800
1600
1400
1200
1000
800
=
VDRM & VRRM + 100V
respectively
Lower voltage grades available.
ORDERING INFORMATION
Module type code: MP02.
For further information see Package Details.
Order As:
MP02HB175-20 or MP02HB175-18 or MP02HB175-16 or
MP02HB175-14 or MP02HB175-12 or MP02HB175-10 or
MP02HB175-08
Fig. 2 Electrical connections - (not to scale)
MP02G175-20 or MP02G175-18 or MP02G175-16 or
MP02G175-14 or MP02G175-12 or MP02G175-10 or
MP02G175-08
MP02GN175-20 or MP02GN175-18 or MP02GN175-16 or
MP02GN175-14 or MP02GN175-12 or MP02GN175-10 or
MP02GN175-08
Note: When ordering, please use the complete part number.
1/7
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MP02XX175 Series
ABSOLUTE MAXIMUM RATINGS - PER ARM
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme
conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety
precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
Symbol
Parameter
Test Conditions
Half wave resistive load
Max.
170
Units
A
IF(AV)
Mean forward current
Tcase = 75˚C
Tcase = 85˚C
152
A
IF(RMS)
IFSM
I2t
RMS value
Tcase = 75˚C
267
A
Surge (non-repetitive) forward current
I2t for fusing
10ms half sine, Tj = 150˚C
VR = 0
5.625
158 x 103
4.5
kA
A2s
kA
A2s
V
IFSM
I2t
Surge (non-repetitive) forward current
I2t for fusing
10ms half sine, Tj = 150˚C
VR = 50% VDRM
100 x 103
3000
Visol
Isolation voltage
Commoned terminals to base plate.
AC RMS, 1 min, 50Hz
THERMAL AND MECHANICAL RATINGS
Min.
Symbol
Parameter
Thermal resistance - junction to case
(per thyristor or diode)
Test Conditions
Max.
0.37
0.38
0.39
0.07
Units
˚C/kW
˚C/kW
˚C/kW
˚C/kW
-
-
-
-
Rth(j-c)
dc
Half wave
3 Phase
Rth(c-hs)
Thermal resistance - case to heatsink
(per thyristor or diode)
Mounting torque = 6Nm
with mounting compound
-
Tvj
Tstg
-
Virtual junction temperature
Storage temperature range
Screw torque
Reverse (blocking)
150
150
˚C
˚C
–40
-
Mounting - M6
Electrical connections - M6
-
-
-
-
6 (55) Nm (lb.ins)
5 (44) Nm (lb.ins)
-
Weight (nominal)
350
g
2/7
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MP02XX175 Series
DYNAMIC CHARACTERISTICS
Parameter
Peak reverse current
Test Conditions
At VRRM, Tj = 150˚C
Min.
Max. Units
Symbol
IRRM
-
-
-
30
mA
V
VTO
Threshold voltage
At Tvj = 150˚C. See note 1
At Tvj = 150˚C. See note 1
0.81
0.84
rT
Forward slope resistance
mΩ
Note 1: The data given in this datasheet with regard to forward voltage drop is for calculation of the power dissipation in the
semiconductor elements only. Forward voltage drops measured at the power terminals of the module will be in excess of these
figures due to the impedance of the busbar from the terminal to the semiconductor.
10.0
I2t = Î2 x t
2000
1500
1000
500
0
Measured under pulse conditions
Tj = 150˚C
2
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
10
9
8
I2t
7
6
5
1
10
1
2
3
5
10 20 30 50
0.5
1.0
1.5
2.0
2.5
ms
cycles at 50Hz
Instantaneous forward voltage, VF - (V)
Duration
Fig. 3 Maximum (limit) forward characteristics
Fig. 4 Surge (non-repetitive) forward current vs time
(With 50% VRRM at Tcase = 150˚C)
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MP02XX175 Series
300
250
200
150
100
50
0.4
0.3
0.2
0.1
0
Rectangular
Sine
d.c.
d.c.
180˚
180˚
120˚
60˚
0
0
50
100
150
200
250
300
0.001
0.01
0.1
1.0
Time - (s)
Fig. 5 Transient thermal impedance - dc (per diode)
10
100
Mean forward current, IT(AV) - (A)
Fig. 6 On-state power loss per arm vs forward current at
various conduction angles, 50/60Hz
160
Rectangular
Sine
140
120
100
80
60
40
20
0
0
50
100
150
200
250
300
Mean forward current, IF(AV) - (A)
Fig. 7 Maximum permissible case temperature vs forward
current per arm at various conduction angles, 50/60Hz
4/7
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MP02XX175 Series
1200
1000
800
600
400
200
0
Rth(hs-a) ˚C/W
0.04 0.02
R - Load
0.10 0.08
0.12
L - Load
0.15
0.20
0.30
0.40
60
40
0
20
80
100
120
140
0
100
200
400
300
D.C. output current - (A)
Maximum ambient temperature - (˚C)
Fig. 8 50/60Hz single phase bridge dc output current vs power loss and maximum permissible ambient temperature for
various values of heatsink thermal resistance.
(Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal).
1000
Rth(hs-a) ˚C/W
0.08
0.04
0.02
R & L - Load
800
600
400
200
0
0.10
0.12
0.15
0.20
0.30
0.40
60
Maximum ambient temperature - (˚C)
0
20
40
80
100
120
140
0
100
200
400
300
D.C. output current - (A)
Fig. 7 50/60Hz 3- phase bridge dc output current vs power loss and maximum permissible ambient temperature for various
values of heatsink thermal resistance.
(Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal).
5/7
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MP02XX175 Series
PACKAGE DETAILS
Forfurtherpackageinformation,please visitourwebsiteorcontactyournearestCustomerServiceCentre. Alldimensionsinmm,unless
stated otherwise. DO NOT SCALE.
23
23
24
2 holes Ø6.5
1
2
3
Circuit type: HB
13
80
1
2
3
3x M6
1
2
3
Circuit type: G
1
2
3
Circuit type: GN
94
Nominal weight: 350g
Recommended fixings for mounting: M6 socket head cap screws
Recommended mounting torque: 6Nm (55lb.ins)
Recommended torque for electrical connections: 5Nm (44lb.ins)
Maximum torque for electrical connections: 8Nm (70lb.ins)
Module outline type code: MP02
MOUNTING RECOMMENDATIONS
Adequate heatsinking is required to maintain the base
An even coating of thermal compound (eg. Unial) should be
applied to both the heatsink and module mounting surfaces.
This should ideally be 0.05mm (0.002") per surface to ensure
optimum thermal performance.
temperature at 75˚C if full rated current is to be achieved. Power
dissipation may be calculated by use of VT(TO) and rT information
in accordance with standard formulae. We can provide
assistance with calculations or choice of heatsink if required.
After application of thermal compound, place the module
squarely over the mounting holes, (or ‘T’ slots) in the heatsink.
Fit and finger tighten the recommended fixing bolts at each end.
Using a torque wrench, continue to tighten the fixing bolts by
rotating each bolt in turn no more than 1/4 of a revolution at a
time, until the required torque of 6Nm (55lbs.ins) is reached on
all bolts at both ends.
The heatsink surface must be smooth and flat; a surface finish
of N6 (32µin) and a flatness within 0.05mm (0.002") are
recommended.
Immediately prior to mounting, the heatsink surface should be
lightly scrubbed with fine emery, Scotch Brite or a mild chemical
etchant and then cleaned with a solvent to remove oxide build
up and foreign material. Care should be taken to ensure no
foreign particles remain.
It is not acceptable to fully tighten one fixing bolt before starting
to tighten the others. Such action may DAMAGE the module.
6/7
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POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic
semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages
and current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today.
The Assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
Solution (PACs).
HEATSINKS
The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to
optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow
rates) is available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or
Customer Services.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS
CUSTOMER SERVICE
Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
SALES OFFICES
Lincolnshire. LN6 3LF. United Kingdom.
Tel: +44-(0)1522-500500
Fax: +44-(0)1522-500550
Benelux, Italy & Switzerland: Tel: +33 (0)1 64 66 42 17. Fax: +33 (0)1 64 66 42 19.
France: Tel: +33 (0)2 47 55 75 52. Fax: +33 (0)2 47 55 75 59.
Germany, Northern Europe, Spain & Rest Of World: Tel: +44 (0)1522 502753 / 502901.
Fax: +44 (0)1522 500020
North America: Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2002 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRODUCED IN
UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
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