MP02TT800-13-W12 [DYNEX]
Silicon Controlled Rectifier, 510A I(T)RMS, 1300V V(DRM), 1300V V(RRM), 2 Element, MP02-W12, 7 PIN;
| 型号： | MP02TT800-13-W12 |
| 厂家： | 
Dynex Semiconductor |
| 描述： | Silicon Controlled Rectifier, 510A I(T)RMS, 1300V V(DRM), 1300V V(RRM), 2 Element, MP02-W12, 7 PIN 局域网 栅 栅极 |
| 文件： | 总8页 (文件大小：127K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MP02TT800
Dual Thyristor Water Cooled Welding Module
Preliminary Information
DS5435-1.1 June 2001
FEATURES
KEY PARAMETERS
VDRM
1600V
510A
805A
6800A
3000V
■ Dual Device Module
ILINE(cont.)
ILINE(20cy./50%)
ITSM(per arm)
Visol
■ Electrically Isolated Package
■ Pressure Contact Construction
■ International Standard Footprint
■ Alumina (Non Toxic) Isolation Medium
■ Integral Water Cooled Heatsink
G1 K1 K2 G2
2
3
1
APPLICATIONS
■ Welding
Fig. 1 Circuit diagram
VOLTAGE RATINGS
Type Number
Repetitive Peak
Voltages
VDRM VRRM
V
Conditions
K2
G2
MP02TT800-16
MP02TT800-15
MP02TT800-14
MP02TT800-13
1600
1500
1400
1300
Tvj = 0˚ to 125˚C,
IDRM = IRRM = 30mA
K1 G1
2
3
1
VDSM = VRSM
=
VDRM = VRRM + 100V
respectively
Lower voltage grades available
ORDERING INFORMATION
Order As:
MP02TT800-XX W12
MP02TT800-XX W13
1/4 - 18NPT
1/4 BSP connection
Outline type code: MP02 W12/W13
XX shown in the part number about represents VDRM/100
selection required, e.g. MP02TT800-14-W12
(See package details for further information)
Fig. 2 Electrical connections - (not to scale)
Note: When ordering, please use the whole part number.
Auxiliary gate and cathode leads can be ordered separately.
1/8
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MP02TT800
ABSOLUTE MAXIMUM CURRENT RATINGS
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme
conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety
precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
Symbol
Parameter
Max. controllable RMS line
current - single phase
Test Conditions
Max.
510
450
920
805
6.8
Units
A
ILINE
Continuous 50/60Hz
4.5 Ltr/min
Twater (in) = 25˚C
water (in) = 40˚C
T
A
20 cycles, 50% duty cycle
4.5 Ltr/min
Twater (in) = 25˚C
Twater (in) = 40˚C
A
A
ITSM
I2t
ITSM
I2t
Surge (non-repetitive) on-current
I2t for fusing
10ms half sine, Tj = 125˚C
kA
VR = 0
0.231 x 106 A2s
5.5 kA
0.15 x 106 A2s
Surge (non-repetitive) on-current
I2t for fusing
10ms half sine, Tj = 125˚C
VR = 50% VDRM
Visol
Isolation voltage
Commoned terminals to base plate.
AC RMS, 1 min, 50Hz
3000
V
THERMAL AND MECHANICAL RATINGS
Min.
Symbol
Parameter
Thermal resistance - junction to water
(per thyristor)
Test Conditions
dc, 4.5 Ltr/min
Max.
0.3
Units
˚C/kW
˚C/kW
˚C/kW
˚C
-
Rth(j-c)
-
Half wave, 4.5 Ltr/min
3 Phase, 4.5 Ltr/min
Reverse (blocking)
-
0.32
0.33
125
125
-
-
-
Tvj
Tstg
-
Virtual junction temperature
Storage temperature range
Screw torque
–40
˚C
5 (44)
Mounting - M6
Electrical connections - M6
-
Nm (lb.ins)
-
-
5 (44) Nm (lb.ins)
-
Weight (nominal)
1200
g
2/8
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MP02TT800
DYNAMIC CHARACTERISTICS
Min.
Symbol
IRRM/IDRM
dV/dt
Parameter
Test Conditions
At VRRM/VDRM, Tj = 125˚C
Max. Units
Peak reverse and off-state current
Linear rate of rise of off-state voltage
Rate of rise of on-state current
-
-
-
30
mA
To 67% VDRM, Tj = 125˚C
From 67% VDRM to 200A, gate source 10V, 5Ω
tr = 0.5µs, Tj = 125˚C
1000
500
V/µs
A/µs
dI/dt
-
-
0.98
0.75
V
VT(TO)
rT
Threshold voltage
At Tvj = 125˚C
On-state slope resistance
At Tvj = 125˚C
mΩ
Note 1: The data given in this datasheet with regard to forward voltage drop is for calculation of the power dissipation in the
semiconductor elements only. Forward voltage drops measured at the power terminals of the module will be in excess of these
figures due to the impedance of the busbar from the terminal to the semiconductor.
GATE TRIGGER CHARACTERISTICS AND RATINGS
Parameter
Gate trigger voltage
Test Conditions
VDRM = 5V, Tcase = 25oC
DRM = 5V, Tcase = 25oC
Max.
3
Units
V
Symbol
VGT
IGT
Gate trigger current
V
150
0.25
30
mA
V
VGD
Gate non-trigger voltage
Peak forward gate voltage
Peak forward gate voltage
Peak reverse gate voltage
Peak forward gate current
Peak gate power
At VDRM Tcase = 125oC
Anode positive with respect to cathode
V
VFGM
VFGN
VRGM
IFGM
Anode negative with respect to cathode
0.25
5
V
-
V
Anode positive with respect to cathode
10
A
See table fig. 5
100
5
W
W
PGM
PG(AV)
Mean gate power
-
3/8
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MP02TT800
2000
20
Measured under pulse conditions
1500
1000
500
0
180
140
100
15
10
I2t
Tj = 125˚C
5
0
60
10
1
2
3 4 5
50
20 30
10
1
0.5
1.0
1.5
2.0
2.5
Instantaneous on-state voltage, VT - (V)
ms
cycles at 50Hz
Duration
Fig. 3 Maximum (limit) on-state characteristics
Fig. 4 Surge (non-repetitive) on-state current vs time
(with 50% VRSM at Tcase = 125˚C)
100
VFGM
10
1.0
Table gives pulse power PGM in watts
Pulse Pulse Frequency
Width
µs
Hz
100 400
50
100W
75W
50W
20
25
100
500
1ms
10ms
100 100
100 100
100 100
100
100
100
100
100
10
10W
5W
100
50
-
25
-
-
0.1
Tj = 25˚C
Tj = 125˚C
1.0
0.01
mit 1%
Upper limit 99%
VGD
0.1
Lower li
0.001
0.001
0.001
0.01
0.1
1.0
10
IFGM
0.01
0.1
1
10
1000
100
Gate trigger current, IGT - (A)
Time - (s)
Fig. 5 Gate characteristics
Fig. 6 Transient thermal impedance - dc
4/8
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MP02TT800
3000
3000
Twater = 30˚C
Twater = 25˚C
Number of cycles
Number of cycles
1
3
5
10
20
30
50
100
1
3
5
10
20
30
50
100
2500
2000
1500
2500
2000
1500
1000
500
1
1000
500
1
1
10
100
1
10
100
Duty cycles - (%)
Duty cycles - (%)
Fig. 7 Single phase welding rating @Twater = 25˚C
Fig. 8 Single phase welding rating @Twater = 30˚C
3000
3000
Twater = 40˚C
Twater = 50˚C
Number of cycles
Number of cycles
1
3
5
10
20
30
50
100
1
3
5
10
20
30
50
100
2500
2000
1500
2500
2000
1500
1000
500
1
1000
500
1
1
10
100
1
10
100
Duty cycles - (%)
Duty cycles - (%)
Fig. 9 Single phase welding rating @Twater = 40˚C
Fig. 10 Single phase welding rating @Twater = 50˚C
5/8
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MP02TT800
PACKAGE DETAILS
For further package information, please contact Customer Services. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
23
23
K2
24
15
5
G2
Ø6.5
13
80
K1
G1
2 Off water connectors
1/4 - 18 NTP (W12)
2
3
1
M6
2.8 X 0.8
23.8
21.6
50.8
94
Water-way plug
2 Off Holes M3 x 0.5
10 deep
Recommended fixings for mounting: M6 socket head cap screws.
Auxiliary gate and cathode leads can be ordered separately.
Nominal weight: 1200g
Module outline type code: MP02-W12
6/8
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MP02TT800
PACKAGE DETAILS
For further package information, please contact Customer Services. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
23
23
K2
24
15
5
G2
fl6.5
13
80
K1
G1
2 Off water connectors
1/4 BSP (W13)
2
3
1
M6
2.8 X 0.8
23.8
21.6
50.8
94
Water-way plug
2 Off Holes M3 x 0.5
10 deep
Recommended fixings for mounting: M6 socket head cap screws.
Auxiliary gate and cathode leads can be ordered separately.
Nominal weight: 1200g
Module outline type code: MP02-W13
7/8
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POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic
semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages
and current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today.
The Assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
Solution (PACs).
HEATSINKS
The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to
optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow
rates) is available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or
Customer Services.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS
CUSTOMER SERVICE
Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
SALES OFFICES
Lincolnshire. LN6 3LF. United Kingdom.
Tel: +44-(0)1522-500500
Fax: +44-(0)1522-500550
Benelux, Italy & Switzerland: Tel: +33 (0)1 64 66 42 17. Fax: +33 (0)1 64 66 42 19.
France: Tel: +33 (0)2 47 55 75 52. Fax: +33 (0)2 47 55 75 59.
Germany, Northern Europe, Spain & Rest Of World: Tel: +44 (0)1522 502753 / 502901.
Fax: +44 (0)1522 500020
North America: Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2002 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRODUCED IN
UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded
as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company
reservestherighttoalterwithoutpriornoticethespecification, designorpriceofanyproductorservice. Informationconcerningpossiblemethodsofuseisprovidedasaguideonlyanddoesnotconstituteanyguarantee
that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure
that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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