SV2010MR [DYNEX]

暂无描述;
SV2010MR
型号: SV2010MR
厂家: Dynex Semiconductor    Dynex Semiconductor
描述:

暂无描述

整流二极管
文件: 总7页 (文件大小:133K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SV20  
Rectifier Diode  
Replaces March 1998 version, DS4085-2.3  
DS4085-3.0 January 2000  
APPLICATIONS  
Rectification  
KEY PARAMETERS  
VRRM  
IF(AV)  
IFSM  
2000V  
220A  
4000A  
Freewheel Diode  
DC Motor Control  
Power Supplies  
Welding  
Battery Chargers  
FEATURES  
High Surge Capability  
VOLTAGE RATINGS  
Type Number  
Repetitive Peak  
Conditions  
Reverse Voltage  
VRRM  
V
SV20 20 M or K(R)  
SV20 14 M or K(R)  
SV20 10 M or K(R)  
SV20 06 M or K(R)  
V
RSM = VRRM + 100V  
2000  
1400  
1000  
600  
Lower voltage grades available.  
Outline type codes: DO8C and DO8  
M for M12 thread. K for 1/2" - 20UNF thread, R for reverse  
polarity.  
See Package Details for further information.  
Add C to type number for DO8C package.  
CURRENT RATINGS  
Symbol  
Parameter  
Conditions  
Max.  
Units  
Single Side Cooled  
Half wave resistive load, Tcase = 100oC  
220  
350  
297  
A
A
A
IF(AV)  
IF(RMS)  
IF  
Mean forward current  
RMS value  
Continuous (direct) forward current  
T
case = 100oC  
case = 100oC  
T
1/7  
SV20  
SURGE RATINGS  
Parameter  
Conditions  
10ms half sine; Tcase = 175oC  
VR = 50% VRRM - 1/4 sine  
10ms half sine; Tcase =175oC  
VR = 0  
Max.  
3.2  
Units  
kA  
Symbol  
IFSM  
I2t  
Surge (non-repetitive) forward current  
I2t for fusing  
51.2 x 103  
4.0  
A2s  
kA  
IFSM  
I2t  
Surge (non-repetitive) forward current  
I2t for fusing  
80.0 x 103  
A2s  
THERMAL AND MECHANICAL DATA  
Conditions  
Min.  
Max. Units  
Symbol  
Rth(j-c)  
Parameter  
oC/W  
oC/W  
dc  
Thermal resistance - junction to case  
Thermal resistance - case to heatsink  
-
-
0.23  
0.08  
Mounting torque 15.0Nm  
with mounting compound  
Rth(c-h)  
Forward (conducting)  
Reverse (blocking)  
-
-
175  
175  
200  
15.0  
oC  
oC  
Tvj  
Virtual junction temperature  
Tstg  
-
Storage temperature range  
Mounting Torque  
-55  
12.0  
oC  
Nm  
CHARACTERISTICS  
Symbol  
Parameter  
Forward voltage  
Peak reverse current  
Conditions  
At 600A peak, Tcase = 25oC  
At VRRM, Tcase = 175oC  
Typ.  
Max.  
1.4  
20  
-
Units  
V
VFM  
IRRM  
QS  
IRM  
trr  
-
-
mA  
µC  
A
Total stored charge  
Peak recovery current  
reverse recovery time  
Threshold voltage  
Slope resistance  
200*  
70*  
5.5*  
-
IF = 100A, dIRR/dt = 20A/µs, Tcase = 25˚C  
-
-
µs  
VTO  
rT  
At Tvj = 175˚C  
At Tvj = 175˚C  
0.8  
1.0  
V
-
mΩ  
*Typical values.  
2/7  
SV20  
CURVES  
3/7  
SV20  
4/7  
SV20  
5/7  
SV20  
PACKAGE DETAILS  
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.  
DO NOT SCALE.  
Ø8.4 ± 0.3  
8 min  
20 max  
Ø5.2 ± 0.2  
12 ± 0.5  
Ø27 max  
8 min  
Ø27 max  
8 min  
3.17 max  
Thread M12  
1/2" 20 UNF  
Thread M12  
1/2" 20 UNF  
3.17 max  
Nominal weight: 120g  
Mounting torque: 15Nm ±10%  
Nominal weight: 120g  
Mounting torque: 15Nm ±10%  
Package outine type code: DO8C  
Package outine type code: DO8  
ASSOCIATED PUBLICATIONS  
Title  
Application Note  
Number  
Calculating the junction temperature or power semiconductors  
Thyristor and diode measurement with a multi-meter  
Use of VTO, rT on-state characteristic  
AN4506  
AN4853  
AN5001  
6/7  
SV20  
POWER ASSEMBLY CAPABILITY  
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconduc-  
tor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and  
current capability of our semiconductors.  
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The  
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of  
our customers.  
Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete  
solution (PACs).  
HEATSINKS  
Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the  
performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on  
request.  
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the  
factory.  
http://www.dynexsemi.com  
e-mail: power_solutions@dynexsemi.com  
HEADQUARTERS OPERATIONS  
CUSTOMER SERVICE CENTRES  
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50  
North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444  
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020  
DYNEX SEMICONDUCTOR LTD  
Doddington Road, Lincoln.  
Lincolnshire. LN6 3LF. United Kingdom.  
Tel: 00-44-(0)1522-500500  
SALES OFFICES  
Fax: 00-44-(0)1522-500550  
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50  
Germany Tel: 07351 827723  
DYNEX POWER INC.  
Unit 7 - 58 Antares Drive,  
Nepean, Ontario, Canada K2E 7W6.  
Tel: 613.723.7035  
Fax: 613.723.1518  
Toll Free: 1.888.33.DYNEX (39639)  
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /  
Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986.  
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020  
These offices are supported by Representatives and Distributors in many countries world-wide.  
© Dynex Semiconductor 2000 Publication No. DS4085-3 Issue No. 3.0 January 2000  
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM  
Datasheet Annotations:  
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-  
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.  
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.  
Advance Information: The product design is complete and final characterisation for volume production is well in hand.  
No Annotation: The product parameters are fixed and the product is available to datasheet specification.  
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as  
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves  
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such  
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication  
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury  
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.  
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.  
7/7  

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