TV2208FM [DYNEX]
Fast Recovery Diode; 快恢复二极管型号: | TV2208FM |
厂家: | Dynex Semiconductor |
描述: | Fast Recovery Diode |
文件: | 总7页 (文件大小:63K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TV22..F
Fast Recovery Diode
Replaces March 1998 version, DS4210-2.2
DS4210-3.0 January 2000
APPLICATIONS
■ Induction Heating
■ A.C. Motor Drives
■ Snubber Diode
■ Welding
KEY PARAMETERS
VRRM
IF(AV)
IFSM
Qr
1600V
305A
5000A
70µC
trr
3.2µs
■ High Frequency Rectification
■ UPS
FEATURES
■ Thermal Fatigue Free Pressure Contact
■ High Surge Capability
■ Low Recovery Charge
VOLTAGE RATINGS
Type Number
Repetitive Peak
Conditions
Reverse Voltage
VRRM
V
TV22 16F M or K
TV22 14F M or K
TV22 12F M or K
TV22 10F M or K
TV22 08F M or K
TV22 06F M or K
VRSM = VRRM + 100V
1600
1400
1200
1000
800
600
For 3/4" 16 UNF thread, add suffix K, e.g. TV22 16FK.
For M16 thread, add suffix M, e.g. TV22 16FM.
Outline type codes: DO9.
See Package Details for further information.
For stud anode add 'R' to type number, e.g. TV22 16FMR.
CURRENT RATINGS
Symbol
IF(AV)
Parameter
Mean forward current
RMS value
Conditions
Max.
305
Units
Half wave resistive load, Tcase = 65oC
A
A
IF(RMS)
T
case = 65oC
346
1/7
TV22..F
SURGE RATINGS
Conditions
Symbol
Parameter
Max.
Units
kA
IFSM
I2t
Surge (non-repetitive) forward current
I2t for fusing
5.0
10ms half sine; with 0% VRRM, Tj = 150oC
125 x 103
A2s
kA
IFSM
I2t
Surge (non-repetitive) forward current
I2t for fusing
-
-
10ms half sine; with 50% VRRM, Tj = 150oC
A2s
THERMAL AND MECHANICAL DATA
Conditions
Min.
Max. Units
Symbol
Rth(j-c)
Parameter
oC/W
oC/W
dc
-
-
0.16
0.06
Thermal resistance - junction to case
Thermal resistance - case to heatsink
Mounting torque 35.0Nm
with mounting compound
Rth(c-h)
Tvj
Tstg
-
On-state (conducting)
-
150
175
oC
oC
Virtual junction temperature
Storage temperature range
-55
Nm
Mounting torque
30.0
35.0
CHARACTERISTICS
Symbol
Typ.
Units
Parameter
Conditions
At 750A peak, Tcase = 25oC
At VRRM, Tcase = 150oC
Max.
1.6
VFM
IRRM
trr
Forward voltage
Peak reverse current
-
-
-
V
40
mA
Reverse recovery time
3.2
µs
QRA1
IRM
K
Recovered charge (50% chord)
Reverse recovery current
Soft factor
IF = 750A, diRR/dt = 100A/µs
-
-
70
43
-
µC
A
Tcase = 125oC, VR = 100V
1.8
-
VTO
rT
Threshold voltage
At Tvj = 150oC
-
-
-
1.0
0.8
-
V
mΩ
V
Slope resistance
At Tvj = 150oC
Forward recovery voltage
di/dt = 1000A/µs, Tj = 125oC
VFRM
2/7
TV22..F
DEFINITION OF K FACTOR AND QRA1
QRA1 = 0.5x IRR(t1 + t2)
k = t1/t2
dIR/dt
t1
t2
τ
0.5x IRR
IRR
CURVES
3000
2500
2000
1500
1000
500
Measured under pulse conditions
Tj = 150˚C
Tj = 25˚C
1.0
1.5
2.0
2.5
3.0
Instantaneous forward voltage VF - (V)
Fig.1 Maximum (limit) forward characteristics
3/7
TV22..F
500
400
300
200
100
0
Measured under pulse conditions
Tj = 150˚C
Tj = 25˚C
0.95
1.05
1.15
1.25
1.35
1.45
Instantaneous forward voltage VF - (V)
Fig.2 Maximum (limit) forward characteristics
10000
1000
100
50µs
Conditions:
IF
Q =
∫
S
0
Tj = 125˚C,
VR = 100V
Q
S
tp = 1ms
dIR/dt
IRR
IF = 2000A
IF = 1000A
IF = 500A
IF = 200A
IF = 100A
10
1
10
100
1000
Rate of rise of reverse current dIR/dt - (A/µs)
Fig.3 Recovered charge
4/7
TV22..F
1000
Conditions:
Tj = 125˚C,
VR = 100V
IF = 2000A
IF = 1000A
IF = 500A
IF = 200A
100
IF = 100A
10
1
10
Rate of rise of reverse current dIR/dt - (A/µs)
Fig.4 Typical reverse recovery current vs rate of rise of reverse current
100
1000
0.100
0.010
0.001
d.c.
0.1
1
10
100
0.01
Time - (s)
Fig.5 Maximum (limit) transient thermal impedance - junction to case - (˚C/W)
5/7
TV22..F
PACKAGE DETAILS
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
Ø4
20 ± 2
Hex. 32AF
ASSOCIATED PUBLICATIONS
Title
Application Note
Number
Calculating the junction temperature or power semiconductors
Thyristor and diode measurement with a multi-meter
Use of VTO, rT on-state characteristic
AN4506
AN4853
AN5001
6/7
TV22..F
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconduc-
tor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and
current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
solution (PACs).
HEATSINKS
Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the
performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the
factory.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS
CUSTOMER SERVICE CENTRES
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
SALES OFFICES
Fax: 00-44-(0)1522-500550
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
Germany Tel: 07351 827723
DYNEX POWER INC.
Unit 7 - 58 Antares Drive,
Nepean, Ontario, Canada K2E 7W6.
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2000 Publication No. DS4210-3 Issue No. 3.0 January 2000
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
7/7
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