CC12H3A [EATON]
High I²t Chip fuses;型号: | CC12H3A |
厂家: | Eaton All Rights Reserved. |
描述: | High I²t Chip fuses |
文件: | 总8页 (文件大小:551K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Effective November 2017
Supersedes April 2016
Technical Data 4309
CC12H
High I²t Chip fuses
HALOGEN
Applications
HF
Pb
Secondary circuit protection
FREE
•
Laptop, notebook, netbook
•
Tablets, e-readers
•
Flat panel displays
•
High definition television (HDTV)
•
LCD/LED backlighting
•
Computers and peripherals
•
Gaming console systems
•
Handheld/portable equipment
•
Mobile device chargers
Automotive
•
Central body control module
•
Heating ventilation and air conditioning
controllers (HVAC)
Product features
•
High I²t
•
•
•
•
•
Doors, window lift and seat control
Digital instrument cluster
•
High inrush withstand capability
•
AEC-Q200 qualified: (750 mA to 30 A)
In-vehicle infotainment (IVI) and navigation
Electric pumps, motor control and auxiliaries
•
Excellent temperature and cycling
characteristics
Powertrain control module (PCU)/Engine
Control unit (ECU)
•
1206 (3216 metric) compact design
utilizes less board space
•
Transmission Control Unit (TCU)
•
Compatible with solder reflow and
wave solder
Agency information
•
cURus Recognition: File E19180, Guide
JDYX2/JDYX8
•
AEC-Q200 qualified (750 mA to 30 A)
Ordering
•
Use ordering number (see page 6 for details)
Packaging suffixes
•
-TR (3000 parts per 7” diameter reel,
tape width 8 mm)
CC12H
High I²t Chip fuses
Technical Data 4309
Effective November 2017
Electrical characteristics
Amp Rating
250 mA – 30 A
1 A – 3 A
% of Amp Rating
OpeningTime
4 hours minimum
1.0 s – 60 s
120 s max
100%
200%
200%
250%
300%
350%
350%
1000%
1000%
25 A – 30 A
1 A – 5 A
5.0 s max
1 A – 5 A
0.1 s – 3.0 s
5 s max
250 mA – 750 mA
6 A – 20 A
5 s max
250 mA – 500 mA
750 mA – 30 A
0.01 ms – 1.0 ms
0.2 ms – 20 ms
Product specifications
Interrupting
rating¹
(A)
Voltage rating
Typical DC cold
resistance² (mΩ)
Typical pre-arcing³
I²t (A2s)
Current rating
(A)
Typical voltage
Part
Part Number
CC12H250mA
CC12H375mA
CC12H500mA
CC12H750mA
CC12H1A
(VDC
63
63
63
63
63
63
63
63
63
63
63
32
32
32
32
32
32
32
32
32
32
32
)
drop (mV)
1400
730
700
700
490
355
305
240
185
180
169
160
140
150
130
110
90
marking
0.25
0.375
0.5
0.75
1
50
3500
1750
980
800
470
218
133
79
0.00038
0.00077
0.0019
0.15
0.18
0.4
.25
A
.5
E
50
50
50
50
H
K
N
O
P
CC12H1.5A
CC12H2A
1.5
2
50
50
1.1
CC12H2.5A
CC12H3A
2.5
3
50
1.7
50
49
2.2
CC12H3.5A
CC12H4A
3.5
4
50
37
2.7
R
S
X
T
50
33
3.2
CC12H4.5A
CC12H5A
4.5
5
100
100
100
100
100
100
100
100
100
200
200
28
4.2
23
6
CC12H6A
6
15.5
11.5
7.3
6.5
4.7
3
12
F
CC12H7A
7
18
J
CC12H8A
8
18
V
U
W
Y
Q
L
CC12H10A
CC12H12A
CC12H15A
CC12H20A
CC12H25A
CC12H30A
10
12
15
20
25
30
30
45
90
33
90
2
80
90
3
60
90
2.1
100
90
Z
1. DC interrupting rating measured at rated voltage, time constant of less than 50 microseconds, battery source.
2. Typical DC cold resistance measured at <10% of rated current.
3. Typical pre-arcing I²t value is measured at 10In rated current.
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2
CC12H
High I²t Chip fuses
Technical Data 4309
Effective November 2017
Dimensions–mm
Packaging information- mm
Supplied in tape and reel packaging, 3000 parts per 7” diameter reel.
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3
CC12H
High I²t Chip fuses
Technical Data 4309
Effective November 2017
I2t vs. time curve
CC12H
Time (s)
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4
CC12H
High I²t Chip fuses
Technical Data 4309
Effective November 2017
Time vs. current curve
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5
CC12H
High I²t Chip fuses
Technical Data 4309
Effective November 2017
Temperature derating curve
Environmental data
Operating temperature: -55 °C to +125 °C (with derating); (20 A- 30 A) -40 °C to +85 °C (with derating)
Thermal shock: MIL- STD- 202G, Method 107, (300 cycles -55 °C to +125 °C)
Vibration: MIL-STD- 202G, Method 204, (20 g's for 20 minutes, 12 cycles in each of 3 orientations, 10- 2000 Hz)
Humidity: MIL- STD- 202G, Method 103, (+85 °C, 85% relative humidty, 1000 hours 10% of operating power
Mechanical shock: MIL-STD- 202G, Method 213, Condition C
Ordering codes
The ordering code is the part number replacing the “.” with a “-” plus adding the packaging suffix.
Packaging suffix
• -TR (3000 parts on a 7” reel, tape width 8 mm).
Ordering code
Ordering code
-TR option
Part Number
CC12H250mA
CC12H375mA
CC12H500mA
CC12H750mA
CC12H1A
-TR option
Part Number
CC12H4A
CC12H250mA-TR
CC12H375mA-TR
CC12H500mA-TR
CC12H750mA-TR
CC12H1A-TR
CC12H4A-TR
CC12H4-5A-TR
CC12H5A-TR
CC12H6A-TR
CC12H7A-TR
CC12H8A-TR
CC12H10A-TR
CC12H12A-TR
CC12H15A-TR
CC12H20A-TR
CC12H25A-TR
CC12H30A-TR
CC12H4.5A
CC12H5A
CC12H6A
CC12H7A
CC12H1.5A
CC12H2A
CC12H1-5A-TR
CC12H2A-TR
CC12H8A
CC12H10A
CC12H12A
CC12H15A
CC12H20A
CC12H25A
CC12H30A
CC12H2.5A
CC12H3A
CC12H2-5A-TR
CC12H3A-TR
CC12H3.5A
CC12H3-5A-TR
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6
CC12H
High I²t Chip fuses
Technical Data 4309
Effective November 2017
Wave solder profile
tp
Tp
First Wave
Second Wave
Tsmax
Tstyp
Tsmin
Preheat area
Cool down area
Time
Reference EN 61760-1:2006
Profile Feature
Standard SnPb Solder
Lead (Pb) Free Solder
Preheat
• Temperature min. (T
)
100°C
100°C
smin
• Temperature typ. (T
)
120°C
120°C
styp
• Temperature max. (T
)
130°C
130°C
smax
) (t )
• Time (T
to T
70 seconds
150°C max.
235°C – 260°C
70 seconds
150°C max.
250°C – 260°C
smin
preheat to max Temperature
Peak temperature (T )*
smax
s
D
P
Time at peak temperature (t )
p
10 seconds max
5 seconds max each wave
10 seconds max
5 seconds max each wave
Ramp-down rate
~ 2 K/s min
~3.5 K/s typ
~5 K/s max
~ 2 K/s min
~3.5 K/s typ
~5 K/s max
Time 25°C to 25°C
Manual solder
4 minutes
4 minutes
350°C, 4-5 seconds. (by soldering iron), generally manual, hand soldering is not recommended.
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7
CC12H
High I²t Chip fuses
Technical Data 4309
Effective November 2017
Solder reflow profile
TP
Table 1 - Standard SnPb Solder (T )
c
TC -5°C
Volume
mm3
Volume
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Package
mm3
Thickness
<350
≥350
220°C
220°C
<2.5mm)
235°C
220°C
TL
Preheat
t
≥2.5mm
Tsmax
Table 2 - Lead (Pb) Free Solder (T )
c
Volume
mm3
Volume
Volume
mm3
Package
mm3
Tsmin
Thickness
<350
350 - 2000
>2000
ts
<1.6mm
260°C
260°C
250°C
260°C
250°C
245°C
260°C
245°C
245°C
1.6 – 2.5mm
>2.5mm
25°C
Time 25°C to Peak
Time
Reference JDEC J-STD-020
Profile Feature
Standard SnPb Solder
100°C
Lead (Pb) Free Solder
150°C
Preheat and Soak • Temperature min. (T
)
smin
• Temperature max. (T
)
150°C
200°C
smax
• Time (T
to T
) (t )
smax s
60-120 Seconds
3°C/ Second Max.
60-120 Seconds
3°C/ Second Max.
smin
to T
Average ramp up rate T
smax
p
Liquidous temperature (Tl)
183°C
60-150 Seconds
217°C
60-150 Seconds
Time at liquidous (t )
L
Peak package body temperature (T )*
Table 1
Table 2
P
Time (t )** within 5 °C of the specified classification temperature (T )
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
p
c
Average ramp-down rate (T to T
p
)
smax
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.
p
** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.
p
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Printed in USA
Eaton is a registered trademark.
Publication No. 4309 BU-MC16040
November 2017
All other trademarks are property
of their respective owners.
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