DR124-151-R [EATON]

High power density, high efficiency, low profile shielded drum core power inductors;
DR124-151-R
型号: DR124-151-R
厂家: Eaton All Rights Reserved.    Eaton All Rights Reserved.
描述:

High power density, high efficiency, low profile shielded drum core power inductors

测试 功率感应器 电感器
文件: 总5页 (文件大小:655K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Effective March 2019  
Supersedes September 2017  
Technical Data 4141  
DR124  
High power density, high efficiency, low profile shielded  
drum core power inductors  
Applications  
Notebook power  
LCD panels  
Desktop and servers  
DVD players and portable power devices  
DC-DC Converters  
Buck, boost, forward, and resonant  
converters  
Noise filtering and filter chokes  
Environmental Data  
Storage temperature range (Component):  
-40 °C to +125 °C  
Product features  
Operating temperature range: -40 °C to +125 °C  
(ambient plus self-temperature rise)  
Low profile surface mount inductor  
12.5 mm x 12.5 mm x 4.5 mm shielded  
drum core  
Solder reflow temperature:  
J-STD-020 (latest revision) compliant  
Inductance range from 0.47 µH to 1000 µH  
Current range from 0.44 A to 24.4 A  
Frequency range up to 1 MHz  
Ferrite core material  
HALOGEN  
HF  
Pb  
FREE  
Technical Data 4141  
DR124  
High power density, high efficiency, low profile shielded drum  
core power inductors  
Effective March 2019  
Product specifications  
Rated  
Inductance  
(μH)  
DCR  
mΩ @±2°C  
Typ  
DCR  
mΩ @ +±2°C  
Max  
OCL1  
μH±±20  
Irms  
(A)  
Isat  
(A)  
±
3
Part Number  
DR124-R47-R  
DR124-1R0-R  
DR124-1R5-R  
DR124-2R2-R  
DR124-3R9-R  
DR124-4R7-R  
DR124-6R8-R  
DR124-8R2-R  
DR124-100-R  
DR124-120-R  
DR124-150-R  
DR124-180-R  
DR124-220-R  
DR124-270-R  
DR124-330-R  
DR124-390-R  
DR124-470-R  
DR124-560-R  
DR124-680-R  
DR124-820-R  
DR124-101-R  
DR124-121-R  
DR124-151-R  
DR124-181-R  
DR124-221-R  
DR124-271-R  
DR124-331-R  
DR124-471-R  
DR124-681-R  
DR124-821-R  
DR124-102-R  
K-factor4  
17.51  
12.50  
9.73  
7.96  
5.84  
5.15  
4.61  
4.17  
3.81  
3.50  
3.02  
2.82  
2.50  
2.24  
2.04  
1.86  
1.72  
1.54  
1.39  
1.27  
1.17  
1.08  
0.94  
0.87  
0.77  
0.71  
0.63  
0.53  
0.45  
0.40  
0.37  
0.47  
1.0  
1.5  
2.2  
3.9  
4.7  
6.8  
8.2  
10  
0.42  
0.83  
1.37  
2.04  
3.80  
4.88  
6.10  
7.45  
8.94  
11.5  
14.2  
16.2  
20.7  
25.7  
31.2  
37.3  
44.0  
54.9  
67.1  
80.5  
95.1  
111  
16.0  
13.9  
11.1  
9.1  
24.40  
18.00  
14.00  
11.45  
8.40  
7.65  
6.47  
6.22  
5.80  
4.96  
4.62  
4.32  
3.83  
3.44  
3.12  
2.85  
2.63  
2.35  
2.13  
1.94  
1.79  
1.65  
1.44  
1.30  
1.15  
1.09  
0.92  
0.74  
0.65  
0.62  
0.53  
2.2  
2.7  
3.6  
3.00  
4.75  
5.7  
5.92  
7.1  
7.0  
12.50  
15.0  
6.5  
13.50  
16.2  
5.6  
18.06  
21.7  
5.2  
21.67  
26.0  
4.5  
23.33  
28.0  
12  
4.1  
31.67  
38.0  
15  
3.6  
37.30  
44.8  
18  
3.4  
46.97  
56.4  
22  
3.2  
53.99  
64.8  
27  
2.8  
66.67  
80.0  
33  
2.6  
80.83  
97.0  
39  
2.3  
110.00  
124.66  
144.32  
183.33  
212.72  
256.67  
311.18  
371.02  
501.66  
558.00  
725.00  
825.00  
1242.50  
1845.83  
2109.17  
2898.00  
132.0  
149.6  
173.2  
220.0  
255.3  
308.0  
373.4  
445.2  
602.0  
669.6  
870.0  
990.0  
1491.0  
2215.0  
2351.0  
3477.00  
47  
2.2  
56  
2.0  
68  
1.8  
82  
1.7  
100  
120  
150  
180  
220  
270  
330  
470  
680  
820  
1000  
1.5  
1.3  
146  
1.3  
179  
1.1  
216  
1.0  
256  
0.88  
0.83  
0.68  
0.56  
0.53  
0.44  
327  
460  
669  
825  
998  
1. Open Circuit Inductance Test Parameters: 100 kHz, 0.25 V, 0.0 Adc.  
4. K-factor: Used to determine Bp-p for core loss (see graph).  
Bp-p = K*L*I, Bp-p (mT), K: (K factor from table), L: (Inductance in μH),  
I (Peak to peak ripple current in Amps).  
2. Irms: DC current for an approximate T of 40 °C without core loss. Derating is  
necessary for AC currents. PCB layout, trace thickness and width, air-flow,  
and proximity of other heat generating components will affect the  
temperature rise. It is recommended that the temperature of the part not  
exceed +125 °C under worst case operating conditions verified in the end  
application.  
5. Part Number Definition: DR124-xxx-R  
- DR124 = Product code and size; -xxx = Inductance value in uH;  
- R = decimal point; If no R is present, third character = # of zeros.  
- “-R” suffix = RoHS compliant  
3. Isat Amps peak for approximately 25% rolloff (@ +25 °C).  
www.eaton.com/electronics  
2
DR124  
Technical Data 4141  
High power density, high efficiency, low profile shielded drum  
core power inductors  
Effective March 2019  
Dimensions- mm  
SCHEMATIC  
FRONT VIEW  
TOP VIEW  
RECOMMENDED PCB LAYOUT  
BOTTOM VIEW  
2.05  
Typ.  
13.8  
4.5  
Max  
1
2
5.00  
Typ  
12.50  
Max  
1
2
DR124-###  
wwllyy R  
1
2
5.50  
12.50  
Max  
10  
Dimensions are in millimeters.  
3.85  
wwlly = Date code, R = Revision level.  
Do not route traces or vias underneath the inductor.  
Packaging- mm  
1.5 dia  
+0.1/-0.0  
1.5 dia  
min  
A
1.75  
4.0  
11  
24.0  
Ao=13.2 mm  
12.6  
1
B
Bo  
Bo=13.2 mm  
A1=10mm  
B1=10 mm  
Ko=5.2 mm  
A1  
Ao  
Ko  
16.0  
A
SECTION A-A  
User direction of feed  
Parts packaged on 13" Diameter reel, 750 parts per reel.  
Temperature rise vs. total loss  
120  
100  
80  
60  
40  
20  
0
0
0.4  
0.8  
1.2  
1.6  
2
Total Power Loss (W)  
www.eaton.com/electronics  
3
Technical Data 4141  
DR124  
High power density, high efficiency, low profile shielded drum  
core power inductors  
Effective March 2019  
Core loss vs. Bp-p  
100  
500 kHz  
1 MHz  
300 kHz  
200 kHz  
10  
1
100 kHz  
0.1  
0.01  
0.001  
0.0001  
1
10  
100  
1000  
B
p-p  
(mT)  
Inductance characteristics  
OCL vs. I  
sat  
120.0  
100.0  
80.0  
60.0  
40.0  
20.0  
0.0  
-40 °C  
+25 °C  
+85 °C  
0.0  
20.0  
40.0  
60.0  
80.0  
100.0  
120.0  
% I  
sat  
www.eaton.com/electronics  
4
DR124  
Technical Data 4141  
High power density, high efficiency, low profile shielded drum  
core power inductors  
Effective March 2019  
Solder reflow profile  
TP  
Table 1 - Standard SnPb Solder (T )  
c
TC -5°C  
tP  
Volume  
mm3  
Volume  
mm3  
Max. Ramp Up Rate = 3°C/s  
Max. Ramp Down Rate = 6°C/s  
Package  
Thickness  
<350  
350  
220°C  
220°C  
TL  
<2.5mm)  
235°C  
220°C  
Preheat  
t
2.5mm  
Tsmax  
Table 2 - Lead (Pb) Free Solder (T )  
c
Volume  
Volume  
Volume  
mm3  
Package  
mm3  
mm3  
Tsmin  
Thickness  
<350  
350 - 2000  
>2000  
ts  
<1.6mm  
260°C  
260°C  
250°C  
260°C  
250°C  
245°C  
260°C  
245°C  
245°C  
1.6 – 2.5mm  
>2.5mm  
25°C  
Time 25°C to Peak  
Time  
Reference JDEC J-STD-020  
Profile Feature  
Standard SnPb Solder  
Lead (Pb) Free Solder  
150°C  
Preheat and Soak • Temperature min. (T  
)
100°C  
smin  
• Temperature max. (T  
)
150°C  
200°C  
smax  
• Time (T  
smin  
to T  
) (t )  
60-120 Seconds  
3°C/ Second Max.  
60-120 Seconds  
3°C/ Second Max.  
smax  
s
Average ramp up rate T  
to T  
p
smax  
Liquidous temperature (Tl)  
183°C  
60-150 Seconds  
217°C  
60-150 Seconds  
Time at liquidous (t )  
L
Peak package body temperature (T )*  
Table 1  
Table 2  
P
Time (t )** within 5 °C of the specified classification temperature (T )  
20 Seconds**  
6°C/ Second Max.  
6 Minutes Max.  
30 Seconds**  
6°C/ Second Max.  
8 Minutes Max.  
p
c
Average ramp-down rate (T to T  
p
)
smax  
Time 25°C to Peak Temperature  
* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.  
p
** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.  
p
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written  
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly  
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.  
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also  
reserves the right to change or update, without notice, any technical information contained in this bulletin.  
Eaton  
Electronics Division  
1000 Eaton Boulevard  
Cleveland, OH 44122  
United States  
www.eaton.com/electronics  
© 2019 Eaton  
All Rights Reserved  
Printed in USA  
Eaton is a registered trademark.  
Publication No. 4141 BU-SB14114  
March 2019  
All other trademarks are property  
of their respective owners.  

相关型号:

DR124-180-R

DR124 Series Low Profile Power Inductors
COOPER

DR124-180-R

High power density, high efficiency, low profile shielded drum core power inductors
EATON

DR124-181-R

DR124 Series Low Profile Power Inductors
COOPER

DR124-181-R

High power density, high efficiency, low profile shielded drum core power inductors
EATON

DR124-1R0-R

DR124 Series Low Profile Power Inductors
COOPER

DR124-1R0-R

High power density, high efficiency, low profile shielded drum core power inductors
EATON

DR124-1R5-R

DR124 Series Low Profile Power Inductors
COOPER

DR124-220-R

DR124 Series Low Profile Power Inductors
COOPER

DR124-221-R

DR124 Series Low Profile Power Inductors
COOPER

DR124-270-R

DR124 Series Low Profile Power Inductors
COOPER

DR124-271-R

DR124 Series Low Profile Power Inductors
COOPER

DR124-2R2-R

DR124 Series Low Profile Power Inductors
COOPER