FP1110V1-R22-R [EATON]
High frequency, high current power inductors;型号: | FP1110V1-R22-R |
厂家: | Eaton All Rights Reserved. |
描述: | High frequency, high current power inductors |
文件: | 总6页 (文件大小:419K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Technical Data 10427
Effective August 2015
FP1110V
High frequency, high current power inductors
Applications
•
Servers
•
Multi-phase and Vcore regulators
•
•
•
•
•
Voltage Regulator Modules (VRMs)
Desktop VRMs and EVRDs
Data networking and storage systems
Point-of-Load modules
DCR Sensing circuits
Environmental Data
•
Storage temperature range (Component):
-40°C to +125°C
Description
•
Operating temperature range: -40°C to +125°C
(ambient + self-temperature rise)
•
Vertical design utilizes less board space
•
Solder reflow temperature: J-STD-020D
compliant
•
Controlled DCR for sensing circuits
•
Inductance Range from 195 nH to 320nH
•
Current range from 42 to 70 amps
•
HALOGEN
10.7 x 7.5mm and 10.5 x 6.2mm footprint
surface mount package in a 9.5mm height
HF
Pb
FREE
•
Ferrite core material
•
Halogen free, lead free, RoHS compliant
FP1110V
Technical Data 10427
Effective August 2015
High frequency, high current power inductors
Product specifications
3
4
5
OCL1
FLL2
I
I
I
sat2
DCR (mΩ)
rms
sat1
Part Number7
(nH) 1ꢀ0
minimum (nH)
(amps)
(amps)
(amps)
50 ꢁ ꢂ2ꢀꢃC
K-factor6
V1-10.7 x 7.5 x 9.5mm
FP1110V1-R20-R
195
220
270
320
140
158
173
230
61
61
61
61
70
64
55
42
58
51
44
34
0.23
0.23
0.23
0.23
278
278
278
278
FP1110V1-R22-R
FP1110V1-R27-R
FP1110V1-R32-R
V2-10.5 x 6.2 x 9.5mm
FP1110V2-R200-R
200
144
61
65
52
0.18
328
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, +25°C
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, @ Isat1, @ +25ºC
5. Isat : Peak current for approximately 20% rolloff @ +100ºC
6. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3.
3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents.
PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the
temperature rise. It is recommended that the temperature of the part not exceed +125°C under worst case operating
conditions verified in the end application.
Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), ΔI (Peak to peak ripple current in Amps).
7. Part Number Definition: FP1110Vx-Rxx(x)-R
FP1110V = Product code
x= DCR indicator
4. Isat1 : Peak current for approximately 20% rolloff @ +25ºC
Rxx(x)= Inductance value in uH, R= decimal point
-R suffix = RoHS compliant
Dimensions (mm)
7.5
max
9.5
max
Recommended Pad Layout
Schematic
a
b
10.7
max
4.6
2.8
4.1
3.4
2.8
3.3
Recommended Pad Layout
Schematic
6.2
max
9.5
max
a
b
10.5
max
4.0
3.6
4.2
3.0
2.15
2.8
Part marking: FP1110V1 or V2, Rxx(x)=inductance value in µH, R=decimal point
wwllyy= date code, R=revision level
DCR measured from point “a” to point “b”
Soldering surfaces to be coplanar within 0.10 millimeters
Do not route traces or vias underneath the inductor.
www.eaton.com/elx
2
FP1110V
Technical Data 10427
Effective April 2015
High frequency, high current power inductors
Packaging information (mm)
(Drawing not to scale)
(Supplied in tape and reel packaging, 300 parts per 13” diameter reel
FP1110V1
4.0
2.0
1.75
11.5
24.0
0.ꢀ
10.9
20.0
Part marking
9.5
7.6
User Direction of feed
FP1110V2
1.5 dia
1.75
4.0
2.0
1.5 dia
11.5
24.0
0.ꢀ
10.7
20.0
10.2
Part marking
2.5
6.4
User Direction of feed
www.eaton.com/elx
3
FP1110V
Technical Data 10427
Effective August 2015
High frequency, high current power inductors
Temperature rise vs. total loss
FP1110V1
FP1110V2
50
40
30
20
10
0
50
40
30
20
10
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0.0
0.2
0.4
0.6
0.8
1.0
Total Loss (W)
Total Loss (W)
Core loss vs. Bp-p
FP1110V1
FP1110V2
10
1
10
1
0.1
0.01
0.1
0.01
0.001
0.001
100
1000
10000
100
1000
Bp-p (Gauss)
10000
Bp-p (Gauss)
www.eaton.com/elx
4
FP1110V
Technical Data 10427
Effective April 2015
High frequency, high current power inductors
Inductance characteristics
FP1110V1-R20-R
FP1110V1-R22-R
120%
120%
100%
80%
60%
40%
20%
0%
100%
80%
60%
40%
-40°C
+25°C
+100°C
+125°C
-40°C
+25°C
+100°C
+125°C
20%
0%
0
10 20 30 40 50 60 70 80 90 100 110 120
0
10 20 30 40 50 60 70 80 90 100 110
IDC(Amps)
IDC(Amps)
FP1110V1-R27-R
FP1110V1-R32-R
120%
100%
80%
60%
40%
20%
0%
120%
100%
80%
60%
40%
20%
0%
-40°C
-40°C
+25°C
+100°C
+125°C
+25°C
+100°C
+125°C
0
10
20
30
40
50
60
70
80
90
0
10
20
30
40
50
60
70
80
IDC(Amps)
IDC(Amps)
FP1110V2-R200-R
120%
100%
80%
60%
40%
20%
0%
-40°C
+25°C
+100°C
+125°C
0
10
20
30
40
50
60
70
80
90 100
IDC(Amps)
www.eaton.com/elx
5
FP1110V
Technical Data 10427
Effective August 2015
High frequency, high current power inductors
Solder reflow profile
TP
Table 1 - Standard SnPb Solder (T )
c
TC -5°C
tP
Volume
Volume
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Package
mm3
mm3
Thickness
<35ꢀ
≥35ꢀ
TL
<2.5mm)
235°C
220°C
220°C
220°C
Preheat
t
≥2.5mm
Tsmax
Table 2 - Lead (Pb) Free Solder (T )
c
Volume
Volume
Volume
mm3
Package
mm3
mm3
Tsmin
Thickness
<35ꢀ
35ꢀ - 2ꢀꢀꢀ
>2ꢀꢀꢀ
ts
<1.6mm
260°C
260°C
250°C
260°C
250°C
245°C
260°C
245°C
245°C
1.6 – 2.5mm
>2.5mm
25°C
Time 25°C to Peak
Time
Reference JDEC J-STD-020D
Profile Feature
Standard SnPb Solder
100°C
Lead (Pb) Free Solder
150°C
Preheat and Soak • Temperature min. (T
)
smin
• Temperature max. (T
)
150°C
200°C
smax
• Time (T
smin
to T
) (t )
smax
60-120 Seconds
3°C/ Second Max.
60-120 Seconds
3°C/ Second Max.
s
Average ramp up rate T
smax
to T
p
Liquidous temperature (Tl)
Time at liquidous (t )
183°C
60-150 Seconds
217°C
60-150 Seconds
L
Peak package body temperature (T )*
Table 1
Table 2
P
Time (t )** within 5 °C of the specified classification temperature (T )
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
p
c
Average ramp-down rate (T to T
p
)
smax
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.
p
** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.
p
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/elx
© 2015 Eaton
All Rights Reserved
Printed in USA
Eaton is a registered trademark.
Publication No. 10427 BU-MC15008
August 2015
All other trademarks are property
of their respective owners.
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