FP1308-R26-R [EATON]
High frequency, high current power inductors;型号: | FP1308-R26-R |
厂家: | Eaton All Rights Reserved. |
描述: | High frequency, high current power inductors 功率感应器 电感器 |
文件: | 总4页 (文件大小:279K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Effective June 2017
Supersedes Sepetember 2011
Technical Data DS4313
FP1308
High frequency, high current power inductors
Applications
•
Voltage regulator modules (VRMs) for servers
and microprocessors
•
•
Multi-phase buck inctors
High frequencynt switching power
supplies
SMD Device
Enviromental
•
•
Storamperature range (component):
-40 °C to 125 °C
Operating tmperature range: -40 °C to +125 °C
mbient plus self-tmperature rise)
er reflow tematu
Product features
•
•
13.7 x 12.9 x 8.0mm surface moackae
High current handling capabilityomact
footprint
•
•
•
•
•
Ferrite core material
-020 (laterevision) copliant
Inductance range from 0to 0.440µH
Current range from 32 to m
Frequency range up to 2MH
HALOG
Pb
HF
Halogen free, lead RoHS mpliant
FE
Product Specifications
2
3
Part
Number5
FP1308-R11-R
FP1308-R21-R
FP1308-R26-R
FP1308-R32-R
FP1308-R44-R
Rated
OCL1
I
I
DCR (mΩ) @
DCR (mΩ) @
K-factor4
rms
sat
Inductance (μH)
0.110
1ꢀ0 (μH)
0.110
0.210
0.260
0.320
(Amps)
68
68
(Amps)
120
72
25°C Typical
0.20
25°C Max
0.24
0.24
0.24
0.24
21.330
21.333
21.335
21.340
21.366
0.210
0.260
0.320
0.440
0.20
0.20
0.20
0.20
68
60
68
45
0.440
68
32
0.24
1
2
Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0V , 0.0Adc
rms
4
5
K-factor: Used to determine B for core loss (see graph). B = K L ΔI. B (mT): (Gauss), K:
* *
p-p p-p p-p
(K-factor from table), L: (inductance in μH), ΔI (peak-to-peak ripple current in amps).
Part Number Definition: FP1308-xxx-R
• FP1308 = Product code and size
• xxx= Inductance value in μH, R = decimal point. If no “R” is present, then
third character = # of zeros.
I
: DC current for an approximate temperature rise of 40°C without core loss. Derating is
rms
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
• “-R” suffix = RoHS compliant
3
I
: Peak current for approximately 20% rolloff at +25°C.
sat
FP1308
Technical Data DS4313
High frequency, high current power inductors
Effective June 2017
Dimensions - mm
Schematic
Recommended Pad Layout
Front View
Bottom View
Top View
7.62
1
2
2.54 (2plcs)
12.95 max.
1
3.18
5.4
7.2
8.0
13.70 max.
FP1308X- XX
wwllyy R
Left View
2
8.0 max.
Part Marking: FP1308
xxx = Inductance value in μH. (R = Decimal point). If no “R” is present, then last character is # 0f zeros
wwllyy = Date code
R = Revision level
Packaging Information - mm
1.5 dia. +0.1/-0.0
4.0
A
1.5 diia. min
2.0
1.75
Section A-A
11.5
24.0 ±0.3
13.9
FP1308-XXX
wwllyy R
A
13.2
8.2
User direction of feed
Supplied in tape-and-reel packaging, 400 parts per reel, 13” diameter reel.
Temperature Rise vs. Total Loss
100
80
60
40
20
0
0
0.5
1
1.5
2
2.5
3
Total Loss (W)
www.eaton.com/electronics
2
Technical Data DS4313
FP1308
Effective June 2017
High frequency, high current power inductors
Core Loss
500kHz 100kHz
300kHz
Core Loss vs B
p-p
50kHz
1MHz
10
1
0.1
0.01
0.001
0.0001
1
100
1000
B
(mT)
p-
Inductance Characterist
OCL vs I
s
20%
100%
80
%
20%
-40 °C
+25 °C
+125 °C
0%
0%
20%
40%
60%
80%
100%
120%
140%
160%
% of I
sat
3
www.eaton.com/electronics
FP1308
Technical Data DS4313
High frequency, high current power inductors
Effective June 2017
Solder Reflow Profile
TP
TTaabbllee 1 - SSttaannddaardd SnPPbb SSoolldeerr ((TT ))
cc
TC -5°C
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Volume
mm3
<350
235°C
220°C
Volume
mm3
Package
Thickness
<2.5mm
_
>350
TL
0°C
Preheat
A
t
_
>2.5mm
Tsmax
TTaabbllee 2 - LLeeaadd ((PPFrreee SSeerr ((TT ))
cc
Volume
Volume
mm3
>2000
260°C
245°C
245°C
Tsmin
mm3
ts
Package
Thickns
<1.6mm
<350
260°C
1.6 – 2.5mm 60°C
>2.5mm 20°C
350 - 2000
260°C
250°C
245°C
25°C
Time 25°C to Peak
Time
Reference JDEC J-STD-020
Profile Feature
Preheat and Soak
ard b Solder ad Free Solder
00°C
• Temperature min. (T
)
150°C
smi
• Temperature max. (T
50°C
200°C
s
)
• Time (T
smin
to T
60120 Secnds
°C/ Second M
60-120 Seconds
3°C/ Second Max.
sax
Average ramp up rate T
to T
smax
p
Liquidous temperature (T
Time at liquidous (t )
L
)
13°C
60-15n
217°C
60-150 Seconds
L
Peak package body temperature (T )*
Table 1
Table 2
P
Time (t )** within 5 °C of the fied clasfication empeatu(T )
econds**
°C/ d Max.
inutes Max.
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
p
Average ramp-down rate (T
c
)
max
p
Time 25°C to Peak Temerature
* Tolerance for peak profiperature (T ) is dfined s a pplier minimum and a ximum.
p
** Tolerance for time at peak le temperature is ed as a supplminimum and a user maximum.
ife Support Policy: Eatot rize the use of any of its products for use in life support devices or systems without the express written
pproof an officer of the mpan support systems are devices which support or sustain life, and whose failure to perform, when properly
accordance with instruns for use provided in the labeling, can be reasonably expected to result in significant inju y to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Printed in USA
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
Publication No. DS4313 BU-SB111090
June 2017
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