FP1309B [EATON]
High frequency, high current power inductors;型号: | FP1309B |
厂家: | Eaton All Rights Reserved. |
描述: | High frequency, high current power inductors |
文件: | 总5页 (文件大小:435K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Technical Data 10477
Effective November 2015
FP1309B
High frequency, high current power inductors
Applications
•
Servers
•
Multi-phase and Vcore regulators
•
Voltage Regulator Modules (VRMs)
− Server and desktop
− Central processing unit (CPU)
− Graphics processing unit (GPU)
− Application specific integrated circuit
(ASIC)
− High power density
•
•
•
Data centers, networking and storage systems
Point-of-Load modules
DCR Sensing circuits
Product description
Environmental data
•
High current carrying capacity
•
Storage temperature range (Component):
-40°C to +125°C
•
Low core loss
•
Tight tolerance DCR for sensing circuits
•
Operating temperature range: -40°C to +125°C
(ambient + self-temperature rise)
•
Inductance Range from 100nH to 150nH
•
Current range from 60 to 100 amps
•
Solder reflow temperature:
J-STD-020D compliant
•
12.8 x 8.3mm footprint surface mount package
in an 8.8mm height
HALOGEN
•
Ferrite core material
HF
Pb
FREE
•
Halogen free, lead free, RoHS compliant
FP1309B
Technical Data 10477
Effective November 2015
High frequency, high current power inductors
Product specifications
3
OCL1
FLL2
Irms
Isat14
Isat25
DCR (mΩ)
Part Number7
B1 version
(nH) 1ꢀ0
(nH) minimum
(amps)
(amps)
(amps)
50 ꢁ 2ꢀꢂC
K-factor6
FP1309B1-R100-R
FP1309B1-R120-R
FP1309B1-R150-R
100
120
150
72
60
60
60
100
90
80
72
64
0.19
0.19
0.19
296
296
296
87
108
80
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, +25°C
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1, +25°C
6. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3. Bp-p:(Gauss),
K: (K-factor from table), L: (Inductance in nH), ΔI (Peak to peak ripple current in Amps).
7. Part Number Definition: FP1309Bx-Rxxx-R
3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary
for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generat-
ing components will affect the temperature rise. It is recommended that the temperature of the part
not exceed 125°C under worst case operating conditions verified in the end application.
4. Isat1: Peak current for approximately 20% rolloff @ +25°C
FP1309B= Product code and size
x= Version indicator
Rxxx= Inductance value in μH, R= decimal point
-R suffix = RoHS compliant
5. Isat2: Peak current for approximately 20% rolloff @ +125°C
Dimensions (mm)
Recommended Pad Layout
Schematic
Part marking: FP1309Bx (Product code and size, x = version indicator),
Rxxx = Inductance value in uH, R = decimal point
wwllyy = date code, R = revision level
All soldering surface to be coplanar within 0.10mm
DCR measured between point “a” and point “b”
www.eaton.com/elx
2
FP1309B
Technical Data 10477
Effective November 2015
High frequency, high current power inductors
Packaging information (mm)
Supplied in tape and reel packaging, 330 parts per 13” diameter reel
User Direction of Feed
Temperature rise vs. total loss
FP1309B1
60
50
40
30
20
10
0
0.0
0.5
1.0
1.5
2.0
Total Loss (W)
www.eaton.com/elx
3
FP1309B
Technical Data 10477
Effective November 2015
High frequency, high current power inductors
Core loss vs. Bp-p
FP1309B1
10
1MHz
800kHz
1
0.1
500kHz
300kHz
0.01
0.001
100
1000
Bp-p (Gauss)
10000
Inductance characteristics
FP1309B1-R100-R
FP1309B1-R120-R
120%
100%
80%
60%
40%
20%
0%
120%
100%
80%
60%
40%
20%
0%
-40°C
-40°C
+25°C
+25°C
+125°C
+100°C
+125°C
+100°C
0
20
40
60
80
100
120
140
160
0
20
40
60
80
100
120
140
160
IDC (Amps)
IDC (Amps)
FP1309B1-R150-R
120%
100%
80%
60%
40%
20%
0%
-40°C
+25°C
+125°C
+100°C
0
20
40
60
80
100
120
140
IDC (Amps)
www.eaton.com/elx
4
FP1309B
Technical Data 10477
Effective November 2015
High frequency, high current power inductors
Solder reflow profile
TP
Table 1 - Standard SnPb Solder (T )
c
TC -5°C
tP
Volume
mm3
Volume
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Package
mm3
Thickness
<35ꢀ
≥35ꢀ
TL
<2.5mm)
235°C
220°C
220°C
220°C
Preheat
t
≥2.5mm
Tsmax
Table 2 - Lead (Pb) Free Solder (T )
c
Volume
Volume
Volume
mm3
Package
mm3
mm3
Tsmin
Thickness
<35ꢀ
35ꢀ - 2ꢀꢀꢀ
>2ꢀꢀꢀ
ts
<1.6mm
260°C
260°C
250°C
260°C
250°C
245°C
260°C
245°C
245°C
1.6 – 2.5mm
>2.5mm
25°C
Time 25°C to Peak
Time
Reference JDEC J-STD-020D
Profile Feature
Standard SnPb Solder
100°C
Lead (Pb) Free Solder
150°C
Preheat and Soak • Temperature min. (T
)
smin
• Temperature max. (T
)
150°C
200°C
smax
• Time (T
smin
to T
) (t )
smax
60-120 Seconds
3°C/ Second Max.
60-120 Seconds
3°C/ Second Max.
s
Average ramp up rate T
smax
to T
p
Liquidous temperature (Tl)
Time at liquidous (t )
183°C
60-150 Seconds
217°C
60-150 Seconds
L
Peak package body temperature (T )*
Table 1
Table 2
P
Time (t )** within 5 °C of the specified classification temperature (T )
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
p
c
Average ramp-down rate (T to T
p
)
smax
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.
p
** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.
p
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/elx
© 2015 Eaton
All Rights Reserved
Eaton is a registered trademark.
Printed in USA
Publication No. 10477 BU-MC15049
November 2015
All other trademarks are property
of their respective owners.
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