FP1309B [EATON]

High frequency, high current power inductors;
FP1309B
型号: FP1309B
厂家: Eaton All Rights Reserved.    Eaton All Rights Reserved.
描述:

High frequency, high current power inductors

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Technical Data 10477  
Effective November 2015  
FP1309B  
High frequency, high current power inductors  
Applications  
Servers  
Multi-phase and Vcore regulators  
Voltage Regulator Modules (VRMs)  
− Server and desktop  
− Central processing unit (CPU)  
− Graphics processing unit (GPU)  
− Application specific integrated circuit  
(ASIC)  
− High power density  
Data centers, networking and storage systems  
Point-of-Load modules  
DCR Sensing circuits  
Product description  
Environmental data  
High current carrying capacity  
Storage temperature range (Component):  
-40°C to +125°C  
Low core loss  
Tight tolerance DCR for sensing circuits  
Operating temperature range: -40°C to +125°C  
(ambient + self-temperature rise)  
Inductance Range from 100nH to 150nH  
Current range from 60 to 100 amps  
Solder reflow temperature:  
J-STD-020D compliant  
12.8 x 8.3mm footprint surface mount package  
in an 8.8mm height  
HALOGEN  
Ferrite core material  
HF  
Pb  
FREE  
Halogen free, lead free, RoHS compliant  
FP1309B  
Technical Data 10477  
Effective November 2015  
High frequency, high current power inductors  
Product specifications  
3
OCL1  
FLL2  
Irms  
Isat14  
Isat25  
DCR (mΩ)  
Part Number7  
B1 version  
(nH) 1ꢀ0  
(nH) minimum  
(amps)  
(amps)  
(amps)  
50 ꢁ 2ꢀꢂC  
K-factor6  
FP1309B1-R100-R  
FP1309B1-R120-R  
FP1309B1-R150-R  
100  
120  
150  
72  
60  
60  
60  
100  
90  
80  
72  
64  
0.19  
0.19  
0.19  
296  
296  
296  
87  
108  
80  
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, +25°C  
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1, +25°C  
6. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3. Bp-p:(Gauss),  
K: (K-factor from table), L: (Inductance in nH), ΔI (Peak to peak ripple current in Amps).  
7. Part Number Definition: FP1309Bx-Rxxx-R  
3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary  
for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generat-  
ing components will affect the temperature rise. It is recommended that the temperature of the part  
not exceed 125°C under worst case operating conditions verified in the end application.  
4. Isat1: Peak current for approximately 20% rolloff @ +25°C  
FP1309B= Product code and size  
x= Version indicator  
Rxxx= Inductance value in μH, R= decimal point  
-R suffix = RoHS compliant  
5. Isat2: Peak current for approximately 20% rolloff @ +125°C  
Dimensions (mm)  
Recommended Pad Layout  
Schematic  
Part marking: FP1309Bx (Product code and size, x = version indicator),  
Rxxx = Inductance value in uH, R = decimal point  
wwllyy = date code, R = revision level  
All soldering surface to be coplanar within 0.10mm  
DCR measured between point “a” and point “b”  
www.eaton.com/elx  
2
FP1309B  
Technical Data 10477  
Effective November 2015  
High frequency, high current power inductors  
Packaging information (mm)  
Supplied in tape and reel packaging, 330 parts per 13” diameter reel  
User Direction of Feed  
Temperature rise vs. total loss  
FP1309B1  
60  
50  
40  
30  
20  
10  
0
0.0  
0.5  
1.0  
1.5  
2.0  
Total Loss (W)  
www.eaton.com/elx  
3
FP1309B  
Technical Data 10477  
Effective November 2015  
High frequency, high current power inductors  
Core loss vs. Bp-p  
FP1309B1  
10  
1MHz  
800kHz  
1
0.1  
500kHz  
300kHz  
0.01  
0.001  
100  
1000  
Bp-p (Gauss)  
10000  
Inductance characteristics  
FP1309B1-R100-R  
FP1309B1-R120-R  
120%  
100%  
80%  
60%  
40%  
20%  
0%  
120%  
100%  
80%  
60%  
40%  
20%  
0%  
-40°C  
-40°C  
+25°C  
+25°C  
+125°C  
+100°C  
+125°C  
+100°C  
0
20  
40  
60  
80  
100  
120  
140  
160  
0
20  
40  
60  
80  
100  
120  
140  
160  
IDC (Amps)  
IDC (Amps)  
FP1309B1-R150-R  
120%  
100%  
80%  
60%  
40%  
20%  
0%  
-40°C  
+25°C  
+125°C  
+100°C  
0
20  
40  
60  
80  
100  
120  
140  
IDC (Amps)  
www.eaton.com/elx  
4
FP1309B  
Technical Data 10477  
Effective November 2015  
High frequency, high current power inductors  
Solder reflow profile  
TP  
Table 1 - Standard SnPb Solder (T )  
c
TC -5°C  
tP  
Volume  
mm3  
Volume  
Max. Ramp Up Rate = 3°C/s  
Max. Ramp Down Rate = 6°C/s  
Package  
mm3  
Thickness  
<35ꢀ  
35ꢀ  
TL  
<2.5mm)  
235°C  
220°C  
220°C  
220°C  
Preheat  
t
2.5mm  
Tsmax  
Table 2 - Lead (Pb) Free Solder (T )  
c
Volume  
Volume  
Volume  
mm3  
Package  
mm3  
mm3  
Tsmin  
Thickness  
<35ꢀ  
35ꢀ - 2ꢀꢀꢀ  
>2ꢀꢀꢀ  
ts  
<1.6mm  
260°C  
260°C  
250°C  
260°C  
250°C  
245°C  
260°C  
245°C  
245°C  
1.6 – 2.5mm  
>2.5mm  
25°C  
Time 25°C to Peak  
Time  
Reference JDEC J-STD-020D  
Profile Feature  
Standard SnPb Solder  
100°C  
Lead (Pb) Free Solder  
150°C  
Preheat and Soak • Temperature min. (T  
)
smin  
• Temperature max. (T  
)
150°C  
200°C  
smax  
• Time (T  
smin  
to T  
) (t )  
smax  
60-120 Seconds  
3°C/ Second Max.  
60-120 Seconds  
3°C/ Second Max.  
s
Average ramp up rate T  
smax  
to T  
p
Liquidous temperature (Tl)  
Time at liquidous (t )  
183°C  
60-150 Seconds  
217°C  
60-150 Seconds  
L
Peak package body temperature (T )*  
Table 1  
Table 2  
P
Time (t )** within 5 °C of the specified classification temperature (T )  
20 Seconds**  
6°C/ Second Max.  
6 Minutes Max.  
30 Seconds**  
6°C/ Second Max.  
8 Minutes Max.  
p
c
Average ramp-down rate (T to T  
p
)
smax  
Time 25°C to Peak Temperature  
* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.  
p
** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.  
p
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written  
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly  
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.  
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also  
reserves the right to change or update, without notice, any technical information contained in this bulletin.  
Eaton  
Electronics Division  
1000 Eaton Boulevard  
Cleveland, OH 44122  
United States  
www.eaton.com/elx  
© 2015 Eaton  
All Rights Reserved  
Eaton is a registered trademark.  
Printed in USA  
Publication No. 10477 BU-MC15049  
November 2015  
All other trademarks are property  
of their respective owners.  

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