HCM1103-R47-R [EATON]
High current power inductors;型号: | HCM1103-R47-R |
厂家: | Eaton All Rights Reserved. |
描述: | High current power inductors |
文件: | 总7页 (文件大小:2896K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Effective July 2017
Supersedes June 2012
Technical Data 4449
HCM1103
High current power inductors
Applications
•
•
•
•
•
•
•
•
•
Voltage Regulator Module (VRM)
Multi-phase regulators
Point-of-load modules
Desktop and server VRMs and EVRDs
Base station equipment
Notebook and laptop regulators
Battery power systems
Graphics cards
Data networking and storage systems
Product features
Environmental Data
•
11.5 x 10.3 x 3.0 mm maximum surface
mount package
•
Storage temperature range (Component):
-55 °C to +125 °C
•
•
•
•
•
•
Iron powder core material
•
•
Operating temperature range: -55 °C to +125 °C
(ambient plus self-temperature rise)
Magnetically shielded, low EMI
High current carrying capacity, low core losses
Inductance range from 0.12 µH to 22.0 µH
Current range from 3.0 A to 75 A
Solder reflow temperature:
J-STD-020 (latest revision) compliant
HALOGEN
Halogen free, lead free, RoHS compliant
HF
Pb
FREE
HCM1103
High current power inductors
Technical Data 4449
Effective July 2017
Product Specifications
3
DCR (mΩ) @
+2ꢀ °C Typical
DCR (mΩ) @
+2ꢀ °C Maximum
ꢀ.61
Part
Number6
OCL1
2ꢀ0 (µH)
ꢀ.12
ꢀ.36
ꢀ.47
ꢀ.68
1.ꢀ
2.2
3.3
4.7
8.2
FLL min.2
(µH)
ꢀ.ꢀ7
ꢀ.26
ꢀ.33
ꢀ.38
ꢀ.56
1.2
1.9
2.6
4.6
5.6
8.4
12.3
I
I
4 @ +25 °C
(A)
75
28
26
23
21
16
14
13
rms
sat
(A)
3ꢀ
K-Factor5
12ꢀꢀ
711
HCM11ꢀ3-R12-R
HCM11ꢀ3-R36-R
HCM11ꢀ3-R47-R
HCM11ꢀ3-R68-R
HCM11ꢀ3-1Rꢀ-R
HCM11ꢀ3-2R2-R
HCM11ꢀ3-3R3-R
HCM11ꢀ3-4R7-R
HCM11ꢀ3-8R2-R
HCM11ꢀ3-1ꢀꢀ-R
HCM11ꢀ3-15ꢀ-R
HCM11ꢀ3-22ꢀ-R
ꢀ.55
1.1ꢀ
1.5ꢀ
2.9ꢀ
5.5ꢀ
8.4ꢀ
14.5
2ꢀ.5
35.ꢀ
4ꢀ.ꢀ
59.ꢀ
9ꢀ.ꢀ
23
2ꢀ
21
15
13
1.3ꢀ
2.ꢀꢀ
3.4ꢀ
6.ꢀꢀ
9.ꢀꢀ
16.ꢀ
22.5
38.5
515
51ꢀ
377
264
23ꢀ
2ꢀ5
153
141
9.ꢀ
7.ꢀ
5.ꢀ
5.ꢀ
4.ꢀ
3.ꢀ
8.5
7.5
6.ꢀ
5.ꢀ
1ꢀ.ꢀ
15.ꢀ
22.ꢀ
44.ꢀ
65.ꢀ
99.ꢀ
114
91
1. Open Circuit Inductance (OCL) Test Parameters: 1ꢀꢀ kHz, ꢀ.25 Vrms, ꢀ.ꢀ Adc @
+25 °C
4. Isat: Peak current for approximately 3ꢀ0 rolloff at +25 °C
5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p
= K * L * ∆I. Bp-p:(Gauss), K: (K-factor from table),
L: (Inductance in µH), ∆I (peak-to-peak ripple current in Amps).
6. Part Number Definition: HCM11ꢀ3-xxx-R
2. Full Load Inductance (FLL) Test Parameters: 1ꢀꢀ kHz, ꢀ.25 Vrms, Isat @ +25 °C.
3. Irms: DC current for an approximate temperature rise of 4ꢀ °C without core
loss. Derating is necessary for AC currents. PCB layout, trace thickness and
width, air-flow and proximity of other heat generating components will affect
the temperature rise. It is recommended that the temperature of the part not
exceed +125 °C under worst case operating conditions verified in the end
application.
HCM11ꢀ3 = Product code and size
xxx= Inductance value in µH, R = decimal point,
if no R is present then third character = number of zeros.
-R suffix = RoHS compliant
Dimensions (mm)
Top View
Top View
Side View
Bottom View
Recommended Pad Layout
Schematic
HCM1103-R36-R &
HCM1103-R47-R
HCM1103-R12-R &
HCM1103-R68-R to
HCM1103-220R
wlyy R
Part Marking: xxx = Inductance value in uH, R = decimal point, if no R is present then third character = # of zeros.
wlyy = (Date code), R = Revision Level
All soldering surfaces to be coplanar within 0.10 millimeters.
Tolerances are 0.3 millimeters unless stated otherwise.
HCM1103-R36-R and HCM1103-R47-R Color: Top Grey
HCM1103-R12-R and HCM1103-R68-R to HCM1103-220-R Color : Top Grey
Do not route traces or vias underneath the inductor
www.eaton.com/electronics
2
HCM1103
High current power inductors
Technical Data 4449
Effective July 2017
Packaging information (mm)
Supplied in tape and reel packaging, 1000 parts per 13” diameter reel.
wlyy R
Temperature rise vs. total loss
60.0
50.0
40.0
30.0
20.0
10.0
0.0
HCM1103-R12-R
HCM1103-R36-R
HCM1103-R47-R
HCM1103-R68-R
HCM1103-1R0-R
HCM1103-2R2-R
HCM1103-3R3-R
HCM1103-4R7-R
HCM1103-8R2-R
HCM1103-100-R
HCM1103-150-R
HCM1103-220-R
0.0
0.2
0.4
0.6
1.0
1.2
1.4
1.6
0.8
Total Loss (W)
www.eaton.com/electronics
3
HCM1103
High current power inductors
Technical Data 4449
Effective July 2017
Core loss vs. B
p-p
HCM1103-; R36-R and R47-R
10000
1000
100
10
300K
200K
100K
50K
25K
1
0.1
10
100
1000
10000
Bp-p (Gauss)
HCM1103-; R12-R, R68-R through 220-R
10000.0
1000.0
100.0
10.0
500K
300K
200K
100K
50K
25K
1.0
0.1
10
100
1000
10000
Bp-p (Gauss)
www.eaton.com/electronics
4
HCM1103
High current power inductors
Technical Data 4449
Effective July 2017
Inductance characteristics
HCM1103-; R36-R, R47-R
HCM1103-R12-R
110%
100%
90%
80%
70%
60%
50%
40%
30%
110%
100%
90%
80%
70%
60%
50%
40%
30%
HCM1103-R36-R
HCM1103-R47-R
0
10
20
30
40
50
60
70
80
0
5
10
15
20
25
30
35
40
45
Idc (A)
Idc (A)
HCM1103-; R68-R, 1R0-R
HCM1103-; 2R2-R, 3R3-R
110%
100%
90%
80%
70%
60%
50%
40%
30%
110%
100%
90%
80%
70%
60%
50%
40%
30%
HCM1103-R68-R
HCM1103-1R0-R
HCM1103-2R2-R
HCM1103-3R3-R
0
5
10
15
20
25
30
35
40
0
2
4
6
8
10
12
14
16
18
20
22
24
26
Idc(A)
Idc (A)
HCM1103-4R7-R
HCM1103-; 8R2-R, 100-R
110%
100%
90%
80%
70%
60%
50%
40%
30%
110%
100%
90%
80%
70%
60%
50%
40%
30%
HCM1103-8R2-R
HCM1103-100-R
8
4
6
0
2
10
12
14
0
2
10
12
14
16
18
4
6
Idc (A)
8
Idc (A)
www.eaton.com/electronics
5
HCM1103
High current power inductors
Technical Data 4449
Effective July 2017
Inductance characteristics
110%
100%
90%
80%
70%
60%
50%
HCM1103-150-R
40%
HCM1103-220-R
30%
0
2
4
6
8
10
12
Idc (A)
www.eaton.com/electronics
6
HCM1103
High current power inductors
Technical Data 4449
Effective July 2017
Solder reflow profile
TP
Table 1 - Standard SnPb Solder (T )
c
TC -5°C
tP
Volume
mm3
Volume
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Package
mm3
Thickness
<350
≥350
TL
<2.5mm)
235°C
220°C
220°C
220°C
Preheat
t
≥2.5mm
Tsmax
Table 2 - Lead (Pb) Free Solder (T )
c
Volume
Volume
Volume
mm3
Package
mm3
mm3
Tsmin
Thickness
<350
350 - 2000
>2000
ts
<1.6mm
260°C
260°C
250°C
260°C
250°C
245°C
260°C
245°C
245°C
1.6 – 2.5mm
>2.5mm
25°C
Time 25°C to Peak
Time
Reference JDEC J-STD-020
Profile Feature
Standard SnPb Solder
100°C
Lead (Pb) Free Solder
150°C
Preheat and Soak • Temperature min. (T
smin
)
• Temperature max. (T
)
150°C
200°C
smax
• Time (T
smin
to T
) (t )
60-120 Seconds
3°C/ Second Max.
60-120 Seconds
3°C/ Second Max.
smax
s
Average ramp up rate T
to T
p
smax
Liquidous temperature (Tl)
183°C
60-150 Seconds
217°C
60-150 Seconds
Time at liquidous (t )
L
Peak package body temperature (T )*
Table 1
Table 2
P
Time (t )** within 5 °C of the specified classification temperature (T )
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
p
c
Average ramp-down rate (T to T
p
)
smax
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.
p
** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.
p
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Printed in USA
Eaton is a registered trademark.
Publication No. 4449 BU-SB12434
July 2017
All other trademarks are property
of their respective owners.
相关型号:
©2020 ICPDF网 联系我们和版权申明