HCM1104-4R7-R [EATON]

High current power inductors;


型号：	HCM1104-4R7-R
厂家：	Eaton All Rights Reserved.
描述：	High current power inductors
文件：	总7页 (文件大小：340K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Effective August 2018

Technical Data 4370

Supersedes September 2017

HCM1104

High current power inductors

Applications

•

Voltage Regulator Module (VRM)

•

Multi-phase regulators

•

Point-of-Load modules

•

Desktop and server VRMs and EVRDs

•

Base station equipment

•

Notebook and laptop regulators

•

Battery power systems

•

Graphics cards

•

Data networking and storage systems

Environmental data

•

Storage temperature range (Component):

Product features

-55 °C to +125 °C

•

High current carrying capacity

•

Operating temperature range: -55 °C to +125 °C

(ambient + self-temperature rise)

•

Low core losses

•

Magnetically shielded, low EMI

Solder reflow temperature:

J-STD-020 (latest revision) compliant

•

Frequency range up to 5 MHz

•

Inductance range from 0.2 μH to 22 μH

HALOGEN

•

Current range from 5 A to 45 A

FREE

•

11.5 mm x 10.3 mm footprint surface mount

package in a 4.0 mm height

•

Iron powder core material

HCM1104

High current power inductors

Technical Data 4370

Effective August 2018

Product Specifications

DCR (mΩ)

typical @

+ꢀ2 °C

DCR (mΩ)

maximum @

+ꢀ2 °C

OCL¹

(μH) ꢀ20

FLL^ꢀ(μH)

minimum

I_rms

(A)

I_sat

4,5

Part Number⁷

HCM1104-R20-R

HCM1104-R36-R

HCM1104-R45-R

HCM1104-R56-R

HCM1104-R90-R

HCM1104-1R0-R

HCM1104-1R5-R

HCM1104-2R2-R

HCM1104-3R3-R

HCM1104-4R7-R

HCM1104-100-R

HCM1104-220-R

(A)

8.5

5.5

K-factor⁶

411

0.20

0.36

0.45

0.56

0.90

1.0

0.13

0.23

0.29

0.36

0.58

0.56

0.84

1.23

1.85

2.63

5.60

12.3

8.5

7.5

5.0

0.63

1.04

1.07

1.56

2.17

3.0

0.72

1.20

1.23

1.80

2.50

3.3

269

219

230

236

378

1.5

3.8

4.2

310

2.2

6.0

7.0

253

3.3

10.8

11.8

220

4.7

175

116

1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.25 Vrms, 0.0 Adc, @ +25 °C

2. Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.25 Vrms, @ I_sat, @ +25 °C

3. I_rms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents.

PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the

temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating

conditions verified in the end application.

5. I_sat: Peak current for approximately 30% rolloff @ +25 °C HCM1104-1R0-R to HCM1104-220-R

6. K-factor: Used to determine B_p-pfor core loss (see graph). Bp-p = K * L * ΔI. B_p-p: (Gauss), K: (K-factor from table), L:

(Inductance in μH), ΔI (Peak to peak ripple current in Amps).

7. Part Number Definition: HCM1104-xxx-R

HCM1104 = Product code and size

xxx= inductance value in μH, R= decimal point ,

4. I_sat: Peak current for approximately 20% rolloff @ +25 °C- HCM1104-R20-R to HCM1104-R90-R

If no R is present then last character equals number of zeros

-R suffix = RoHS compliant

Dimensions (mm)

Recommended pad layout

Schematic

Part marking: xxx=inductance value in uH, R= decimal point. If no R is present then last character equals number of zeros.

wlyy=date code, R=revision level

All soldering surfaces to be coplanar within 0.1 millimeters

Tolerances are 0.3 millimeters unless stated otherwise

Color: Grey

Do not route traces or vias underneath the inductor

www.eaton.com/electronics

HCM1104

High current power inductors

Technical Data 4370

Effective August 2018

Packaging information (mm)

Supplied in tape and reel packaging, 850parts per 13” diameter reel

Temperature rise vs. total loss

50.0

40.0

30.0

50.0

40.0

30.0

20.0

10.0

0.0

HCM1104-1R0-R

HCM1104-1R5-R

HCM1104-R20-R

20.0

HCM1104-R36-R

HCM1104-R45-R

HCM1104-R56-R

HCM1104-3R3-R/ HCM1104-

4R7-R/HCM1104-220-R

10.0

HCM1104-2R2-R/ HCM1104-

100-R

HCM1104-R90-R

0.0

0.5

1.0

1.5

2.0

0.0

0.5

1.0

1.5 2.0

Total Loss (W)

www.eaton.com/electronics

HCM1104

High current power inductors

Technical Data 4370

Effective August 2018

Core loss vs. B

p-p

HCM1104-R20-R to HCM1104-R90-R

10,000

1 MHz

500 kHz

300 kHz

200KHz

1000

100

100 kHz

50 kH z

25 kH z

0.1

100

1000

10, 000

B_p-p(Gauss)

HCM1104-1R0-R to HCM1104-220-R

10,000

1MHz

500 kHz

300 kHz

200 kHz

1000

100

100 kHz

50 kH z

25 kH z

0.1

100

1000

B_p-p(Gauss)

10, 000

www.eaton.com/electronics

HCM1104

High current power inductors

Technical Data 4370

Effective August 2018

Inductance characteristics

HCM1104-R36-R

HCM1104-R20-R

100%

90%

80%

70%

60%

50%

40%

100%

90%

80%

70%

60%

50%

40%

100

I_DC(A )

I_DC(A)

HCM1104-R45-R

HCM1104-R56-R

100%

90%

80%

70%

60%

50%

40%

100%

90%

80%

70%

60%

50%

40%

I_DC(A )

HCM1104-1R0-R

HCM1104-R90-R

100%

90%

100%

90%

80%

70%

60%

50%

40%

80%

70%

60%

50%

40%

I_DC(A )

I_dc(A)

www.eaton.com/electronics

HCM1104

High current power inductors

Technical Data 4370

Effective August 2018

Inductance characteristics

HCM1104-1R5-R

HCM1104-2R2-R

100%

90%

80%

70%

60%

50%

100%

90%

80%

70%

60%

50%

40%

10 12 14 16 18 20 22 24 26 28

I_dc(A)

HCM1104-3R3-R

HCM1104-4R7-R

100%

90%

80%

70%

60%

50%

40%

100%

90%

80%

70%

60%

50%

10 12 14 16 18 20 22

I_dc(A)

^%0

I_dc(A)

HCM1104-220-R

HCM1104-100-R

110%

100%

90%

80%

70%

60%

50%

100%

90%

80%

70%

60%

50%

40%

I_dc(A)

www.eaton.com/electronics

HCM1104

High current power inductors

Technical Data 4370

Effective August 2018

Solder reflow profile

T_P

Table 1 - Standard SnPb Solder (T )

T_C-5°C

t_P

Volume

mm3

Volume

Max. Ramp Up Rate = 3°C/s

Max. Ramp Down Rate = 6°C/s

Package

mm3

≥352

Thickness

<352

<2.5mm)

≥2.5mm

235°C

220°C

T_L

Preheat

T_smax

Table 2 - Lead (Pb) Free Solder (T )

Volume

mm³

Volume

mm³

Package

mm³

T_smin

Thickness

<352

352 - ꢀ222

>ꢀ222

t_s

<1.6mm

260°C

250°C

260°C

250°C

245°C

260°C

245°C

1.6 – 2.5mm

>2.5mm

25°C

Time 25°C to Peak

Time

Reference JDEC J-STD-020

Profile Feature

Standard SnPb Solder

Lead (Pb) Free Solder

Preheat and Soak • Temperature min. (T

smin

)

100°C

150°C

200°C

• Temperature max. (T

)

smax

• Time (T

to T

) (t )

smax s

60-120 Seconds

smin

to T

Average ramp up rate T

3°C/ Second Max.

smax

Liquidous temperature (T^l)

Time at liquidous (t )

183°C

60-150 Seconds

217°C

60-150 Seconds

Peak package body temperature (T )*

Table 1

Table 2

Time (t )** within 5 °C of the specified classification temperature (T )

20 Seconds**

6°C/ Second Max.

6 Minutes Max.

30 Seconds**

6°C/ Second Max.

8 Minutes Max.

Average ramp-down rate (T to T

)

smax

Time 25°C to Peak Temperature

* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.

Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written

approval of an ofﬁcer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used

in accordance with instructions for use provided in the labeling, can be reasonably expected to result in signiﬁcant injury to the user.

Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also

reserves the right to change or update, without notice, any technical information contained in this bulletin.

Eaton

Electronics Division

1000 Eaton Boulevard

Cleveland, OH 44122

United States

www.eaton.com/electronics

Printed in USA

Eaton is a registered trademark.

Publication No. 4370 BU-SB14813

August 2018

All other trademarks are property

of their respective owners.

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