E2SLA30-5.000M
更新时间：2024-09-18 18:03:11
品牌：ECLIPTEK
描述：QUARTZ CRYSTAL RESONATOR, 5MHz, ROHS COMPLIANT, RESISTANCE WELDED, SMD, 2 PIN
概述
规格参数
数据手册E2SLA30-5.000M 概述
QUARTZ CRYSTAL RESONATOR, 5MHz, ROHS COMPLIANT, RESISTANCE WELDED, SMD, 2 PIN 石英晶体
E2SLA30-5.000M 规格参数
| 是否无铅： | 不含铅 | 是否Rohs认证： | 符合 |
| 生命周期： | Active | 包装说明： | ROHS COMPLIANT, RESISTANCE WELDED, SMD, 2 PIN |
| Reach Compliance Code： | compliant | HTS代码： | 8541.60.00.30 |
| 风险等级： | 5.39 | 其他特性： | AT-CUT CRYSTAL; BULK |
| 老化： | 5 PPM/YEAR | 晶体/谐振器类型： | PARALLEL - FUNDAMENTAL |
| 驱动电平： | 1000 µW | 频率稳定性： | 0.002% |
| 频率容差： | 15 ppm | JESD-609代码： | e3 |
| 负载电容： | 30 pF | 安装特点： | SURFACE MOUNT |
| 标称工作频率： | 5 MHz | 最高工作温度： | 70 °C |
| 最低工作温度： | -20 °C | 物理尺寸： | L13.3XB4.85XH4.5 (mm)/L0.524XB0.191XH0.177 (inch) |
| 串联电阻： | 150 Ω | 表面贴装： | YES |
| 端子面层： | Matte Tin (Sn) - with Nickel (Ni) barrier | Base Number Matches： | 1 |
E2SLA30-5.000M 数据手册
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PDF下载RoHS
Pb
E2SLA30-5.000M
E2S L A 30 -5.000M
Series
Nominal Frequency
RoHS Compliant (Pb-free) Resistance Welded
HC-49/UP SMD Crystal
5.000MHz
Load Capacitance
30pF Parallel Resonant
Frequency Tolerance/Stability
±15ppm at 25°C, ±20ppm over -20°C to +70°C
Mode of Operation
AT-Cut Fundamental
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
Aging at 25°C
5.000MHz
±15ppm at 25°C, ±20ppm over -20°C to +70°C
±5ppm/year Maximum
30pF Parallel Resonant
7pF Maximum
Load Capacitance
Shunt Capacitance (C0)
Equivalent Series Resistance
Mode of Operation
150 Ohms Maximum
AT-Cut Fundamental
Drive Level
1mWatt Maximum
Storage Temperature Range
Insulation Resistance
-40°C to +125°C
500 Megaohms Minimum at 100Vdc
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
MIL-STD-883, Method 1014 Condition A
MIL-STD-883, Method 1014 Condition C
Sn 2µm - 6µm
Gross Leak Test
Lead Termination
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-202, Method 213 Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Vibration
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007 Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
LINE MARKING
1
E5.000M
E=Ecliptek Designator
M=MHz
4.50
MAX
13.30 MAX
4.85
MAX
0.50 MIN (x2)
4.88 ±0.20
0.80 ±0.30 (x2)
11.60 MAX
NOTE: Coplanarity 0.360 MAX
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/12/2010 | Page 1 of 4
E2SLA30-5.000M
Suggested Solder Pad Layout
All Dimensions in Millimeters
5.5 (X2)
2.0 (X2)
4.0
Solder Land
(X2)
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/12/2010 | Page 2 of 4
E2SLA30-5.000M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate)
3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
150°C
175°C
200°C
60 - 180 Seconds
Ramp-up Rate (TL to TP)
3°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
217°C
60 - 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/12/2010 | Page 3 of 4
E2SLA30-5.000M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 245°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
30 - 60 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
245°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
245°C Maximum 2 Times / 230°C Maximum 1 Time
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/12/2010 | Page 4 of 4
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