E2UMAS-14.7456M [ECLIPTEK]

E2UMAS-14.7456M

Series

RoHS Compliant (Pb-free) Resistance Welded

HC-49/US Crystal

Frequency Tolerance/Stability

±15ppm at 25°C, ±20ppm over -40°C to +85°C

Mode of Operation

AT-Cut Fundamental

RoHS

Pb

E2U M A S -14.7456M

Nominal Frequency

14.7456MHz

Load Capacitance

Series Resonant

ELECTRICAL SPECIFICATIONS

Nominal Frequency

Frequency Tolerance/Stability

Aging at 25°C

Load Capacitance

Shunt Capacitance (C0)

Equivalent Series Resistance

Mode of Operation

Drive Level

Storage Temperature Range

Insulation Resistance

14.7456MHz

±15ppm at 25°C, ±20ppm over -40°C to +85°C

±5ppm/year Maximum

Series Resonant

7pF Maximum

70 Ohms Maximum

AT-Cut Fundamental

1mWatt Maximum

-40°C to +125°C

500 Megaohms Minimum at 100Vdc

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

Fine Leak Test

Gross Leak Test

Lead Integrity

Lead Termination

Mechanical Shock

Resistance to Soldering Heat

Resistance to Solvents

Solderability

Temperature Cycling

Vibration

MIL-STD-883, Method 1014 Condition A

MIL-STD-883, Method 1014 Condition C

MIL-STD-883, Method 2004

Sn 2µm - 6µm

MIL-STD-202, Method 213 Condition C

MIL-STD-202, Method 210

MIL-STD-202, Method 215

MIL-STD-883, Method 2003

MIL-STD-883, Method 1010

MIL-STD-883, Method 2007 Condition A

MECHANICAL DIMENSIONS (all dimensions in millimeters)

LINE MARKING

1

E14.745M

E=Ecliptek Designator

M=MHz

6.35

MIN

DIA 0.457

±0.051(X2)

11.18

MAX

4.88 ±0.20

3.68 MAX

4.70

MAX

www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 8/12/2010 | Page 1 of 3

E2UMAS-14.7456M

Recommended Solder Reflow Methods

T

P

Critical Zone

T

L

to T

P

Ramp-up

Ramp-down

Temperature (T)

T

L

T

S

Max

T

S

Min

t

S

Preheat

t 25°C to Peak

t

L

t

P

Time (t)

High Temperature Solder Bath (Wave Solder)

T

S

MAX to T

L

(Ramp-up Rate)

Preheat

- Temperature Minimum (T

S

MIN)

- Temperature Typical (T

S

TYP)

- Temperature Maximum (T

S

MAX)

- Time (t

S

MIN)

Ramp-up Rate (T

L

to T

P

)

Time Maintained Above:

- Temperature (T

L

)

- Time (t

L

)

Peak Temperature (T

P

)

Target Peak Temperature (T

P

Target)

Time within 5°C of actual peak (t

p

)

Ramp-down Rate

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

3°C/second Maximum

150°C

175°C

200°C

60 - 180 Seconds

3°C/second Maximum

217°C

60 - 150 Seconds

260°C Maximum for 10 Seconds Maximum

250°C +0/-5°C

20 - 40 seconds

6°C/second Maximum

8 minutes Maximum

Level 1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 8/12/2010 | Page 2 of 3

E2UMAS-14.7456M

Recommended Solder Reflow Methods

T

P

Critical Zone

T

L

to T

P

Ramp-up

Ramp-down

Temperature (T)

T

L

T

S

Max

T

S

Min

t

S

Preheat

t 25°C to Peak

t

L

t

P

Time (t)

Low Temperature Solder Bath (Wave Solder)

T

S

MAX to T

L

(Ramp-up Rate)

Preheat

- Temperature Minimum (T

S

MIN)

- Temperature Typical (T

S

TYP)

- Temperature Maximum (T

S

MAX)

- Time (t

S

MIN)

Ramp-up Rate (T

L

to T

P

)

Time Maintained Above:

- Temperature (T

L

)

- Time (t

L

)

Peak Temperature (T

P

)

Target Peak Temperature (T

P

Target)

Time within 5°C of actual peak (t

p

)

Ramp-down Rate

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

5°C/second Maximum

N/A

150°C

N/A

30 - 60 Seconds

5°C/second Maximum

150°C

200 Seconds Maximum

245°C Maximum

245°C Maximum 1 Time / 235°C Maximum 2 Times

5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times

5°C/second Maximum

N/A

Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 8/12/2010 | Page 3 of 3