EB13C5D1H-31.250M [ECLIPTEK]
CRYSTAL OSCILLATOR, CLOCK, 31.25MHz, LVCMOS OUTPUT, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN;
| 型号： | EB13C5D1H-31.250M |
| 厂家： | 
Ecliptek |
| 描述： | CRYSTAL OSCILLATOR, CLOCK, 31.25MHz, LVCMOS OUTPUT, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN 机械 输出元件 振荡器 |
| 文件： | 总5页 (文件大小：183K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RoHS
Pb
EB13C5D1H-31.250M
EB13C5 D 1 H -31.250M
Series
Nominal Frequency
RoHS Compliant (Pb-free) Low Current 3.3V 4 Pad
3.2mm x 5mm Ceramic SMD LVCMOS Oscillator
31.250MHz
Logic Control / Additional Output
Frequency Tolerance/Stability
±50ppm over 0°C to +70°C
Tri-State
Duty Cycle
50% ±10%
ELECTRICAL SPECIFICATIONS
Nominal Frequency
31.250MHz
Frequency Tolerance/Stability
±50ppm over 0°C to +70°C (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability
over the Operating Temperature Range, Supply Voltage Change, Ouput Load Change, First Year Aging at
25°C, Shock, and Vibration)
Supply Voltage
3.3Vdc ±10%
Input Current
5mA Maximum
Output Voltage Logic High (Voh)
Input Current Logic High (Ioh)
Output Voltage Logic Low (Vol)
Input Current Logic Low (Iol)
Rise/Fall Time
90% of Vdd Minimum
-1.6mA
10% of Vdd Maximum
+1.6mA
4nSec Maximum (Measured at 20% to 80% of waveform)
Duty Cycle
50% ±10% (Measured at 50% of waveform)
Load Drive Capability
15pF Maximum
CMOS
Output Logic Type
Logic Control / Additional Output
Tri-State Input Voltage (Vih and Vil)
Tri-State
90% of Vdd Minimum or No Connect to Enable Output, 10% of Vdd Maximum to Disable Output (High
Impedance)
Standby Current
10µA Maximum (Disabled Output: High Impedance)
25pSec Maximum
One Sigma Clock Period Jitter
Start Up Time
10 mSec Maximum
Storage Temperature Range
-55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
MIL-STD-883, Method 1014, Condition A
MIL-STD-883, Method 1014, Condition C
MIL-STD-202, Method 213, Condition C
MIL-STD-202, Method 210
Gross Leak Test
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Vibration
MIL-STD-883, MEthod 1010
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 1 of 5
EB13C5D1H-31.250M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
1
2
3
4
Tri-State
Ground
1.20 ±0.20 (x4)
3.20
±0.20
Output
1.00 ±0.20 (x4)
Supply Voltage
LINE MARKING
4
3
1
2
1
E31.250
5.00
±0.20
2.54
±0.15
E=Ecliptek Designator
1.20
±0.20
(x4)
2
XXYZZ
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
2.20
±0.15
1.3
MAX
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.2 (X4)
1.4 (X4)
Solder Land
(X4)
1.14
1.0
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 2 of 5
EB13C5D1H-31.250M
OUTPUT WAVEFORM & TIMING DIAGRAM
VIH
VIL
VOH
80% of Waveform
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
50% of Waveform
20% of Waveform
VOL
tPLZ
tPZL
Fall
Time
Rise
Time
TW
T
Duty Cycle (%) = TW/T x 100
Test Circuit for CMOS Output
Frequency
Counter
Oscilloscope
Probe
(Note 2)
Supply
Voltage
(VDD
)
Output
_
+
Current
Meter
+
+
Power
Supply
0.01µF
(Note 1)
Voltage
Meter
0.1µF
(Note 1)
CL
(Note 3)
Ground
_
_
No Connect
or Tri-State
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 3 of 5
EB13C5D1H-31.250M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate)
3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
150°C
175°C
200°C
60 - 180 Seconds
Ramp-up Rate (TL to TP)
3°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
217°C
60 - 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 4 of 5
EB13C5D1H-31.250M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
60 - 120 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
240°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 5 of 5
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