EB51F3B15V-8.000M [ECLIPTEK]
OSCILLATORS 1.5PPM 0+70 5.0V 4 8.000MHZ CMOS FULL 14PIN DIP;
| 型号： | EB51F3B15V-8.000M |
| 厂家： | 
Ecliptek |
| 描述： | OSCILLATORS 1.5PPM 0+70 5.0V 4 8.000MHZ CMOS FULL 14PIN DIP |
| 文件： | 总5页 (文件大小：174K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
EB51F3B15V-8.000M
EB51F3 B 15 V -8.000M
Series
Nominal Frequency
5.0Vdc 14-Pin DIP HCMOS/TTL TCXO
8.000MHz
Operating Temperature Range
0°C to +70°C
Control Voltage
2.5Vdc ±2.0Vdc
Frequency Stability
±1.5ppm Maximum
ELECTRICAL SPECIFICATIONS
Nominal Frequency
8.000MHz
Frequency Stability
±1.5ppm Maximum (Inclusive of Operating Temperature Range)
Frequency Stability vs. Input Voltage ±0.3ppm Maximum (±5%)
Aging at 25°C
±1ppm/Year Maximum
Frequency Stability vs. Load
Operating Temperature Range
Supply Voltage
±0.2ppm Maximum (±2pF)
0°C to +70°C
5.0Vdc ±5%
Input Current
30mA Maximum
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
2.4Vdc Minimum w/TTL Load, Vdd-0.5Vdc Minimum w/HCMOS Load
0.4Vdc Maximum w/TTL Load, 0.5Vdc Maximum w/HCMOS Load
10nSec Maximum (Measured at 0.4Vdc to 2.4Vdc w/TTL Load, 20% to 80% of waveform w/HCMOS Load)
50% ±10% (Measured at 1.4Vdc w/TTL Load, at 50% of waveform w/HCMOS Load)
10TTL Load or 15pF HCMOS Load Maximum
CMOS
Duty Cycle
Load Drive Capability
Output Logic Type
Control Voltage
2.5Vdc ±2.0Vdc
Frequency Deviation
Transfer Function
Internal Trim
±7ppm Minimum, ±20ppm Maximum (Referenced to Fo at Vc=2.5Vdc; Vdd=5.0Vdc)
Postive Transfer Characteristic
±3ppm Minimum (Top of Can)
Modulation Bandwidth
Input Impedance
10kHz Minimum (Measured at -3dB with a Control Voltage of 2.5Vdc)
10kOhms Typical
Phase Noise
-70dBc at 10Hz Offset, -100dBc at 100Hz Offset, -130dBc at 1kHz Offset, -140dBc at 10kHz Offset, -
145dBc at 100kHz Offset
Storage Temperature Range
-40°C to +85°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
MIL-STD-883, Method 1014 Condition A (Internal Crystal Only)
Gross Leak Test
Lead Integrity
MIL-STD-883, Method 1014 Condition C (Internal Crystal Only)
MIL-STD-883, Method 2004
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-202, Method 213 Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Vibration
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007 Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/16/2010 | Page 1 of 5
EB51F3B15V-8.000M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
1
2
3
4
Voltage Control
Case Ground
Output
Internal Trim Access
4.8 ±0.3
Hole Ø3.5 ±0.5
3
4
Supply Voltage
4.0 ±0.3
5.0 ±1.0
4.0 ±0.3
LINE MARKING
1
2
3
ECLIPTEK
8.000M
11.7
±0.5
7.62
±0.30
MARKING
ORIENTATION
1.2 +0/-0.5
XXYZZ
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
Ø0.50
±0.05
(x4)
2.5 ±0.3
2
15.24 ±0.40
1
18.3 ±0.5
OUTPUT WAVEFORM
VOH
80% or 2.4VDC
50% or 1.4VDC
20% or 0.4VDC
VOL
Fall
Time
Rise
Time
TW
T
Duty Cycle (%) = TW/T x 100
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/16/2010 | Page 2 of 5
EB51F3B15V-8.000M
Test Circuit for TTL Output
RL Value
(Ohms)
Output Load
Drive Capability
CL Value
(pF)
390
780
15
15
6
10TTL
5TTL
Frequency
Counter
1100
2000
2200
2TTL
Oscilloscope
15
3
10LSTTL
1TTL
Table 1: RL Resistance Value and CL Capacitance
Value Vs. Output Load Drive Capability
Probe
Supply
Voltage
(Note 2)
RL
(Note 4)
(VDD
)
Output
_
+
Current
Meter
+
+
+
Power
Supply
0.01µF
(Note 1)
Power
Supply
_
Voltage
Meter
0.1µF
(Note 1)
CL
(Note 3)
Ground
_
_
No Connect
or Tri-State
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
Note 4: Resistance value RL is shown in Table 1. See applicable specification sheet for 'Load Drive Capability'.
Note 5: All diodes are MMBD7000, MMBD914, or equivalent.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/16/2010 | Page 3 of 5
EB51F3B15V-8.000M
Test Circuit for CMOS Output
Frequency
Counter
Oscilloscope
Probe
(Note 2)
Supply
Voltage
(VDD
)
Output
_
+
Current
Meter
+
+
Power
Supply
0.01µF
(Note 1)
Voltage
Meter
0.1µF
(Note 1)
CL
(Note 3)
Ground
_
_
No Connect
or Tri-State
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/16/2010 | Page 4 of 5
EB51F3B15V-8.000M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
30 - 60 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
245°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
245°C Maximum 1 Time / 235°C Maximum 2 Times
5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
Low Temperature Solder Bath (Wave Solder) Note 1
Device is non-hermetic; Post reflow aqueous wash is not recommended
Low Temperature Solder Bath (Wave Solder) Note 2
Temperatures shown are applied to back of PCB board and device leads only.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/16/2010 | Page 5 of 5
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