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EB52E8C2N-9.216M TR [ECLIPTEK]

OSCILLATORS 0.5PPM -20+70 3.3V 4 9.216MHZ CMOS 5X7MM 10PAD SMD;
EB52E8C2N-9.216M TR
型号： EB52E8C2N-9.216M TR
厂家： Ecliptek    Ecliptek
描述：

OSCILLATORS 0.5PPM -20+70 3.3V 4 9.216MHZ CMOS 5X7MM 10PAD SMD
文件： 总5页 (文件大小：187K)
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RoHS  
Pb  
EB52E8C2N-9.216M  
EB52E8 C 2 N -9.216M  
Series  
Nominal Frequency  
RoHS Compliant (Pb-free) 5mm x 7mm Ceramic SMD  
3.3Vdc LVCMOS TC(VC)XO  
9.216MHz  
Control Voltage  
None (No Connect Pad 10)  
Operating Temperature Range  
-20°C to +70°C  
Frequency Stability  
±0.5ppm Maximum  
ELECTRICAL SPECIFICATIONS  
Nominal Frequency  
Frequency Tolerance  
Frequency Stability  
9.216MHz  
±1.0ppm Maximum (Measured at 25°C ±2°C, at Vdd=3.3Vdc and Vc=1.65Vdc)  
±0.5ppm Maximum (Not available with Operating Temperature Range of -40°C to +85°C)  
Frequency Stability vs. Input Voltage ±0.3ppm Maximum (±5%)  
Frequency Stability vs. Aging  
Frequency Stability vs. Load  
Operating Temperature Range  
Supply Voltage  
±1ppm/year Maximum (at 25°C)  
±0.3ppm Maximum (±10%)  
-20°C to +70°C  
3.3Vdc ±5%  
Input Current  
10mA Maximum  
Output Voltage Logic High (Voh)  
Output Voltage Logic Low (Vol)  
Rise/Fall Time  
90% of Vdd Minimum (IOH = -4mA)  
10% of Vdd Maximum (IOL = +4mA)  
5nSec Maximum (Measured at 20% to 80% of Waveform)  
50 ±5(%) (Measured at 50% of Waveform)  
15pF Maximum  
Duty Cycle  
Load Drive Capability  
Output Logic Type  
CMOS  
Control Voltage  
None (No Connect Pad 10)  
0.0Vdc to Vdd  
Control Voltage Range  
Phase Noise  
-80dBc/Hz at 10Hz Offset, -115dBc/Hz at 100Hz Offset, -135dBc/Hz at 1kHz Offset, and -145dBc/Hz at  
>=10kHz Offset (Typical Values at 12.800MHz)  
Tri-State Input Voltage (Vih and Vil)  
+0.9Vdd Minimum to Enable Output; +0.1Vdd Maximum to Disable Output (High Impedance); No Connect  
to Enable Output  
RMS Phase Jitter  
1pSec Maximum (Fj = 12kHz to 20MHz)  
10mSec Maximum  
Start Up Time  
Storage Temperature Range  
-40°C to +125°C  
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS  
Fine Leak Test  
MIL-STD-883, Method 1014 Condition A  
MIL-STD-883, Method 1014 Condition C  
MIL-STD-202, Method 213 Condition C  
MIL-STD-202, Method 210  
Gross Leak Test  
Mechanical Shock  
Resistance to Soldering Heat  
Resistance to Solvents  
Solderability  
MIL-STD-202, Method 215  
MIL-STD-883, Method 2003  
Temperature Cycling  
Vibration  
MIL-STD-883, Method 1010  
MIL-STD-883, Method 2007 Condition A  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/16/2010 | Page 1 of 5  
EB52E8C2N-9.216M  
MECHANICAL DIMENSIONS (all dimensions in millimeters)  
PIN CONNECTION  
1
2
3
4
5
6
7
8
9
10  
Do Not Connect  
Do Not Connect  
Do Not Connect  
Ground  
2.00  
MAX  
1.00 ±0.10 (x5)  
0.80 ±0.10 (x4)  
5.00  
±0.10  
0.40  
±0.10  
5
6
4
Output  
1.00  
±0.10  
(x4)  
Do Not Connect  
Do Not Connect  
Tri-State  
3
2
7.00  
±0.10  
7
8
Supply Voltage  
No Connect  
1
1.27  
±0.10  
(x4)  
0.60  
±0.10  
(x6)  
10  
9
LINE MARKING  
2.54  
±0.10  
(x2)  
1
EXX.XXX  
0.80  
±0.10  
E=Ecliptek Designator  
XX.XXX=Nominal  
Frequency in MHz  
2
XXYZZ  
XX=Ecliptek Manufacturing  
Code  
Y=Last Digit of the Year  
ZZ=Week of the Year  
Suggested Solder Pad Layout  
All Dimensions in Millimeters  
1.34  
1.4(x4)  
1.3  
1.4  
4.6  
1.0  
1.8  
1.2(x4)  
Solder Land (x5)  
All Tolerances are ±0.1  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/16/2010 | Page 2 of 5  
EB52E8C2N-9.216M  
OUTPUT WAVEFORM & TIMING DIAGRAM  
VIH  
VIL  
VOH  
80% of Waveform  
OUTPUT DISABLE  
(HIGH IMPEDANCE  
STATE)  
50% of Waveform  
20% of Waveform  
VOL  
tPLZ  
tPZL  
Fall  
Time  
Rise  
Time  
TW  
T
Duty Cycle (%) = TW/T x 100  
Test Circuit for CMOS Output  
Switch  
Frequency  
Counter  
Oscilloscope  
Power  
Supply  
Probe  
Supply  
Voltage  
(Note 2)  
Output  
(VDD  
)
Current  
Meter  
Tri-State  
0.1µF  
0.01µF  
Power  
Supply  
(Note 1)  
Voltage  
Meter  
(Note 1)  
CL  
(Note 3)  
No  
Connect  
Ground  
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a  
0.01µF high frequency ceramic bypass capacitor close to the package ground  
and VDD pin is required.  
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance  
(>10Mohms), and high bandwidth (>300MHz) passive probe is recommended.  
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/16/2010 | Page 3 of 5  
EB52E8C2N-9.216M  
Recommended Solder Reflow Methods  
Critical Zone  
TL to TP  
TP  
Ramp-up  
Ramp-down  
TL  
TS Max  
TS Min  
tL  
tP  
tSPreheat  
t 25°C to Peak  
Time (t)  
High Temperature Infrared/Convection  
TS MAX to TL (Ramp-up Rate)  
3°C/second Maximum  
Preheat  
- Temperature Minimum (TS MIN)  
- Temperature Typical (TS TYP)  
- Temperature Maximum (TS MAX)  
- Time (tS MIN)  
150°C  
175°C  
200°C  
60 - 180 Seconds  
Ramp-up Rate (TL to TP)  
3°C/second Maximum  
Time Maintained Above:  
- Temperature (TL)  
- Time (tL)  
217°C  
60 - 150 Seconds  
Peak Temperature (TP)  
260°C Maximum for 10 Seconds Maximum  
250°C +0/-5°C  
Target Peak Temperature (TP Target)  
Time within 5°C of actual peak (tp)  
Ramp-down Rate  
20 - 40 seconds  
6°C/second Maximum  
8 minutes Maximum  
Level 1  
Time 25°C to Peak Temperature (t)  
Moisture Sensitivity Level  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/16/2010 | Page 4 of 5  
EB52E8C2N-9.216M  
Recommended Solder Reflow Methods  
Critical Zone  
TL to TP  
TP  
Ramp-up  
Ramp-down  
TL  
TS Max  
TS Min  
tL  
tP  
tSPreheat  
t 25°C to Peak  
Time (t)  
Low Temperature Infrared/Convection 230°C  
TS MAX to TL (Ramp-up Rate)  
5°C/second Maximum  
Preheat  
- Temperature Minimum (TS MIN)  
- Temperature Typical (TS TYP)  
- Temperature Maximum (TS MAX)  
- Time (tS MIN)  
N/A  
150°C  
N/A  
30 - 60 Seconds  
Ramp-up Rate (TL to TP)  
5°C/second Maximum  
Time Maintained Above:  
- Temperature (TL)  
- Time (tL)  
150°C  
200 Seconds Maximum  
Peak Temperature (TP)  
230°C Maximum  
230°C Maximum 2 Times  
10 seconds Maximum 2 Times  
5°C/second Maximum  
N/A  
Target Peak Temperature (TP Target)  
Time within 5°C of actual peak (tp)  
Ramp-down Rate  
Time 25°C to Peak Temperature (t)  
Moisture Sensitivity Level  
Level 1  
Low Temperature Manual Soldering  
185°C Maximum for 10 seconds Maximum, 2 times Maximum.  
High Temperature Manual Soldering  
260°C Maximum for 5 seconds Maximum, 2 times Maximum.  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/16/2010 | Page 5 of 5  

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